Panasonic EXCCET471U Chip emi filter Datasheet

Chip EMI Filters
Chip EMI Filters
Type:
EXCCET
■ Features
● Rated current (2 A max.)
● Eight capacitance values in a wide range, related to
the noise frequency
● Suitable for narrow pitch insertion
● Suitable for applications requiring thin design
■ Recommended Applications
● Digital equipment such as PCs, word processors,
printers, HDD, PPC, and communication equipment.
● Digital audio and video equipment.
● AC adapters, and switching power supplies.
● Electronic musical instruments, and other digital
equipment.
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
E
X
C
C
E
T
1
0
3
U
Product Code
Noise Filter
Type
Circuit
T-circuit
Chip type
EMI filter
■ Construction
Nominal
Capacitance Value
The first two digits are
significant figures of
capacitance value and the
third one denotes the number
of zeros following.
Form
Code
Packing
U
Embossed Carrier Taping
■ Dimensions in mm (not to scale)
2.7±0.3
Ferrite core
0.5±0.2
0.5±0.2
4.5±0.4
1.8±0.2
Chip capacitor
Electrode
1.0±0.2
Adhesive
Size : 1807 inches
Mass (Weight) : 92.5 mg/pc.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Feb. 2007
Chip EMI Filters
■ Ratings
Part Number
Rated
Voltage
(V DC)
Capacitance
(pF)
EXCCET220U
EXCCET470U
EXCCET101U
EXCCET271U
EXCCET471U
EXCCET102U
EXCCET222U
EXCCET103U
50
50
50
50
50
50
50
50
22
47
100
270
470
1000
2200
10000
(1)
Rated
DC
25 dB Attenuate 15 dB Attenuate
(2)
Tolerance
Frequency
Frequency
Characteristics Current Resistance
(%)
(A DC)
(m액)
(MHz)
(MHz)
±20
±20
±20
±20
±20
±20
±20
±20
YB
YB
YB
YB
YB
YB
YB
YB
2
2
2
2
2
2
2
2
50 max.
50 max.
50 max.
50 max.
50 max.
50 max.
50 max.
50 max.
800 to 1000
450 to 550
300 to 450
200 to 300
100 to 220
65 to 200
35 to 180
15 to 120
600 to 1000
350 to 1000
200 to 900
80 to 700
50 to 700
30 to 700
15 to 700
15 to 700
(1) Please inquire to us about the particular capacitance value, on a range of 22 to 10000 pF.
(2) Characteristics YB: Maximum capacitance is ±10 % over the temperature range of –25 °C to +85 °C in reference to +20 °C.
■ Attenuation Characteristics (Reference Data)
Measurement Circuit
10
20
50 액
30
Sample
101
471271
40
222 102
50
470
220
~
50 액
촞
Attenuation(dB)
0
103
60
1M
10M
100M
1G
Frequency (Hz)
■ Packaging Methods (Taping)
● Standard Quantity
Part Number
Kind of Taping
Pitch (P1)
Quantity
EXCCET첸첸첸U
Embossed Carrier Taping
4 mm
1000 pcs./reel
● Embossed Carrier Taping
● Taping Reel
T
E
Compartment
φC
F E
W
Sprocket hole
φD0
φD
B
A
t2
P1 P2 P0
φB
t1
Tape running direction
Chip component
φA
A
B
W
F
E
Dimensions
2.2±0.2 4.9±0.2 12.0±0.2 5.50±0.05 1.75±0.10 4.0±0.1
(mm)
P2
P0
φD0
t1
φA
P1
Dimensions
(mm)
t2
Dimensions
2.0±0.1 4.0±0.1 1.5+0.1
0.35±0.05 3.5 max.
0
(mm)
0
180.0–3.0
E
Dimensions
(mm)
2.0±0.5
W
φB
φC
φD
60.0±1.0
13.0±0.5
21.0±0.8
W
T
13.0±1.0 16.5 max.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Sep. 2009
Chip EMI Filters
■ Recommended Land Pattern Design(mm)
● For High Density Mounting
Resist
1.0
2.54
1.4
1.4
1.15
Copper foil
1.15
1.0
0.2
Resist
Copper foil
0.2
● For Single Mounting
Resist
1.4
1.3
1.3
5.4
Using the land pattern which we do not recommend,
or mounting by the solder under 180µm, verify the
performance, reliability, etc. thoroughly.
1.3
1.3
5.4
■ Recommended Soldering Conditions
Recommendations and precautions are described below.
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Temperature
Peak
Preheating
Heating
For soldering (Example : Sn-37Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 10 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temperature
Time
Preheating
150 °C to 170 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Safety Precautions
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.
1. Chip EMI Filters (hereafter called the filters) cannot be mounted on a printed circuit board by flow soldering.
Mount them by reflow soldering.
2. Use rosin-based flux or halogen-free flux.
3. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
4. Do not apply shock to the filters or pinch them with a hard tool (e.g. pliers and tweezers). Otherwise, their bodies
may be chipped, affecting their performance. Excessive mechanical stress may damage the filters. Handle
with care.
5. Avoid applying static electricity to the filters.
6. The performance of the filters deteriorates in a circuit that is susceptible to surges or other abnormal voltages.
Carefully check the circuit operations before use.
7. Store the filters in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to 60 %,
where there are no rapid changes in temperature or humidity.
8. Use the filters within a year after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Sep. 2009
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Jan. 2008
– EL113 –
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