ON MC74HC393N Dual 4-stage binary ripple counter Datasheet

SEMICONDUCTOR TECHNICAL DATA
High–Performance Silicon–Gate CMOS
The MC54/74HC393 is identical in pinout to the LS393. The device inputs
are compatible with standard CMOS outputs; with pullup resistors, they are
compatible with LSTTL outputs.
This device consists of two independent 4–bit binary ripple counters with
parallel outputs from each counter stage. A ÷ 256 counter can be obtained
by cascading the two binary counters.
Internal flip–flops are triggered by high–to–low transitions of the clock
input. Reset for the counters is asynchronous and active–high. State
changes of the Q outputs do not occur simultaneously because of internal
ripple delays. Therefore, decoded output signals are subject to decoding
spikes and should not be used as clocks or as strobes except when gated
with the Clock of the HC393.
J SUFFIX
CERAMIC PACKAGE
CASE 632–08
14
1
N SUFFIX
PLASTIC PACKAGE
CASE 646–06
14
1
D SUFFIX
SOIC PACKAGE
CASE 751A–03
14
1
•
•
•
•
•
•
Output Drive Capability: 10 LSTTL Loads
Outputs Directly Interface to CMOS, NMOS, and TTL
Operating Voltage Range: 2 to 6 V
Low Input Current: 1 µA
High Noise Immunity Characteristic of CMOS Devices
In Compliance with the Requirements Defined by JEDEC Standard
No. 7A
• Chip Complexity: 236 FETs or 59 Equivalent Gates
ORDERING INFORMATION
MC54HCXXXJ
MC74HCXXXN
MC74HCXXXD
Ceramic
Plastic
SOIC
PIN ASSIGNMENT
LOGIC DIAGRAM
3, 11
CLOCK
1, 13
4, 10
BINARY
COUNTER
5, 9
6, 8
RESET
1
14
VCC
RESET a
2
13
CLOCK b
Q1a
3
12
RESET b
Q2a
4
11
Q1b
Q3a
5
10
Q2b
Q4a
6
9
Q3b
GND
7
8
Q4b
Q1
Q2
Q3
Q4
2, 12
FUNCTION TABLE
PIN 14 = VCC
PIN 7 = GND
Inputs
10/95
 Motorola, Inc. 1995
CLOCK a
1
REV 6
Clock
Reset
Outputs
X
H
L
H
L
L
L
L
L
No Change
No Change
No Change
Advance to
Next State
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MC54/74HC393
MAXIMUM RATINGS*
Symbol
VCC
Parameter
DC Supply Voltage (Referenced to GND)
Value
Unit
– 0.5 to + 7.0
V
Vin
DC Input Voltage (Referenced to GND)
– 1.5 to VCC + 1.5
V
Vout
DC Output Voltage (Referenced to GND)
– 0.5 to VCC + 0.5
V
DC Input Current, per Pin
± 20
mA
Iout
DC Output Current, per Pin
± 25
mA
ICC
DC Supply Current, VCC and GND Pins
± 50
mA
PD
Power Dissipation in Still Air, Plastic or Ceramic DIP†
SOIC Package†
750
500
mW
Tstg
Storage Temperature
– 65 to + 150
_C
Iin
TL
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high–impedance circuit. For proper operation, Vin and
Vout should be constrained to the
range GND (Vin or Vout) VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
v
v
_C
Lead Temperature, 1 mm from Case for 10 Seconds
(Plastic or SOIC DIP)
(Ceramic DIP)
260
300
* Maximum Ratings are those values beyond which damage to the device may occur.
Functional operation should be restricted to the Recommended Operating Conditions.
†Derating — Plastic DIP: – 10 mW/_C from 65_ to 125_C
Ceramic DIP: – 10 mW/_C from 100_ to 125_C
SOIC Package: – 7 mW/_C from 65_ to 125_C
For high frequency or heavy load considerations, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
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v
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RECOMMENDED OPERATING CONDITIONS
Symbol
VCC
Vin, Vout
Parameter
DC Supply Voltage (Referenced to GND)
Min
Max
Unit
2.0
6.0
V
0
VCC
V
– 55
+ 125
_C
0
0
0
1000
500
400
ns
DC Input Voltage, Output Voltage (Referenced to GND)
TA
Operating Temperature, All Package Types
tr, tf
Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
VCC = 4.5 V
VCC = 6.0 V
DC ELECTRICAL CHARACTERISTICS (Voltages Referenced to GND)
Guaranteed Limit
Symbol
Parameter
Test Conditions
VCC
V
– 55 to
25_C
85_C
125_C
Unit
VIH
Minimum High–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
4.5
6.0
1.5
3.15
4.2
1.5
3.15
4.2
1.5
3.15
4.2
V
VIL
Maximum Low–Level Input
Voltage
Vout = 0.1 V or VCC – 0.1 V
|Iout|
20 µA
2.0
4.5
6.0
0.3
0.9
1.2
0.3
0.9
1.2
0.3
0.9
1.2
V
Minimum High–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
2.0
4.5
6.0
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
V
4.5
6.0
3.98
5.48
3.84
5.34
3.70
5.20
2.0
4.5
6.0
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
0.1
4.5
6.0
0.26
0.26
0.33
0.33
0.40
0.40
VOH
Vin = VIH or VIL |Iout|
|Iout|
VOL
Maximum Low–Level Output
Voltage
Vin = VIH or VIL
|Iout|
20 µA
Vin = VIH or VIL |Iout|
|Iout|
Iin
ICC
4.0 mA
5.2 mA
4.0 mA
5.2 mA
V
Maximum Input Leakage Current
Vin = VCC or GND
6.0
± 0.1
± 1.0
± 1.0
µA
Maximum Quiescent Supply
Current (per Package)
Vin = VCC or GND
Iout = 0 µA
6.0
8
80
160
µA
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
MOTOROLA
2
High–Speed CMOS Logic Data
DL129 — Rev 6
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MC54/74HC393
AC ELECTRICAL CHARACTERISTICS (CL = 50 pF, Input tr = tf = 6 ns)
Guaranteed Limit
VCC
V
– 55 to
25_C
85_C
125_C
Unit
fmax
Maximum Clock Frequency (50% Duty Cycle)
(Figures 1 and 3)
2.0
4.5
6.0
5.4
27
32
4.4
22
26
3.6
18
21
MHz
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q1
(Figures 1 and 3)
2.0
4.5
6.0
120
24
20
150
30
26
180
36
31
ns
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q2
(Figures 1 and 3)
2.0
4.5
6.0
190
38
32
240
48
41
285
57
48
ns
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q3
(Figures 1 and 3)
2.0
4.5
6.0
240
48
41
300
60
51
360
72
61
ns
tPLH,
tPHL
Maximum Propagation Delay, Clock to Q4
(Figures 1 and 3)
2.0
4.5
6.0
290
58
49
365
73
62
435
87
74
ns
tPHL
Maximum Propagation Delay, Reset to any Q
(Figures 2 and 3)
2.0
4.5
6.0
165
33
28
205
41
35
250
50
43
ns
tTLH,
tTHL
Maximum Output Transition Time, Any Output
(Figures 1 and 3)
2.0
4.5
6.0
75
15
13
95
19
16
110
22
19
ns
Maximum Input Capacitance
—
10
10
10
pF
Symbol
Cin
Parameter
NOTES:
1. For propagation delays with loads other than 50 pF, see Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
2. Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
Typical @ 25°C, VCC = 5.0 V
CPD
Power Dissipation Capacitance (Per Counter)*
pF
40
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v
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* Used to determine the no–load dynamic power consumption: PD = CPD VCC 2 f + ICC VCC . For load considerations, see Chapter 2 of the
Motorola High–Speed CMOS Data Book (DL129/D).
TIMING REQUIREMENTS (Input tr = tf = 6 ns)
Guaranteed Limit
VCC
V
– 55 to
25_C
Minimum Recovery Time, Reset Inactive to Clock
(Figure 2)
2.0
4.5
6.0
tw
Minimum Pulse Width, Clock
(Figure 1)
tw
85_C
125_C
50
10
9
65
13
11
75
15
13
ns
2.0
4.5
6.0
80
16
14
100
20
17
120
24
20
ns
Minimum Pulse Width, Reset
(Figure 2)
2.0
4.5
6.0
125
25
21
155
31
26
190
38
32
ns
Maximum Input Rise and Fall Times
(Figure 1)
2.0
4.5
6.0
1000
500
400
1000
500
400
1000
500
400
ns
Symbol
trec
tr, tf
Parameter
Unit
NOTE: Information on typical parametric values can be found in Chapter 2 of the Motorola High–Speed CMOS Data Book (DL129/D).
High–Speed CMOS Logic Data
DL129 — Rev 6
3
MOTOROLA
MC54/74HC393
PIN DESCRIPTIONS
INPUTS
vided for each counter. A high at the Reset input prevents
counting and forces all four outputs low.
Clock (Pins 1, 13)
Clock input. The internal flip–flops are toggled and the
counter state advances on high–to–low transitions of the
clock input.
OUTPUTS
CONTROL INPUTS
Q1, Q2, Q3, Q4 (Pins 3, 4, 5, 6, 8, 9, 10, 11)
Reset (Pins 2, 12)
Active–high, asynchronous reset. A separate reset is pro-
Parallel binary outputs Q4 is the most significant bit.
SWITCHING WAVEFORMS
tf
90%
50%
10%
CLOCK
tr
tw
VCC
50%
GND
GND
tw
tPHL
1/fmax
tPLH
tPHL
Q
VCC
RESET
50%
Q
90%
50%
10%
trec
VCC
50%
CLOCK
tTLH
GND
tTHL
Figure 1.
Figure 2.
EXPANDED LOGIC DIAGRAM
TEST
POINT
CLOCK
OUTPUT
DEVICE
UNDER
TEST
1, 13
C
D
Q
Q
3, 11
Q1
CL*
C
D
* Includes all probe and jig capacitance
Q
Q
4, 10
Q2
Figure 3. Test Circuit
C
D
C
D
RESET
MOTOROLA
4
Q
Q
5, 9
Q3
Q
Q
6, 8
Q4
2, 12
High–Speed CMOS Logic Data
DL129 — Rev 6
MC54/74HC393
TIMING DIAGRAM
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
0
CLOCK
RESET
Q1
Q2
Q3
Q4
COUNT SEQUENCE
Outputs
High–Speed CMOS Logic Data
DL129 — Rev 6
Count
Q4
Q3
Q2
Q1
0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
L
L
L
L
L
L
L
L
H
H
H
H
H
H
H
H
L
L
L
L
H
H
H
H
L
L
L
L
H
H
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
L
H
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
L
H
5
MOTOROLA
MC54/74HC393
OUTLINE DIMENSIONS
J SUFFIX
CERAMIC DIP PACKAGE
CASE 632–08
ISSUE Y
-A14
8
1
7
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEAD WHEN
FORMED PARALLEL.
4. DIMESNION F MAY NARROW TO 0.76 (0.030)
WHERE THE LEAD ENTERS THE CERAMIC
BODY.
-B-
C
-T-
L
DIM
A
B
C
D
F
G
J
K
L
M
N
K
SEATING
PLANE
F
G
D 14 PL
0.25 (0.010)
M
N
T A
M
J 14 PL
0.25 (0.010)
S
M
T
B
S
N SUFFIX
PLASTIC DIP PACKAGE
CASE 646–06
ISSUE L
14
B
7
A
F
DIM
A
B
C
D
F
G
H
J
K
L
M
N
L
C
J
N
H
G
D
SEATING
PLANE
K
M
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751A–03
ISSUE F
–A–
14
1
P 7 PL
0.25 (0.010)
7
G
D
0.25 (0.010)
MOTOROLA
M
T
F
J
M
K
14 PL
B
S
M
R X 45°
C
SEATING
PLANE
B
M
A
S
6
INCHES
MIN
MAX
0.715
0.770
0.240
0.260
0.145
0.185
0.015
0.021
0.040
0.070
0.100 BSC
0.052
0.095
0.008
0.015
0.115
0.135
0.300 BSC
0_
10_
0.015
0.039
MILLIMETERS
MIN
MAX
18.16
19.56
6.10
6.60
3.69
4.69
0.38
0.53
1.02
1.78
2.54 BSC
1.32
2.41
0.20
0.38
2.92
3.43
7.62 BSC
0_
10_
0.39
1.01
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
8
–B–
MILLIMETERS
MIN
MAX
19.05 19.94
6.23
7.11
3.94
5.08
0.39
0.50
1.40
1.65
2.54 BSC
0.21
0.38
3.18
4.31
7.62 BSC
0°
15°
0.51
1.01
NOTES:
1. LEADS WITHIN 0.13 (0.005) RADIUS OF TRUE
POSITION AT SEATING PLANE AT MAXIMUM
MATERIAL CONDITION.
2. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
3. DIMENSION B DOES NOT INCLUDE MOLD
FLASH.
4. ROUNDED CORNERS OPTIONAL.
8
1
INCHES
MIN
MAX
0.750 0.785
0.245 0.280
0.155 0.200
0.015 0.020
0.055 0.065
0.100 BSC
0.008 0.015
0.125 0.170
0.300 BSC
0°
15°
0.020 0.040
DIM
A
B
C
D
F
G
J
K
M
P
R
MILLIMETERS
MIN
MAX
8.75
8.55
4.00
3.80
1.75
1.35
0.49
0.35
1.25
0.40
1.27 BSC
0.25
0.19
0.25
0.10
7°
0°
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
7°
0°
0.228 0.244
0.010 0.019
High–Speed CMOS Logic Data
DL129 — Rev 6
MC54/74HC393
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High–Speed CMOS Logic Data
DL129 — Rev 6
◊
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*MC54/74HC393/D*
MC54/74HC393/D
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