TI1 BQ500412RGZT Low system cost, wireless power controller for wpc tx a6 Datasheet

bq500412
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SLUSBO2A – NOVEMBER 2013 – REVISED DECEMBER 2013
Low System Cost, Wireless Power Controller for WPC TX A6
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FEATURES
DESCRIPTION
•
The bq500412 is a Qi-certified value solution that
integrates all functions required to control wireless
power delivery to a single WPC1.1 compliant
receiver. It is WPC1.1 compliant and designed for 12V systems, or 5-V systems with an optional boost
converter, as a wireless power consortium type A6
free positioning transmitter. The bq500412 pings the
surrounding environment for WPC compliant devices
to be powered, safely engages the device, receives
packet communication from the powered device and
manages the power transfer according to WPC1.1
specification. To maximize flexibility in wireless power
control applications, Dynamic Power Limiting™ (DPL)
is featured on the bq500412 when used with an
optional boost converter from a 5-V input. Dynamic
Power Limiting™ enhances user experience by
seamlessly optimizing the usage of power available
from limited input supplies. The bq500412 supports
both Foreign Object Detection (FOD) and enhanced
Parasitic Metal Object Detection (PMOD) for legacy
product by continuously monitoring the efficiency of
the established power transfer, protecting from power
lost due to metal objects misplaced in the wireless
power transfer field. Should an abnormal operating
condition develop during power transfer, the
bq500412 handles it and provides indicator outputs.
Comprehensive status and fault monitoring features
enable a low cost yet robust, Qi-certified wireless
power system design.
1
2
•
•
•
•
•
•
Proven, Qi-Certified WPC1.1 Solution for
Transmit-Side Application (suitable for 1, 2 or
3 coil configurations)
Lowest Device Count for Full WPC1.1 12-V A6
Solution (single driver stage for all coils)
New Standby Scheme Reduces Standby and
Sleep Power Without Need for Extra
Supervisor Circuit
Improved FOD Calibration Scheme Simplifies
Certification and Increases Accuracy at Higher
Power (customer configurable)
Dynamic Power Limiting™ for USB and
Limited Power Source Operation When Used
With 5-V Input
Digital Demodulation Removes Need for
External Filter Circuitry
10 Configurable LED modes Indicate Charging
State and Fault Status
APPLICATIONS
•
•
Wireless Power Consortium (WPC1.1)
Compliant Wireless Chargers For:
– Qi-Certified Smart Phones and Other
Handhelds
– Car and Other Vehicle Accessories
See www.ti.com/wirelesspower for More
Information on TI's Wireless Charging
Solutions
The bq500412 is available in a 48-pin, 7-mm x 7-mm
QFN package.
System Diagram and Efficiency Versus System Output Power
12 V Input
70
Current
Sense
WPC A 6 Coil
Assembly
BQ500412
HalfBridge
Stage
60
Efficiency (%)
3.3 VDC
Regulator
80
50
40
30
20
COMM
Signal
10
Coil Select
0
0
0.5
1
1.5
2
2.5
3
3.5
4
Power (W)
4.5
5
C001
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Dynamic Power Limiting is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
bq500412
SLUSBO2A – NOVEMBER 2013 – REVISED DECEMBER 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION (1)
OPERATING
TEMPERATURE
RANGE, TA
ORDERABLE PART NUMBER
PIN COUNT
SUPPLY
PACKAGE
TOP SIDE
MARKING
BQ500412RGZR
48 pin
Reel of 2500
QFN
BQ500412
BQ500412RGZT
48 pin
Reel of 250
QFN
BQ500412
-40°C to 110°C
(1)
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS (1)
over operating free-air temperature range (unless otherwise noted)
VALUE
MIN
MAX
Voltage applied at V33D to GND
–0.3
3.6
Voltage applied at V33A to GND
–0.3
3.6
–0.3
3.6
–40
150
Voltage applied to any pin
(2)
Storage temperature,TSTG
(1)
(2)
2
UNIT
V
°C
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings
only and functional operation of the device at these or any other conditions beyond those indicated under recommended operating
conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
All voltages referenced to GND.
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RECOMMENDED OPERATING CONDITIONS
over operating free-air temperature range (unless otherwise noted)
MIN
V
Supply voltage during operation, V33D, V33A
3.0
TA
Operating free-air temperature range
–40
TJ
Junction temperature
TYP MAX
3.3
UNIT
3.6
110
110
V
°C
THERMAL INFORMATION
bq500412
THERMAL METRIC (1)
RGZ
UNITS
48 PINS
θJA
Junction-to-ambient thermal resistance (2)
28.4
θJCtop
Junction-to-case (top) thermal resistance (3)
14.2
(4)
θJB
Junction-to-board thermal resistance
ψJT
Junction-to-top characterization parameter (5)
0.2
ψJB
Junction-to-board characterization parameter (6)
5.3
θJCbot
Junction-to-case (bottom) thermal resistance (7)
1.4
(1)
(2)
(3)
(4)
(5)
(6)
(7)
5.4
°C/W
For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
The junction-to-case (top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDECstandard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
The junction-to-top characterization parameter, ψJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA, using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-board characterization parameter, ψJB, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining θJA , using a procedure described in JESD51-2a (sections 6 and 7).
The junction-to-case (bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
Spacer
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ELECTRICAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
V33A = 3.3 V
8
15
V33D = 3.3 V
44
55
V33D = V33A = 3.3 V
52
60
3.3
3.6
4
4.6
UNIT
SUPPLY CURRENT
IV33A
IV33D
Supply current
ITOTAL
mA
INTERNAL REGULATOR CONTROLLER INPUTS/OUTPUTS
V33
3.3-V linear regulator
V33FB
3.3-V linear regulator feedback
IV33FB
Series pass base drive
Beta
Series NPN pass device
Emitter of NPN transistor
3.25
VIN = 12 V; current into V33FB pin
10
V
mA
40
EXTERNALLY SUPPLIED 3.3 V POWER
V33D
Digital 3.3-V power
TA = 25°C
3
3.6
V33A
Analog 3.3-V power
TA = 25°C
3
3.6
V33Slew
V33 slew rate
V33 slew rate between 2.3 V and 2.9 V,
V33A = V33D
0.25
V
V/ms
DIGITAL DEMODULATION INPUTS COMM_A+, COMM_A-, COMM_B+, COMM_BVbias
COMM+ Bias Voltage
COMM+,
COMM-
1.0
Modulation voltage digital resolution
REA
Input impedance
Ground reference
0.5
IOFFSET
Input offset current
1-kΩ source impedance
–5
V
1
1.5
mV
3
MΩ
5
µA
0.36
V
ANALOG INPUTS V_SENSE, I_SENSE, T_SENSE, LED_MODE, LOSS_THR, SNOOZE_CAP, PWR_UP
VADDR_OPEN
Voltage indicating open pin
LED_MODE open
VADDR_SHORT
Voltage indicating pin shorted to GND
LED_MODE shorted to ground
VADC_RANGE
Measurement range for voltage monitoring
ALL ANALOG INPUTS
INL
ADC integral nonlinearity
RIN
Input impedance
CIN
Input capacitance
Ground reference
2.37
0
2.5
-2.5
2.5
8
mV
MΩ
10
pF
DIGITAL INPUTS/OUTPUTS
DGND1
+ 0.25
VOL
Low-level output voltage
IOL = 6 mA , V33D = 3 V
VOH
High-level output voltage
IOH = -6 mA , V33D = 3 V
VIH
High-level input voltage
V33D = 3V
VIL
Low-level input voltage
V33D = 3.5 V
IOH(MAX)
Output high source current
4
IOL(MAX)
Output low sink current
4
V33D
- 0.6V
2.1
V
3.6
1.4
mA
SYSTEM PERFORMANCE
VRESET
Voltage where device comes out of reset
V33D Pin
tRESET
Pulse width needed for reset
RESET pin
fSW
Switching Frequency
4
2.4
2
112
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V
µs
205
kHz
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DEVICE INFORMATION
Functional Block Diagram
bq500412
LED Control /
Low Power
Interface
COMM_A+ 37
COMM_A- 38
COMM_B+ 39
6
PMOD
7
LED_A
8
LED_B
9
SLEEP
22 FOD_CAL
25 LED_C
Digital
Demodulation
18 SNOOZE
13 FOD
COMM_B- 40
12 PWM-A
Controller
PWM
15 COIL_1
16 COIL_2
COIL_PEAK
1
17 COIL_3
V_SENSE 45
I_SENSE 42
T_SENSE
2
12-bit
ADC
23 BUZ_AC
Buzzer
Control
24 BUZ_DC
LOSS_THR 43
LED_MODE 44
SNOOZE_CAP
POR
11 DATA
I2C
3
10 CLK
5
RESET
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COMM_A+
COMM_B-
I_SENSE
V_SENSE
V_SENSE
37
36
GND
48 47 46 45 44 43 42 41 40 39 38
ADCREF
COMM_A-
COMM_B+
RESERVED
LOSS_THR
LED_MODE
RGZ Package
(Top View)
GND
COIL_PEAK
1
T_SENSE
2
35
BPCAP
SNOOZE_CAP
3
34
V33A
PWR_UP
4
33
V33D
RESET
5
32
GND
PMOD
6
31
GND
bq500412
LED_A
7
30
RESERVED
LED_B
8
29
RESERVED
SLEEP
9
28
RESERVED
CLK
10
27
RESERVED
DATA
11
26
RESERVED
6
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LED_C
BUZ_DC
BUZ_AC
FOD_CAL
SNOOZE_CHG
RESERVED
RESERVED
SNOOZE
COIL_3
COIL_2
COIL_1
RESERVED
25
12
13 14 15 16 17 18 19 20 21 22 23 24
FOD
PWM_A
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PIN FUNCTIONS
PIN
NO.
1
NAME
I/O
DESCRIPTION
COIL_PEAK
I
Connected to peak detect circuit. Protects from coil overvoltage event.
T_SENSE
I
Sensor Input. Device shuts down when below 1 V for longer than 150ms. If not used, keep
above 1 V by connecting to the 3.3-V supply.
3
SNOOZE_CAP
I
Connected to interval timing capacitor
4
PWR_UP
I
First power-up indicator
5
RESET
I
Device reset. Use a 10-kΩ to 100-kΩ pull-up resistor to the 3.3-V supply.
6
PMOD
O
Select for PMOD threshold
7
LED_A
I
Connect to an LED via 470-Ω resistor for status indication. Typically GREEN
8
LED_B
I
Connect to an LED via 470-Ω resistor for status indication. Typically RED
2
9
SLEEP
O
Force SLEEP (5 sec low power)
10
CLK
I/O
10-kΩ pull-up resistor to 3.3-V supply. Please contact field for GUI application assitance.
11
DATA
I/O
10-kΩ pull-up resistor to 3.3-V supply. Please contact field for GUI application assitance.
PWM_A
O
PWM Output A, controls one half of the full bridge in a phase-shifted full bridge. Switching
deadtimes must be externally generated.
13
FOD
O
Select for FOD threshold
14
RESERVED
O
Reserved. Leave open.
15
COIL_1
O
Select first coil
16
COIL_2
O
Select second coil
17
COIL_3
O
Select third coil
18
SNOOZE
O
Force SNOOZE (500ms low power)
19
RESERVED
O
Reserved, leave this pin open.
20
RESERVED
I
Reserved, connect to GND.
21
SNOOZE_CHG
O
Charge the snooze cap
22
FOD_CAL
O
Select for FOD calibration resistor
23
BUZ_AC
O
AC Buzzer Output. Outputs a 400-ms, 4-kHz AC pulse when charging begins.
BUZ_DC
O
DC Buzzer Output. Outputs a 400-ms DC pulse when charging begins. This could also be
connected to an LED via 470-Ω resistor.
25
LED_C
I/O
Connect to an LED via 470-Ω resistor for status indication. Typically YELLOW
26
RESERVED
I/O
Reserved, connect to GND.
27
RESERVED
I/O
Reserved, leave this pin open.
28
RESERVED
I/O
Reserved, leave this pin open.
29
RESERVED
I/O
Reserved, leave this pin open.
30
RESERVED
I/O
Reserved, leave this pin open.
31
GND
I/O
Reserved, connect to GND.
12
24
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PIN FUNCTIONS (continued)
PIN
NO.
32
33
34
GND
V33D
V33A
I/O
DESCRIPTION
—
GND.
—
Digital core 3.3-V supply. Be sure to decouple with bypass capacitors as close to the part as
possible.
—
Analog 3.3-V Supply. This pin can be derived from V33D supply, decouple with 10-Ω resistor
and additional bypass capacitors
35
BPCAP
—
Bypass capacitor for internal 1.8-V core regulator. Connect bypass capacitor to GND.
36
GND
—
GND.
37
COMM_A+
I
Digital demodulation non-inverting input A, connect parallel to input B+.
38
COMM_A-
I
Digital demodulation inverting input A, connect parallel to input B-.
39
COMM_B+
I
Digital demodulation non-inverting input B, connect parallel to input A+.
40
COMM_B-
I
Digital demodulation inverting input B, connect parallel to input A-.
41
RESERVED
O
Reserved, leave this pin open.
I
Transmitter input current, used for efficiency calculations. Use 20-mΩ sense resistor and
A=50 gain current sense amplifier.
42
I_SENSE
43
LOSS_THR
I
Input to program FOD/PMOD thresholds and FOD_CAL correction.
44
LED_MODE
I
Input to select from four LED modes.
I
Transmitter input voltage, used for efficiency calculations. Use 76.8-kΩ to 10-kΩ divider to
minimize quiescent current.
I
System input voltage, used for DPL. Use 76.8-kΩ to 10-kΩ divider to minimize quiescent
current.
45
46
8
NAME
V_SENSE
V_IN
47
GND
48
ADCREF
49
EPAD
—
I
—
GND.
External Reference Voltage Input. Connect this input to GND.
Flood with copper GND plane and stitch vias to PCB internal GND plane.
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Principles of Operation
Fundamentals
The principle of wireless power transfer is simply an open cored transformer consisting of primary and secondary
coils and associated electronics. The primary coil and electronics are also referred to as the transmitter, and the
secondary side the receiver. The transmitter coil and electronics are typically built into a charger pad. The
receiver coil and electronics are typically built into a portable device, such as a cell-phone.
When the receiver coil is positioned on the transmitter coil, magnetic coupling occurs when the transmitter coil is
driven. The flux is coupled into the secondary coil which induces a voltage, current flows, it is rectified and power
can be transferred quite effectively to a load - wirelessly. Power transfer can be managed via any of various
familiar closed-loop control schemes.
Wireless Power Consortium (WPC)
The Wireless Power Consortium (WPC) is an international group of companies from diverse industries. The WPC
standard was developed to facilitate cross compatibility of compliant transmitters and receivers. The standard
defines the physical parameters and the communication protocol to be used in wireless power. For more
information, go to www.wirelesspowerconsortium.com.
Power Transfer
Power transfer depends on coil coupling. Coupling is dependent on the distance between coils, alignment, coil
dimensions, coil materials, number of turns, magnetic shielding, impedance matching, frequency and duty cycle.
Most importantly, the receiver and transmitter coils must be aligned for best coupling and efficient power transfer.
The closer the space between the coils, the better the coupling, but the practical distance is set to be less than 5
mm (as defined within the WPC Specification) to account for housing and interface surfaces.
Shielding is added as a backing to both the transmitter and receiver coils to direct the magnetic field to the
coupled zone. Magnetic fields outside the coupled zone do not transfer power. Thus, shielding also serves to
contain the fields to avoid coupling to other adjacent system components.
Regulation can be achieved by controlling any one of the coil coupling parameters. For WPC compatibility, the
transmitter coils and capacitance are specified and the resonant frequency point is fixed. Power transfer is
regulated by changing the operating frequency between 120 kHz to 205 kHz. The higher the frequency, the
further from resonance and the lower the power. Duty cycle remains constant at 50% throughout the power band
and is reduced only once 205 kHz is reached.
The WPC standard describes the dimension and materials of the coils. It also has information on tuning the coils
to resonance. The value of the inductor and resonant capacitor are critical to proper operation and system
efficiency.
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Communication
Communication within the WPC is from the receiver to the transmitter, where the receiver tells the transmitter to
send power and how much. In order to regulate, the receiver must communicate with the transmitter whether to
increase or decrease frequency. The receiver monitors the rectifier output and using Amplitude Modulation (AM),
sends packets of information to the transmitter. A packet is comprised of a preamble, a header, the actual
message and a checksum, as defined by the WPC standard.
The receiver sends a packet by modulating an impedance network. This AM signal reflects back as a change in
the voltage amplitude on the transmitter coil. The signal is demodulated and decoded by the transmitter side
electronics and the frequency of its coil drive output is adjusted to close the regulation loop. The bq500412
features internal digital demodulation circuitry.
The modulated impedance network on the receiver can either be resistive or capacitive. Figure 1 shows the
resistive modulation approach, where a resistor is periodically added to the load and also shows the resulting
change in resonant curve which causes the amplitude change in the transmitter voltage indicated by the two
operating points at the same frequency. Figure 2 shows the capacitive modulation approach, where a capacitor
is periodically added to the load and also shows the resulting amplitude change in the transmitter voltage.
Rectifier
Receiver Coil
Receiver
Capacitor
Amax
Modulation
Resitor
Operating state at logic “0”
A(0)
Operating state at logic “1”
A(1)
Comm
Fsw
a)
F, kHz
b)
Figure 1. Receiver Resistive Modulation Circuit
Rectifier
Receiver Coil
Receiver
Capacitor
Modulation
Capacitors
Amax
Comm
A(0)
Operating state at logic “ 0”
A(1)
Operating state at logic “ 1”
Fsw
F, kHz
Fo(1) < Fo(0)
a)
b)
Figure 2. Receiver Capacitive Modulation Circuit
10
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Application Information
Coils and Matching Capacitors
The coil and matching capacitor selection for the transmitter has been established by WPC standard. These
values are fixed and cannot be changed on the transmitter side.
An up to date list of available and compatible A6 transmitter coils can be found here (Texas Instruments
Literature Number SLUA649):
Capacitor selection is critical to proper system operation. The total capacitance value of 147nF is required in the
center coil of the resonant tank. This capacitance is not a standard value and therefore several must be
combined in parallel. It is recommended to use 100nF + 47nF, as these are very commonly available.
NOTE
A total capacitance value of 147nF/100 V/C0G is required in the center coil and
133nF/100V/C0G in the side coils of the resonant tank to achieve the desired resonance
frequency.
The capacitors chosen must be rated for 100 V operation. Use quality C0G type dielectric capacitors from
reputable vendors such as KEMET, MURATA or TDK.
Dynamic Power Limiting™
With an optional 5-V to 12-V boost converter, a 5-V input can enable a 12-V WPC A6 transmitter. The Dynamic
Power Limiting™ (DPL) feature allows operation from a 5-V supply with limited current capability (such as a USB
port). When the 5-V input voltage is observed drooping, the output power is dynamically limited to reduce the
load and provides margin relative to the supply’s capability.
Anytime the DPL control loop is regulating the operating point of the transmitter, the LED will indicate that DPL is
active. The LED color and flashing pattern are determined by the LED Table. If the receiver sends a Control
Error Packet (CEP) with a negative value, (for example, to reduce power to the load), the transmitter in DPL
mode will respond to this CEP via the normal WPC control loop.
NOTE
The power limit indication depends on the LED_MODE selected.
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Option Select Pins
Several pins on the bq500412 are allocated to programming the FOD and PMOD Loss Threshold and the LED
mode of the device. At power up, a bias current is applied to pins LED_MODE and LOSS_THR and the resulting
voltage measured in order to identify the value of the attached programming resistor. FOD, PMOD and
FOD_CAL pin values are enabled and read sequentially from the same LOSS_THR bias current. The values of
the operating parameters set by these pins are determined using Table 2. For LED_MODE, the selected bin
determines the LED behavior based on Table 1; for the LOSS_THR, the selected bin sets a threshold used for
parasitic metal object detection (see Parasitic Metal Detection (PMOD) and Foreign Object Detection (FOD)
section). Table 1.
bq500412
LED_MODE
44
Resistors
to set
options
LOSS_THR
To 12-bit ADC
43
FOD
PMOD
FOD_CAL
13
6
22
Figure 3. Option Select Pin Programming
LED Indication Modes
The bq500412 can directly drive up to three (3) LED outputs (pin 7, pin 8 and pin 25) through a simple current
limit resistor (typically 470 Ω), based on the mode selected. The current limit resistors can be individually
adjusted to tune or match the brightness of the LEDs. Do not exceed the maximum output current rating of the
device. The resistor in Figure 3 connected to pin 44 and GND selects the desired LED indication scheme in
Table 1.
• LED modes permit the use of one to three indicator LED's. Amber in the 2-LED mode is obtained by turning
on both the green and red.
• LEDs can be turned on solid or configured to blink either slow (approx. 1.6s period) or fast (approx. 400ms
period).
• Except in modes 2 and 9, the charge complete state is only maintained for 5 seconds after which it reverts to
idle. This permits the processor to sleep in order to reduce standby power consumption. In other modes,
external logic, such as a flip-flop, may be implemented to maintain the charge complete indication if desired.
• LED modes 5 and 8 will display a sequence of red-amber-green, for 0.5 seconds when the device is first
powered up.
12
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Table 1. LED Modes
OPERATIONAL STATES
LED
CONTROL
OPTION
LED
SELECTION
RESISTOR
X
< 36.5 kΩ
DESCRIPTION
STANDBY
POWER
TRANSFER
CHARGE
COMPLETE
FAULT
DYNAMIC
POWER
LIMITING™
FOD Warning
-
-
-
-
-
-
LED1, green
Off
Blink slow
On
Off
Blink slow
Off
LED2, red
Off
Off
Off
On
Blink slow
Blink fast
LED
LED1, green
Reserved, do not use
LED2, red
LED3, amber
1
2
3
4
5
6
7
8
9
10
42.2 kΩ
48.7 kΩ
56.2 kΩ
64.9 kΩ
75 kΩ
86.6 kΩ
100 kΩ
115 kΩ
133 kΩ
154 kΩ
Choice number 1
Choice number 2
Choice number 3
Choice number 4
Choice number 5
Choice number 6
Choice number 7
Choice number 8
Choice number 9
Choice number 10
LED3, amber
-
-
-
-
-
-
LED1, green
On
Blink slow
On
Off
Blink slow
Off
Blink fast
LED2, red
On
Off
Off
On
Blink slow
LED3, amber
-
-
-
-
-
-
LED1, green
Off
On
Off
Blink fast
On
On
-
LED2, red
-
-
-
-
-
LED3, amber
-
-
-
-
-
-
LED1, green
Off
On
Off
Off
Off
Off
Blink fast
LED2, red
Off
Off
Off
On
Blink slow
LED3, amber
-
-
-
-
-
-
LED1, green
Off
Off
On
Off
Off
Off
LED2, red
Off
On
Off
Off
On
On
LED3, amber
Off
Off
Off
Blink slow
Off
Off
LED1, green
Off
Blink slow
On
Off
Off
Off
LED2, red
Off
Off
Off
On
Off
Blink fast
LED3, amber
Off
Off
Off
Off
Blink Slow
Off
LED1, green
Off
Blink slow
Off
Off
Off
Off
LED2, red
Off
Off
On
Off
Off
Off
LED3, amber
Off
Off
Off
On
Blink slow
Blink fast
LED1, green
Off
Off
On
Blink slow
Off
Off
LED2, red
Off
On
Off
Blink slow
On
On
LED3, amber
-
-
-
-
-
-
LED1, green
Off
Blink slow
On
Off
Blink slow
Off
Blink fast
LED2, red
Off
Off
Off
On
Blink slow
LED3, amber
-
-
-
-
-
-
LED1, green
Off
On
Off
Blink fast
Blink slow
On
LED2, red
Off
Off
On
Off
Off
Off
LED3, amber
-
-
-
-
-
-
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bq500412
SLUSBO2A – NOVEMBER 2013 – REVISED DECEMBER 2013
www.ti.com
Parasitic Metal Object Detect (PMOD), Foreign Object Detection (FOD) and FOD Calibration
The bq500412 supports improved FOD (WPC1.1) and enhanced PMOD (WPC 1.0) features. Continuously
monitoring input power, known losses, and the value of power reported by the RX device being charged, the
bq500412 can estimate how much power is unaccounted for and presumed lost due to metal objects placed in
the wireless power transfer path. If this unexpected loss exceeds the threshold set by the FOD or PMOD
resistors, a fault is indicated and power transfer is halted. Whether the FOD or the PMOD algorithm is used is
determined by the ID packet of the receiver being charged.
As the default, both PMOD and FOD resistors should set a threshold of 400 mW (selected by 56.2-kΩ resistors
from FOD (pin 13) and PMOD(pin 6) to LOSS_THR (pin43)). 400 mW has been empirically determined using
standard WPC FOD test objects (disc, ring and foil). Some tuning might be required as every system will be
slightly different. The ultimate goal of the FOD feature is safety; to protect misplaced metal objects from
becoming hot. Reducing the loss threshold and making the system too sensitive will lead to false trips and a bad
user experience. Find the balance which best suits the application.
If the application requires disabling one function or the other (or both), it is possible by leaving the respective
FOD/PMOD pin open. For example, to selectively disable the PMOD function, PMOD (pin16) should be left open.
NOTE
Disabling FOD results in a TX solution that is not WPC compliant.
Resistors of 1% tolerance should be used for a reliable selection of the desired threshold.
The FOD and PMOD resistors (pin 13 and pin 6) program the permitted power loss for the FOD and PMOD
algorithms respectively. The FOD_CAL resistor (pin 22), can be used to compensate for any load dependent
effect on the power loss. Using a calibrated test receiver with no foreign objects present, the FOD_CAL resistor
should be selected such that the calculated loss across the load range is substantially constant (within ~100
mW). After correcting for the load dependence, the FOD and PMOD thresholds should be re-set above the
resulting average by approximately 400 mW in order for the transmitter to satisfy the WPC requirements on
tolerated heating.
Please contact TI for more information about setting appropriate FOD, PMOD, and FOD_CAL resistor values for
your design.
Table 2. Option Select Bins
14
BIN NUMBER
RESISTANCE (kΩ)
LOSS THRESHOLD
(mW)
0
<36.5
250
1
42.2
300
2
48.7
350
3
56.2
400
4
64.9
450
5
75.0
500
6
86.6
550
7
100
600
8
115
650
9
133
700
10
154
750
11
178
800
12
205
850
13
>237
Feature Disabled
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Shut Down via External Thermal Sensor or Trigger
Typical applications of the bq500412 will not require additional thermal protection. This shutdown feature is
provided for enhanced applications and is not only limited to thermal shutdown. The key parameter is the 1.0 V
threshold on pin 2. Voltage below 1.0 V on pin 2 for longer than 150ms causes the device to shutdown.
The application of thermal monitoring via a Negative Temperature Coefficient (NTC) sensor, for example, is
straightforward. The NTC forms the lower leg of a temperature dependant voltage divider. The NTC leads are
connected to the bq500412 device, pin 2 and GND. The threshold on pin 2 is set to 1.0 V, below which the
system shuts down and a fault is indicated (depending on LED mode chosen).
To implement this feature follow these steps:
1) Consult the NTC datasheet and find the resistence vs temperature curve.
2) Determine the actual temperature where the NTC will be placed by using a thermal probe.
3) Read the NTC resistance at that temperature in the NTC datasheet, that is R_NTC.
4) Use the following formula to determine the upper leg resistor (R_Setpoint):
R _ Setpoint = 2.3 ´ R _ NTC
(1)
The system will restore normal operation after approximately five minutes or if the receiver is removed. If the
feature is not used, this pin must be pulled high.
NOTE
Pin 2 must always be terminated, else erratic behavior may result.
3V3_VCC
Optional
Temperature
Sensor
R_Setpoint
T_SENSE
NTC
2
AGND
AGND
Figure 4. Negative Temperature Coefficient (NTC) Application
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bq500412
SLUSBO2A – NOVEMBER 2013 – REVISED DECEMBER 2013
www.ti.com
Fault Handling and Indication
The following table provides approximate durations for the time before a retry is attempted for End Power
Transfer (EPT) packets and fault events. Precise timing may be affected by external components, or may be
shortened by receiver removal. The LED mode selected determines how the LED indicates the condition or fault.
CONDITION
DURATION
(before retry)
EPT-00
Immediate
Unknown
EPT-01
5 seconds
Charge complete
EPT-02
5 seconds
Internal fault
EPT-03
5 minutes
temperature
EPT-04
Immediate Over
voltage
EPT-05
Immediate Over
current
HANDLING
EPT-06
5 seconds
failure
EPT-07
Not applicable
Reconfiguration
EPT-08
Immediate
No response
OC (over current)
1 minute
NTC (external sensor)
5 minutes
PMOD/FOD warning
12 seconds
PMOD/FOD
5 minutes
10 seconds LED only,
2 seconds LED +
buzzer
Power Transfer Start Signal
The bq500412 features two signal outputs to indicate that power transfer has begun. Pin 23 outputs a 400-ms
duration, 4-kHz square wave for driving low cost AC type ceramic buzzers. Pin 24 outputs logic high, also for 400
ms, which is suitable for DC type buzzers with built-in tone generators, or as a trigger for any type of customized
indication scheme. If not used, these pins can be left open.
Power-On Reset
The bq500412 has an integrated Power-On Reset (POR) circuit which monitors the supply voltage and handles
the correct device startup sequence. Additional supply voltage supervisor or reset circuits are not needed.
External Reset, RESET Pin
The bq500412 can be forced into a reset state by an external circuit connected to the RESET pin. A logic low
voltage on this pin holds the device in reset. For normal operation, this pin is pulled up to 3.3 VCC with a 10-kΩ
pull-up resistor.
Low Power Mode, SNOOZE
During standby, when nothing is on the transmitter pad, the bq500412 pings the surrounding environment at
fixed intervals. The ping interval can be adjusted; the component values selected for the SNOOZE circuit
determine this interval between pings. Time for SNOOZE is set by an RC time constant controlling the Enable of
a 3.3V LDO. The LDO will remove 3.3V from the bq500412 to reduce power. The choice of the ping interval
effects two quantities: the idle efficiency of the system, and the time required to detect the presence of a receiver
when it is placed on the pad. A trade off should be made which balances low power (longest ping interval) with
good user experience (quick detection through short ping interval) while still meeting the WPC requirement for
detection within 0.5 seconds. Typical RC time constant values for the SNOOZE circuit are 392k ohms and 4.7uF.
The value can be adjusted to increase or decrease the ping interval.
The system power consumption is approximately 300 mW during an active ping of all three coils, which lasts
approximately 210 ms, and 40 mW for the balance of the cycle. A weighted average can thus be used to
estimate the overall system’s idle consumption:
If T_ping is the interval between pings in ms, P_idle in mW is approximately:
(40 x (T_ping – 210) + 300 x 210)/T_ping
16
(2)
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SLUSBO2A – NOVEMBER 2013 – REVISED DECEMBER 2013
Trickle Charge and CS100
The WPC specification provides an End-of-Power Transfer message (EPT–01) to indicate charge complete.
Upon receipt of the charge complete message, the bq500412 will change the LED indication. The exact
indication depends on the LED_MODE chosen.
In some battery charging applications there is a benefit to continue the charging process in trickle-charge mode
to top off the battery. There are several information packets in the WPC specification related to the levels of
battery charge (Charge Status). The bq500412 uses these commands to enable top-off charging. The bq500412
changes the LED indication to reflect charge complete when a Charge Status message is 100% received, but
unlike the response to an EPT, it will not halt power transfer while the LED is solid green. The mobile device can
use a CS100 packet to enable trickle charge mode.
If the reported charge status drops below 90% normal, charging indication will be resumed.
Current Monitoring Requirements
The bq500412 is WPC1.1 ready. In order to enable the FOD or PMOD features, current monitoring circuitry must
be provided in the application design.
For proper scaling of the current monitor signal, the current sense resistor should be 20 mΩ and the current
shunt amplifier should have a gain of 50, such as the INA199A1. For FOD accuracy, the current sense resistor
must be a quality component with 1% tolerance, at least 1/4-Watt rating, and a temperature stability of ±200
PPM. Proper current sensing techniques in the application hardware should also be observed.
If WPC compliance is not required current monitoring can be omitted. Connect the I_SENSE pin (pin 42) to GND.
All Unused Pins
All unused pins can be left open unless otherwise indicated. Pin 4 can be tied to GND and flooded with copper to
improve ground shielding. Please refer to the pin definition table for further explanations.
Design Checklist for WPC1.1 Compliance with the bq500412
•
•
•
•
Coil and capacitor selection matches the A6 specification.
Total 147-nF center and 133-nF side coil resonant capacitor requirement is met.
Precision current sense amp used, such as the INA199A1. This is required for accurate FOD operation.
Current shunt resistor 1% and <200 PPM. This is required for accurate FOD operation.
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bq500412
SLUSBO2A – NOVEMBER 2013 – REVISED DECEMBER 2013
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APPLICATION INFORMATION
Overview
The application block diagram for the transmitter with reduced standby power is shown in Figure 5. Below are
some notes on parts selection.
CAUTION
Please check the bq500412 product page for the most up-to-date application
schematic and list of materials package before starting a new design.
12V Input
INA199 A1
Current Shunt
Monitor
TPS54231
Buck Reg
Cap/Tank/FET x3
Bq500410
bq500412
WPC Qi Controller
PWM
CSD97376
PowerBlock
Tank /Coil
Assembly
LED
SN3157
Analog Switch
FEEDBACK
Figure 5. bq500412 System Diagram
18
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Input Regulator
The bq500412 requires 3.3 VDC to operate. A buck regulator or a linear regulator can be used to step down from
the 12-V system input. Either choice is fully WPC compatible, the decision lies in the user's requirements with
respect to cost versus efficiency. A buck regulator will offer higher efficiency and although slightly higher cost,it is
typically the better choice.
Power Train
The bq500412 drives three half bridges and only one of these bridges is activated at a time.
PCB Layout
A good PCB layout is critical to proper system operation and due care should be taken. There are many
references on proper PCB layout techniques.
Generally speaking, the system layout will require a 4-layer PCB layout, although a 2-layer PCB layout can be
achieved. A proven and recommended approach to the layer stack-up has been:
• Layer 1, component placement and as much ground plane as possible.
• Layer 2, clean ground.
• Layer 3, finish routing.
• Layer 4, clean ground.
Thus, the circuitry is virtually sandwiched between grounds. This minimizes EMI noise emissions and also
provides a noise free voltage reference plane for device operation.
Keep as much copper as possible. Make sure the bq500412 GND pins and the power pad have a continuous
flood connection to the ground plane. The power pad should also be stitched to the ground plane, which also
acts as a heat sink for the bq500412. A good GND reference is necessary for proper bq500412 operation, such
as analog-digital conversion, clock stability and best overall EMI performance.
Separate the analog ground plane from the power ground plane and use only one tie point to connect grounds.
Having several tie points defeats the purpose of separating the grounds.
The COMM return signal from the resonant tank should be routed as a differential pair. This is intended to reduce
stray noise induction. The frequencies of concern warrant low-noise analog signaling techniques, such as
differential routing and shielding, but the COMM signal lines do not need to be impedance matched.
Typically a single chip controller solution with integrated power FET and synchronous rectifier will be used. To
create a tight loop, pull in the buck inductor and power loop as close as possible. Likewise, the power-train, fullbridge components should be pulled together as tight as possible. See the bq500412EVM-550, bqTESLA
Wireless Power TX EVM User's Guide (Texas Instruments Literature Number SLVU536) for layout examples.
References
1. Building a Wireless Power Transmitter, Application Report, (Texas Instruments Literature Number, SLUA635)
2. Technology, Wireless Power Consortium, www.wirelesspowerconsortium.com
3. An Introduction to the Wireless Power Consortium Standard and TI’s Compliant Solutions, (Johns Bill, Texas
Instruments)
4. Integrated Wireless Power Supply Receiver, Qi (Wireless Power Consortium), BQ51013 Datasheet, (Texas
Instruments Literature Number, SLUSAY6)
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bq500412
SLUSBO2A – NOVEMBER 2013 – REVISED DECEMBER 2013
www.ti.com
REVISION HISTORY
Changes from Original (November, 2013) to Revision A
Page
•
Changed marketing status from Product Preview to Production Data. ................................................................................ 1
•
Changed System Diagram drawing. ..................................................................................................................................... 1
•
Changed COMM+ Bias Voltage from 1.5 V to 1.0 V. ........................................................................................................... 4
•
Changed Block Diagram. ...................................................................................................................................................... 5
•
Changed pinout drawing with updated pin names. ............................................................................................................... 6
20
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PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2013
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
BQ500412RGZR
ACTIVE
VQFN
RGZ
48
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 110
BQ500412
BQ500412RGZT
ACTIVE
VQFN
RGZ
48
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-3-260C-168 HR
-40 to 110
BQ500412
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
17-Dec-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Dec-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
BQ500412RGZR
VQFN
RGZ
48
2500
330.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
BQ500412RGZT
VQFN
RGZ
48
250
180.0
16.4
7.3
7.3
1.5
12.0
16.0
Q2
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
17-Dec-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
BQ500412RGZR
VQFN
RGZ
48
2500
367.0
367.0
38.0
BQ500412RGZT
VQFN
RGZ
48
250
210.0
185.0
35.0
Pack Materials-Page 2
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