1.1mm [0.043"] 1.1mm [0.043"] 12.8mm [0.504"] 0.8mm typ. 15mm [0.591"] Top View 15mm square [0.591"] 1 4.55mm [0.179"] 2.96mm [0.116"] 2 Side View 0.2mm dia. [0.008"] 1 Substrate: 1.59mm ±0.18mm [0.0625" ±0.007"] FR4/G10 or equivalent high temp material. non clad 2 Pins: material- Brass Alloy 360 1/2 hard; finish0.25µm [10µ"] Au over 1.27µm [50µ"] Ni (min.). Description: Giga-snaP BGA Land Socket 257 position BGA land pattern to terminal pins (0.8mm centers, 17x17 array) RoHS Tolerances: diameters ±0.03mm [±0.001”], PCB perimeters ±0.13mm [±0.005”], PCB thicknesses ±0.18mm [±0.007"], pitches (from true position) ±0.08mm [±0.003"], all other tolerances ±0.13mm [±0.005”] unless stated otherwise. Materials and specifications are subject to change without notice. LS-BGA257D-61 Drawing © 2012 IRONWOOD ELECTRONICS, INC. Tele: (800) 404-0204 www.ironwoodelectronics.com Status: Released Scale: 8:1 Rev: B Drawing: S. Huang Date: 5/17/2012 File: LS-BGA257D-61 Dwg.mcd Modified: 01/18/13, DH