[ /Title (CD74 HC166 , CD74 HCT16 6) /Subject (High Speed CMOS Logic 8-Bit ParallelIn/Seri CD54HC166, CD74HC166, CD54HCT166, CD74HCT166 Data sheet acquired from Harris Semiconductor SCHS157C February 1998 - Revised October 2003 High-Speed CMOS Logic 8-Bit Parallel-In/Serial-Out Shift Register Features Description • Buffered Inputs The ’HC166 and ’HCT166 8-bit shift register is fabricated with silicon gate CMOS technology. It possesses the low power consumption of standard CMOS integrated circuits, and can operate at speeds comparable to the equivalent low power Schottky device. • Fanout (Over Temperature Range) - Standard Outputs . . . . . . . . . . . . . . . 10 LSTTL Loads - Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads • Wide Operating Temperature Range . . . -55oC to 125oC The ’HCT166 is functionally and pin compatible with the standard ’LS166. • Balanced Propagation Delay and Transition Times • Significant Power Reduction Compared to LSTTL Logic ICs The 166 is an 8-bit shift register that has fully synchronous serial or parallel data entry selected by an active LOW Parallel Enable (PE) input. When the PE is LOW one setup time before the LOW-to-HIGH clock transition, parallel data is entered into the register. When PE is HIGH, data is entered into the internal bit position Q0 from Serial Data Input (DS), and the remaining bits are shifted one place to the right (Q0 → Q1 → Q2, etc.) with each positive-going clock transition. For expansion of the register in parallel to serial converters, the Q7 output is connected to the DS input of the succeeding stage. • HC Types - 2V to 6V Operation - High Noise Immunity: NIL = 30%, NIH = 30% of VCC at VCC = 5V • HCT Types - 4.5V to 5.5V Operation - Direct LSTTL Input Logic Compatibility, VIL= 0.8V (Max), VIH = 2V (Min) The clock input is a gated OR structure which allows one input to be used as an active LOW Clock Enable (CE) input. The pin assignment for the CP and CE inputs is arbitrary and can be reversed for layout convenience. The LOW-to-HIGH transition of CE input should only take place while the CP is HIGH for predictable operation. Pinout CD54HC166, CD54HCT166 (CERDIP) CD74HC166, CD74HCT166 (PDIP, SOIC) TOP VIEW A LOW on the Master Reset (MR) input overrides all other inputs and clears the register asynchronously, forcing all bit positions to a LOW state. DS 1 16 VCC D0 2 15 PE D1 3 14 D7 D2 4 13 Q7 D3 5 12 D6 CD54HC166F3A -55 to 125 16 Ld CERDIP CE 6 11 D5 CD54HCT166F3A -55 to 125 16 Ld CERDIP CP 7 10 D4 GND 8 9 MR Ordering Information PART NUMBER TEMP. RANGE (oC) PACKAGE CD74HC166E -55 to 125 16 Ld PDIP CD74HC166M -55 to 125 16 Ld SOIC CD74HC166MT -55 to 125 16 Ld SOIC CD74HC166M96 -55 to 125 16 Ld SOIC CD74HCT166E -55 to 125 16 Ld PDIP CD74HCT166M -55 to 125 16 Ld SOIC CD74HCT166MT -55 to 125 16 Ld SOIC CD74HCT166M96 -55 to 125 16 Ld SOIC NOTE: When ordering, use the entire part number. The suffix 96 denotes tape and reel. The suffix T denotes a small-quantity reel of 250. CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures. Copyright © 2003, Texas Instruments Incorporated 1 CD54HC166, CD74HC166, CD54HCT166, CD74HCT166 Functional Diagram D0 D1 D2 D3 D4 D5 D6 D7 PARALLEL ENABLE CIRCUIT PE D0 D7 DS 8 - REGISTERS Q7 CP CE MR TRUTH TABLE INPUTS INTERNAL Q STATES PARALLEL MASTER RESET PARALLEL ENABLE CLOCK ENABLE CLOCK SERIAL D0 D7 Q0 Q1 OUTPUT Q7 L X X X X X L L L H X L L X X Q00 Q10 Q0 H L L ↑ X a...h a b h H H L ↑ H X H Q0n Q6n H H L ↑ L X L Q0n Q6n H X H ↑ X X Q00 Q10 Q70 H= High Voltage Level L= Low Voltage Level X= Don’t Care ↑= Transition from Low to High Level a...h = The level of steady-state input at inputs D0 thru D7, respectively. Q00, Q10, Q70 = The level of Q0, Q1, or Q7, respectively, before the indicated steady-state input conditions were established. Q0n, Q6n = The level of Q0 or Q6, respectively, before the most recent ↑ transition of the clock. 2 CD54HC166, CD74HC166, CD54HCT166, CD74HCT166 Absolute Maximum Ratings Thermal Information DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V DC Input Diode Current, IIK For VI < -0.5V or VI > VCC + 0.5V . . . . . . . . . . . . . . . . . . . . . .±20mA DC Output Diode Current, IOK For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA DC Drain Current, per Output, IO For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA DC Output Source or Sink Current per Output Pin, IO For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA DC VCC or Ground Current, ICC or IGND . . . . . . . . . . . . . . . . . .±50mA Thermal Resistance (Typical, Note 1) θJA (oC/W) E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . 67 M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 73 Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150oC Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) Operating Conditions Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC Supply Voltage Range, VCC HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC Input Rise and Fall Time 2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max) 4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max) 6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max) CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. The package thermal impedance is calculated in accordance with JESD 51-7. DC Electrical Specifications TEST CONDITIONS PARAMETER SYMBOL VI (V) High Level Input Voltage VIH - Low Level Input Voltage VIL 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 2 1.5 - - 1.5 - 1.5 - V 4.5 3.15 - - 3.15 - 3.15 - V 6 4.2 - - 4.2 - 4.2 - V 2 - - 0.5 - 0.5 - 0.5 V 4.5 - - 1.35 - 1.35 - 1.35 V 6 - - 1.8 - 1.8 - 1.8 V -0.02 2 1.9 - - 1.9 - 1.9 - V -0.02 4.5 4.4 - - 4.4 - 4.4 - V -0.02 6 5.9 - - 5.9 - 5.9 - V -4 4.5 3.98 - - 3.84 - 3.7 - V -5.2 6 5.48 - - 5.34 - 5.2 - V HC TYPES High Level Output Voltage CMOS Loads VOH - VIH or VIL High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current II VCC or GND - - 0.02 2 - - 0.1 - 0.1 - 0.1 V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 0.02 6 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V 5.2 6 - - 0.26 - 0.33 - 0.4 V - 6 - - ±0.1 - ±1 - ±1 µA 3 CD54HC166, CD74HC166, CD54HCT166, CD74HCT166 DC Electrical Specifications (Continued) TEST CONDITIONS SYMBOL VI (V) ICC VCC or GND 0 High Level Input Voltage VIH - Low Level Input Voltage VIL High Level Output Voltage CMOS Loads VOH PARAMETER Quiescent Device Current 25oC IO (mA) VCC (V) -40oC TO 85oC -55oC TO 125oC MIN TYP MAX MIN MAX MIN MAX UNITS 6 - - 8 - 80 - 160 µA - 4.5 to 5.5 2 - - 2 - 2 - V - - 4.5 to 5.5 - - 0.8 - 0.8 - 0.8 V VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V -4 4.5 3.98 - - 3.84 - 3.7 - V 0.02 4.5 - - 0.1 - 0.1 - 0.1 V 4 4.5 - - 0.26 - 0.33 - 0.4 V HCT TYPES High Level Output Voltage TTL Loads Low Level Output Voltage CMOS Loads VOL VIH or VIL Low Level Output Voltage TTL Loads Input Leakage Current Quiescent Device Current Additional Quiescent Device Current Per Input Pin: 1 Unit Load II VCC to GND 0 5.5 - - ±0.1 - ±1 - ±1 µA ICC VCC or GND 0 5.5 - - 8 - 80 - 160 µA ∆ICC (Note 2) VCC -2.1 - 4.5 to 5.5 - 100 360 - 450 - 490 µA NOTE: 2. For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA. HCT Input Loading Table INPUT UNIT LOADS DS, D0-D7 0.2 PE 0.35 CP, CE 0.5 MR 0.2 NOTE: Unit Load is ∆ICC limit specified in DC Electrical Specifications table, e.g., 360µA max at 25oC. Prerequisite For Switching Specifications 25oC PARAMETER -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN MAX MIN MAX MIN MAX UNITS fMAX 2 6 - 5 - 4 - MHz 4.5 30 - 25 - 20 - MHz 6 35 - 29 - 23 - MHz HC TYPES Clock Frequency (Figure 1) 4 CD54HC166, CD74HC166, CD54HCT166, CD74HCT166 Prerequisite For Switching Specifications (Continued) 25oC PARAMETER MR Pulse Width (Figure 1) -40oC TO 85oC -55oC TO 125oC SYMBOL VCC (V) MIN MAX MIN MAX MIN MAX UNITS tw 2 100 - 125 - 150 - ns 4.5 20 - 25 - 30 - ns 6 17 - 21 - 26 - ns 2 80 - 100 - 120 - ns 4.5 16 - 20 - 24 - ns Clock Pulse Width (Figure 1) tW Set-up Time Data and CE to Clock (Figure 5) tSU 6 14 - 17 - 20 - ns 2 80 - 100 - 120 - ns 4.5 16 - 20 - 24 - ns 6 14 - 17 - 20 - ns 2 1 - 1 - 1 - ns 4.5 1 - 1 - 1 - ns 6 1 - 1 - 1 - ns 2 0 - 0 - 0 - ns 4.5 0 - 0 - 0 - ns 6 0 - 0 - 0 - ns 2 145 - 180 - 220 - ns 4.5 29 - 36 - 44 - ns 6 25 - 31 - 38 - ns 2 0 - 0 - 0 - ns 4.5 0 - 0 - 0 - ns 6 0 - 0 - 0 - ns fMAX 4.5 25 - 20 - 16 - MHz MR Pulse Width (Figure 2) tw 4.5 35 - 44 - 53 - ns Clock Pulse Width (Figure 2) tw 4.5 20 - 25 - 30 - ns Set-up Time Data and CE to Clock (Figure 6) tSU 4.5 16 - 20 - 24 - ns Hold Time Data to Clock (Figure 6) tH 4.5 0 - 0 - 0 - ns tREM 4.5 0 - 0 - 0 - ns Set-up Time PE to CP (Figure 6) tSU 4.5 30 - 38 - 45 - ns Hold Time PE to CP or CE (Figure 6) tH 4.5 0 - 0 - 0 - ns Hold Time Data to Clock (Figure 5) tH Removal Time MR to Clock (Figure 5) tREM Set-up Time PE to CP (Figure 5) tSU Hold Time PE to CP or CE (Figure 5) tH HCT TYPES Clock Frequency (Figure 2) Removal Time MR to Clock (Figure 6) Switching Specifications PARAMETER HC TYPES Propagation Delay, Clock to Output (Figure 3) Input tr, tf = 6ns SYMBOL TEST CONDITIONS tPLH, tPHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) TYP MAX MAX MAX UNITS 2 - 160 200 240 ns 4.5 - 32 40 48 ns CL = 15pF 5 13 - - - ns CL = 50pF 6 - 27 34 41 ns 5 CD54HC166, CD74HC166, CD54HCT166, CD74HCT166 Switching Specifications PARAMETER Output Transition Time (Figure 3) Input tr, tf = 6ns (Continued) SYMBOL TEST CONDITIONS tTLH, tTHL CL = 50pF 25oC -40oC TO 85oC -55oC TO 125oC VCC (V) TYP MAX MAX MAX UNITS 2 - 75 95 110 ns 4.5 - 15 19 22 ns 6 - 13 16 19 ns 2 - 160 200 240 ns 4.5 - 32 40 48 ns Propagation Delay MR to Output (Figure 3) tPHL 6 - 27 34 41 ns Input Capacitance CI - - - 10 10 10 pF Power Dissipation Capacitance (Notes 3, 4) CPD - 5 41 - - - pF HCT TYPES Propagation Delay, Clock to Output (Figure 4) CL = 50pF tPLH, tPHL CL = 50pF 4.5 - 40 50 60 ns Output Transition Time (Figure 4) tTLH, tTHL CL = 50pF 4.5 - 15 19 22 ns Propagation Delay MR to Output (Figure 4) tPHL CL = 50pF 4.5 - 40 50 60 ns - - 10 10 10 pF Input Capacitance CI - NOTES: 3. CPD is used to determine the dynamic power consumption, per gate. 4. PD = CPD VCC2fi + ∑ (CL VCC2 + fO) where fi = Input Frequency, fO = Output Frequency, CL = Output Load Capacitance, VCC = Supply Voltage. Test Circuits and Waveforms tfCL trCL CLOCK 90% 10% tWL + tWH = I tWL 50% tfCL = 6ns fCL I fCL 3V VCC 50% 10% tWL + tWH = trCL = 6ns CLOCK 50% 2.7V 0.3V GND 1.3V 0.3V tWL tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. 1.3V 1.3V GND tWH NOTE: Outputs should be switching from 10% VCC to 90% VCC in accordance with device truth table. For fMAX, input duty cycle = 50%. FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND PULSE WIDTH 6 CD54HC166, CD74HC166, CD54HCT166, CD74HCT166 Test Circuits and Waveforms tr = 6ns (Continued) tf = 6ns 90% 50% 10% INPUT GND tTLH 90% INVERTING OUTPUT tPHL FIGURE 3. HC AND HCU TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC trCL VCC 90% GND tH(H) 3V 2.7V 1.3V 0.3V GND tH(H) tH(L) VCC DATA INPUT DATA INPUT 50% tH(L) 3V 1.3V 1.3V 1.3V GND tSU(H) tSU(H) tSU(L) tTLH 90% OUTPUT tTHL 90% 50% 10% tTLH 90% 1.3V OUTPUT tREM 3V SET, RESET OR PRESET GND tTHL 1.3V 10% FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS tPHL 1.3V GND IC CL 50pF GND 90% tPLH 50% IC tSU(L) tPHL tPLH tREM VCC SET, RESET OR PRESET tfCL CLOCK INPUT 50% 10% tPLH FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION DELAY TIMES, COMBINATION LOGIC tfCL trCL tTLH 1.3V 10% tPLH tPHL GND tTHL 90% 50% 10% INVERTING OUTPUT 3V 2.7V 1.3V 0.3V INPUT tTHL CLOCK INPUT tf = 6ns tr = 6ns VCC CL 50pF FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME, AND PROPAGATION DELAY TIMES FOR EDGE TRIGGERED SEQUENTIAL LOGIC CIRCUITS 7 PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 PACKAGING INFORMATION (1) Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) CD54HC166F3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD54HCT166F3A ACTIVE CDIP J 16 1 TBD A42 SNPB N / A for Pkg Type CD74HC166E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC166EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HC166M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC166M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC166M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC166M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC166ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC166MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC166MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC166MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HC166MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166E ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT166EE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type CD74HCT166M ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166M96 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166M96E4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166M96G4 ACTIVE SOIC D 16 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166ME4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166MG4 ACTIVE SOIC D 16 40 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166MT ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166MTE4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166MTG4 ACTIVE SOIC D 16 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM CD74HCT166TM96Q1 OBSOLETE SOIC D 16 TBD Call TI The marketing status values are defined as follows: Addendum-Page 1 Call TI PACKAGE OPTION ADDENDUM www.ti.com 9-Oct-2007 ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. 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Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel Diameter Width (mm) W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant CD74HC166M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 CD74HCT166M96 SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 19-Mar-2008 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) CD74HC166M96 SOIC D 16 2500 333.2 345.9 28.6 CD74HCT166M96 SOIC D 16 2500 333.2 345.9 28.6 Pack Materials-Page 2 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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