IRF9520NL
l
l
l
l
l
l
l
Advanced Process Technology
Surface Mount (IRF9520S)
Low-profile through-hole (IRF9520L)
175°C Operating Temperature
Fast Switching
P-Channel
Fully Avalanche Rated
TO-263
Description
The D2Pak is a surface mount power package capable of
accommodating die sizes up to HEX-4. It provides the highest
power capability and the lowest possible on-resistance in
any existing surface mount package. The D2Pak is suitable
for high current applications because of its low internal
connection resistance and can dissipate up to 2.0W in a
typical surface mount application.
The through-hole version (IRF9520L) is available for lowprofile applications.
D
VDSS = -100V
RDS(on) = 0.48Ω
G
ID = -6.8A
S
Absolute Maximum Ratings
ID @ TC = 25°C
ID @ TC = 100°C
IDM
PD @TA = 25°C
PD @TC = 25°C
VGS
EAS
IAR
EAR
dv/dt
TJ
TSTG
Parameter
Max.
Continuous Drain Current, VGS @ -10V
Continuous Drain Current, VGS @ -10V
Pulsed Drain Current
Power Dissipation
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
-6.8
-4.8
-27
3.8
48
0.32
± 20
140
-4.0
4.8
-5.0
-55 to + 175
Units
A
W
W
W/°C
V
mJ
A
mJ
V/ns
°C
300 (1.6mm from case )
Thermal Resistance
Parameter
RθJC
RθJA
2014-8-30
Junction-to-Case
Junction-to-Ambient ( PCB Mounted,steady-state)**
1
Typ.
Max.
Units
–––
–––
3.1
40
°C/W
www.kersemi.com
IRF9520NL
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Drain-to-Source Breakdown Voltage
∆V(BR)DSS/∆TJ Breakdown Voltage Temp. Coefficient
RDS(on)
Static Drain-to-Source On-Resistance
VGS(th)
Gate Threshold Voltage
gfs
Forward Transconductance
Qg
Qgs
Qgd
td(on)
tr
td(off)
tf
Gate-to-Source Forward Leakage
Gate-to-Source Reverse Leakage
Total Gate Charge
Gate-to-Source Charge
Gate-to-Drain ("Miller") Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Min.
-100
–––
–––
-2.0
1.4
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
LS
Internal Source Inductance
–––
Ciss
Coss
Crss
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
–––
–––
–––
V(BR)DSS
IDSS
IGSS
Drain-to-Source Leakage Current
Typ.
–––
-0.10
–––
–––
–––
–––
–––
–––
–––
–––
–––
–––
14
47
28
31
Max. Units
Conditions
–––
V
VGS = 0V, ID = -250µA
––– V/°C Reference to 25°C, ID = -1mA
0.48
Ω
VGS = 10V, ID = -4.0A
-4.0
V
VDS = VGS, ID = -250µA
–––
S
VDS = -50V, ID = -4.0A
-25
VDS = -100V, VGS = 0V
µA
-250
VDS = -80V, VGS = 0V, T J = 150°C
100
VGS = 20V
nA
-100
VGS = -20V
27
ID = -4.0A
5.0
nC
VDS = -80V
15
VGS = -10V, See Fig. 6 and 13
–––
VDD = -50V
–––
ID = -4.0A
ns
–––
RG = 22Ω
–––
RD = 12Ω, See Fig. 10
Between lead,
nH
7.5 –––
and center of die contact
350 –––
VGS = 0V
110 –––
pF
VDS = -25V
70 –––
ƒ = 1.0MHz, See Fig. 5
Source-Drain Ratings and Characteristics
IS
ISM
V SD
t rr
Q rr
ton
Parameter
Continuous Source Current
(Body Diode)
Pulsed Source Current
(Body Diode)
Diode Forward Voltage
Reverse Recovery Time
Reverse Recovery
Charge
Forward Turn-On Time
Min. Typ. Max. Units
Conditions
D
MOSFET symbol
––– ––– -6.8
showing the
A
G
integral reverse
––– ––– -27
p-n junction diode.
S
––– ––– -1.6
V
TJ = 25°C, IS = -4.0A, VGS = 0V
––– 100 150
ns
TJ = 25°C, IF = -4.0A
___ 420 630
nC di/dt = -100A/µs
Intrinsic turn-on time is negligible (turn-on is dominated by LS+LD)
Notes:
Repetitive rating; pulse width limited by
Pulse width ≤ 300µs; duty cycle ≤ 2%
max. junction temperature. ( See fig. 11 )
Starting TJ = 25°C, L = 18mH
Uses IRF9520N data and test conditions
RG = 25Ω, IAS = -4.0A. (See Figure 12)
ISD ≤ -4.0A, di/dt ≤ -300A/µs, VDD ≤ V(BR)DSS,
TJ ≤ 175°C
2014-8-30
2
www.kersemi.com
IRF9520NL
100
100
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
BOTTOM -4.5V
10
1
-4.5V
10
1
-4.5V
20µs PULSE WIDTH
TJ = 25 °C
0.1
0.1
1
10
100
R DS(on) , Drain-to-Source On Resistance
(Normalized)
-I D , Drain-to-Source Current (A)
2.5
TJ = 175 ° C
10
TJ = 25 ° C
1
V DS = 10V
20µs PULSE WIDTH
6
7
8
9
10
100
ID = -6.7A
2.0
1.5
1.0
0.5
0.0
-60 -40 -20 0
VGS = -10V
20 40 60 80 100 120 140 160 180
TJ , Junction Temperature ( °C)
-VGS , Gate-to-Source Voltage (V)
Fig 4. Normalized On-Resistance
Vs. Temperature
Fig 3. Typical Transfer Characteristics
2014-8-30
10
Fig 2. Typical Output Characteristics,
100
5
1
-VDS , Drain-to-Source Voltage (V)
Fig 1. Typical Output Characteristics,
0.1
20µs PULSE WIDTH
TJ = 175 °C
0.1
0.1
-VDS , Drain-to-Source Voltage (V)
4
VGS
-15V
-10V
-8.0V
-7.0V
-6.0V
-5.5V
-5.0V
BOTTOM -4.5V
TOP
-I D , Drain-to-Source Current (A)
-I D , Drain-to-Source Current (A)
TOP
3
www.kersemi.com
IRF9520NL
800
20
-VGS, Gate-to-Source Voltage (V)
VGS = 0V,
f = 1MHz
Ciss = Cgs + Cgd , Cds SHORTED
Crss = Cgd
Coss = Cds + Cgd
C, Capacitance (pF)
600
Ciss
Coss
400
Crss
200
ID = -4.0 A
VDS =-80V
VDS =-50V
VDS =-20V
16
12
8
4
FOR TEST CIRCUIT
SEE FIGURE 13
0
0
1
10
0
100
5
10
15
20
25
QG , Total Gate Charge (nC)
-VDS , Drain-to-Source Voltage (V)
Fig 6. Typical Gate Charge Vs.
Gate-to-Source Voltage
Fig 5. Typical Capacitance Vs.
Drain-to-Source Voltage
100
100
10us
TJ = 175 ° C
-II D , Drain Current (A)
-ISD , Reverse Drain Current (A)
OPERATION IN THIS AREA LIMITED
BY RDS(on)
10
TJ = 25 ° C
1
V GS = 0 V
0.1
0.2
0.8
1.4
2.0
100us
1ms
1
10ms
TC = 25 ° C
TJ = 175 ° C
Single Pulse
0.1
1
2.6
10
100
1000
-VDS , Drain-to-Source Voltage (V)
-VSD ,Source-to-Drain Voltage (V)
Fig 7. Typical Source-Drain Diode
Forward Voltage
2014-8-30
10
Fig 8. Maximum Safe Operating Area
4
www.kersemi.com
IRF9520NL
RD
VDS
8.0
VGS
D.U.T.
-ID , Drain Current (A)
RG
+
6.0
V DD
-10V
Pulse Width ≤ 1 µs
Duty Factor ≤ 0.1 %
4.0
Fig 10a. Switching Time Test Circuit
2.0
td(on)
tr
t d(off)
tf
VGS
10%
0.0
25
50
75
100
125
150
175
TC , Case Temperature ( ° C)
90%
VDS
Fig 10b. Switching Time Waveforms
Fig 9. Maximum Drain Current Vs.
Case Temperature
Thermal Response (Z thJC )
10
D = 0.50
1
0.20
0.10
0.05
0.1
0.02
0.01
0.01
0.00001
P DM
SINGLE PULSE
(THERMAL RESPONSE)
t1
t2
Notes:
1. Duty factor D = t 1 / t 2
2. Peak T J = P DM x Z thJC + TC
0.0001
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case
2014-8-30
5
www.kersemi.com
IRF9520NL
400
D .U .T
RG
VD D
IA S
-2 0 V
tp
EAS , Single Pulse Avalanche Energy (mJ)
L
VD S
A
D R IV E R
0 .0 1Ω
15V
Fig 12a. Unclamped Inductive Test Circuit
ID
-1.7A
-2.8A
BOTTOM -4.0A
TOP
300
200
100
0
25
IAS
50
75
100
125
150
175
Starting TJ , Junction Temperature ( ° C)
Fig 12c. Maximum Avalanche Energy
Vs. Drain Current
tp
V (BR)DSS
Fig 12b. Unclamped Inductive Waveforms
Current Regulator
Same Type as D.U.T.
50KΩ
QG
12V
.3µF
-10V
QGS
QGD
D.U.T.
+VDS
VGS
VG
-3mA
IG
Charge
ID
Current Sampling Resistors
Fig 13a. Basic Gate Charge Waveform
2014-8-30
.2µF
Fig 13b. Gate Charge Test Circuit
6
www.kersemi.com
IRF9520NL
Peak Diode Recovery dv/dt Test Circuit
+
D.U.T*
Circuit Layout Considerations
• Low Stray Inductance
• Ground Plane
• Low Leakage Inductance
Current Transformer
+
-
-
+
• dv/dt controlled by RG
• ISD controlled by Duty Factor "D"
• D.U.T. - Device Under Test
RG
VGS
*
+
-
VDD
Reverse Polarity of D.U.T for P-Channel
Driver Gate Drive
P.W.
D=
Period
P.W.
Period
[VGS=10V ] ***
D.U.T. ISD Waveform
Reverse
Recovery
Current
Body Diode Forward
Current
di/dt
D.U.T. VDS Waveform
Diode Recovery
dv/dt
Re-Applied
Voltage
Body Diode
[VDD]
Forward Drop
Inductor Curent
Ripple ≤ 5%
[ ISD ]
*** VGS = 5.0V for Logic Level and 3V Drive Devices
2014-8-30
7
www.kersemi.com
IRF9520NL
D2Pak Package Outline
1 0.54 (.4 15)
1 0.29 (.4 05)
1.4 0 (.055 )
M AX.
-A-
1.3 2 (.05 2)
1.2 2 (.04 8)
2
1.7 8 (.07 0)
1.2 7 (.05 0)
1
1 0.16 (.4 00 )
RE F.
-B -
4.69 (.1 85)
4.20 (.1 65)
6.47 (.2 55 )
6.18 (.2 43 )
15 .4 9 (.6 10)
14 .7 3 (.5 80)
3
2.7 9 (.110 )
2.2 9 (.090 )
2.61 (.1 03 )
2.32 (.0 91 )
5 .28 (.20 8)
4 .78 (.18 8)
3X
1.40 (.0 55)
1.14 (.0 45)
3X
5 .08 (.20 0)
0.5 5 (.022 )
0.4 6 (.018 )
0 .93 (.03 7 )
0 .69 (.02 7 )
0 .25 (.01 0 )
M
8.8 9 (.3 50 )
R E F.
1.3 9 (.0 5 5)
1.1 4 (.0 4 5)
B A M
M IN IM U M R E CO M M E ND E D F O O TP R IN T
1 1.43 (.4 50 )
LE A D A SS IG N M E N TS
1 - G A TE
2 - D R AIN
3 - S O U RC E
NO TE S:
1 D IM EN S IO N S A FTER SO L D ER D IP.
2 D IM EN S IO N IN G & TO LE RA N C IN G PE R A N S I Y1 4.5M , 198 2.
3 C O N TRO L LIN G D IM EN SIO N : IN C H .
4 H E ATSINK & L EA D D IM EN S IO N S D O N O T IN C LU D E B UR R S.
8.89 (.3 50 )
17 .78 (.70 0)
3 .8 1 (.15 0)
2 .08 (.08 2)
2X
2.5 4 (.100 )
2X
Part Marking Information
D2Pak
A
PART NUM BER
LO G O
F530S
9 24 6
9B
1M
A S S E M B LY
LO T C O D E
2014-8-30
8
DATE CODE
(Y YW W )
YY = Y E A R
W W = W EEK
www.kersemi.com
IRF9520NL
Package Outline
TO-262 Outline
Part Marking Information
TO-262
2014-8-30
9
www.kersemi.com
IRF9520NL
Tape & Reel Information
D2Pak
TR R
1 .6 0 (.0 6 3 )
1 .5 0 (.0 5 9 )
1 .6 0 (.0 6 3 )
1 .5 0 (.0 5 9 )
4 .1 0 (.1 6 1 )
3 .9 0 (.1 5 3 )
F E E D D IRE CTIO N 1 .8 5 (.0 7 3 )
1 1.6 0 (.4 57 )
1 1.4 0 (.4 49 )
1 .6 5 (.0 6 5 )
0 .3 6 8 (.0 1 4 5 )
0 .3 4 2 (.0 1 3 5 )
1 5.4 2 (.6 0 9 )
1 5.2 2 (.6 0 1 )
2 4 .3 0 (.9 5 7 )
2 3 .9 0 (.9 4 1 )
TR L
1 .7 5 (.0 6 9 )
1 .2 5 (.0 4 9 )
1 0.9 0 (.4 2 9 )
1 0.7 0 (.4 2 1 )
4 .7 2 (.1 3 6)
4 .5 2 (.1 7 8)
1 6 .1 0 (.6 3 4 )
1 5 .9 0 (.6 2 6 )
F E E D D IRE CTIO N
13 .5 0 (.53 2)
12 .8 0 (.50 4)
27 .40 (1.0 79)
23 .90 (.94 1)
4
3 30 .0 0
(14.1 73)
MAX.
60.00 (2.3 62)
M IN .
NO TES :
1. C O M F O R M S T O E IA-4 18.
2. C O N TR O LL IN G D IM E N S IO N : M IL LIM E T E R .
3. D IM E N S IO N M E A SU R E D @ H U B .
4. IN C LU D E S F L AN G E D IS T O R T IO N @ O U TE R E D G E.
2014-8-30
10
26 .40 (1 .03 9)
24 .40 (.9 61 )
3
30 .40 (1.19 7)
MAX.
4
www.kersemi.com