ON MC14043B Cmos msi(quad r-s latches) Datasheet

MC14043B, MC14044B
CMOS MSI
Quad R–S Latches
The MC14043B and MC14044B quad R–S latches are constructed
with MOS P–channel and N–channel enhancement mode devices in a
single monolithic structure. Each latch has an independent Q output
and set and reset inputs. The Q outputs are gated through three–state
buffers having a common enable input. The outputs are enabled with a
logical “1” or high on the enable input; a logical “0” or low
disconnects the latch from the Q outputs, resulting in an open circuit at
the Q outputs.
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MARKING
DIAGRAMS
16
PDIP–16
P SUFFIX
CASE 648
• Double Diode Input Protection
• Three–State Outputs with Common Enable
• Outputs Capable of Driving Two Low–power TTL Loads or One
•
MC140XXBCP
AWLYYWW
1
16
Low–Power Schottky TTL Load Over the Rated Temperature Range
Supply Voltage Range = 3.0 Vdc to 18 Vdc
SOIC–16
D SUFFIX
CASE 751B
140XXB
AWLYWW
1
16
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Parameter
Symbol
VDD
Unit
– 0.5 to +18.0
V
– 0.5 to VDD + 0.5
V
Input or Output Current
(DC or Transient) per Pin
± 10
mA
PD
Power Dissipation,
per Package (Note 3.)
500
mW
TA
Ambient Temperature Range
– 55 to +125
°C
Tstg
Storage Temperature Range
– 65 to +150
°C
TL
Lead Temperature
(8–Second Soldering)
260
°C
Vin, Vout
Iin, Iout
DC Supply Voltage Range
Value
Input or Output Voltage Range
(DC or Transient)
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS
(Vin or Vout)
VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
v
v
SOEIAJ–16
F SUFFIX
CASE 966
MC140XXB
AWLYWW
1
XX
= Specific Device Code
A
= Assembly Location
WL or L = Wafer Lot
YY or Y = Year
WW or W = Work Week
ORDERING INFORMATION
Device
Package
Shipping
MC14043BCP
PDIP–16
2000/Box
MC14043BD
SOIC–16
2400/Box
MC14043BDR2
SOIC–16
2500/Tape & Reel
MC14043BF
SOEIAJ–16
See Note 1.
MC14043BFEL
SOEIAJ–16
See Note 1.
MC14044BCP
PDIP–16
2000/Box
MC14044BD
SOIC–16
2400/Box
MC14044BDR2
SOIC–16
2500/Tape & Reel
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
 Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3
1
Publication Order Number:
MC14043B/D
MC14043B, MC14044B
PIN ASSIGNMENT
MC14043B
MC14044B
Q3
1
16
VDD
Q3
1
16
VDD
Q0
2
15
R3
NC
2
15
S3
R0
3
14
S3
S0
3
14
R3
S0
4
13
NC
R0
4
13
Q0
E
5
12
S2
E
5
12
R2
S1
6
11
R2
R1
6
11
S2
R1
7
10
Q2
S1
7
10
Q2
VSS
8
9
Q1
VSS
8
9
Q1
NC = NO CONNECTION
MC14043B
S0
R0
S1
R1
S2
R2
S3
4
MC14044B
2
R0
Q0
3
S0
6
9
R1
Q1
7
12
VDD = PIN 16
VSS = PIN 8
NC = PIN 13
10
S1
R2
Q2
11
S2
14
TRUTH TABLE
1
Q3
S R E
Q
X X 0
High
Impedance
15
R3
5
ENABLE
0
0
1
1
0
1
0
1
R3
4
13
Q0
3
6
9
Q1
7
12
VDD = PIN 16
VSS = PIN 8
NC = PIN 2
10
Q2
11
14
TRUTH TABLE
1
Q3
S R E
Q
X X 0
High
Impedance
15
S3
1 No Change
1
0
1
1
1
1
5
ENABLE
X = Don’t Care
0
0
1
1
0
1
0
1
1
0
1
1
1
0
1 No Change
X = Don’t Care
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2
MC14043B, MC14044B
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Output Voltage
Vin = VDD or 0
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ (4.)
Max
Min
Max
Unit
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
“1” Level
VIH
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
1.0
2.0
4.0
—
—
—
0.002
0.004
0.006
1.0
2.0
4.0
—
—
—
30
60
120
µAdc
Total Supply Current (5.) (6.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs all
buffers switching)
IT
5.0
10
15
Three–State Output Leakage
Current
ITL
15
Vin = 0 or VDD
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
Vdc
Vdc
IOH
Source
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Sink
mAdc
IT = (0.58 µA/kHz) f + IDD
IT = (1.15 µA/kHz) f + IDD
IT = (1.73 µA/kHz) f + IDD
± 0.1
—
—
± 0.0001
± 0.1
µAdc
—
± 3.0
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25_C.
6. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.004.
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3
µAdc
MC14043B, MC14044B
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SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
VDD
Vdc
Min
Typ (8.)
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
100
50
40
200
100
80
5.0
10
15
—
—
—
175
75
60
350
175
120
Unit
Output Rise Time
tTLH = (1.35 ns/pF) CL + 32.5 ns
tTLH = (0.60 ns/pF) CL + 20 ns
tTLH = (0.40 ns/pF) CL + 20 ns
tTLH
Output Fall Time
tTHL = (1.35 ns/pF) CL + 32.5 ns
tTHL = (0.60 ns/pF) CL + 20 ns
tTHL = (0.40 ns/pF) CL + 20 ns
tTHL
Propagation Delay Time
tPLH = (0.90 ns/pF) CL + 130 ns
tPLH = (0.36 ns/pF) CL + 57 ns
tPLH = (0.26 ns/pF) CL + 47 ns
tPLH
tPHL = (0.90 ns/pF) CL + 130 ns
tPHL = (0.90 ns/pF) CL + 57 ns
tPHL = (0.26 ns/pF) CL + 47 ns
tPHL
5.0
10
15
—
—
—
175
75
60
350
175
120
ns
Set, Set Pulse Width
tW
5.0
10
15
200
100
70
80
40
30
—
—
—
ns
Reset, Reset Pulse Width
tW
5.0
10
15
200
100
70
80
40
30
—
—
—
ns
tPLZ,
tPHZ,
tPZL,
tPZH
5.0
10
15
—
—
—
150
80
55
300
160
110
ns
Three–State Enable/Disable Delay
ns
ns
ns
7. The formulas given are for the typical characteristics only at 25_C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
AC WAVEFORMS
MC14043B
MC14044B
20 ns
50%
10%
20 ns
50%
tPHL
VDD
90%
10%
VSS
20 ns
90% VDD
VDD
10%
10%
50%
20 ns
90%
tTHL
Q
SET
VSS
20 ns
RESET
20 ns
VDD
90%
SET
20 ns
20 ns
50%
RESET
VSS
tTLH
tTHL
tTLH
VOH
90%
50%
10%
Q
50%
VOL
90%
10%
tPLH
tPLH
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4
tPHL
VSS
VOH
VOL
MC14043B, MC14044B
THREE–STATE ENABLE/DISABLE DELAYS
Set, Reset, Enable, and Switch Conditions for 3–State Tests
MC14043B
Test
Enable
VDD
MC14044B
S1
S2
Q
S
R
S
R
tPZH
Open
Closed
A
VDD
VSS
VSS
VDD
tPZL
Closed
Open
B
VSS
VDD
VDD
VSS
tPHZ
Open
Closed
A
VDD
VSS
VSS
VDD
tPLZ
Closed
Open
B
VSS
VDD
VDD
VSS
S1
TO
OUTPUT
UNDER
TEST
1k
CL
50 pF
S2
VSS
VDD
ENABLE
50%
VSS
tPZH
VDD
90%
QA
10%
tPZL
tPHZ
VOL
tPLZ
VOH
QB
10%
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5
VSS
MC14043B, MC14044B
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R
–A–
16
9
1
8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
B
F
C
DIM
A
B
C
D
F
G
H
J
K
L
M
S
L
S
–T–
SEATING
PLANE
K
H
G
D
M
J
16 PL
0.25 (0.010)
M
T A
M
16
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
9
–B–
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
MILLIMETERS
MIN
MAX
18.80
19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
–A–
–T–
INCHES
MIN
MAX
0.740
0.770
0.250
0.270
0.145
0.175
0.015
0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008
0.015
0.110
0.130
0.295
0.305
0_
10 _
0.020
0.040
M
T B
S
A
S
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6
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC14043B, MC14044B
PACKAGE DIMENSIONS
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
16
LE
9
Q1
M_
E HE
1
L
8
DETAIL P
Z
D
e
VIEW P
A
A1
b
0.13 (0.005)
c
M
0.10 (0.004)
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7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
MILLIMETERS
MIN
MAX
–––
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
10 _
0_
0.70
0.90
–––
0.78
INCHES
MIN
MAX
–––
0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
–––
0.031
MC14043B, MC14044B
ON Semiconductor and
are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
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MC14043B/D
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