SCBS794 − DECEMBER 2003 D Controlled Baseline D D D D D D Typical VOLP (Output Ground Bounce) − One Assembly/Test Site, One Fabrication Site Enhanced Diminishing Manufacturing Sources (DMS) Support Enhanced Product-Change Notification Qualification Pedigree† Member of the Texas Instruments Widebus+ Family State-of-the-Art Advanced BiCMOS Technology (ABT) Design for 3.3-V Operation and Low Static-Power Dissipation † Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits. GKE PACKAGE (TOP VIEW) 1 2 3 4 5 <0.8 V at VCC = 3.3 V, TA = 25°C Ioff and Power-Up 3-State Support Hot Insertion Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC ) Bus Hold on Data Inputs Eliminates the Need for External Pullup/Pulldown Resistors Supports Unregulated Battery Operation Down To 2.7 V Latch-Up Performance Exceeds 500 mA Per JESD 17 ESD Protection Exceeds JESD 22 − 2000-V Human-Body Model (A114-A) − 200-V Machine Model (A115-A) − 1000-V Charged-Device Model (C101) D D D D D D terminal assignments 6 1 2 3 4 5 6 A A 1Q2 1Q1 1OE 1LE 1D1 1D2 B B 1Q4 1Q3 GND GND 1D3 1D4 C C 1Q6 1Q5 1D6 D 1Q8 1Q7 1VCC GND 1D5 D 1VCC GND 1D7 1D8 E 2Q2 2Q1 GND GND 2D1 2D2 F 2Q4 2Q3 2D4 2Q6 2Q5 1VCC GND 2D3 G 1VCC GND 2D5 2D6 H 2Q7 2Q8 2OE 2LE 2D8 2D7 J 3Q2 3Q1 3OE 3LE 3D1 3D2 E F G H J K 3Q4 3Q3 GND GND 3D3 3D4 K L 3Q6 3Q5 3D6 M 3Q8 3Q7 2VCC GND 3D5 L 2VCC GND 3D7 3D8 M N 4Q2 4Q1 GND GND 4D1 4D2 N P 4Q4 4Q3 4D4 R 4Q6 4Q5 2VCC GND 4D3 P 2VCC GND 4D5 4D6 R T 4Q7 4Q8 4OE 4LE 4D8 4D7 T Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Widebus+ is a trademark of Texas Instruments. Copyright 2003, Texas Instruments Incorporated ! " #$%! " &$'(#! )!% )$#!" # ! "&%##!" &% !*% !%" %+" "!$%!" "!)) ,!- )$#! &#%"". )%" ! %#%""(- #($)% !%"!. (( &%!%" POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 SCBS794 − DECEMBER 2003 description/ordering information The SN74LVTH32373 is a 32-bit transparent D-type latch designed for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment. This device is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. This device can be used as four 8-bit latches, two 16-bit latches, or one 32-bit latch. When the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the levels set up at the D inputs. A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without interface or pullup components. OE does not affect internal operations of the latch. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. Inputs can be driven from either 3.3-V or 5-V devices. This feature allows the use of these devices as translators in a mixed 3.3-V/5-V system environment. When VCC is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down. However, to ensure the high-impedance state above 1.5 V, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict. Active bus-hold circuitry holds unused or undriven inputs at a valid logic state. Use of pullup or pulldown resistors with the bus-hold circuitry is not recommended. ORDERING INFORMATION TA ORDERABLE PART NUMBER PACKAGE† TOP-SIDE MARKING −40°C to 85°C LFBGA − GKE Tape and reel CLVTH32373IGKEREP L373EP † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. FUNCTION TABLE (each 8-bit latch) INPUTS 2 OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS794 − DECEMBER 2003 logic diagram (positive logic) 1OE 1LE A3 2OE A4 2LE C1 1D1 A5 A2 1D H3 H4 C1 1Q1 2D1 E5 To Seven Other Channels 3OE 3LE 4OE J4 J5 4LE 1D 1D 2Q1 To Seven Other Channels J3 C1 3D1 E2 J2 T3 T4 C1 3Q1 To Seven Other Channels 4D1 N5 1D N2 4Q1 To Seven Other Channels POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 SCBS794 − DECEMBER 2003 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high-impedance or power-off state, VO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V Voltage range applied to any output in the high state, VO (see Note 1) . . . . . . . . . . . . . −0.5 V to VCC + 0.5 V Current into any output in the low state, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Current into any output in the high state, IO (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA Package thermal impedance, θJA (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40°C/W Storage temperature range, Tstg (see Note 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. This current flows only when the output is in the high state and VO > VCC. 3. The package thermal impedance is calculated in accordance with JESD 51-7. 4. Long-term high-temperature storage and/or extended use at maximum recommended operating conditions may result in a reduction of overall device life. See Figure 1 for additional information on thermal derating. 0.0001 1/Time to Failure − Hours 125°C (16 kHours, 1.84 Years) 115°C (40 kHours, 4.57 Years) 0.00001 105°C (104 kHours, 11.94 Years) 100°C (172 kHours, 19.65 Years) 0.000001 1/TJ − Constant Device Junction Temperature Figure 1. Estimated Wirebond Life Based on Elevated-Temperature Kirkendall-Voiding Failure Mode 4 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS794 − DECEMBER 2003 recommended operating conditions (see Note 5) MIN MAX 2.7 3.6 UNIT VCC VIH Supply voltage VIL VI Low-level input voltage Input voltage 5.5 V IOH IOL High-level output current −32 mA ∆t/∆v Input transition rise or fall rate ∆t/∆VCC TA Power-up ramp rate 200 Operating free-air temperature −40 High-level input voltage 2 V 0.8 Low-level output current Outputs enabled V V 64 mA 10 ns/V µs/V 85 °C NOTE 5: All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 SCBS794 − DECEMBER 2003 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS II(hold) V IOH = −8 mA IOH = −32 mA IOL = 100 µA IOL = 24 mA 0.2 VCC = 2.7 V IOL = 16 mA IOL = 32 mA 0.4 IOL = 64 mA VI = 5.5 V 0.55 Control inputs Data inputs VCC = 3.6 V VCC = 0, IOZH IOZL UNIT −1.2 VCC = 2.7 V, VCC = 3 V, VCC = 0 or 3.6 V, VCC = 3.6 V, Data inputs MAX II = −18 mA IOH = −100 µA VCC = 3 V Ioff TYP† VCC = 2.7 V, VCC = 2.7 V to 3.6 V, VOL II MIN VCC−0.2 2.4 V 2 0.5 0.5 10 VI = VCC or GND VI = VCC ±1 VI = 0 VI or VO = 0 to 4.5 V −5 VCC = 3 V VI = 0.8 V VI = 2 V VCC = 3.6 V,‡ VCC = 3.6 V, VI = 0 to 3.6 V VO = 3 V VCC = 3.6 V, VO = 0.5 V V 1 ±100 µA A µA 75 µA −75 ±500 5 µA −5 µA IOZPU VCC = 0 to 1.5 V, VO = 0.5 V to 3 V, OE = don’t care ± 100 µA IOZPD VCC = 1.5 V to 0, VO = 0.5 V to 3 V, OE = don’t care ±100 µA ICC VCC = 3.6 V, IO = 0, VI = VCC or GND Outputs high 10 Outputs disabled ∆ICC§ VCC = 3 V to 3.6 V, One input at VCC − 0.6 V, Other inputs at VCC or GND Ci VI = 3 V or 0 VO = 3 V or 0 Co 0.38 Outputs low mA 0.38 0.2 3 mA pF 9 pF † All typical values are at VCC = 3.3 V, TA = 25°C. ‡ This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another. § This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. timing requirements over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2) VCC = 3.3 V ± 0.3 V MIN 6 MAX VCC = 2.7 V MIN UNIT MAX tw tsu Pulse duration, LE high 3 3 ns Setup time, data before LE↓ 1 0.6 ns th Hold time, data after LE↓ 1 1.1 ns POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 SCBS794 − DECEMBER 2003 switching characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2) FROM (INPUT) TO (OUTPUT) tPLH tPHL D Q tPLH tPHL LE Q tPZH tPZL OE Q tPHZ tPLZ OE Q PARAMETER tsk(o) † All typical values are at VCC = 3.3 V, TA = 25°C. POST OFFICE BOX 655303 VCC = 3.3 V ± 0.3 V VCC = 2.7 V MIN TYP† MAX 1.5 2.7 3.8 4.2 1.5 2.5 3.6 4 2.1 3 4.3 4.8 2.1 2.9 4 4 1.5 2.8 4.3 5.1 1.5 2.8 4.3 4.7 2.4 3.5 5 5.4 2 3.2 4.7 4.8 0.5 • DALLAS, TEXAS 75265 MIN UNIT MAX ns ns ns ns ns 7 SCBS794 − DECEMBER 2003 PARAMETER MEASUREMENT INFORMATION 6V 500 Ω From Output Under Test S1 GND CL = 50 pF (see Note A) TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 6V GND Open 500 Ω 2.7 V Timing Input LOAD CIRCUIT 1.5 V 0V tw tsu 2.7 V Input 1.5 V 1.5 V th 2.7 V Data Input 1.5 V 1.5 V 0V 0V VOLTAGE WAVEFORMS PULSE DURATION VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 2.7 V 1.5 V Input 1.5 V 0V tPLH tPHL VOH 1.5 V Output 1.5 V VOL tPHL 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 0V tPZL tPLZ 3V 1.5 V tPZH VOH Output Output Waveform 1 S1 at 6 V (see Note B) tPLH 1.5 V 2.7 V Output Control Output Waveform 2 S1 at GND (see Note B) VOL + 0.3 V VOL tPHZ 1.5 V VOH − 0.3 V VOH ≈0 V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, ZO = 50 Ω, tr ≤ 2.5 ns, tf ≤ 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 2. Load Circuit and Voltage Waveforms 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 18-Sep-2008 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty CLVTH32373IGKEREP ACTIVE LFBGA GKE 96 1000 TBD SNPB Level-3-220C-168 HR V62/04721-01XA ACTIVE LFBGA GKE 96 1000 TBD SNPB Level-3-220C-168 HR Lead/Ball Finish MSL Peak Temp (3) (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. 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OTHER QUALIFIED VERSIONS OF SN74LVTH32373-EP : • Catalog: SN74LVTH32373 NOTE: Qualified Version Definitions: • Catalog - TI's standard catalog product Addendum-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2011 TAPE AND REEL INFORMATION *All dimensions are nominal Device CLVTH32373IGKEREP Package Package Pins Type Drawing LFBGA GKE 96 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 1000 330.0 24.4 Pack Materials-Page 1 5.7 B0 (mm) K0 (mm) P1 (mm) 13.7 2.0 8.0 W Pin1 (mm) Quadrant 24.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 16-Jul-2011 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CLVTH32373IGKEREP LFBGA GKE 96 1000 333.2 345.9 31.8 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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