Material Content Data Sheet Sales Product Name TLE7469G V52 MA# MA000616592 Package PG-DSO-12-11 Issued 28. August 2013 Weight* 402.01 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal inorganic material non noble metal noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin phosphorus nickel silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7723-14-0 7440-02-0 7440-22-4 7440-31-5 7439-92-1 3.559 0.89 0.230 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.89 8852 8852 573 0.069 0.02 230.106 57.23 57.31 572396 172 573141 0.155 0.04 0.04 385 385 0.316 0.08 787 14.547 3.62 143.252 35.63 39.33 356344 36185 393316 4.235 1.05 1.05 10535 10535 0.002 0.00 0.630 0.16 0.123 0.03 0.098 0.02 4.684 1.17 4 0.16 1567 244 1.22 11651 Sum in total: 100,00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 1571 305 12200 1000000