Material Content Data Sheet Sales Product Name IPI80N04S3-03 MA# MA000366323 Package PG-TO262-3-1 Issued 29. August 2013 Weight* 1574.58 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material non noble metal inorganic material non noble metal non noble metal organic material plastics inorganic material non noble metal non noble metal inorganic material noble metal non noble metal non noble metal < 10% silicon iron phosphorus copper aluminium carbon black epoxy resin silicondioxide tin nickel phosphorus silver tin lead 7440-21-3 7439-89-6 7723-14-0 7440-50-8 7429-90-5 1333-86-4 60676-86-0 7440-31-5 7440-02-0 7723-14-0 7440-22-4 7440-31-5 7439-92-1 6.365 0.40 0.957 0.06 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.40 4042 4042 608 0.287 0.02 955.892 60.70 60.78 607076 182 607866 6.478 0.41 0.41 4114 4114 8.769 0.56 5569 96.456 6.13 479.357 30.44 37.13 304435 61258 371262 15.198 0.97 0.97 9652 9652 0.228 0.01 0.001 0.00 0.115 0.01 0.092 0.01 4.390 0.28 145 0.01 2. 3. Sum in total: 100,00 Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 145 58 0.30 Important Remarks: 1. 0 73 2788 2919 1000000