Intersil ISL83220E ±15kv esd protected, 3v to 5.5v, 1microamp, 250kbps, rs-232 transmitters/receiver Datasheet

ISL83220E
®
Data Sheet
April 27, 2006
±15kV ESD Protected, +3V to +5.5V,
1Microamp, 250kbps, RS-232
Transmitters/Receivers
FN6011.5
Features
• Pb-Free Plus Anneal Available (RoHS Compliant)
The Intersil ISL83220E is a 3.0V to 5.5V powered RS-232
transmitter/receiver which meets ElA/TIA-232 and V.28/V.24
specifications, even at VCC = 3.0V. Additionally, it provides
±15kV ESD protection (IEC61000-4-2 Air Gap and Human
Body Model) on transmitter outputs and receiver inputs
(RS-232 pins). Targeted applications are PDAs, Palmtops,
and notebook and laptop computers where the low
operational, and even lower standby, power consumption is
critical. Efficient on-chip charge pumps, coupled with a
manual powerdown function, reduce the standby supply
current to a 1μA trickle. Small footprint packaging, and the
use of small, low value capacitors ensure board space
savings as well. Data rates greater than 250kbps are
guaranteed at worst case load conditions. This family is fully
compatible with 3.3V only systems, mixed 3.3V and 5.0V
systems, and 5.0V only systems.
Table 1 summarizes the features of the ISL83320E, while
Application Note AN9863 summarizes the features of each
device comprising the ICL32XXE 3V family.
• ESD Protection for RS-232 I/O Pins to ±15kV (IEC61000)
• Drop in Replacement for SP3220E
• Meets EIA/TIA-232 and V.28/V.24 Specifications at 3V
• RS-232 Compatible Outputs at 2.7V
• Latch-Up Free
• On-Chip Voltage Converters Require Only Four External
0.1μF Capacitors
• Manual Powerdown Feature with Receivers Active
• Separate Receiver Enable Pin
• RX and TX Hysteresis For Improved Noise Immunity
• Guaranteed Minimum Data Rate . . . . . . . . . . . . . 250kbps
• Guaranteed Minimum Slew Rate . . . . . . . . . . . . . . . 6V/μs
• Wide Power Supply Range . . . . . . . Single +3V to +5.5V
• Low Supply Current in Powerdown State. . . . . . . . . . .1μA
Applications
• Any System Requiring RS-232 Communication Ports
- Battery Powered, Hand-Held, and Portable Equipment
- Laptop Computers, Notebooks, Palmtops
- Modems, Printers and other Peripherals
- Digital Cameras
- Cellular/Mobile Phones
Related Literature
• Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
TABLE 1. SUMMARY OF FEATURES
NO. OF NO. OF
PART NUMBER
Tx.
Rx.
ISL83220E
1
1
1
NO. OF
MONITOR Rx.
(ROUTB)
DATA
RATE
(kbps)
Rx. ENABLE
FUNCTION?
READY
OUTPUT?
MANUAL
POWERDOWN?
AUTOMATIC
POWERDOWN
FUNCTION?
0
250
Yes
No
Yes
No
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2004, 2006. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL83220E
Pinout
Ordering Information
ISL83220E (TSSOP)
TOP VIEW
PART NUMBER
PART
MARKING
TEMP.
RANGE
(°C)
PACKAGE
PKG.
DWG. #
16 SHDN
EN 1
C1+ 2
15 VCC
V+ 3
14 GND
C1- 4
13 T1OUT
C2+ 5
12 N.C.
C2- 6
11 T1IN
V- 7
10 N.C.
9 R1OUT
R1IN 8
ISL83220ECV
83220ECV
0 to 70 16 Ld TSSOP M16.173
ISL83220ECV-T
83220ECV
0 to 70 16 Ld TSSOP M16.173
Tape and Reel
ISL83220ECVZ
(See Note)
83220ECVZ
0 to 70 16 Ld TSSOP M16.173
(Pb-Free)
ISL83220ECVZ-T 83220ECVZ
(See Note)
0 to 70 16 Ld TSSOP M16.173
(Pb-Free)
Tape and Reel
ISL83220EIV
83220EIV
-40 to 85 16 Ld TSSOP M16.173
ISL83220EIV-T
83220EIV
-40 to 85 16 Ld TSSOP M16.173
Tape and Reel
ISL83220EIVZ
(See Note)
83220EIVZ
-40 to 85 16 Ld TSSOP M16.173
(Pb-Free)
ISL83220EIVZ-T
(See Note)
83220EIVZ
-40 to 85 16 Ld TSSOP M16.173
(Pb-Free)
Tape and Reel
NOTE: Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations. Intersil
Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
Pin Descriptions
PIN
VCC
FUNCTION
System power supply input (3.0V to 5.5V).
V+
Internally generated positive transmitter supply (+5.5V).
V-
Internally generated negative transmitter supply (-5.5V).
GND
Ground connection.
C1+
External capacitor (voltage doubler) is connected to this lead.
C1-
External capacitor (voltage doubler) is connected to this lead.
C2+
External capacitor (voltage inverter) is connected to this lead.
C2-
External capacitor (voltage inverter) is connected to this lead.
TIN
TTL/CMOS compatible transmitter Inputs.
TOUT
RIN
ROUT
EN
SHDN
N.C.
±15kV ESD Protected, RS-232 level (nominally ±5.5V) transmitter outputs.
±15kV ESD Protected, RS-232 compatible receiver inputs.
TTL/CMOS level receiver outputs.
Active low receiver enable control; doesn’t disable ROUTB outputs.
Active low input shuts down transmitters and on-board power supply, to place device in low power mode.
No internal connection.
2
ISL83220E
Typical Operating Circuit
ISL83220E
+3.3V
C1
0.1μF
C2
0.1μF
T1IN
TTL/CMOS
LOGIC LEVELS
R1OUT
+
0.1μF
2
+ C1+
4
C15
+ C2+
6
C211
15
VCC
3
V+
V- 7
+ C3
0.1μF
C4
+ 0.1μF
T1
13
9
8
T1OUT
R1IN
5kΩ
R1
1 EN
16
GND
14
3
SHDN
VCC
RS-232
LEVELS
ISL83220E
Absolute Maximum Ratings
Thermal Information
VCC to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
V+ to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V
V- to Ground. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3V to -7V
V+ to V- . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14V
Input Voltages
TIN, EN, SHDN. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 6V
RIN . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25V
Output Voltages
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±13.2V
ROUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC +0.3V
Short Circuit Duration
TOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . See Specification Table
Thermal Resistance (Typical, Note 1)
θJA (°C/W)
16 Ld TSSOP Package . . . . . . . . . . . . . . . . . . . . . .
145
Maximum Junction Temperature (Plastic Package) . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300°C
(Lead Tips Only)
Operating Conditions
Temperature Range
ISL83220ECV . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1μF; Unless Otherwise Specified.
Typicals are at TA = 25°C
Electrical Specifications
PARAMETER
TEMP
(°C)
MIN
TYP
MAX
UNITS
25
-
0.3
1.0
mA
25
-
1.0
10
μA
Full
-
-
0.8
V
VCC = 3.3V
Full
2.0
-
-
V
VCC = 5.0V
Full
2.4
-
-
V
25
-
0.3
TEST CONDITIONS
DC CHARACTERISTICS
Supply Current
All Outputs Unloaded,
SHDN = VCC
Supply Current, Powerdown
SHDN = GND
VCC = 3.15V
LOGIC AND TRANSMITTER INPUTS AND RECEIVER OUTPUTS
Input Logic Threshold Low
TIN, EN, SHDN
Input Logic Threshold High
TIN, EN, SHDN
Transmitter Input Hysteresis
V
Input Leakage Current
TIN, EN, SHDN
Full
-
±0.01
±1.0
μA
Output Leakage Current
EN = VCC
Full
-
±0.05
±10
μA
Output Voltage Low
IOUT = 1.6mA
Full
-
-
0.4
V
Output Voltage High
IOUT = -1.0mA
Full
-
V
VCC -0.6 VCC -0.1
TRANSMITTER OUTPUTS
Output Voltage Swing
All Transmitter Outputs Loaded with 3kΩ to Ground
Full
±5.0
±5.4
-
V
Output Resistance
VCC = V+ = V- = 0V, Transmitter Output = ±2V
Full
300
10M
-
Ω
Output Short-Circuit Current
VOUT = 0V
Full
-
±35
±60
mA
Output Leakage Current
VOUT = ±12V, VCC = 0V or 3V to 5.5V, SHDN = GND
Full
-
-
±25
μA
Full
-25
-
25
V
VCC = 3.3V
Full
0.6
1.2
-
V
VCC = 5.0V
Full
0.8
1.5
-
V
VCC = 3.3V
Full
-
1.5
2.4
V
VCC = 5.0V
Full
-
1.8
2.4
V
Input Hysteresis
25
-
0.3
-
V
Input Resistance
Full
3
5
7
kΩ
RECEIVER INPUTS
Input Voltage Range
Input Threshold Low
Input Threshold High
4
ISL83220E
Test Conditions: VCC = 3V to 5.5V, C1 - C4 = 0.1μF; Unless Otherwise Specified.
Typicals are at TA = 25°C (Continued)
Electrical Specifications
PARAMETER
TEMP
(°C)
MIN
TYP
MAX
UNITS
Full
250
500
-
kbps
tPHL
25
-
1.0
-
μs
tPLH
25
-
1.0
-
μs
tPHL
25
-
0.20
-
μs
tPLH
25
-
0.30
-
μs
TEST CONDITIONS
TIMING CHARACTERISTICS
Maximum Data Rate
RL = 3kΩ, CL = 1000pF, One Transmitter Switching
Transmitter Propagation Delay
Transmitter Input to
Transmitter Output,
RL = 3kΩ, CL = 1000pF
Receiver Propagation Delay
Receiver Input to Receiver
Output, CL = 150pF
Receiver Output Enable Time
Normal Operation
25
-
200
-
ns
Receiver Output Disable Time
Normal Operation
25
-
200
-
ns
Transmitter Skew
tPHL - tPLH (Note 2)
25
-
100
500
ns
Receiver Skew
tPHL - tPLH
Full
-
100
1000
ns
Transition Region Slew Rate
CL = 150pF to 2500pF
VCC = 3.3V,
RL = 3kΩ to 7kΩ,
CL = 150pF to 1000pF
Measured From 3V to -3V or
-3V to 3V
25
4
-
30
V/μs
25
6
-
30
V/μs
ESD PERFORMANCE
RS-232 Pins (TOUT, RIN)
All Other Pins
Human Body Model
25
-
±15
-
kV
IEC61000-4-2 Contact Discharge
25
-
±8
-
kV
IEC61000-4-2 Air Gap Discharge
25
-
±15
-
kV
Human Body Model
25
-
±3
-
kV
NOTE:
2. Transmitter skew is measured at the transmitter zero crossing points.
Detailed Description
The ISL83220E operates from a single +3V to +5.5V supply,
guarantees a 250kbps minimum data rate, requires only four
small external 0.1μF capacitors, features low power
consumption, and meets all ElA RS-232C and V.28
specifications. The circuit is divided into three sections: The
charge pump, the transmitter, and the receiver.
Charge-Pump
Intersil’s new 3.3V family utilizes regulated on-chip dual
charge pumps as voltage doublers, and voltage inverters to
generate ±5.5V transmitter supplies from a VCC supply as
low as 3.0V. This allows these devices to maintain RS-232
compliant output levels over the ±10% tolerance range of
3.3V powered systems. The efficient on-chip power supplies
require only four small, external 0.1μF capacitors for the
voltage doubler and inverter functions, even at VCC = 3.3V.
The charge pumps operate discontinuously (i.e., they turn off
as soon as the V+ and V- supplies are pumped up to the
nominal values), resulting in significant power savings.
Transmitters
The transmitters are proprietary, low dropout, inverting
drivers that translate TTL/CMOS inputs to EIA/TIA-232
output levels. Coupled with the on-chip ±5.5V supplies,
5
these transmitters deliver true RS-232 levels over a wide
range of single supply system voltages.
The transmitter output disables and assumes a high
impedance state when the device enters the powerdown
mode (see Table 2). This output may be driven to ±12V when
disabled.
All devices guarantee a 250kbps data rate for full load
conditions (3kΩ and 1000pF), VCC ≥ 3.0V. Under more
typical conditions of VCC ≥ 3.3V, RL = 3kΩ, and CL = 250pF,
the ISL83220E easily operates at 900kbps.
Transmitter inputs float if left unconnected, and may cause
ICC increases.
Receivers
The ISL83220E device contains a standard inverting
receiver that three-states via the EN control line. Receivers
convert RS-232 signals to CMOS output levels and accept
inputs up to ±25V while presenting the required 3kΩ to 7kΩ
input impedance (see Figure 1) even if the power is off
(VCC = 0V). The receiver’s Schmitt trigger input stage uses
hysteresis to increase noise immunity and decrease errors
due to slow input signal transitions.
ISL83220E
The ISL83220E receiver disables only when EN is driven
high. (see Table 2). This allows the receiver to monitor
external devices, like a modem, even when the ISL83220E
is in its 1μA powerdown state.
Standard receivers driving powered down peripherals must
be disabled to prevent current flow through the peripheral’s
protection diodes (see Figure 2). This renders them useless
for wake up functions.
TABLE 2. POWERDOWN AND ENABLE LOGIC TRUTH TABLE
SHDN
EN TRANSMITTER RECEIVER
INPUT INPUT
OUTPUT
OUTPUT
L
L
High-Z
Active
Manual Powerdown
L
H
High-Z
High-Z
Manual Powerdown
w/Rcvr. Disabled
H
L
Active
Active
Normal Operation
H
H
Active
High-Z
Normal Operation
w/Rcvr. Disabled
VCC
R1OUT
R1IN
-25V ≤ VRIN ≤ +25V
VCC
VCC
GND ≤ VROUT ≤ VCC
5kΩ
MODE OF
OPERATION
GND
CURRENT
FLOW
VCC
FIGURE 1. INVERTING RECEIVER CONNECTIONS
VOUT = VCC
Operation Down to 2.7V
ISL83220E transmitter outputs meet RS-562 levels (±3.7V),
at the full data rate, with VCC as low as 2.7V. RS-562 levels
typically ensure interoperability with RS-232 devices.
Rx
POWERED
DOWN
UART
Tx
GND
SHDN = GND
Powerdown Functionality
This 3V family of RS-232 interface devices requires a
nominal supply current of 0.3mA during normal operation
(not in powerdown mode), which is considerably less than
the 5mA to 11mA current required of 5V RS-232 devices.
The already low current requirement drops significantly
when the device enters powerdown mode. In powerdown,
supply current drops to 1μA, because the on-chip charge
pump turns off (V+ collapses to VCC, V- collapses to GND),
and the transmitter outputs three-state. This micro-power
mode makes these devices ideal for battery powered and
portable applications.
Software Controlled (Manual) Powerdown
On the ISL83220E, the powerdown control is via a simple
shutdown (SHDN) pin. Driving this pin high enables normal
operation, while driving it low forces the IC into it’s
powerdown state. Connect SHDN to VCC if the powerdown
function isn’t needed. Note that the receiver output remains
enabled during shutdown (see Table 2). For the lowest
power consumption during powerdown, the receiver should
also be disabled by driving the EN input high (see next
section). The time to recover from manual powerdown mode
is typically 100μs.
OLD
RS-232 CHIP
FIGURE 2. POWER DRAIN THROUGH POWERED DOWN
PERIPHERAL
Receiver ENABLE Control
The ISL83220E also features an EN input to control the
receiver output. Driving EN high disables the receiver output
placing it in a high impedance state. This is useful to
eliminate supply current, due to a receiver output forward
biasing the protection diode, when driving the input of a
powered down (VCC = GND) peripheral (see Figure 2).
Capacitor Selection
The charge pumps require 0.1μF capacitors for 3.3V
operation. Do not use values smaller than 0.1μF. Increasing
the capacitor values (by a factor of 2) reduces ripple on the
transmitter outputs and slightly reduces power consumption.
When using minimum required capacitor values, make sure
that capacitor values do not degrade excessively with
temperature. If in doubt, use capacitors with a larger nominal
value. The capacitor’s equivalent series resistance (ESR)
usually rises at low temperatures and it influences the
amount of ripple on V+ and V-.
Power Supply Decoupling
In most circumstances a 0.1μF bypass capacitor is
adequate. In applications that are particularly sensitive to
power supply noise, decouple VCC to ground with a
capacitor of the same value as the charge-pump capacitor C1.
Connect the bypass capacitor as close as possible to the IC.
6
ISL83220E
Transmitter Output when Exiting
Powerdown
5V/DIV
Figure 3 shows the response of the transmitter output when
exiting powerdown mode. As it activates, the transmitter
output properly goes to RS-232 levels, with no glitching,
ringing, nor undesirable transients. The transmitter is loaded
with 3kΩ in parallel with 2500pF. Note that the transmitter
enables only when the magnitude of the supplies exceed
approximately 3V.
T1IN
T1OUT
R1OUT
5V/DIV
VCC = +3.3V
C1 - C4 = 0.1µF
SHDN
TIN = LOW
5µs/DIV
FIGURE 5. LOOPBACK TEST AT 120kbps
2V/DIV
5V/DIV
TIN = HIGH
T1IN
VCC = +3.3V
C1 - C4 = 0.1µF
TIME (20µs/DIV)
FIGURE 3. TRANSMITTER OUTPUT WHEN EXITING
POWERDOWN
T1OUT
High Data Rates
The ISL83220E maintains the RS-232 ±5V minimum
transmitter output voltages even at high data rates. Figure 4
details a transmitter loopback test circuit, and Figure 5
illustrates the loopback test result at 120kbps. For this test,
the transmitter is driving an RS-232 load in parallel with
1000pF, at 120kbps. Figure 6 shows the loopback results for
the transmitter driving 1000pF and an RS-232 load at
250kbps.
+
0.1μF
+
C1+
VCC
V+
C1C2
+
ISL83220E
V-
C2+
C2TIN
VCC
VCC = +3.3V
C1 - C4 = 0.1µF
2µs/DIV
FIGURE 6. LOOPBACK TEST AT 250kbps
Interconnection with 3V and 5V Logic
VCC
C1
R1OUT
+
C3
C4
+
TOUT
ROUT
RIN
EN
5K
1000pF
SHDN
FIGURE 4. TRANSMITTER LOOPBACK TEST CIRCUIT
7
The ISL83220E directly interfaces with 5V CMOS and TTL
logic families. Nevertheless, with the device at 3.3V, and the
logic supply at 5V, AC, HC, and CD4000 outputs can drive
ISL83220E inputs, but ISL83220E outputs do not reach the
minimum VIH for these logic families. See Table 4 for more
information.
ISL83220E
TABLE 3. LOGIC FAMILY COMPATIBILITY WITH VARIOUS
SUPPLY VOLTAGES
VCC
SYSTEM
POWER-SUPPLY SUPPLY
VOLTAGE
VOLTAGE
(V)
(V)
determines an IC’s ability to withstand the ESD transients
typically present during handling and manufacturing. Due to
the random nature of these events, each pin is tested with
respect to all other pins. The RS-232 pins on “E” family
devices can withstand HBM ESD events to ±15kV.
COMPATIBILITY
IEC61000-4-2 Testing
3.3
3.3
5
5
5
3.3
Compatible with all CMOS
families.
Compatible with all TTL and
CMOS logic families.
Compatible with ACT and HCT
CMOS, and with TTL.
ISL83220E outputs are
incompatible with AC, HC, and
CD4000 CMOS inputs.
±15kV ESD Protection
All pins on ISL8XXX devices include ESD protection
structures, but the ISL8XXXE family incorporates advanced
structures which allow the RS-232 pins (transmitter outputs
and receiver inputs) to survive ESD events up to ±15kV. The
RS-232 pins are particularly vulnerable to ESD damage
because they typically connect to an exposed port on the
exterior of the finished product. Simply touching the port
pins, or connecting a cable, can cause an ESD event that
might destroy unprotected ICs. These new ESD structures
protect the device whether or not it is powered up, protect
without allowing any latchup mechanism to activate, and
don’t interfere with RS-232 signals as large as ±25V.
Human Body Model (HBM) Testing
As the name implies, this test method emulates the ESD
event delivered to an IC during human handling. The tester
delivers the charge through a 1.5kΩ current limiting resistor,
making the test less severe than the IEC61000 test which
utilizes a 330Ω limiting resistor. The HBM method
Typical Performance Curves
The IEC61000 test method applies to finished equipment,
rather than to an individual IC. Therefore, the pins most likely
to suffer an ESD event are those that are exposed to the
outside world (the RS-232 pins in this case), and the IC is
tested in its typical application configuration (power applied)
rather than testing each pin-to-pin combination. The lower
current limiting resistor coupled with the larger charge
storage capacitor yields a test that is much more severe than
the HBM test. The extra ESD protection built into this
device’s RS-232 pins allows the design of equipment
meeting level 4 criteria without the need for additional board
level protection on the RS-232 port.
AIR-GAP DISCHARGE TEST METHOD
For this test method, a charged probe tip moves toward the
IC pin until the voltage arcs to it. The current waveform
delivered to the IC pin depends on approach speed,
humidity, temperature, etc., so it is difficult to obtain
repeatable results. The “E” device RS-232 pins withstand
±15kV air-gap discharges.
CONTACT DISCHARGE TEST METHOD
During the contact discharge test, the probe contacts the
tested pin before the probe tip is energized, thereby
eliminating the variables associated with the air-gap
discharge. The result is a more repeatable and predictable
test, but equipment limits prevent testing devices at voltages
higher than ±8kV. All “E” family devices survive ±8kV contact
discharges on the RS-232 pins.
VCC = 3.3V, TA = 25°C
25
VOUT+
4
20
SLEW RATE (V/µs)
TRANSMITTER OUTPUT VOLTAGE (V)
6
2
TRANSMITTER AT 250kbps
0
-2
15
-SLEW
+SLEW
10
VOUT -
-4
-6
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
FIGURE 7. TRANSMITTER OUTPUT VOLTAGE vs LOAD
CAPACITANCE
8
5
0
1000
2000
3000
4000
LOAD CAPACITANCE (pF)
FIGURE 8. SLEW RATE vs LOAD CAPACITANCE
5000
ISL83220E
Typical Performance Curves
VCC = 3.3V, TA = 25°C (Continued)
45
3.5
NO LOAD
ALL OUTPUTS STATIC
3.0
35
SUPPLY CURRENT (mA)
SUPPLY CURRENT (mA)
40
250kbps
30
25
20
120kbps
15
10
20kbps
2.5
2.0
1.5
1.0
0.5
5
0
0
1000
2000
3000
4000
5000
LOAD CAPACITANCE (pF)
FIGURE 9. SUPPLY CURRENT vs LOAD CAPACITANCE
WHEN TRANSMITTING DATA
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
286
PROCESS:
Si Gate CMOS
9
0
2.5
3.0
3.5
4.0
4.5
5.0
5.5
SUPPLY VOLTAGE (V)
FIGURE 10. SUPPLY CURRENT vs SUPPLY VOLTAGE
6.0
ISL83220E
Thin Shrink Small Outline Plastic Packages (TSSOP)
M16.173
N
16 LEAD THIN SHRINK SMALL OUTLINE PLASTIC PACKAGE
INDEX
AREA
E
0.25(0.010) M
E1
2
INCHES
GAUGE
PLANE
-B1
B M
0.05(0.002)
-A-
SYMBOL
MIN
MAX
MIN
MAX
NOTES
A
-
0.043
-
1.10
-
A1
3
L
A
D
-C-
e
α
A1
b
0.10(0.004) M
0.25
0.010
SEATING PLANE
c
0.10(0.004)
C A M
0.05
0.15
-
A2
0.033
0.037
0.85
0.95
-
b
0.0075
0.012
0.19
0.30
9
c
0.0035
0.008
0.09
0.20
-
B S
0.002
D
0.193
0.201
4.90
5.10
3
0.169
0.177
4.30
4.50
4
0.026 BSC
E
0.246
L
0.020
N
α
NOTES:
0.006
E1
e
A2
MILLIMETERS
0.65 BSC
0.256
6.25
0.028
0.50
16
0o
-
0.70
6
16
8o
0o
-
6.50
7
8o
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AB, Issue E.
Rev. 1 2/02
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.15mm (0.006
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.08mm (0.003 inch) total in excess
of “b” dimension at maximum material condition. Minimum space
between protrusion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. (Angles in degrees)
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Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
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10
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