ON MBRP20045CT Powertap ii switchmode power rectifier Datasheet

MBRP20045CT
Preferred Device
POWERTAPt II
SWITCHMODEt
Power Rectifier
This state−of−the−art device uses the Schottky Barrier principle
with a platinum barrier metal.
http://onsemi.com
Features
• Dual Diode Construction; May Be Paralleled for Higher Current
•
•
•
•
•
Output
Guardring for Stress Protection
Low Forward Voltage
150°C Operating Junction Temperature
Guaranteed Reverse Avalanche
Pb−Free Package is Available*
SCHOTTKY
BARRIER RECTIFIER
200 AMPERES, 45 VOLTS
1
3
2
Mechanical Characteristics
•
•
•
•
•
Case: Epoxy, Molded with Metal Heatsink Base
Weight: 80 Grams (Approximately)
Finish: All External Surfaces Corrosion Resistant
Top Terminal Torque: 25−40 lb−in Max
Base Plate Torques: See Procedure Given in the Package Outline
Section
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
45
V
Average Rectified Forward Current
(Rated VR, TC = 140°C)
Per Leg
Per Device
IF(AV)
Peak Repetitive Forward Current,
(Rated VR, Square Wave,
20 kHz, TC = 140°C)
Per Leg
IFRM
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions
Halfwave, Single Phase, 60 Hz)
IFSM
Peak Repetitive Reverse Current
(2.0 ms, 1.0 kHz)
Per Leg
IRRM
Storage Temperature Range
Tstg
−55 to +150
°C
Operating Junction Temperature
TJ
−55 to +150
°C
dv/dt
10,000
V/ms
Voltage Rate of Change (Rated VR)
A
100
200
A
MCC
AYYWWG
B20045T
200
1500
A
A
2.0
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
September, 2006 − Rev. 6
POWERTAP II
CASE 357C
PLASTIC
MARKING DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
© Semiconductor Components Industries, LLC, 2006
1
3
MAXIMUM RATINGS
Rating
2
1
B20045T
MCC
A
YY
WW
G
= Specific Device Code
= Mold Compound Code
= Assembly Location
= Year
= York Week
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping
MBRP20045CT
POWERTAP II
25 Units/Tray
MBRP20045CTG
POWERTAP II
(Pb−Free)
25 Units/Tray
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MBRP20045CT/D
MBRP20045CT
THERMAL CHARACTERISTICS (Per Leg)
Rating
Thermal Resistance, Junction−to−Case
Symbol
Value
Unit
RqJC
0.6
°C/W
ELECTRICAL CHARACTERISTICS (Per Leg)
Instantaneous Forward Voltage (Note 1)
(iF = 200 Amps, TJ = 25°C)
(iF = 200 Amps, TJ = 125°C)
vF
Instantaneous Reverse Current (Note 1)
(Rated dc Voltage, TJ = 125°C)
(Rated dc Voltage, TJ = 25°C)
iR
V
0.89
0.78
mA
50
0.5
1. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%.
MAXIMUM MECHANICAL RATINGS
POWERTAP MECHANICAL DATA
APPLIES OVER OPERATING TEMPERATURE
Terminal Penetration:
0.235 max
Terminal Torque:
25−40 in-lb max
Mounting Torque —
Outside Holes:
30−40 in-lb max
Mounting Torque —
Center Hole:
8−10 in-lb max
Seating Plane
Flatness
1 mil per in.
(between mounting holes)
2″
Vertical Pull
250 lbs. max
2 in. Lever Pull
50 lbs. max
Note: While the POWERTAP is capable of sustaining these vertical and levered tensions, the intimate contact
Note: between POWERTAP and heat sink may be lost. This could lead to thermal runaway. The use of very
Note: flexible leads is recommended for the anode connections. Use of thermal grease is highly recommended.
http://onsemi.com
2
MBRP20045CT
MOUNTING PROCEDURE
The POWERTAP package requires special mounting considerations because of the long longitudinal axis of the copper
heat sink. It is important to follow the proper tightening sequence to avoid warping the heat sink, which can reduce thermal
contact between the POWERTAP and heat sink.
STEP 1:
Locate the POWERTAP on the heat sink and
start mounting bolts into the threads by hand
(2 or 3 turns).
STEP 2:
Finger tighten the center bolt. The bolt may
catch on the threads of the heat sink so it is
important to make sure the face of the bolt or
washer is in contact with the surface of the
POWERTAP.
STEP 3:
Tighten each of the end bolts between 5 to 10
in-lb.
STEP 4:
Tighten the center bolt between 8 to 10 in-lb.
STEP 5:
Finally, tighten the end bolts between 30 to 40
in-lb.
2 −3 TURNS
2 −3 TURNS
POWER
TAP
HEAT
SINK
2 −3 TURNS
FINGER-TIGHT
2 −3 TURNS
POWER
TAP
HEAT
SINK
FINGER-TIGHT
5 −10 IN-LB
5 −10 IN-LB
POWER
TAP
HEAT
SINK
8 −10 IN-LB
5 −10 IN-LB
5 −10 IN-LB
POWER
TAP
HEAT
SINK
8 −10 IN-LB
30 −40 IN-LB
30 −40 IN-LB
POWER
TAP
HEAT
SINK
http://onsemi.com
3
2 −3 TURNS
MBRP20045CT
PACKAGE DIMENSIONS
CASE 357C−03
POWERTAP
PLASTIC PACKAGE
ISSUE E
−A−
W
0.25 (0.010)
R
G
M
T A
B
M
M
N
−B−
Q
H
2 PL
0.25 (0.010)
F
C
U
E
−T−
M
T A
M
B
M
SEATING
PLANE
V
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. TERMINAL PENETRATION: 5.97 (0.235) MAXIMUM.
DIM
A
B
C
E
F
G
H
N
Q
R
U
V
W
INCHES
MIN
MAX
3.450
3.635
0.700
0.810
0.615
0.640
0.120
0.130
0.435
0.445
1.370
1.380
0.007
0.030
1/4−20UNC−2B
0.270
0.285
31.50 BSC
0.600
0.630
0.330
0.375
0.170
0.190
MILLIMETERS
MIN
MAX
87.63
92.33
17.78
20.57
15.63
16.26
3.05
3.30
11.05
11.30
34.80
35.05
0.18
0.76
1/4−20UNC−2B
6.86
7.23
80.01 BSC
15.24
16.00
8.39
9.52
4.32
4.82
POWERTAP and SWITCHMODE are trademarks of Semiconductor Components Industries, LLC
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5773−3850
http://onsemi.com
4
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MBRP20045CT/D
Similar pages