ATS ATS-59009-C2-R0 Custom high performance cooling Datasheet

Custom High Performance Cooling
Solutions w/ maxiGRIP™ Attachment
ATS PART # ATS-59009-C2-R0
D
Features & Benefits
»
Designed for flip-chip processors such as Freescale MPCs
»
maxiGRIP™ attachment applies steady, even pressure to
the component and does not require holes in the PCB
»
Comes preassembled with high performance thermal
interface material
A
B
C
Thermal Performance
*Image above is for illustration purposes only.
AIR VELOCITY
THERMAL RESISTANCE
FT/MIN
M/S
°C/W (UNDUCTED FLOW)
°C/W (DUCTED FLOW)
200
1.0
3.2
1.8
300
1.5
2.6
400
2.0
2.1
500
2.5
1.9
600
3.0
1.7
700
3.5
1.5
800
4.0
1.4
Product Details
DIMENSION A
DIMENSION B
DIMENSION C
DIMENSION D
62 mm
52 mm
13 mm
52 mm
INTERFACE MATERIAL
FINISH
SAINT-GOBAIN C675
BLACK-ANODIZED
NOTES:
1)
2)
3)
4)
Dimension C = heat sink height from bottom of the base to the top of the fin field.
Thermal performance data are provided for reference only. Actual performance may vary
by application.
ATS reserves the right to update or change its products without notice to improve the
design or performance.
Contact ATS to learn about custom options available.
For more information, to find a distributor or to place an order, visit www.qats.com or
call: 781.769.2800 (North America); +31 (0) 3569 84715 (Europe).
REV2_111408
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