ON NCV7719DQR2G Octal half-bridge driver Datasheet

NCV7719
Octal Half-Bridge Driver
The NCV7719 Octal is an eight channel half-bridge driver with
protection features designed specifically for automotive and industrial
motion control applications. The product has independent controls and
diagnostics, and the drivers can be operated in forward, reverse, brake,
and high impedance states. The device is controlled via a 16 bit SPI
interface and is daisy chain compatible.
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Features
MARKING
DIAGRAM
• Low Quiescent Current Sleep Mode
• High−Side and Low−Side Drivers
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Connected in Half−Bridge Configurations
Integrated Freewheeling Protection (LS and HS)
0.55 A Peak Current
RDS(on) = 1.0 W (typ)
5 MHz SPI Communication
16 Bit Frame Error Detection
Daisy Chain Compatible with Multiple of 8 bit Devices
Compliance with 3.3 V and 5 V Systems
Undervoltage and Overvoltage Lockout
Discriminated Fault Reporting
Over Current Protection
Over−temperature Protection
Underload Detection
Exposed Pad Package
NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q100
Qualified and PPAP Capable
This is a Pb−Free Device
SSOP24 NB EP
CASE 940AK
NCV7719
AWLYYWWG
NCV7719 = Specific Device Code
A
= Assembly Location
WL
= Wafer Lot
YY
= Year
WW
= Work Week
G
= Pb−Free Package
ORDERING INFORMATION
See detailed ordering and shipping information on page 24 of
this data sheet.
Typical Applications
• Automotive
• Industrial
• DC Motor Management for HVAC Application
© Semiconductor Components Industries, LLC, 2016
March, 2016 − Rev. 4
1
Publication Order Number:
NCV7719/D
NCV7719
NCV7719
High−side
Driver
Low−side
Driver
VS1
13.2 V
OUT1
MRA4003T3
VS2
HS
OUT2
LS
Voltage
VCC
Power On
Reset
Regulator
HS
OUT3
LS
EN
Control
Logic
Watchdog
HS
OUT4
LS
HS
OUT5
Protection:
Under Load
Over Temperature
Under−voltage
Over−voltage
Over Current
LS
HS
OUT6
LS
SO
HS
16 −Bit
SI
uC
Serial
SCLK
Data
CSB
Interface
LS
High−side
Driver
Low−side
Driver
GND
Figure 1. Typical Application
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2
OUT7
OUT8
NCV7719
VS1
DRIVE 1
VS
EN
ENABLE
High Side
Driver
VS1
Wave Shaping
VCC
Fault
Reporting
BIAS
POR
Control
Logic
OUT1
Wave Shaping
VS
Low Side
Driver
SO
SI
LS Under Load
Fault
16 Bit Logic
and Latch
SPI
SCLK
CSB
Overcurrent
Thermal Warning &
Shutdown
VS1
VS2
VS1, VS2
Overvoltage
Lockout
VS2
VS1
VCC
Undervoltage
Lockout
VS2
VS1
VS1
GND
VS2
GND
GND
GND
Figure 2. Block Diagram
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3
DRIVE 2
OUT2
DRIVE 3
OUT3
DRIVE 4
OUT4
DRIVE 5
OUT5
DRIVE 6
OUT6
DRIVE 7
OUT7
DRIVE 8
OUT8
NCV7719
GND
1
24
GND
OUT1
2
23
OUT2
OUT5
3
22
OUT8
OUT7
4
21
VS1
SI
5
20
SCLK
VCC
6
19
CSB
EPAD
SO
7
18
RESERVED
EN
8
17
RESERVED
9
16
VS2
OUT6
10
15
NC
OUT4
11
14
OUT3
GND
12
13
GND
NC
Figure 3. Pinout – SSOP24
PIN FUNCTION DESCRIPTION The pin−out for the Deca Half−Bridge in SSOP24 package is shown in the table below.
Pin#
SSOP24
Symbol
Description
1
GND
Ground
2
OUT1
Half−bridge output 1
3
OUT5
Half−bridge output 5
4
OUT7
Half−bridge output 7
5
SI
6
VCC
16 bit serial communication input. 3.3V/5V (TTL) Compatible − internally pulled down.
7
SO
16 bit serial communication output. 3.3V/5V Compliant
8
EN
Enable − active high; wakes the device from sleep mode. 3.3V/5V (TTL) Compatible − internally pulled
down.
9
NC
No Connection. This pin should be isolated from any traces or vias on the PCB board.
10
OUT6
Half−bridge output 6
11
OUT4
Half−bridge output 4
12
GND
Ground
13
GND
Ground
14
OUT3
Half−bridge output 3
Power supply input for Logic.
15
NC
No Connection. This pin should be isolated from any traces or vias on the PCB board.
16
VS2
Power Supply input for outputs 3, 4 and 6. This pin must be connected to VS1 externally.
17
Reserved
Reserved for factory use − this pin must be grounded.
18
Reserved
Reserved for factory use − this pin must be grounded.
19
CSB
Chip select bar − active low; enables serial communication operation. 3.3V/5V (TTL) Compatible − internally pulled up.
20
SCLK
Serial communication clock input. 3.3V/5V (TTL) Compatible − internally pulled down.
21
VS1
22
OUT8
Half−bridge output 8
23
OUT2
Half−bridge output 2
24
GND
Ground
EPAD
Exposed
Pad
Power Supply input for outputs 1, 2, 5, 7, 8, and all pre−drivers. This pin must be connected to VS2 externally.
Connect to GND or leave unconnected.
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NCV7719
MAXIMUM RATINGS (Voltages are with respect to GND)
Rating
Symbol
Value
VSxdcMax
VSxac
−0.3 to 40
−1.0
( Vcc, SI, SCLK, CSB, SO, EN)
VioMax
−0.3 to 5.5
(DC)
(AC)
(AC), t< 500 ms, IOUTx > −1.1 A
(AC), t< 500 ms, IOUTx < 1 A
VoutxDc
VoutxAc
−0.3 to 40
−0.3 to 40
−1.0
1.0
IoutxImax
−2.0 to 2.0
A
Junction Temperature Range
TJ
−40 to 150
°C
Storage Temperature Range
Tstr
−55 to 150
°C
(Note 1)
260
°C
VSx Pin Voltage
I/O Pin Voltage
(VS1, VS2)
(DC)
(AC), t < 500 ms, Ivsx > −2 A
Unit
V
V
OUTx Pin Voltage
OUTx Pin Current
V
(OUT1, ..., OUT8)
Peak Reflow Soldering Temperature: Pb−free 60 to 150 seconds at 217°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. See or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
ATTRIBUTES
Characteristic
Short Circuit Reliability Characterization
ESD Capability
Human Body Model per AEC−Q100−002
VSx, OUTx
All Other Pins
Machine Model per AEC−Q100−003
Moisture Sensitivity Level
Package Thermal Resistance – Still−air
Junction–to–Ambient
Junction–to–Board
(Note 2)
(Note 3)
(Note 2)
(Note 3)
Symbol
Value
Unit
AECQ10x
Grade A
−
Vesd4k
Vesd2k
Vesd200
≥ ±4.0 kV
≥ ±2.0 kV
≥ ±200 V
MSL
MSL2
−
RqJA
RqJA
54
26
22
14
°C/W
°C/W
°C/W
°C/W
RYJBOARD
RYJBOARD
2. Based on JESD51−3, 1.2 mm thick FR4, 2S0P PCB with 2 oz. copper and 18 thermal vias to 600 mm2 spreader on bottom layer.
3. Based on JESD51−7, 1.2 mm thick FR4, 1S2P PCB with 2 oz. copper and 18 thermal vias to 80x80 mm 1 oz. internal spreader planes.
RECOMMENDED OPERATING CONDITIONS
Symbol
Min
Max
Unit
Digital Supply Input Voltage
Parameter
VCCOp
3.15
5.25
V
Battery Supply Input Voltage
VSxOp
5.5
28
V
DC Output Current
IxOp
−
0.55
A
Junction Temperature
TjOp
−40
125
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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NCV7719
ELECTRICAL CHARACTERISTICS
(−40°C ≤ TJ ≤ 150°C, 5.5 V ≤ VSx ≤ 40 V, 3.15 V ≤ VCC ≤ 5.25 V, EN = VCC, unless otherwise specified.)
Characteristic
Symbol
Conditions
Min
Typ
Max
Unit
−
1.0
2.5
mA
−
2.5
5.0
mA
−
1.0
2.5
mA
−
1.5
3.0
mA
Sleep Mode, −40°C to 85°C
VS1 = VS2 = 13.2 V, No Load
−
2.0
5.0
mA
POWER SUPPLIES
Supply Current (VS1 + VS2)
Sleep Mode
IqVSx85
Supply Current (VS1 + VS2)
Active Mode
IvsOp
Supply Current (Vcc)
Sleep Mode
Active Mode
Total Sleep Mode Current
I(VS1) + I(VS2) + I(VCC)
IqVCC
IVCCOp
IqTot
VS1 = VS2 = 13.2V, VCC = 0 V
−40°C to 85°C
EN = VCC, 5.5V < VSx < 28 V
No Load
CSB = VCC, EN = SI = SCLK = 0 V
−40°C to 85°C
EN = CSB = VCC, SI = SCLK = 0V
No Load
VCC Power−on Reset Threshold
VCCpor
VCC increasing
−
2.55
2.90
V
VSx Undervoltage Detection Threshold
VSxuv
VSx decreasing
3.5
4.1
4.5
V
100
−
450
mV
30
36
40
V
1
2.5
4
V
VSx Undervoltage Detection
Hysteresis
VSxuHys
VSx Overvoltage Detection Threshold
VsXov
VSx Overvoltage Detection Hysteresis
VSxoHys
VSx increasing
DRIVER OUTPUT CHARACTERISTICS
Output High RDS(on) (source)
RDSonHS
Iout = −500 mA, Vs = 13.2 V
VCC = 3.15 V
−
1.0
2.25
W
Output Low RDS(on) (sink)
RDSonLS
Iout = 500 mA, Vs =13.2 V
VCC = 3.15 V
−
1.0
2.25
W
Output Path RDS(HSx+LSx)
RDSonPath
Iout = |500| mA, TJ ≤ 125°C
−
−
4.0
W
−1.0
−5.0
−
−
−
−
mA
mA
−
−
−
−
1.0
5.0
mA
mA
Source Leakage Current
Sink Leakage Current
IsrcLkg13.2
IsrcLkg40
IsnkLkg13.2
IsnkLkg40
VCC = 5 V,OUT(1−8) = 0 V,
−40°C to 85°C;
VSx = 13.2 V
VSx = 40 V
VCC = 5 V;
OUT(1−8) = VSx = 13.2 V
OUT(1−8) = VSx = 40 V
Overcurrent Shutdown Threshold
(Source)
IsdSrc
VCC = 5 V, VSx = 13.2 V
−2.0
−1.2
−0.8
A
Overcurrent Shutdown Threshold
(Sink)
IsdSnk
VCC = 5 V, VSx = 13.2 V
0.8
1.2
2.0
A
10
25
50
ms
Over Current Delay Timer
TdOc
Underload Detection Threshold
(Low Side)
IuldLS
VCC = 5 V, VSx = 13.2 V
2.0
11
20
mA
Underload Detection Delay Time
TdUld
VCC = 5 V, VSx = 13.2 V
200
350
600
ms
If = 500 mA
−
0.9
1.3
V
Body Diode Forward Voltage
IbdFwd
DRIVER OUTPUT SWITCHING CHARACTERISTICS
High Side Turn On Time
ThsOn
Vs = 13.2 V, Rload = 39 W
−
7.5
13
ms
High Side Turn Off Time
ThsOff
Vs = 13.2 V, Rload = 39 W
−
3.0
6.0
ms
Low Side Turn On Time
TlsOn
Vs = 13.2 V, Rload = 39 W
−
6.5
13
ms
Low Side Turn Off Time
TlsOff
Vs = 13.2 V, Rload = 39 W
−
2.0
5.0
ms
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Not production tested.
5. This is the minimum time the user must wait between SPI commands.
6. This is the minimum time the user must wait between consecutive SRR requests.
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NCV7719
ELECTRICAL CHARACTERISTICS
(−40°C ≤ TJ ≤ 150°C, 5.5 V ≤ VSx ≤ 40 V, 3.15 V ≤ VCC ≤ 5.25 V, EN = VCC, unless otherwise specified.)
Characteristic
Symbol
Conditions
Min
Typ
Max
Unit
DRIVER OUTPUT SWITCHING CHARACTERISTICS
High Side Rise Time
ThsTr
Vs = 13.2 V, Rload = 39 W
−
4.0
8.0
ms
High Side Fall Time
ThsTf
Vs = 13.2 V, Rload = 39 W
−−
2.0
4.0
ms
Low Side Rise Time
TlsTr
Vs = 13.2 V, Rload = 39 W
−
1.0
3.0
ms
Low Side Fall Time
TlsTf
Vs = 13.2 V, Rload = 39 W
−
1.0
3.0
ms
High Side Off to Low Side On
Non−Overlap Time
ThsOffLsOn
Vs = 13.2 V, Rload = 39 W
1.5
−
−
ms
Low Side Off to High Side On
Non−Overlap Time
TlsOffHsOn
Vs = 13.2 V, Rload = 39 W
1.5
−
−
ms
Twr
(Note 4)
120
140
170
°C
TwHy
(Note 4)
−
20
−
°C
Tsd
(Note 4)
150
175
200
°C
TsdHy
(Note 4)
−
20
−
°C
VthInH
VthInL
2.0
−
−
−
−
0.6
V
V
Input Hysteresis − SI, SCLK, CSB
VthInHys
50
150
300
mV
Input Hysteresis − EN
VthENHys
150
400
800
mV
EN = SI = SCLK = VCC
50
125
200
kW
CSB = 0 V
50
125
250
kW
Cinx
(Note 4)
−
−
15
pF
Output High
VsoH
ISOURCE = −1 mA
VCC –
0.6
−
−
V
Output Low
VsoL
ISINK = 1.6 mA
−
−
0.4
V
THERMAL RESPONSE
Thermal Warning
Thermal Warning Hysteresis
Thermal Shutdown
Thermal Shutdown Hysteresis
LOGIC INPUTS − EN, SI, SCLK, CSB
Input Threshold
High
Low
Pull−down Resistance − EN, SI, SCLK
Pull−up Resistance − CSB
Input Capacitance
Rpdx
RpuCSB
LOGIC OUTPUT − SO
Tri−state Leakage
ItriStLkg
CSB = 5 V
−5
−
5
mA
Tri−state Output Capacitance
ItriStCout
CSB = VCC, 0 V < VCC < 5.25 V
(Note 4)
−
−
15
pF
Timing
Charts #
Min
Typ
Max
Unit
−
−
−
5.0
MHz
−
200
500
−
−
−
−
ns
SERIAL PERIPHERAL INTERFACE
Characteristic
SCLK Frequency
Symbol
Conditions
Fclk
VCC = 5 V
VCC = 3.3 V
SCLK Clock Period
TpClk
SCLK High Time
TclkH
1
85
−
−
ns
SCLK Low Time
TclkL
2
85
−
−
ns
SCLK Setup Time
TclkSup
3, 4
85
−
−
ns
SI Setup Time
TsiSup
11
50
−
−
ns
SI Hold Time
TsiH
12
50
−
−
ns
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Not production tested.
5. This is the minimum time the user must wait between SPI commands.
6. This is the minimum time the user must wait between consecutive SRR requests.
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NCV7719
ELECTRICAL CHARACTERISTICS
(−40°C ≤ TJ ≤ 150°C, 5.5 V ≤ VSx ≤ 40 V, 3.15 V ≤ VCC ≤ 5.25 V, EN = VCC, unless otherwise specified.)
SERIAL PERIPHERAL INTERFACE
Characteristic
Symbol
Conditions
Timing
Charts #
Min
Typ
Max
Unit
5, 6
100
−
−
ns
7
5.0
−
−
ms
CSB Setup Time
TcsbSup
CSB High Time
TcsbH
SO enable after CSB falling edge
TenSo
8
−
−
200
ns
SO disable after CSB rising edge
TdisSo
9
−
−
200
ns
SO Rise/Fall Time
TsoR/F
Cload = 40 pF (Note 4)
−
−
10
25
ns
SO Valid Time
TsoV
Cload = 40 pF (Note 4)
SCLK ↑ to SO 50%
10
−
20
50
ns
EN Low Valid Time
TenL
VCC = 5V; EN H→L 50%
to OUTx turning off 50%
−
10
−
−
ms
−
−
−
100
ms
−
150
−
−
ms
EN High to SPI Valid
SRR Delay Between Consecutive
Frames
(Note 5)
TenHspiV
Tsrr
(Note 6)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
4. Not production tested.
5. This is the minimum time the user must wait between SPI commands.
6. This is the minimum time the user must wait between consecutive SRR requests.
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NCV7719
CHARACTERISTIC TIMING DIAGRAMS
TlsTr
90%
TlsOff
10%
LS Turn OFF
TlsOffHsOn
90%
10%
HS Turn ON
ThsTr
90%
ThsOn
CSB
LS Turn On
TlsTf
90%
TlsOn
10%
HS Turn Off
ThsOffLsOn
90%
10%
ThsTf
90%
ThsOff
CSB
Figure 4. Detailed Driver Timing
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NCV7719
4
7
CSB
5
SCLK
3
1
2
6
CSB
SO
9
8
SI
12
SCLK
10
11
SO
Figure 5. Detailed SPI Timing
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NCV7719
TYPICAL PERFORMANCE CURVES
2.3
ACITVE MODE VCC CURRENT (mA)
6.0
SLEEP MODE CURRENT (mA)
VSx = 13.2 V
5.0
4.0
3.0
VCC = 5.25 V
2.0
VCC = 5 V
1.0
0
−50
VCC = 3.15 V
−30 −10
10
30
50
70
90
110 130 150
2.2
25°C
2.1
−40°C
2.1
2.0
3.0
3.5
4.0
4.5
5.0
Figure 7. I(VCC) Active Mode vs. V(VCC)
BODY DIODE FORWARD VOLTAGE (V)
1.6
RDS(on) (W)
125°C
Figure 6. IqTot vs. Temperature
1.8
HSx
1.4
LSx
1.2
1.0
0.8
0
50
100
150
5.5
1.2
If = 0.5 A
1.1
1.0
LSx
HSx
0.9
0.8
−50
0
50
100
150
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 8. RDS(on) vs. Temperature
Figure 9. Body Diode Voltage vs. Temperature
2.0
0.20
1.5
LSx
1.0
0.5
0
−0.5
−1.0
HSx
−1.5
VS = 13.2 V,
VCC = 5.0 V
0
50
100
IsrcLkg, IsnkLkg, LEAKAGE CURRENT
(mA)
IsdSrc, IsdSnk, OVERCURRENT (A)
2.2
VCC VOLTAGE (V)
VSx = 13.2 V
−2.0
−50
150°C
TEMPERATURE (°C)
2.0
0.6
−50
VSx = 13.2 V
2.3
150
LSx
0
−0.20
HSx
−0.40
−0.60
−0.80
−1.00
−1.20
VSx = 13.2 V
−1.40
−50
0
50
100
TEMPERATURE (°C)
TEMPERATURE (°C)
Figure 10. Over Current vs. Temperature
Figure 11. Leakage Current vs. Temperature
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150
NCV7719
DETAILED OPERATING DESCRIPTION
General Overview
SPI Communication
The NCV7719 is comprised of sixteen power drivers (8
PMOS high−side and 8 NMOS low−side). The drivers are
arranged as ten half−bridge output channels, allowing for
five independent full−bridge configured loads. Output
control and status reporting is handled via the SPI (Serial
Peripheral Interface) communications port.
Each output is characterized for a maximum 0.55 A DC
load and has a maximum 2.0 A surge capability (at VSx =
13.2 V). Maximum allowable junction temperature is 150°C
and may constrain the maximum load current and/or limit
the number of drivers active at once.
An active−high enable function (EN) allows global
control of the outputs and provides a low quiescent current
sleep mode when the device is not being utilized. An internal
pull−down resistor is provided on the input to ensure the
device enters sleep mode if the input signal is lost.
When EN is asserted, the VCC POR cycle will proceed and
bring the device into normal operation. The device
configuration registers can then be programmed via SPI.
De−asserting EN clears all registers (no configuration or
status data is stored), resets the drivers, and enters sleep
mode.
16−bit full duplex SPI communication has been
implemented for device configuration, driver control, and
reading the status data. In addition to the 16−bit status data,
a pseudo−bit (PRE_15) can also be retrieved from the SO
output.
The device must be enabled (EN = H) for SPI
communication. The SPI inputs are TTL compatible and the
SO output high level is defined by the applied VCC. The
active−low CSB input has a pull−up resistor and the
remaining inputs have pull−down resistors to bias them to
known states when the SPI is not active.
The latched thermal shutdown (TSD) status bit PRE_15
is available on SO until the first rising SCLK edge after CSB
goes low. The following conditions must be met for a valid
TSD read to be captured:
1. SCLK and SI are low before the CSB cycle;
2. CSB transitions from high to low;
3. CSB setup time (TcsbSup: Figure 5, #5) is
satisfied.
Figure 12 shows the SPI communication frame format,
and Tables 1 and 2 define the command input and diagnostic
status output bits.
CSB
SRR
SI
SCLK
SO
15
TSD
PRE_15
PSEUDO−BIT
OCS
HBSEL
ULDSC
14
13
PSF
B[12:7] ³ HBEN[6:1]
B[8:7] ³ HBEN[8:7]
B[6:1] ³ HBCNF[6:1]
B[2:1] ³ HBCNF[8:7]
OVLO
0
B[12:7] ³ HBST[6:1]
B[8:7] ³ HBST[8:7]
ULD
B[6:1] ³ HBCR[6:1]
B[2:1] ³ HBCR[8:7]
TW
Figure 12. SPI Communication Frame Format
5. Current SO data is simultaneously shifted out on
every rising edge of SCLK, starting with the MSB
(OCS).
6. CSB goes high to end the frame and SO becomes
tri−state.
7. The last 16 bits clocked into SI are transferred to
the device’s data register if no frame error is
detected, otherwise the entire frame is ignored and
the previous input data is preserved.
Communication is implemented as follows and is also
illustrated in Figures 12 and 14:
1. SI and SCLK are set to low before the CSB cycle.
2. CSB goes low to begin a serial data frame;
pseudo−bit PRE_15 is immediately available at
SO.
3. SI data is shifted in on every rising edge of SCLK,
starting with the most significant bit (MSB), SRR.
4. SI data is recognized on every falling edge of the
SCLK.
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NCV7719
Table 1. SPI COMMAND INPUT DEFINITIONS
Channels 8 – 7 (Input Bit # 14 = 1)
Bit#
Name
Function
Status*
Scope
15
SRR
Status Register Reset**
1 = Reset
Status Reset per HBSEL
14
HBSEL
Channel Group Select
1 = HB [8:7]
1 = HB [8:7] | 0 = HB [6:1]
13
ULDSC
Underload Shutdown
1 = Enabled
Enabled per HBSEL;
Per Half−Bridge Operation
X
Not Used
−
−
8
HBEN8
Enable Half−Bridge 8
0 = Hi−Z
7
HBEN7
Enable Half−Bridge 7
1 = Enabled
X
Not Used
−
2
HBCNF8
Configure Half−Bridge 8
0 = LS On, HS Off
1
HBCNF7
Configure Half−Bridge 7
1 = LS Off, HS On
0
OVLO
VSx Overvoltage Lockout
1 = Enabled
12
11
10
9
Per Half−Bridge
6
5
4
−
3
Per Half−Bridge
Global Lockout
Channels 6 – 1 (Input Bit # 14 = 0)
Bit#
Name
Function
Status*
Scope
15
SRR
Status Register Reset**
1 = Reset
Status Reset per HBSEL
14
HBSEL
Channel Group Select
0 = HB [6:1]
1 = HB [8:7] | 0 = HB [6:1]
13
ULDSC
Underload Shutdown
1 = Enabled
Enabled per HBSEL;
Per Half−Bridge Operation
12
HBEN6
Enable Half−Bridge 6
11
HBEN5
Enable Half−Bridge 5
10
HBEN4
Enable Half−Bridge 4
0 = Hi−Z
9
HBEN3
Enable Half−Bridge 3
1 = Enabled
8
HBEN2
Enable Half−Bridge 2
7
HBEN1
Enable Half−Bridge 1
6
HBCNF6
Configure Half−Bridge 6
5
HBCNF5
Configure Half−Bridge 5
4
HBCNF4
Configure Half−Bridge 4
0 = LS On, HS Off
3
HBCNF3
Configure Half−Bridge 3
1 = LS Off, HS On
2
HBCNF2
Configure Half−Bridge 2
1
HBCNF1
Configure Half−Bridge 1
0
OVLO
VSx Overvoltage Lockout
Per Half−Bridge
Per Half−Bridge
1 = Enabled
*All command input bits are set to 0 at VCC power−on reset.
**Latched faults are cleared and outputs can be re−programmed if no fault exists after SRR asserted.
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13
Global Lockout
NCV7719
Table 2. SPI STATUS OUTPUT DEFINITIONS
Channels 8 – 7 (Input Bit # 14 = 1)
Bit#
Name
Function
Status*
Scope
PRE_15
TSD
Latched Thermal Shutdown
1 = Fault
Global Notification;
Per Half−Bridge Operation
15
OCS
Latched Overcurrent
Shutdown
1 = Fault
Notification per HBSEL;
Per Half−Bridge Operation
14
PSF
VS1 and/or VS2
Undervoltage or Overvoltage
1 = Fault
Global Notification and
Global Operation
13
ULD
Underload Detect
1 = Fault
Notification per HBSEL;
Per Half−Bridge Operation
X
Not Used
(Hard coded to zero)
−
8
HBST8
Half−Bridge 8 Output Status
0 = Hi−Z
7
HBST7
Half−Bridge 7 Output Status
1 = Enabled
X
Not Used
(Hard coded to zero)
2
HBCR8
Half−Bridge 8 Config Status
0 = LS On, HS Off
1
HBCR7
Half−Bridge 7 Config Status
1 = LS Off, HS On**
0
TW
Thermal Warning
1 = Fault
12
11
10
9
Per Half−Bridge
6
5
4
−
3
Per Half−Bridge
*All status output bits are set to 0 at Vcc power−on reset (POR).
**HBCRx is forced to 0 when HBSTx = 0 via POR, SPI, or fault.
www.onsemi.com
14
Global Notification;
Per Half−Bridge Operation
NCV7719
Table 2. SPI STATUS OUTPUT DEFINITIONS
Channels 6 – 1 (If Previous Input Bit # 14 = 0)
Bit#
Name
Function
Status*
Scope
PRE_15
TSD
Latched Thermal Shutdown
1 = Fault
Global Notification;
Per Half−Bridge Operation
15
OCS
Latched Overcurrent
Shutdown
1 = Fault
Notification per HBSEL;
Per Half−Bridge Operation
14
PSF
VS1 and/or VS2
Undervoltage or Overvoltage
1 = Fault
Global Notification and
Global Operation
13
ULD
Underload Detect
1 = Fault
Notification per HBSEL;
Per Half−Bridge Operation
12
HBST6
Half−Bridge 6 Output Status
11
HBST5
Half−Bridge 5 Output Status
10
HBST4
Half−Bridge 4 Output Status
0 = Hi−Z
9
HBST3
Half−Bridge 3 Output Status
1 = Enabled
8
HBST2
Half−Bridge 2 Output Status
7
HBST1
Half−Bridge 1 Output Status
6
HBCR6
Half−Bridge 6 Config Status
5
HBCR5
Half−Bridge 5 Config Status
4
HBCR4
Half−Bridge 4 Config Status
0 = LS On, HS Off
3
HBCR3
Half−Bridge 3 Config Status
1 = LS Off, HS On**
2
HBCR2
Half−Bridge 2 Config Status
1
HBCR1
Half−Bridge 1 Config Status
0
TW
Thermal Warning
Per Half−Bridge
Per Half−Bridge
1 = Fault
Global Notification;
Per Half−Bridge Operation
*All status output bits are set to 0 at Vcc power−on reset (POR).
**HBCRx is forced to 0 when HBSTx = 0 via POR, SPI, or fault.
Frame Error Detection
device’s SI. The SO of the final device in the chain is
connected to the master’s MISO.
The hardware configuration for the NCV7719 daisy
chained with an 8− bit SPI device is shown in Figure 13. A
24−bit frame made of 16−bit word ‘A’ and 8−bit word ‘B’ is
sent from the master. Command word B is sent first followed
by word A. The master simultaneously receives status word
B first followed by word A. The progression of data from the
MCU through the sequential devices is illustrated in
Figure 14.
Compliance with the illustrated frame format is required
for proper daisy chain operation. Situations should be
avoided where an incorrect multiple of 8 bits is sent to the
devices, but the frame length does not cause a frame error in
the devices. For example, the word order could be
inadvertently interleaved or reversed. Invalid data is
accepted by the NCV7719 in such scenarios and possibly by
other devices in the chain, depending on their frame error
implementation. Data is received as a command by the
device at the beginning of the chain, but the device at the end
of the chain may receive status data from the preceding
device as a command.
The NCV7719 employs frame error detection to help
ensure input data integrity. SCLK is compared to an n x 8 bit
counter and a valid frame (CSB H−L−H cycle) has integer
multiples of 8 SCLK cycles. For the first 16 bits shifted into
SI, SCLK is compared to a modulo16 counter (n = 2), and
SCLK is compared to a modulo 8 counter (n = 1, 2, ...m)
thereafter. This variable modulus facilitates daisy chain
operation with devices using different word lengths.
The last 16 bits clocked into SI are transferred to the
NCV7719’s data register if no frame error is detected,
otherwise the entire frame is ignored and the previous input
data is preserved.
Daisy Chain Operation
Daisy chain operation is possible with multiple 16−bit and
8−bit devices that have a compatible SPI protocol. The clock
phase and clock polarity with respect to the data for all the
devices in the chain must be the same as the NCV7719.
CSB and SCLK are parallel connected to every device in
the chain while SO and SI are series connected between each
device.
The master’s MOSI is connected to the SI of the first
device and the first device’s SO is connected to the next
www.onsemi.com
15
NCV7719
CMD [x, n] = Command Word to Device ‘x’, Length ‘n’
STA [x, n] = Status Word from Device ‘x’, Length ‘n’
NCV7719
16−bit Device
MCU
MISO
8−bit Device
CSB
CSB
CSB
SCLK
SCLK
SCLK
MOSI
Master
SO
SI
CMD [B, 8]
+
CMD [A, 16]
SO
SI
STA [A, 16]
+
CMD [B, 8]
Device A
STA [B, 8]
+
STA [A, 16]
Device B
Figure 13. Daisy Chain Configuration
24bit Frame
Word B − 8 bits
Word A − 16 bits
CSB
SCLK
7
6
1
0
MSB
SI
15
LSB
8
7
0
MSB
LSB
MSB
LSB
SI data is recognized on the falling SCLK. edge
SO
TSD
MSB
LSB
SO data is shifted out on the rising SCLK edge.
Modulo 16 counter begins on the first rising SCLK edge after CSB goes low.
Modulo 16 counter ends − 16 bit word length valid.
Modulo 8 counter begins on the next rising SCLK edge.
Modulo 8 counter ends − 8 bit word length valid. valid n*8 bit frame.
Figure 14. Daisy Chain – 24 bit Frame Format
TSD Bit in Daisy Chain Operation
The TSD status automatically propagates through the
chain from the SO output of the previous device to the SI
input of the next. This is shown in Figures 16 and 17, first
without a TSD fault in either device (Figure 16), and then
subsequently with a latched TSD fault (TSD = 1) in device
“A” propagating through to device “B” (Figure 17).
Since the TSD status of any device propagates
automatically through the entire chain, it is not possible to
determine which device (or devices) has a fault (TSD = 1).
The usual status data from each device will need to be
examined to determine where a fault (or faults) may exist.
The SO path is designed to allow TSD status retrieval in
a daisy chain configuration using NCV7719 or other devices
with identical SPI functionality. The TSD status bit is OR’d
with SI and then multiplexed with the device’s usual status
data (Figure 15).
CSB is held high and SI and SCLK are held low by the
master before the start of the SPI frame. TSD status is
immediately available as bit PRE_15 at SO (SO = TSD)
when CSB goes low to begin the frame. The usual status data
(SO = STA) becomes available after the first rising SCLK
edge.
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16
NCV7719
SI
M
U
X
TSD
SO
SO
SI
SPI
SEL
Figure 15. TSD SPI Link
NCV7719
MCU
MISO
NCV7718/19/20
CSB
1³0
CSB
CSB
SCLK
0
SCLK
SCLK
MOSI
0
SI
Master
SO
Z³ 0
SI
SO
Device A
Device B
No TSD
No TSD
Z³ 0
Figure 16. Daisy Chain Without TSD Fault
NCV7719
MCU
MISO
Master
NCV7718/19/20
CSB
1³0
CSB
CSB
SCLK
0
SCLK
SCLK
MOSI
0
SI
SO
Z³ 1
SI
SO
Device A
Device B
Latched TSD
No TSD
Z³1
Figure 17. Daisy Chain With TSD Fault
Power Up/Down Control
Driver Control
The VCC supply input powers the device’s logic core. A
VCC power−on reset (POR) function provides controlled
power−up/down. VCC POR initializes the command input
and status output registers to their default states (0x00), and
ensures that the bridge output and SO drivers maintain Hi−Z
as power is applied. SPI communication and normal device
operation can proceed once VCC rises above the POR
threshold.
The VS1 and VS2 supply inputs power their respective
output drivers (refer to Figure 2 and the PIN FUNCTION
DESCRIPTION). The VSx inputs are monitored to ensure
that the supply stays within the recommended operating
range. If the VSx supply moves into either of the VS
undervoltage or overvoltage regions, the output drivers are
switched to Hi−Z but command and status data is preserved.
The NCV7719 has the flexibility to control each
half−bridge driver channel via SPI. Actual driver output
state is determined by the command input and the current
fault status bits as shown in Figure 18 and Table 3.
The channels are divided into two groups and each group
is selected by the HBSEL input bit (see Table 1). High−side
(HSx) and low−side (LSx) drivers of the same channel
cannot be active at the same time, and non−overlap delays
are imposed when switching between HSx and LSx drivers
in the same channel. This control design thus prevents
current shoot−through.
After the device has powered up and the drivers are
allowed to turn on, the drivers remain on until commanded
off via SPI or until a fault condition occurs.
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17
NCV7719
VS
HSx
HBCNFx
OUTx
HBENx
LSx
HBCRx
GND
PSF −VSUV
PSF −VSOV
HBSTx
SPI −OVLO
SPI −ULDSC
Q
R
S
LATCH
SRR
CONTROL
ULD
OCS
(reset dominant)
TSD
FAULT
SPI
Figure 18. Simplified Half−Bridge Control Logic
Table 3. OUTPUT STATE VS. COMMAND AND STATUS
Command
Status
HBENx
HBCNFx
HBSTx
HBCRx
OUTx
X
X
0
0
Z
0
X
0
0
Z
1
0
1
0
GND
1
1
1
1
VS
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18
NCV7719
DIAGNOSTICS, PROTECTIONS, STATUS REPORTING AND RESET
Overview
intervention for output recovery and status memory clear.
Diagnostics resulting in output lockout and non−latched
status (VSOV or VSUV) may recover and clear
automatically. Output configurations can be changed during
output lockout. Outputs assume the new configurations or
resume the previous configurations when an auto−recover
fault is resolved. Table 5 shows output states during faults
and output recovery modes, and Table 6 shows the status
memory and memory clear modes.
The NCV7719 employs diagnostics designed to prevent
destructive overstress during a fault condition. Diagnostics
are classified as either supervisory or protection functions
(Table 4). Supervisory functions provide status information
about device conditions. Protection functions provide status
information and activate fault management behaviors.
Diagnostics resulting in output shutdown and latched
status may depend on a qualifier and may require user
Table 4. Diagnostic Classes and Functions
Name
Class
Function
TSD
Protection
Thermal Shutdown
OCS
Protection
Overcurrent Shutdown
PSF
Supervisory
Under/overvoltage Lockout
ULD
Protection
Underload Shutdown
HBSTX
Supervisory
Half−Bridge X Output Status
HBCRX
Supervisory
Half−Bridge X Config Status
TW
Supervisory
Thermal Warning
Table 5. OUTPUT STATE VS. FAULT AND OUTPUT RECOVERY
Fault
Qualifier
OUTx
State
OUTx
Recovery
TSD
−
→Z
Send SRR
OCS
−
→Z
Send SRR
PSF – VSOV
OVLO = 1
→Z→Yn | Yn+1
Auto*
OVLO = 0
Unaffected
−
PSF – VSUV
−
→Z→Yn | Yn+1
Auto*
ULD
ULDSC = 1
→Z
Send SRR
ULDSC = 0
Unaffected
−
−
Unaffected
−
TW
*OUTx returns to its previous state (Yn) or new state (Yn+1) if fault is removed.
Table 6. STATUS MEMORY VS. FAULT AND MEMORY CLEAR
Fault
Qualifier
Status
Memory
Memory
Clear
TSD
−
Latched
Send SRR
OCS
−
Latched
Send SRR
PSF – VSOV
OVLO = X
Non−Latched
Auto*
PSF – VSUV
−
Non−Latched
Auto*
ULD
ULDSC = X
Latched
Send SRR
TW
−
Non−Latched
Auto*
*Status memory returns to its no−fault state if fault is removed.
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19
NCV7719
Status Information Retrieval
Diagnostics Details
Current status information as selected by HBSEL is
retrieved during each SPI frame. To preserve device
configuration and output states, the previous SI data pattern
must be sent during the status retrieval frame.
Status information is prevented from being updated
during a SPI frame but new status becomes available after
CSB goes high at the end of the frame provided the frame did
not contain an SRR request. For certain device faults, it may
not be possible to determine which channel (or channels) has
a particular fault (or faults) since notification may be via a
single global status bit. The complete status data from all
channels may need to be examined to determine where a
fault may exist.
The following sections describe the individual
diagnostics and some behaviors. In each description and
illustration, a SPI frame is assumed to always be valid and
the SI data pattern sent for HBCNFx and HBENx is the same
as the previous frame. Actual results can depend on
asynchronous fault events and SPI clock frequency and
frame rate.
Undervoltage Lockout
Global Notification, Global Operation
Undervoltage detection and lockout control is provided
by monitoring the VS1, VS2 and VCC supply inputs.
Undervoltage hysteresis is provided to ensure clean
detection transitions. Undervoltage timing is shown in
Figure 19.
Undervoltage at either VSx input turns off all outputs and
sets the power supply fail (PSF) status bit. The outputs return
to their previously programmed state and the PSF status bit
is cleared when VSx rises above the hysteresis voltage level.
SPI is available and programmed output enable and
configuration states are maintained if proper VCC is present
during VSx undervoltage. VCC undervoltage turns all
outputs off and clears the command input and status output
registers.
Status Register Reset − SRR
Sending SRR = 1 clears status memory and re−activates
faulted outputs for channels as selected by HBSEL. The
previous SI data pattern must be sent with SRR to preserve
device configuration and output states. SRR takes effect at
the rising edge of CSB and a timer (Tsrr) is started. Tsrr is the
minimum time the user must wait between consecutive SRR
requests. If a fault is still present when SRR is sent,
protection can be re−engaged and shutdown can recur. The
device can also be reset by toggling the EN pin or by VCC
power−on reset.
SI
OUTx
LS
OUTx
LS
OUTx
LS
OUTx
LS
OUTx
HS
OUTx
HS
OUTx
HS
SO
X
No
Fault
PSF
No
Fault
Z
0x00
No
Fault
Status
?
No Fault
PSF
No
Fault
?
Output
State
?
OUTx GND
ALL
Z
OUTx GND
ALL
Z
³0x00
No
Fault
OUTx VS
VSx
VSUV
Vcc
VccUV
t
Figure 19. Undervoltage Timing
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20
NCV7719
Overvoltage Lockout
X), and sets the power supply fail (PSF) status bit (see
Tables 5 and 6). The outputs return to their previously
programmed state and the PSF status bit is cleared when
VSx falls below the hysteresis voltage level.
To reduce stress, it is recommended to operate the device
with OVLO bit asserted to ensure that the drivers turn off
during a load dump scenario.
Global Notification, Global Operation
Overvoltage detection and lockout control is provided by
monitoring the VS1 and VS2 supply inputs. Overvoltage
hysteresis is provided to ensure clean detection transitions.
Overvoltage timing is shown in Figure 20.
Overvoltage at either VSx input turns off all outputs if the
overvoltage lockout input bit is set (OVLO = 1, HBSEL =
SI
OUTx ON
OVLO=0
OUTx
ON
OUTx
ON
OUTx ON
OVLO=1
OUTx
ON
OUTx
OFF
SO
X
No
Fault
PSF
No
Fault
PSF
No
Fault
No
Fault
PSF
No
Fault
PSF
No
Fault
No
Fault
ALL
Z
OUTx
ON
OUTx Z
Status
?
Output
State
?
OUTx
ON
VSOV
VSx
VSOV
t
Figure 20. Overvoltage Timing
Overcurrent Shutdown
(OCS) status bit is set. The OCS bit is cleared and channels
are re−activated by sending SRR = 1. The channel group
select (HBSEL) input bit determines which channels are
affected by SRR.
A persistent overcurrent cause should be resolved prior to
re−activation to avoid repetitive stress on the drivers.
Extended exposure to stress may affect device reliability.
Notification per HBSEL, Per Half−Bridge Operation
Overcurrent detection and shutdown control is provided
by monitoring each HS and LS driver. Overcurrent timing is
shown in Figure 21. Overcurrent in either driver starts a
channel’s overcurrent delay timer. If overcurrent exists after
the delay, both drivers are latched off and the overcurrent
SI
OUTx ON
SRR=0
OUTx
ON
OUTx
ON
OUTx ON
SRR=1
OUTx
ON
OUTx
ON
SO
No
Fault
No
Fault
OCS
OCS
No
Fault
OCS
Status
No
Fault
OCS
No
Fault
OCS
Output
State
OUTx
ON
OUTx Z
OUTx
ON
OUTx Z
TdOc
Output
Current
TdOc
IsdSxx
t
Figure 21. Overcurrent Timing
www.onsemi.com
21
NCV7719
Underload Shutdown
set; otherwise the drivers remain on and the ULD bit is set
(see Table 5 and 6). The ULD bit is cleared and channels are
re−activated by sending SRR = 1. The channel group select
(HBSEL) input bit determines which channels are affected
by SRR and also determines which half−bridges are latched
off via the ULDSC command bit (see Table 1).
Underload may result from a fault (e.g. open−load)
condition or normal circuit behavior (e.g. L/R tau). In motor
applications it is often desirable to actively brake the motor
by turning on both HS or LS drivers in two half−bridge
channels. If the configuration is two LS drivers (LS brake),
an underload will result as the motor current decays
normally. Utilizing HS brake instead will avoid underload
notification.
Notification per HBSEL, Shutdown per HBSEL
Underload detection and shutdown control is provided by
monitoring each LS driver. Underload timing is shown in
Figure 22. Underload at a LS driver starts the global
underload delay timer. If underload occurs in another
channel after the global timer has been started, the delay for
any subsequent underload will be the remainder of the timer.
The timer runs continuously with a persistent underload
condition.
If underload exists after the delay and if the underload
shutdown (ULDSC) command bit is set, both HS and LS
drivers are latched off and the underload (ULD) status bit is
SI
LSx ON
ULDSC=0
LSx
ON
LSx ON
SRR=1
LSx ON
ULDSC=1
LSx ON
SRR=1
LSx
ON
SO
No
Fault
No
Fault
ULD
ULD
ULD
No
Fault
No Fault
Status
Output
State
ULD
OUTx
ON
No Fault
ULD
OUTx
Z
OUTx GND
TdUld
Output
Current
No
Fault
TdUld
OUTx GND
TdUld
IuldLS
t
Figure 22. Underload Timing
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22
NCV7719
Thermal Warning and Thermal Shutdown
bit is automatically cleared when sensor temperature falls
below the warning hysteresis level (TJ < TwHy). A
channel’s output state is unaffected by TW.
When sensor temperature exceeds the shutdown level (TJ
> Tsd), the channel’s HS and LS drivers are latched off, the
TW bit is/remains set, and the TSD (PRE_15) bit is set. The
TSD bit is cleared and all affected channels in a group are
re−activated (TJ < TsdHy) by sending SRR = 1. The channel
group select (HBSEL) input bit determines which channels
are affected by SRR.
Global Notification, Per Half−Bridge Operation
Thermal warning (TW) and thermal shutdown (TSD)
detection and control are provided for each half−bridge by
monitoring the driver pair’s thermal sensor. Thermal
hysteresis is provided for each of the warning and shutdown
functions to ensure clean detection transitions. Since TW
notification precedes TSD, software polling of the TW bit
enables avoidance of thermal shutdown. Thermal warning
and shutdown timing is shown in Figure 23.
The TW status bit is set when a half−bridge’s sensor
temperature exceeds the warning level (TJ > Twr), and the
SI
OUTx
ON
OUTx
ON
OUTx
ON
OUTx
ON
OUTx ON
SRR=1
OUTx ON
SRR=1
SO
No
Fault
TW
No
Fault
TW
TSD
TW
TW
Status
No
Fault
TW
No
Fault
TW
TSD
TW
Output
State
TW
OUTx Z
OUTx ON
TW
OUTx
ON
TJ
TSD
TsdHy
TWR
TwHy
t
Figure 23. Thermal Warning and Shutdown Timing
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23
NCV7719
THERMAL PERFORMANCE ESTIMATES
200
3.0
Spreader based on
JESD51−3
Spreader based on
JESD51−3
MAXIMUM POWER (W)
180
qJA (°C/W)
160
140
120
100
1.0 oz
80
2.0 oz
2.5
2.0 oz
2.0
1.5
1.0 oz
1.0
60
40
0
100
200
300
400
500
600
700
800
900
0.5
0
100
200
300
400
500
600
700
800
900
COPPER HEAT SPREADER AREA (mm2)
COPPER HEAT SPREADER AREA (mm2)
Figure 24. qJA vs. Cu Area and Thickness
Figure 25. Maximum Power vs. Cu Area and
Thickness
80
70
Spreader based on
JESD51−3
200 mm2
R(t) (°C/W)
60
50
600 mm2
40
30
20
10
0
0.000001
0.00001
0.0001
0.001
0.01
0.1
1
10
100
1000
PULSE TIME (sec)
Figure 26. Transient R(t) vs. Area for 2 oz Spreader
ORDERING INFORMATION
Device
NCV7719DQR2G
Package
Shipping†
SSOP24
(Pb−Free)
2500 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
24
NCV7719
PACKAGE DIMENSIONS
SSOP24 NB EP
CASE 940AK
ISSUE O
2X
0.20 C A-B
NOTE 4
D
NOTE 6
D
A
24
2X
L1
13
H
L2
0.20 C
GAUGE
PLANE
ÉÉÉ
ÉÉÉ
E1
NOTE 5
PIN 1
REFERENCE
E
L
DETAIL A
A1
C
NOTE 7
1
12
0.20 C
e
B
SEATING
PLANE
2X 12 TIPS
b
0.12
24X
NOTE 6
TOP VIEW
C A-B D
M
DETAIL A
A
A2
h
h
0.10 C
M
0.10 C
24X
0.15
SIDE VIEW
M
C A-B D
c
A1
C
END VIEW
SEATING
PLANE
NOTE 8
D2
0.15
M
C A-B D
E2
NOTE 8
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. DAMBAR PROTRUSION SHALL
BE 0.10 MAX. AT MMC. DAMBAR CANNOT BE
LOCATED ON THE LOWER RADIUS OF THE
FOOT. DIMENSION b APPLIES TO THE FLAT
SECTION OF THE LEAD BETWEEN 0.10 TO 0.25
FROM THE LEAD TIP.
4. DIMENSION D DOES NOT INCLUDE MOLD
FLASH, PROTRUSIONS OR GATE BURRS. MOLD
FLASH, PROTRUSIONS OR GATE BURRS SHALL
NOT EXCEED 0.15 PER SIDE. DIMENSION D IS
DETERMINED AT DATUM PLANE H.
5. DIMENSION E1 DOES NOT INCLUDE INTERLEAD
FLASH OR PROTRUSION. INTERLEAD FLASH
OR PROTRUSION SHALL NOT EXCEED 0.25 PER
SIDE. DIMENSION E1 IS DETERMINED AT DATUM PLANE H.
6. DATUMS A AND B ARE DETERMINED AT DATUM
PLANE H.
7. A1 IS DEFINED AS THE VERTICAL DISTANCE
FROM THE SEATING PLANE TO THE LOWEST
POINT ON THE PACKAGE BODY.
8. CONTOURS OF THE THERMAL PAD ARE UNCONTROLLED WITHIN THE REGION DEFINED
BY DIMENSIONS D2 AND E2.
DIM
A
A1
A2
b
c
D
D2
E
E1
E2
e
h
L
L1
L2
M
RECOMMENDED
SOLDERING FOOTPRINT*
BOTTOM VIEW
5.63
24X
1.15
2.84 6.40
1
24X
0.65
PITCH
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
25
MILLIMETERS
MIN
MAX
1.70
--0.00
0.10
1.10
1.65
0.19
0.30
0.09
0.20
8.64 BSC
5.28
5.58
6.00 BSC
3.90 BSC
2.44
2.64
0.65 BSC
0.25
0.50
0.40
0.85
1.00 REF
0.25 BSC
0_
8_
NCV7719
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