MOTOROLA MC14024B 7-stage ripple counter Datasheet

! SEMICONDUCTOR TECHNICAL DATA
! " #"
L SUFFIX
CERAMIC
CASE 632
The MC14024B is a 7–stage ripple counter with short propagation delays
and high maximum clock rates. The Reset input has standard noise
immunity, however the Clock input has increased noise immunity due to
Hysteresis. The output of each counter stage is buffered.
•
•
•
•
Diode Protection on All Inputs
Output Transitions Occur on the Falling Edge of the Clock Pulse
Supply Voltage Range = 3.0 Vdc to 18 Vdc
Capable of Driving Two Low–power TTL Loads or One Low–power
Schottky TTL Load Over the Rated Temperature Range
• Pin–for–Pin Replacement for CD4024B
P SUFFIX
PLASTIC
CASE 646
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D SUFFIX
SOIC
CASE 751A
MAXIMUM RATINGS* (Voltages Referenced to VSS)
Symbol
VDD
Parameter
DC Supply Voltage
Value
Unit
– 0.5 to + 18.0
V
Vin, Vout
Input or Output Voltage (DC or Transient)
– 0.5 to VDD + 0.5
V
lin, lout
Input or Output Current (DC or Transient),
per Pin
± 10
mA
PD
Power Dissipation, per Package†
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
260
_C
TL
Lead Temperature (8–Second Soldering)
* Maximum Ratings are those values beyond which damage to the device may occur.
†Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/_C From 65_C To 125_C
Ceramic “L” Packages: – 12 mW/_C From 100_C To 125_C
LOGIC DIAGRAM
1
C
CLOCK
Q
C
Q
C
Q
C
ORDERING INFORMATION
MC14XXXBCP
MC14XXXBCL
MC14XXXBD
Plastic
Ceramic
SOIC
TA = – 55° to 125°C for all packages.
PIN ASSIGNMENT
CLOCK
1
14
VDD
RESET
2
13
NC
Q7
3
12
Q1
Q6
4
11
Q2
Q5
5
10
NC
Q4
6
9
Q3
VSS
7
8
NC
Q
VDD = PIN 14
VSS = PIN 7
NC = NO CONNECTION
R
Q
R
Q
R
Q
R
Q
2
RESET
12
Q1
11
Q2
4
Q6
3
Q7
Q3 = PIN 9
Q4 = PIN 6
Q5 = PIN 5
REV 3
1/94
MC14024B
Motorola, Inc. 1995
100
MOTOROLA CMOS LOGIC DATA
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ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
Characteristic
Symbol
– 55_C
25_C
125_C
VDD
Vdc
Min
Max
Min
Typ #
Max
Min
Max
Unit
Output Voltage
Vin = VDD or 0
“0” Level
VOL
5.0
10
15
—
—
—
0.05
0.05
0.05
—
—
—
0
0
0
0.05
0.05
0.05
—
—
—
0.05
0.05
0.05
Vdc
Vin = 0 or VDD
“1” Level
VOH
5.0
10
15
4.95
9.95
14.95
—
—
—
4.95
9.95
14.95
5.0
10
15
—
—
—
4.95
9.95
14.95
—
—
—
Vdc
5.0
10
15
—
—
—
1.5
3.0
4.0
—
—
—
2.25
4.50
6.75
1.5
3.0
4.0
—
—
—
1.5
3.0
4.0
5.0
10
15
3.5
7.0
11
—
—
—
3.5
7.0
11
2.75
5.50
8.25
—
—
—
3.5
7.0
11
—
—
—
5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
—
—
—
—
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
—
—
—
—
– 1.7
– 0.36
– 0.9
– 2.4
—
—
—
—
IOL
5.0
10
15
0.64
1.6
4.2
—
—
—
0.51
1.3
3.4
0.88
2.25
8.8
—
—
—
0.36
0.9
2.4
—
—
—
mAdc
Input Current
Iin
15
—
± 0.1
—
± 0.00001
± 0.1
—
± 1.0
µAdc
Input Capacitance
(Vin = 0)
Cin
—
—
—
—
5.0
7.5
—
—
pF
Quiescent Current
(Per Package)
IDD
5.0
10
15
—
—
—
5.0
10
20
—
—
—
0.005
0.010
0.015
5.0
10
20
—
—
—
150
300
600
µAdc
IT
5.0
10
15
Input Voltage
“0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL
(VO = 0.5 or 4.5 Vdc) “1” Level
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH
Output Drive Current
(VOH = 2.5 Vdc)
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
(VOL = 0.4 Vdc)
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
Vdc
IOH
Source
Sink
Total Supply Current**†
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
Vdc
mAdc
IT = (0.31 µA/kHz) f + IDD
IT = (0.60 µA/kHz) f + IDD
IT = (1.89 µA/kHz) f + IDD
µAdc
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
** The formulas given are for the typical characteristics only at 25_C.
†To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.001.
This device contains protection circuitry to guard against damage due to high static voltages or electric fields. However,
precautions must be taken to avoid applications of any voltage higher than maximum rated voltages to this high-impedance
circuit. For proper operation, Vin and Vout should be constrained to the range VSS ≤ (Vin or Vout) ≤ VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g., either VSS or VDD). Unused outputs must
be left open.
MOTOROLA CMOS LOGIC DATA
MC14024B
101
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ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS* (CL = 50 pF, TA = 25_C)
Characteristic
Symbol
Output Rise and Fall Time
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL
Propagation Delay Time
Clock to Q1
tPLH, tPHL = (1.7 ns/pF) CL + 295 ns
tPLH, tPHL = (0.66 ns/pF) CL + 117 ns
tPLH, tPHL = (0.5 ns/pF) CL + 85 ns
Clock to Q7
tPLH, tPHL = (1.7 ns/pF) CL + 915 ns
tPLH, tPHL = (0.66 ns/pF) CL + 367 ns
tPLH, tPHL = (0.5 ns/pF) CL + 275 ns
Reset to Qn
tPLH, tPHL = (1.7 ns/pF) CL + 415 ns
tPLH, tPHL = (0.66 ns/pF) CL + 217 ns
tPLH, tPHL = (0.5 ns/pF) CL + 155 ns
tPLH,
tPHL
Clock Pulse Width
VDD
Min
Typ #
Max
5.0
10
15
—
—
—
100
50
40
200
100
80
Unit
ns
ns
5.0
10
15
—
—
—
380
150
110
600
230
175
5.0
10
15
—
—
—
1000
400
300
2000
750
565
5.0
10
15
—
—
—
500
250
180
800
400
300
tWH
5.0
10
15
500
165
125
200
60
40
—
—
—
ns
Reset Pulse Width
tWH
5.0
10
15
600
350
260
375
200
150
—
—
—
ns
Reset Removal Time
trem
5.0
10
15
625
190
145
250
75
50
—
—
—
ns
tTLH, tTHL
5.0
10
15
—
—
—
—
—
—
1.0
8.0
200
s
ms
µs
fcl
5.0
10
15
—
—
—
2.5
8.0
12
1.0
3.0
4.0
MHz
Clock Input Rise and Fall Time
Input Pulse Frequency
* The formulas given are for the typical characteristics only at 25_C.
#Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
TRUTH TABLE
MC14024B
102
Clock
Reset
State
0
0
No Change
0
1
All Outputs Low
1
0
No Change
1
1
All Outputs Low
0
No Change
1
All Outputs Low
0
Advance One Count
1
All Outputs Low
MOTOROLA CMOS LOGIC DATA
VDD
VDD
VDD
VOL = Vout
C Qn
C Qn
IOH
R
COUNT Qn TO A
LOGIC “1” LEVEL.
VSS
VOH = Vout
IOL
R
EXTERNAL
POWER
SUPPLY
VSS
Figure 1. Typical Output Source
Characteristics Test Circuit
EXTERNAL
POWER
SUPPLY
Figure 2. Typical Output Sink
Characteristics Test Circuit
VDD
500 µF
PULSE
GENERATOR
0.01 µF
CERAMIC
ID
f
C Q1
Q2
Q3
Q4
Q5
Q6
R Q7
CL
CL
CL
CL
CL
CL
CL
VSS
Figure 3. Power Dissipation Test Circuit
MOTOROLA CMOS LOGIC DATA
MC14024B
103
Figure 4. Functional Waveforms
MC14024B
104
MOTOROLA CMOS LOGIC DATA
Q7 (3)
Q6 (4)
Q5 (5)
Q4 (6)
Q3 (9)
Q2 (11)
Q1 (12)
RESET (2)
CLOCK (1)
t rem
1
t WH
t TLH
t PLH1
t WL
2
t PLH3
t TLH
10%
90%
50%
t PHL1
4
8
t TLH
t PLH4
50%
t PHL2
Input t TLH and t THL = 20 ns
t PLH2
t TLH
10%
90%
50%
t PLH5
t TLH
50%
t PHL3
16
t TLH
t PLH6
50%
t PHL4
32
t PHL6
t TLH
t PLH7
50%
t PHL5
64
t THL
t PHL7
50%
t THL
t THL
t THL
t THL
t THL
128
t THL
10%
90%
255
t R7
t R6
t R5
t R4
t R3
t R2
t R1
50%
VOL
VOH
VOL
VOH
VOL
VOH
VOL
VOH
VOL
VOH
VOL
VOH
VOL
VOH
VSS
VDD
VSS
VDD
OUTLINE DIMENSIONS
L SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
–A–
14
9
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMENSION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
–B–
C
–T–
L
K
SEATING
PLANE
F
G
D
N
M
J
14 PL
0.25 (0.010)
M
T A
S
14 PL
0.25 (0.010)
M
T B
P SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
8
1
7
B
A
F
L
C
J
N
H
G
D
SEATING
PLANE
MOTOROLA CMOS LOGIC DATA
K
M
S
DIM
A
B
C
D
F
G
J
K
L
M
N
INCHES
MIN
MAX
0.750
0.785
0.245
0.280
0.155
0.200
0.015
0.020
0.055
0.065
0.100 BSC
0.008
0.015
0.125
0.170
0.300 BSC
0_
15_
0.020
0.040
MILLIMETERS
MIN
MAX
19.05
19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0_
15_
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
DIM
A
B
C
D
F
G
H
J
K
L
M
N
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
MC14024B
105
OUTLINE DIMENSIONS
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
–A–
14
8
–B–
1
P 7 PL
0.25 (0.010)
7
G
M
F
–T–
M
K
D 14 PL
0.25 (0.010)
M
T B
S
M
R X 45 _
C
SEATING
PLANE
B
A
S
J
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337
0.344
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.228
0.244
0.010
0.019
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MC14024B
106
◊
*MC14024B/D*
MOTOROLA CMOS LOGIC
DATA
MC14024B/D
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