HLMP-HB55/HLMP-HM55/ HLMP-HB54/HLMP-HM54 5 mm Precision Optical Performance InGaN Oval LED Lamps Data Sheet Description Features These Precision Optical Performance Oval LEDs are specifically designed for full color/video and passenger information signs. The oval shaped radiation pattern and high luminous intensity ensure that this device is excellent for wide field of view outdoor applications where a wide viewing angle and readability in sunlight are essential. This lamp has very smooth, matched radiation patterns ensuring consistent color mixing in full color applications, message uniformity across the viewing angle of the sign. High efficiency LED material is used in this lamp: Indium Gallium Nitride for Blue and Green. Each lamp is made with an advanced optical grade epoxy offering superior high temperature and high moisture resistance in outdoor applications. The package epoxy contains both UV-a and UV-b inhibitors to reduce the effects of long term exposure to direct sunlight. These lamps are available in two package options (standoff and without standoff) to give designer flexibility with device mounting. • Well-defined spatial radiation pattern • High brightness material – Blue InGaN 470 nm – Green InGaN 525 nm Applications • Full color signs • Commercial outdoor advertising Benefits • Viewing angle designed for wide field of view applications • Superior performance for outdoor environments CAUTION: InGaN devices are Class 1C HBM ESD sensitive per JEDEC standard. Please observe appropriate precautions during handling and processing. Refer to Application Note AN-1142 for additional details. Package Dimensions Package Drawing A NOTE: MEASURED JUST ABOVE FLANGE. 1.50 MAX. (0.059) 3.80 (0.150) 0.70 MAX. 0.50 ± 0.10 (0.019 ± 0.003) 2.54 (0.10) 5.20 (0.204) CATHODE LEAD 7.00 (0.275) 1.00 MIN. (0.039) 25.00 MIN. (0.984) NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED. Package Drawing B NOTE: MEASURED JUST ABOVE FLANGE. 10.85 ± 0.50 (0.427 ± 0.019) 3.80 (0.150) 1.20 (0.047) 0.50 ± 0.10 (0.019 ± 0.003) 2.54 (0.10) 5.20 (0.204) 1.50 MAX. (0.059) 7.00 (0.275) CATHODE LEAD 25.00 MIN. (0.984) NOTES: 1. DIMENSIONS IN MILLIMETERS (INCHES). 2. TOLERANCE ± 0.25 mm UNLESS OTHERWISE NOTED. 2 1.00 MIN. (0.039) Device Selection Guide Part Number Color and Dominant Wavelength λd (nm) Typ. Luminous Intensity Iv (mcd) at 20 mA Min. Luminous Intensity Iv (mcd) at 20 mA Max. Leads with Standoff Package Drawing Tinting Type HLMP-HB54-FJ0xx Blue 470 110 310 No A Blue HLMP-HB55-HJCxx Blue 470 180 310 Yes B Blue HLMP-HB55-JKCxx Blue 470 240 400 Yes B Blue HLMP-HM54-MQ0xx Green 525 520 1500 No A Green HLMP-HM55-MQ0xx Green 525 520 1500 Yes B Green HLMP-HM55-NPCxx Green 525 680 1150 Yes B Green HLMP-HM55-PQCxx Green 525 880 1500 Yes B Green Notes: 1 The luminous intensity is measured on the mechanical axis of the lamp package. 2. The optical axis is closely aligned with the package mechanical axis. 3. The dominant wavelength, λd, is derived from the Chromaticity Diagram and represents the color of the lamp. Part Numbering System HLMP-X X XX – X X X XX Mechanical Options 00: Bulk Packaging DD: Ammo Pack Color Bin Selections 0: No color bin limitation Maximum Intensity Bin 0: No Iv bin limitation Minimum Intensity Bin Refer to Device Selection Guide Color B: 470 nm Blue M: 525 nm Green Package H: 5 mm Oval 40° x 100° 3 Absolute Maximum Ratings at TA = 25°C Parameter DC Forward Value Current[1] Peak Pulsed Forward 30 mA Current[2] 100 mA Power Dissipation 117 mW Reverse Voltage 5 V (IR = 10 µA) LED Junction Temperature 130°C Operating Temperature Range –40°C to +80°C Storage Temperature Range –40°C to +100°C Notes: 1. Derate linearly as shown in Figure 3. 2. Duty factor 10%, Frequency 1kHz Electrical /Optical Characteristics Table TA = 25°C Parameter Symbol Min. Typ. Max. Units Test Conditions Forward Voltage Blue (λd = 470 nm) Green (λd = 525 nm) VF 3.2 3.2 3.7 3.9 V IF = 20 mA Reverse Voltage VR Capacitance Blue (λd = 470 nm) Green (λd = 525 nm) C 40 pF VF = 0, f = 1 MHz Thermal Resistance RθJ-PIN 240 °C/W LED Junction-to-Cathode Lead Viewing Angle Major Axis Minor Axis 2θ1/2 100 40 deg Peak Wavelength Blue (λd = 470 nm) Green (λd = 525 nm) λP 467 520 nm Peak of Wavelength of Spectral Distribution at IF = 20 mA Spectral Halfwidth Blue (λd = 470 nm) Green (λd = 525 nm) ∆λ1/2 24 35 nm Wavelength Width at Spectral Distribution Power Point at IF = 20 mA Luminous Efficacy Blue (λd = 470 nm) Green (λd = 525 nm) ηv 75 520 lm/W Emitted luminous power/Emitted radiant power IR = 10 µA 5 Notes: 1. 2θ1/2 is the off-axis angle where the luminous intensity is 1/2 the on axis intensity. 2. The radiant intensity, Ie in watts per steradian, may be found from the equation Ie = Iv/ηv where Iv is the luminous intensity in candelas and ηv is the luminous efficacy in lumens/watt. 4 RELATIVE LUMINOUS INTENSITY 1.0 BLUE GREEN 0.8 0.6 0.4 0.2 0 400 450 550 500 600 650 700 WAVELENGTH – nm RELATIVE LUMINOUS INTENSITY (NORMALIZED AT 20 mA) 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0 0 5 10 15 20 25 30 MAXIMUM FORWARD CURRENT – mA Figure 1. Relative intensity vs. wavelength. 35 30 25 20 15 10 5 0 0 Figure 2. Relative luminous intensity vs. forward current. 25 20 15 10 5 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 FORWARD VOLTAGE – V Figure 4. Forward current vs. forward voltage. 5 Figure 3. Forward current vs. ambient temperature. RELATIVE DOMINANT WAVELENGTH FORWARD CURRENT – mA 30 10 20 30 40 50 60 70 80 90 AMBIENT TEMPERATURE – °C FORWARD CURRENT – mA 1.035 1.030 1.025 GREEN 1.020 1.015 1.010 1.005 BLUE 1.000 0.995 0.990 0.985 0 5 10 15 20 25 FORWARD CURRENT – mA Figure 5. Relative dominant wavelength vs. forward current. 30 RELATIVE INTENSITY 1.0 0.5 0 -90 -70 -50 -30 -10 10 30 50 70 90 30 50 70 90 ANGLE – DEGREES Figure 6. Spatial radiation pattern – minor axis. RELATIVE INTENSITY 1.0 0.5 0 -90 -70 -50 -30 -10 10 ANGLE – DEGREES Figure 7. Spatial radiation pattern – major axis. Intensity Bin Limits (mcd @ 20 mA) Bin Name Min. Max. F 110 140 G 140 180 H 180 240 J 240 310 K 310 400 L 400 520 M 520 680 N 680 880 P 880 1150 Q 1150 1500 R 1500 1900 Tolerance will be ±15% of these limits. 6 Green Color Bin Table Bin Min. Dom. Max. Dom. 1 520.0 524.0 2 524.0 528.0 3 528.0 532.0 4 532.0 536.0 5 536.0 540.0 Xmin. Ymin. Xmax. Ymax. 0.0743 0.8338 0.1856 0.6556 0.1650 0.6586 0.1060 0.8292 0.1060 0.8292 0.2068 0.6463 0.1856 0.6556 0.1387 0.8148 0.1387 0.8148 0.2273 0.6344 0.2068 0.6463 0.1702 0.7965 0.1702 0.7965 0.2469 0.6213 0.2273 0.6344 0.2003 0.7764 0.2003 0.7764 0.2659 0.6070 0.2469 0.6213 0.2296 0.7543 Xmin. Ymin. Xmax. Ymax. 0.1440 0.0297 0.1766 0.0966 0.1818 0.0904 0.1374 0.0374 0.1374 0.0374 0.1699 0.1062 0.1766 0.0966 0.1291 0.0495 0.1291 0.0495 0.1616 0.1209 0.1699 0.1062 0.1187 0.0671 0.1187 0.0671 0.1517 0.1423 0.1616 0.1209 0.1063 0.0945 0.1063 0.0945 0.1397 0.1728 0.1517 0.1423 0.0913 0.1327 Tolerance for each bin limit is ± 0.5 nm Blue Color Bin Table Bin Min. Dom. Max. Dom. 1 460.0 464.0 2 464.0 468.0 3 468.0 472.0 4 472.0 476.0 5 476.0 480.0 Tolerance for each bin limit is ± 0.5 nm Note: 1. All bin categories are established for classification of products. Products may not be available in all bin categories. Please contact your Avago representative for further information. 7 Avago Color Bin on CIE Chromaticity Diagram CIE 1931 – Chromaticity Diagram 1.000 0.800 Green 1 2 3 4 5 0.600 Y 0.400 0.200 Blue 5 4 3 2 1 0.000 0.000 0.200 0.400 X 8 0.600 0.800 Relative Light Output vs. Junction Temperature 1.2 RELATIVE LIGHT OUTPUT (NORMALIZED AT TJ = 25°C) BLUE 1.0 GREEN 0.8 0.6 0.4 0.2 0 -40 -20 0 20 40 60 80 TJ – JUNCTION TEMPERATURE – °C Precautions: Lead Forming • The leads of an LED lamp may be preformed or cut to length prior to insertion and soldering into PC board. • If lead forming is required before soldering, care must be taken to avoid any excessive mechanical stress induced to LED package. Otherwise, cut the leads of LED to length after soldering process at room temperature. The solder joint formed will absorb the mechanical stress of the lead cutting from traveling to the LED chip die attach and wirebond. • For better control, it is recommended to use proper tool to precisely form and cut the leads to applicable length rather than doing it manually. Soldering Conditions • Care must be taken during PCB assembly and soldering process to prevent damage to LED component. • The closest LED is allowed to solder on board is 1.59 mm below the body (encapsulant epoxy) for those parts without standoff. • Recommended soldering conditions: 9 Pre-heat Temperature Pre-heat Time Wave Soldering 105 °C Max. 30 sec Max. Manual Solder Dipping – – Peak Temperature Dwell Time 250 °C Max. 3 sec Max. 260 °C Max. 5 sec Max. • Wave soldering parameter must be set and maintained according to recommended temperature and dwell time in the solder wave. Customer is advised to periodically check on the soldering profile to ensure the soldering profile used is always conforming to recommended soldering condition. Notes: 1. PCB with different size and design (component density) will have different heat mass (heat capacity). This might cause a change in temperature experienced by the board if same wave soldering setting is used. So, it is recommended to recalibrate the soldering profile again before loading a new type of PCB. 2. Avago Technologies' high brightness LED are using high efficiency LED die with single wire bond as shown below. Customer is advised to take extra precaution during wave soldering to ensure that the maximum wave temperature is not exceeding 250° C. Overstressing the LED during soldering process might cause premature failure to the LED due to delamination. Avago Technologies LED Configuration CATHODE Note: Electrical connection between bottom surface of LED die and the lead frame material through conductive paste of solder. • If necessary, use fixture to hold the LED component in proper orientation with respect to the PCB during soldering process. • At elevated temperature, the LED is more susceptible to mechanical stress. Therefore, PCB must be allowed to cool down to room temperature prior to handling, which includes removal of jigs, fixtures or pallet. • Special attention must be given to board fabrication, solder masking, surface platting and lead holes size and component orientation to assure the solderability. • Recommended PC board plated through hole sizes for LED component leads: LED Component Lead Size 0.457 x 0.457 mm (0.018 x 0.018 inch) 0.508 x 0.508 mm (0.020 x 0.020 inch) Note: Refer to application note AN1027 for more information on soldering LED components. • Over sizing of plated through hole can lead to twisting or improper LED placement during auto insertion. Under sizing plated through hole can lead to mechanical stress on the epoxy lens during clinching. HOT AIR KNIFE TOP SIDE OF PC BOARD 200 TEMPERATURE – °C Plated Through Hole Diameter 0.976 to 1.078 mm (0.038 to 0.042 inch) 1.049 to 1.150 mm (0.041 to 0.045 inch) LAMINAR WAVE TURBULENT WAVE 250 BOTTOM SIDE OF PC BOARD 150 FLUXING CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN) PREHEAT SETTING = 150°C (100°C PCB) SOLDER WAVE TEMPERATURE = 245°C ± 5°C AIR KNIFE AIR TEMPERATURE = 390°C AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.) AIR KNIFE ANGLE = 40° LEAD SOLDER: SN63; FLUX: RMA LEAD FREE SOLDER: 96.5% Sn, 3.0% Ag, 0.5% Cu 100 50 30 NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED BEFORE EXERTING MECHANICAL FORCE. PREHEAT 0 10 20 30 40 50 TIME – SECONDS Figure 8. Recommended wave soldering profile. 10 Diagonal 0.646 mm (0.025 inch) 0.718 mm (0.028 inch) 60 70 80 90 100 Ammo Packs Drawing 6.35 ± 1.30 (0.25 ± 0.0512) 12.70 ± 1.00 (0.50 ± 0.0394) CATHODE 20.5 ± 1.00 (0.8071 ± 0.0394) 9.125 ± 0.625 (0.3593 ± 0.025) 18.00 ± 0.50 (0.7087 ± 0.0197) A 12.70 ± 0.30 (0.50 ± 0.0118) 0.70 ± 0.20 (0.0276 ± 0.0079) A ∅ 4.00 ± 0.20 TYP. (0.1575 ± 0.0079) VIEW A–A ALL DIMENSIONS IN MILLIMETERS (INCHES). Note: The ammo-packs drawing is applicable for packaging option -DD & -ZZ and regardless of standoff or non-standoff. Packaging Box Ammo Packs LABEL ON THIS SIDE OF BOX. FROM LEFT SIDE OF BOX, ADHESIVE TAPE MUST BE FACING UPWARDS. A + O AN O AG ES AV LOGI DE NO HO – CH AT DE TE C ANODE LEAD LEAVES THE BOX FIRST. C L BE LA ER TH MO Note: For InGaN device, the ammo pack packaging box contains ESD logo. 11 DISCLAIMER AVAGO’S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALLY DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OPERATION OF A NUCLEAR FACILITY OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLELY RESPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EXPENSE OR LIABILITY IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our website: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright © 2007 Avago Technologies Limited. All rights reserved. Obsoletes 5989-4145EN AV02-0206EN March 20, 2007 12