<For Europe and America> CXG1017N GSM1800/1900 DPDT TX/RX Antenna Switch For the availability of this product, please contact the sales office. Description The CXG1017N is a high power DPDT switch suitable for Digital Cellular applications. This device is part of a growing family of MMIC Antenna switches for digital cellular and cordless radios. It uses the state-of-the-art Sony JFET process. 8 pin SSOP (Plastic) Features • Positive voltage supply only • Low insertion loss, typically 0.7dB at 33dBm input level • Stable Characteristics over wide temperature range • Fast switching-100ns Typical • Low current consumption, 400µA typical at 5.5V • 8 pin SSOP package (3.0 × 6.4mm) ESD As with other GaAs semiconductors, ESD precautions must be adhered to. Applications • GSM1800 handportable • GSM1900 handportable • DECT basestation/handportable diversity antenna switching • Other digital cellular and wireless local loop applications Typical Application Internal Antenna PA TX IN CXG1017N RX OUT LNA External Antenna Sony reserves the right to change products and specifications without prior notice. This information does not convey any license by any implication or otherwise under any patents or other right. Application circuits shown, if any, are typical examples illustrating the operation of the devices. Sony cannot assume responsibility for any problems arising out of the use of these circuits. –1– E97756A79 <For Europe and America> CXG1017N Electrical Characteristics Measurement Conditions, unless otherwise stated: Vctl (L) = 0V, Vctl (H) = 5.5V, Pin = 33dBm GSM Burst (577µs pulse length with 8:1 Duty cycle), F = 1.75GHz. Temperature Range –25 to +75°C. Parameter Min. Insertion loss Isolation 14 Typ. Max. Unit 0.7 0.95 dB 16 dB VSWR 1.5 Switching time 100 ns Harmonic levels –56 –50 dBc Control currents 400 800 µA P0.1dB 34.5 dBm P0.3dB 35.5 dBm P0.1dB for Vctl (H) = 4.5V 34 dBm P0.1dB for Vctl (H) = 3.0V 29 dBm Control Voltage Selection, Vctl (H) The choice of control voltage will determine the compression characteristic of the switch and the generation of harmonics. The table above indicates the sensitivity of P0.1dB to control voltage, whilst the graphs below indicate the sensitivity of harmonic levels: 2nd Harmonic with Power/Control Volts 3nd Harmonic with Power/Control Volts –20 –30 Vctl = 0/3V Vctl = 0/4.5V Vctl = 0/5.5V –40 Harmonic level [dBc] Harmonic level [dBc] –20 –50 –30 –40 –50 Vctl = 0/3V Vctl = 0/4.5V Vctl = 0/5.5V –60 –60 –70 –70 30 31 32 33 34 35 36 37 30 38 31 32 33 34 35 Input power [dBm] Input power [dBm] –2– 36 37 38 <For Europe and America> Compression Characteristics Measurement Conditions: Vctl (L) = 0V, Vctl (H) = 5.5V, GSM Burst, F = 1.75GHz Temperature range –25 to +75°C. Typical Characteristics over Temperature: 3.0 Insertion loss [dB] 2.5 –25°C 25°C 75°C 2.0 1.5 1.0 0.5 0 30 31 32 33 34 35 36 37 38 Input power [dBm] Frequency Characteristics Measurement Conditions: Vctl (L) = 0V, Vctl (H) = 5.5V, Pin = 0dBm CW, T = 25°C Insertion Loss and Isolation vs. Frequency 0 0 –10 –2 –20 Isolation –3 –30 –4 –40 –5 Isolation [dB] Insertion loss [dB] Insertion loss –1 –50 0 1 2 3 Frequency [GHz] –3– CXG1017N <For Europe and America> CXG1017N Schematic/Pinout Pin No. Port1 1 8 Port4 CTLA 2 7 CTLB GND 3 6 GND Port2 4 5 Port3 8pin SSOP (PLASTIC) FUNCTION 1 RF PORT1 2 Ctl (A) 3 GROUND 4 RF PORT2 5 RF PORT3 6 GROUND 7 Ctl (B) 8 RF PORT4 Block Diagram/Truth Table Port1 Port4 Port2 Port3 VCTLA VCTLB High Low Port1-Port2, Port3-Port4 ON Port2-Port3, Port4-Port1 OFF Low High Port2-Port3, Port4-Port1 ON Port1-Port2, Port3-Port4 OFF Note) Internal and External Antenna Connections should be diagonally opposite (1-3, 2-4). External Circuitry C2 100pF Port1 optional → RRF 75kΩ D1 C2 100pF Port2 C2 100pF C1 100pF 1 8 2 7 3 6 4 5 Port4 C1 100pF D1 → optional C2 100pF Port3 RRF 75kΩ When using the CXG1017N, the following external components should be used: C1: This is used for signal line filtering 100pF is recommended. C2: This is used for RF De-coupling and must be used in all applications. 100pF is recommended. Rrf: This resistor is used to stabilize the dc operating point at high power levels. A value of 75kΩ is recommended. D1: 6.2V Zenor diodes may be incorporated at the Control lines, as indicated, in order to give improved ESD performance if necessary. –4– <For Europe and America> CXG1017N ESD Precautions As this is a GaAs MMIC, ESD precautions must be adhered to, as outlined in at standard Data Book. Please contact Sony if detailed ESD performance data is required. Configuration of External Logic Circuitry For most portable appplicaitons, the following logic states are normally available.: 1. TX ON/OFF 2. RX ON/OFF 3. INT/EXT ANT. A simple Logic circuit, using EXOR gates may be used to drive the CXG1017N. The following is a suggested schematic: TX ON/OFF CTLA A = TX ON/OFF B = INT/EXT ANT INT/EXT ANT CTLB RX ON/OFF Absolute Maximum Ratings (Ta = 25°C) • Control voltage Vctl 7 • Operating temperature Topr –30 to +85 • Storage temperature Tstg –65 to +150 • Input Power Pin 37 Assumed Port1 : INT ANT Port2 : RX LNA Port3 : EXT ANT Port4 : TX PA V °C °C dBm Tape and Reel Information This device is available in Tape and Reel. Order CXG1017N-T4 Reel Quantity: 1000 pieces/reel Reel Dimensions: 245mm. There are detailed on Page 1-112 of the package manual 93. –5– <For Europe and America> CXG1017N Sony GSM Lineup 32K × 8 CXK5T8257BTM 64K × 8 CXK5T8512TM CXK5T81000ATM 128K × 8 64K × 16 CXK5T16100TM MCU SGM2016AM-21-T7 Flash SRAM 64K × 16 90MHz I LNA SAW IT362/IT402 IT363/IT403 IT413 RX PLL1 Q Speech Codec AD DSP PLL2 CXA3021R TX I Q DA CXG1037FN DCS1800 RX SPDT Antenna Switches HP ANT CXG1028TM GSM 900/1800/1900 CXG1006N GSM1800/1900 CAR ANT TX CXG1017N GSM1800/1900 –6– Sony IC <For Europe and America> Package Outline CXG1017N Unit: mm 8PIN SSOP (PLASTIC) + 0.2 1.25 – 0.1 ∗3.0 ± 0.1 0.1 8 5 6.4 ± 0.2 ∗4.4 ± 0.1 A 4 1 0.65 + 0.08 0.24 – 0.07 0.25 0.13 M (0.5) 0° to 10° (0.15) + 0.025 0.17 – 0.015 + 0.08 0.24 – 0.07 (0.22) 0.6 ± 0.15 0.1 ± 0.05 B DETAIL A DETAIL B NOTE: Dimension “∗” does not include mold protrusion. PACKAGE STRUCTURE PACKAGE MATERIAL EPOXY RESIN SONY CODE SSOP-8P-L01 LEAD TREATMENT SOLDER / PALLADIUM PLATING EIAJ CODE SSOP008-P-0044 LEAD MATERIAL COPPER ALLOY PACKAGE MASS 0.04g JEDEC CODE –7–