SEMICONDUCTOR TECHNICAL DATA ! " The MC10H330 is a Quad Bus Driver/Receiver with two–to–one output multiplexers. These multiplexers have a common select and output enable. When disabled, (OE = high) the bus outputs go to –2.0 V. Their output can be brought to a low state (VOL) by applying a high level to the receiver enable (RE = High). The parameters specified are with 25 Ω loading on the bus drivers and 50 Ω loads on the receivers. L SUFFIX CERAMIC PACKAGE CASE 758–02 • Propagation Delay, 1.5 ns Typical Data–to–Output • Improved Noise Margin 150 mV (Over Operating Voltage and Temperature Range) • Voltage Compensated • MECL 10K–Compatible P SUFFIX PLASTIC PACKAGE CASE 724–03 MAXIMUM RATINGS Characteristic Symbol Rating Unit VEE VI –8.0 to 0 Vdc 0 to VEE Vdc Power Supply (VCC = 0) Input Voltage (VCC = 0) Output Current — Continuous — Surge Iout 50 100 mA Operating Temperature Range TA Tstg 0 to +75 °C –55 to +150 –55 to +165 °C °C Storage Temperature Range — Plastic — Ceramic FN SUFFIX PLCC CASE 776–02 DIP PIN ASSIGNMENT ELECTRICAL CHARACTERISTICS (VEE = –5.2 V ±5%) (See Note) 0° 25° 75° VCC 1 24 VCC0 XBUS 2 23 YBUS WBUS 3 22 ZBUS Characteristic Symbol Min Max Min Max Min Max Unit Power Supply Current IE — 157 — 143 — 157 mA VCC0 4 21 OE µA X1 5 20 Y0 — — — 667 514 475 — — — 417 321 297 — — — 417 321 297 X0 6 19 Y1 7 18 Z0 — 0.5 — 0.3 — µA W1 0.5 –1.02 –0.84 –0.98 –0.81 –0.92 –0.735 Vdc W0 8 17 Z1 –1.95 –1.63 –1.95 –1.63 –1.95 –1.60 Vdc S 9 16 RE High Input Voltage VOL VIH –1.17 –0.84 –1.13 –0.81 –1.07 –0.735 Vdc WIN 10 15 ZIN Low Input Voltage VIL –1.95 –1.48 –1.95 –1.48 –1.95 –1.45 Vdc XIN 11 14 YIN VEE 12 13 VCC0 Input Current High Pins 5–8, 17–20 Pins 16, 21 Pin 9 IinH Input Current Low IinL VOH High Output Voltage Low Output Voltage AC PARAMETERS Propagation Delay Select–to–Input Data–to–Bus Output Select–to–Bus Output OE–to–Bus Output Bus–to–Input RE–to–Input Data–to–Receiver Input Rise Time Fall Time tpd tr tf ns 1.8 0.5 5.3 2.0 1.8 0.5 5.3 2.0 1.8 0.5 5.3 2.0 1.0 0.8 0.8 0.5 3.2 2.2 2.1 2.2 1.0 0.8 0.8 0.5 3.2 2.2 2.1 2.2 1.0 0.8 0.8 0.5 3.2 2.2 2.4 2.2 1.3 4.0 1.3 4.0 1.3 4.0 0.5 2.0 0.5 2.0 0.5 2.0 ns 0.5 2.0 0.5 2.0 0.5 2.0 ns Pin assignment is for Dual–in–Line Package. For PLCC pin assignment, see the Pin Conversion Tables on page 6–11 of the Motorola MECL Data Book (DL122/D). NOTE: Each MECL 10H series circuit has been designed to meet the dc specifications shown in the test table, after thermal equilibrium has been established. The circuit is in a test socket or mounted on a printed circuit board and transverse air flow greater than 500 Ifpm is maintained. Receiver outputs are terminated through a 50–ohm resistor to –2.0 volts dc. Bus outputs are terminated through a 25–ohm resistor to –2.0 volts dc. 3/93 Motorola, Inc. 1996 2–299 REV 5 MC10H330 LOGIC DIAGRAM OE 21 S 9 W0 8 W1 7 WIN 10 X0 6 X1 XIN 11 Y0 20 VCC0 VCC VCC0 VCC0 VEE PIN 24 PIN 1 PIN 13 PIN 4 PIN 12 3 WBUS 2 XBUS 23 YBUS 22 ZBUS 5 Y1 19 YIN 14 Z0 18 Z1 17 ZIN 15 RE 16 MULTIPLEXER TRUTH TABLE OE S WBus H L L X L H –2.0 V –2.0 V –2.0 V –2.0 V W0 X0 Y0 Z0 W1 X1 Y1 Z1 MOTOROLA = = = = = XBus YBus RECEIVER TRUTH TABLE ZBus 2–300 RE Win Xin Yin Zin H L L WBus L XBus L YBus L ZBus MECL Data DL122 — Rev 6 MC10H330 OUTLINE DIMENSIONS FN SUFFIX PLASTIC PLCC PACKAGE CASE 776–02 ISSUE D 0.007 (0.180) B T L–M M N S T L–M S S Y BRK –N– 0.007 (0.180) U M N S D Z –M– –L– W 28 D X G1 0.010 (0.250) T L–M S N S S V 1 VIEW D–D A 0.007 (0.180) R 0.007 (0.180) M T L–M S N S C M T L–M S N 0.007 (0.180) H Z M T L–M N S S S K1 E 0.004 (0.100) G J S K SEATING PLANE F VIEW S G1 0.010 (0.250) –T– T L–M S N S M T L–M S N S VIEW S NOTES: 1. DATUMS –L–, –M–, AND –N– DETERMINED WHERE TOP OF LEAD SHOULDER EXITS PLASTIC BODY AT MOLD PARTING LINE. 2. DIMENSION G1, TRUE POSITION TO BE MEASURED AT DATUM –T–, SEATING PLANE. 3. DIMENSIONS R AND U DO NOT INCLUDE MOLD FLASH. ALLOWABLE MOLD FLASH IS 0.010 (0.250) PER SIDE. 4. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 5. CONTROLLING DIMENSION: INCH. 6. THE PACKAGE TOP MAY BE SMALLER THAN THE PACKAGE BOTTOM BY UP TO 0.012 (0.300). DIMENSIONS R AND U ARE DETERMINED AT THE OUTERMOST EXTREMES OF THE PLASTIC BODY EXCLUSIVE OF MOLD FLASH, TIE BAR BURRS, GATE BURRS AND INTERLEAD FLASH, BUT INCLUDING ANY MISMATCH BETWEEN THE TOP AND BOTTOM OF THE PLASTIC BODY. 7. DIMENSION H DOES NOT INCLUDE DAMBAR PROTRUSION OR INTRUSION. THE DAMBAR PROTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE GREATER THAN 0.037 (0.940). THE DAMBAR INTRUSION(S) SHALL NOT CAUSE THE H DIMENSION TO BE SMALLER THAN 0.025 (0.635). MECL Data DL122 — Rev 6 0.007 (0.180) 2–301 DIM A B C E F G H J K R U V W X Y Z G1 K1 INCHES MIN MAX 0.485 0.495 0.485 0.495 0.165 0.180 0.090 0.110 0.013 0.019 0.050 BSC 0.026 0.032 0.020 ––– 0.025 ––– 0.450 0.456 0.450 0.456 0.042 0.048 0.042 0.048 0.042 0.056 ––– 0.020 2_ 10_ 0.410 0.430 0.040 ––– MILLIMETERS MIN MAX 12.32 12.57 12.32 12.57 4.20 4.57 2.29 2.79 0.33 0.48 1.27 BSC 0.66 0.81 0.51 ––– 0.64 ––– 11.43 11.58 11.43 11.58 1.07 1.21 1.07 1.21 1.07 1.42 ––– 0.50 2_ 10_ 10.42 10.92 1.02 ––– MOTOROLA MC10H330 OUTLINE DIMENSIONS L SUFFIX CERAMIC DIP PACKAGE CASE 758–02 ISSUE A L B 24 P 13 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 12 J –A– DIM A B C D F G J K L N P N C –T– K SEATING PLANE G F INCHES MIN MAX 1.240 1.285 0.285 0.305 0.160 0.200 0.015 0.021 0.045 0.062 0.100 BSC 0.008 0.013 0.100 0.165 0.300 0.310 0.020 0.050 0.360 0.400 MILLIMETERS MIN MAX 31.50 32.64 7.24 7.75 4.07 5.08 0.38 0.53 1.14 1.57 2.54 BSC 0.20 0.33 2.54 4.19 7.62 7.87 0.51 1.27 9.14 10.16 D 24 PL 0.25 (0.010) T A M M P SUFFIX PLASTIC DIP PACKAGE CASE 724–03 ISSUE D –A– 24 13 1 12 –B– L C –T– NOTE 1 K SEATING PLANE N E G M J F D 24 PL 0.25 (0.010) 24 PL 0.25 (0.010) NOTES: 1. CHAMFERED CONTOUR OPTIONAL. 2. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 3. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 4. CONTROLLING DIMENSION: INCH. M T A M M T B M DIM A B C D E F G J K L M N INCHES MIN MAX 1.230 1.265 0.250 0.270 0.145 0.175 0.015 0.020 0.050 BSC 0.040 0.060 0.100 BSC 0.007 0.012 0.110 0.140 0.300 BSC 0_ 15_ 0.020 0.040 MILLIMETERS MIN MAX 31.25 32.13 6.35 6.85 3.69 4.44 0.38 0.51 1.27 BSC 1.02 1.52 2.54 BSC 0.18 0.30 2.80 3.55 7.62 BSC 0_ 15_ 0.51 1.01 Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. 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Box 20912; Phoenix, Arizona 85036. 1–800–441–2447 or 602–303–5454 JAPAN: Nippon Motorola Ltd.; Tatsumi–SPD–JLDC, 6F Seibu–Butsuryu–Center, 3–14–2 Tatsumi Koto–Ku, Tokyo 135, Japan. 03–81–3521–8315 MFAX: [email protected] – TOUCHTONE 602–244–6609 INTERNET: http://Design–NET.com ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; 8B Tai Ping Industrial Park, 51 Ting Kok Road, Tai Po, N.T., Hong Kong. 852–26629298 ◊ MOTOROLA 2–302 *MC10H330/D* MC10H330/D MECL Data DL122 — Rev 6