ON MC74HC4040ADTR2G 12−stage binary ripple counter high−performance silicon−gate cmo Datasheet

MC74HC4040A
12−Stage Binary Ripple
Counter
High−Performance Silicon−Gate CMOS
The MC74C4040A is identical in pinout to the standard CMOS
MC14040. The device inputs are compatible with standard CMOS
outputs; with pullup resistors, they are compatible with LSTTL
outputs.
This device consists of 12 master−slave flip−flops. The output of
each flip−flop feeds the next and the frequency at each output is half of
that of the preceding one. The state counter advances on the
negative−going edge of the Clock input. Reset is asynchronous and
active−high.
State changes of the Q outputs do not occur simultaneously because
of internal ripple delays. Therefore, decoded output signals are subject
to decoding spikes and may have to be gated with the Clock of the
HC4040A for some designs.
MARKING
DIAGRAMS
16
PDIP−16
N SUFFIX
CASE 648
16
1
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2.0 to 6.0 V
Low Input Current: 1 mA
High Noise Immunity Characteristic of CMOS Devices
In Compliance With JEDEC Standard No. 7A Requirements
Chip Complexity: 398 FETs or 99.5 Equivalent Gates
Pb−Free Packages are Available*
MC74HC4040AN
AWLYYWWG
1
16
SOIC−16
D SUFFIX
CASE 751B
16
Features
•
•
•
•
•
•
•
•
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1
HC4040AG
AWLYWW
1
16
16
1
TSSOP−16
DT SUFFIX
CASE 948F
HC40
40A
ALYWG
G
1
16
16
1
SOEIAJ−16
F SUFFIX
CASE 966
74HC4040A
ALYWG
1
A
= Assembly Location
L, WL
= Wafer Lot
Y, YY
= Year
W, WW = Work Week
G
= Pb−Free Package
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2005
June, 2005 − Rev. 5
1
Publication Order Number:
MC74HC4040A/D
MC74HC4040A
FUNCTION TABLE
Clock
9
7
6
5
3
2
4
13
12
14
10
15
1
Reset
11
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Clock
Reset
Output State
X
L
L
H
No Charge
Advance to Next State
All Outputs Are Low
VCC
Q11
Q10
Q8
Q9
16
15
14
13
12
Q11
Q12
Pin 16 = VCC
Pin 8 = GND
Figure 1. Logic Diagram
Reset Clock
11
Q1
10
9
8
GND
1
2
3
4
5
6
7
Q12
Q6
Q5
Q7
Q4
Q3
Q2
Figure 2. Pinout: 16−Lead Plastic Package
(Top View)
ORDERING INFORMATION
Package
Shipping †
MC74HC4040AN
PDIP−16
2000 Units / Box
MC74HC4040ANG
PDIP−16
(Pb−Free)
2000 Units / Box
MC74HC4040AD
SOIC−16
48 Units / Rail
MC74HC4040ADG
SOIC−16
(Pb−Free)
48 Units / Rail
MC74HC4040ADR2
SOIC−16
2500 Units / Reel
MC74HC4040ADR2G
SOIC−16
(Pb−Free)
2500 Units / Reel
MC74HC4040ADTR2
TSSOP−16*
2500 Units / Reel
MC74HC4040ADTR2G
TSSOP−16*
2500 Units / Reel
MC74HC4040AF
SOEIAJ−16
50 Units / Rail
MC74HC4040AFG
SOEIAJ−16
(Pb−Free)
50 Units / Rail
MC74HC4040AFEL
SOEIAJ−16
2000 Units / Reel
MC74HC4040AFELG
SOEIAJ−16
(Pb−Free)
2000 Units / Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*This package is inherently Pb−Free.
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2
MC74HC4040A
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MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
– 0.5 to + 7.0
V
DC Input Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
VCC
DC Supply Voltage (Referenced to GND)
Vin
Vout
Iin
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air,
750
500
450
mW
Tstg
Storage Temperature Range
– 65 to + 150
_C
TL
Lead Temperature, 1 mm from Case for 10 Seconds
Plastic DIP, SOIC or TSSOP Package
Plastic DIP†
SOIC Package†
TSSOP Package†
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
_C
260
Maximum ratings are those values beyond which device damage can occur. Maximum ratings
applied to the device are individual stress limit values (not normal operating conditions) and are
not valid simultaneously. If these limits are exceeded, device functional operation is not implied,
damage may occur and reliability may be affected.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
TSSOP Package: − 6.1 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book (DL129/D).
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Min
Max
Unit
2.0
6.0
V
Vin, Vout
DC Input Voltage, Output Voltage (Referenced to GND)
0
VCC
V
TA
Operating Temperature Range, All Package Types
– 55
+ 125
_C
tr, tf
Input Rise and Fall Time
(Figure 1)
0
0
0
0
1000
600
500
400
ns
VCC = 2.0 V
VCC = 3.0 V
VCC = 4.5 V
VCC = 6.0 V
DC CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter
Condition
Guaranteed Limit
VCC
V
−55 to 25°C
≤85°C
≤125°C
Unit
VIH
Minimum High−Level Input Voltage
Vout = 0.1V or VCC −0.1V
|Iout| ≤ 20mA
2.0
3.0
4.5
6.0
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
1.50
2.10
3.15
4.20
V
VIL
Maximum Low−Level Input Voltage
Vout = 0.1V or VCC − 0.1V
|Iout| ≤ 20mA
2.0
3.0
4.5
6.0
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
0.50
0.90
1.35
1.80
V
VOH
Minimum High−Level Output Voltage
Vin = VIH or VIL
|Iout| ≤ 20mA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
3.0
4.5
6.0
2.48
3.98
5.48
2.34
3.84
5.34
2.20
3.70
5.20
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
|Iout| ≤ 2.4mA
|Iout| ≤ 4.0mA
|Iout| ≤ 5.2mA
Vin =VIH or VIL
VOL
Maximum Low−Level Output Voltage
Vin = VIH or VIL
|Iout| ≤ 20mA
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V
MC74HC4040A
DC CHARACTERISTICS (Voltages Referenced to GND)
Symbol
Parameter
Condition
|Iout| ≤ 2.4mA
|Iout| ≤ 4.0mA
|Iout| ≤ 5.2mA
Vin = VIH or VIL
Guaranteed Limit
VCC
V
−55 to 25°C
≤85°C
≤125°C
3.0
4.5
6.0
0.26
0.26
0.26
0.33
0.33
0.33
0.40
0.40
0.40
Unit
Iin
Maximum Input Leakage Current
Vin = VCC or GND
6.0
±0.1
±1.0
±1.0
mA
ICC
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0mA
6.0
4
40
160
mA
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book
(DL129/D).
AC CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Symbol
Parameter
Guaranteed Limit
VCC
V
−55 to 25°C
≤85°C
≤125°C
Unit
fmax
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 4)
2.0
3.0
4.5
6.0
10
15
30
50
9.0
14
28
45
8.0
12
25
40
MHz
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q1*
(Figures 1 and 4)
2.0
3.0
4.5
6.0
96
63
31
25
106
71
36
30
115
88
40
35
ns
tPHL
Maximum Propagation Delay, Reset to Any Q
(Figures 2 and 4)
2.0
3.0
4.5
6.0
45
30
30
26
52
36
35
32
65
40
40
35
ns
tPLH,
tPHL
Maximum Propagation Delay, Qn to Qn+1
(Figures 3 and 4)
2.0
3.0
4.5
6.0
69
40
17
14
80
45
21
15
90
50
28
22
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 4)
2.0
3.0
4.5
6.0
75
27
15
13
95
32
19
15
110
36
22
19
ns
10
10
10
pF
Cin
Maximum Input Capacitance
NOTE: For propagation delays with loads other than 50 pF, and information on typical parametric values, see Chapter 2 of the ON
Semiconductor High−Speed CMOS Data Book (DL129/D).
* For TA = 25°C and CL = 50 pF, typical propagation delay from Clock to other Q outputs may be calculated with the following equations:
VCC = 2.0 V: tP = [93.7 + 59.3 (n−1)] ns
VCC = 4.5 V: tP = [30.25 + 14.6 (n−1)] ns
VCC = 3.0 V: tP = [61.5 + 34.4 (n−1)] ns
VCC = 6.0V: tP = [24.4 + 12 (n−1)] ns
Typical @ 25°C, VCC = 5.0 V
CPD
31
Power Dissipation Capacitance (Per Package)*
* Used to determine the no−load dynamic power consumption: PD = CPD VCC
ON Semiconductor High−Speed CMOS Data Book (DL129/D).
2f + I
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4
CC
pF
VCC . For load considerations, see Chapter 2 of the
MC74HC4040A
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
Symbol
Parameter
Guaranteed Limit
VCC
V
−55 to 25°C
≤85°C
≤125°C
Unit
trec
Minimum Recovery Time, Reset Inactive to Clock
(Figure 2)
2.0
3.0
4.5
6.0
30
20
5
4
40
25
8
6
50
30
12
9
ns
tw
Minimum Pulse Width, Clock
(Figure 1)
2.0
3.0
4.5
6.0
70
40
15
13
80
45
19
16
90
50
24
20
ns
tw
Minimum Pulse Width, Reset
(Figure 2)
2.0
3.0
4.5
6.0
70
40
15
13
80
45
19
16
90
50
24
20
ns
1000
800
500
400
1000
800
500
400
1000
800
500
400
ns
tr, tf
Maximum Input Rise and Fall Times
(Figure 1)
2.0
3.0
4.5
6.0
NOTE: Information on typical parametric values can be found in Chapter 2 of the ON Semiconductor High−Speed CMOS Data Book
(DL129/D).
PIN DESCRIPTIONS
INPUTS
OUTPUTS
Q1 thru Q12 (Pins 9, 7, 6, 5, 3, 2, 4, 13, 12, 14, 15, 1)
Clock (Pin 10)
Active−high outputs. Each Qn output divides the Clock
input frequency by 2N.
Negative−edge triggering clock input. A high−to−low
transition on this input advances the state of the counter.
Reset (Pin 11)
Active−high reset. A high level applied to this input
asynchronously resets the counter to its zero state, thus
forcing all Q outputs low.
SWITCHING WAVEFORMS
tf
tr
90%
50%
10%
Clock
50%
trec
GND
tw
1/fMAX
tPLH
Q1
VCC
Clock
VCC
tw
Reset
tPHL
90%
50%
10%
Any Q
tTHL
Figure 3.
50%
Figure 4.
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5
VCC
50%
tPHL
tTLH
GND
GND
MC74HC4040A
SWITCHING WAVEFORMS (continued)
TEST
POINT
Qn
VCC
tPLH
Qn+1
OUTPUT
50%
DEVICE
UNDER
TEST
GND
tPHL
C L*
50%
*Includes all probe and jig capacitance
Figure 5.
Figure 6. Test Circuit
Q1
Q2
9
Clock
10
Q10
6
Q11
14
Q12
15
1
C
Q
C
Q
C
Q
C
Q
C
Q
C
C
Q
C
Q
C
Q
C
Q
C
Q
C
R
Reset
Q3
7
R
11
Q4 = Pin 5
Q5 = Pin 3
Q6 = Pin 2
Q7 = Pin 4
Q8 = Pin 13
Q9 = Pin 12
Figure 7. Expanded Logic Diagram
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6
VCC = Pin 16
GND = Pin 8
Q
MC74HC4040A
1
Clock
2
4
8
16
32
64
128
256
512
1024
2048
4096
Reset
Q1
Q2
Q3
Q4
Q5
Q6
Q7
Q8
Q9
Q10
Q11
Q12
Figure 8. Timing Diagram
APPLICATIONS INFORMATION
Time−Base Generator
waveform and feeds the HC4040A. Selecting outputs Q5,
Q10, Q11, and Q12 causes a reset every 3600 clocks. The
HC20 decodes the counter outputs, produces a single
(narrow) output pulse, and resets the binary counter. The
resulting output frequency is 1.0 pulse/minute.
A 60Hz sinewave obtained through a 100 K resistor
connected to a 120 Vac power line through a step down
transformer is applied to the input of the MC54/74HC14A,
Schmitt-trigger inverter. The HC14A squares−up the input
VCC
1.0M
120Vac
60Hz
HC4040A
Clock
≥20pF
Q5
Q10
Q11
Q12
NOTE:
13
12
10
9
Ground MUST be isolated
by a transformer or
opto−isolator for safety
reasons.
Figure 9. Time−Base Generator
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7
1/2
HC20
8
1
2
4
5
1/2
HC20
6
1.0 Pulse/Minute
Output
MC74HC4040A
PACKAGE DIMENSIONS
PDIP−16
N SUFFIX
CASE 648−08
ISSUE T
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS
WHEN FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE
MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
−A−
16
9
1
8
B
F
C
L
DIM
A
B
C
D
F
G
H
J
K
L
M
S
S
−T−
SEATING
PLANE
K
H
D
M
J
G
16 PL
0.25 (0.010)
T A
M
M
INCHES
MIN
MAX
0.740 0.770
0.250 0.270
0.145 0.175
0.015 0.021
0.040
0.70
0.100 BSC
0.050 BSC
0.008 0.015
0.110 0.130
0.295 0.305
0_
10 _
0.020 0.040
MILLIMETERS
MIN
MAX
18.80 19.55
6.35
6.85
3.69
4.44
0.39
0.53
1.02
1.77
2.54 BSC
1.27 BSC
0.21
0.38
2.80
3.30
7.50
7.74
0_
10 _
0.51
1.01
SOIC−16
D SUFFIX
CASE 751B−05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
−A−
16
9
−B−
1
P
8 PL
0.25 (0.010)
8
M
B
S
G
R
K
F
X 45 _
C
−T−
SEATING
PLANE
J
M
D
16 PL
0.25 (0.010)
M
T B
S
A
S
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8
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
9.80
10.00
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.386
0.393
0.150
0.157
0.054
0.068
0.014
0.019
0.016
0.049
0.050 BSC
0.008
0.009
0.004
0.009
0_
7_
0.229
0.244
0.010
0.019
MC74HC4040A
PACKAGE DIMENSIONS
TSSOP−16
DT SUFFIX
CASE 948F−01
ISSUE A
16X K REF
0.10 (0.004)
0.15 (0.006) T U
M
T U
V
S
S
S
ÇÇÇ
ÉÉÉ
ÇÇÇ
ÉÉÉ
ÇÇÇ
K
K1
2X
L/2
16
9
J1
B
−U−
L
SECTION N−N
J
PIN 1
IDENT.
8
1
N
0.15 (0.006) T U
S
0.25 (0.010)
A
−V−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD
FLASH. PROTRUSIONS OR GATE BURRS.
MOLD FLASH OR GATE BURRS SHALL NOT
EXCEED 0.15 (0.006) PER SIDE.
4. DIMENSION B DOES NOT INCLUDE
INTERLEAD FLASH OR PROTRUSION.
INTERLEAD FLASH OR PROTRUSION SHALL
NOT EXCEED 0.25 (0.010) PER SIDE.
5. DIMENSION K DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08
(0.003) TOTAL IN EXCESS OF THE K
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
6. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
7. DIMENSION A AND B ARE TO BE
DETERMINED AT DATUM PLANE −W−.
M
N
F
DETAIL E
−W−
C
0.10 (0.004)
−T− SEATING
PLANE
H
D
DETAIL E
G
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DIM
A
B
C
D
F
G
H
J
J1
K
K1
L
M
MILLIMETERS
MIN
MAX
4.90
5.10
4.30
4.50
−−−
1.20
0.05
0.15
0.50
0.75
0.65 BSC
0.18
0.28
0.09
0.20
0.09
0.16
0.19
0.30
0.19
0.25
6.40 BSC
0_
8_
INCHES
MIN
MAX
0.193 0.200
0.169 0.177
−−− 0.047
0.002 0.006
0.020 0.030
0.026 BSC
0.007
0.011
0.004 0.008
0.004 0.006
0.007 0.012
0.007 0.010
0.252 BSC
0_
8_
MC74HC4040A
PACKAGE DIMENSIONS
SOEIAJ−16
F SUFFIX
CASE 966−01
ISSUE O
16
LE
9
Q1
M_
E HE
1
8
L
DETAIL P
Z
D
e
VIEW P
A
DIM
A
A1
b
c
D
E
e
HE
L
LE
M
Q1
Z
A1
b
0.13 (0.005)
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
0.10 (0.004)
MILLIMETERS
MIN
MAX
−−−
2.05
0.05
0.20
0.35
0.50
0.18
0.27
9.90
10.50
5.10
5.45
1.27 BSC
7.40
8.20
0.50
0.85
1.10
1.50
0_
10 _
0.70
0.90
−−−
0.78
INCHES
MIN
MAX
−−− 0.081
0.002
0.008
0.014
0.020
0.007
0.011
0.390
0.413
0.201
0.215
0.050 BSC
0.291
0.323
0.020
0.033
0.043
0.059
10 _
0_
0.028
0.035
−−− 0.031
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MC74HC4040A/D
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