TI1 LM747H/883 Lm747qml dual operational amplifier Datasheet

LM747QML
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SNOSAR6A – DECEMBER 2010 – REVISED MARCH 2013
LM747QML Dual Operational Amplifier
Check for Samples: LM747QML
FEATURES
DESCRIPTION
•
•
•
The LM747 is a general purpose dual operational
amplifier. The two amplifiers share a common bias
network and power supply leads. Otherwise, their
operation is completely independent.
1
2
•
•
No Frequency Compensation Required
Short-Circuit Protection
Wide Common-Mode and Differential Voltage
Ranges
Low Power Consumption
No Latch-Up
Additional features of the LM747 are: no latch-up
when input common mode range is exceeded,
freedom from oscillations, and package flexibility.
Connection Diagrams
IN- A
1
14
OFFSET NULL A
IN+ A
2
13
V A
OFFSET NULL A
3
12
OUTPUT A
V-
4
11
N/C
OFFSET NULL B
5
10
OUTPUT B
IN+ B
6
9
V B
IN- B
7
8
OFFSET NULL B
+
+
Figure 1. CDIP Top View
See Package Number J (R-GDIP-T14)
N/C
10
OUTPUT A
+
9
1
OUTPUT B
+
V A
2
8
V B
IN- A
3
7
IN- B
IN+ A
6
4
IN+ B
5
V-
Figure 2. TO-100
See Package Number LME (O-MBCY-W10)
1
2
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2010–2013, Texas Instruments Incorporated
LM747QML
SNOSAR6A – DECEMBER 2010 – REVISED MARCH 2013
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)
Supply voltage
±22V
Power Dissipation (2)
800mW
Differential Input Voltage
Input Voltage
±30V
(3)
±15V
Output Short-Circuit Duration
Indefinite
Maximum Junction Temperature (TJmax)
150°C
Operating Temperature Range
−55°C ≤ TA ≤ +125°C
Storage Temperature Range
−65°C ≤ TA ≤ +150°C
Lead Temperature (Soldering, 10 seconds)
(1)
(2)
(3)
+300°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA (ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
For supply voltages less than ±15V, the absolute maximum input voltage is equal to the supply voltage.
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
2
Subgroup
Description
1
Static tests at
Temp (°C)
+25
2
Static tests at
+125
3
Static tests at
-55
4
Dynamic tests at
+25
5
Dynamic tests at
+125
6
Dynamic tests at
-55
7
Functional tests at
+25
8A
Functional tests at
+125
8B
Functional tests at
-55
9
Switching tests at
+25
10
Switching tests at
+125
11
Switching tests at
-55
12
Settling time at
+25
13
Settling time at
+125
14
Settling time at
-55
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LM747QML
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SNOSAR6A – DECEMBER 2010 – REVISED MARCH 2013
LM747 Electrical Characteristics DC Parameters
The following conditions apply, unless otherwise specified.
Symbol
Parameter
VCC = ±15V, VCM = 0V
Conditions
Notes
RS = 50Ω, VCM = -12V
RS = 50Ω, VCM = 12V
VIO
Input Offset Voltage
RS = 50Ω
RS = 50Ω, VCC = ±5V
VCM = -12V
VCM = 12V
IIO
Input Offset Current
VCC = ±5V
VCM = -12V
VCM = 12V
IIB+
Input Bias Current
VCC = ±5V
VCM = -12V
VCM = 12V
IIB-
Input Bias Current
VCC = ±5V
VIO
Adj
+
VIO Adj-
Input Offset Voltage Adjustment
Range
Min
Max
Units
Sub- groups
-5.0
5.0
mV
1
-6.0
6.0
mV
2, 3
-5.0
5.0
mV
1
-6.0
6.0
mV
2, 3
-5.0
5.0
mV
1
-6.0
6.0
mV
2, 3
-5.0
5.0
mV
1
2, 3
-6.0
6.0
mV
-200
200
nA
1
-500
500
nA
2, 3
-200
200
nA
1
-500
500
nA
2, 3
-200
200
nA
1
-500
500
nA
2, 3
-200
200
nA
1
-500
500
nA
2, 3
0.0
500
nA
1
0.0
1500
nA
2, 3
0.0
500
nA
1
0.0
1500
nA
2, 3
0.0
500
nA
1
0.0
1500
nA
2, 3
0.0
500
nA
1
0.0
1500
nA
2, 3
0.0
500
nA
1
0.0
1500
nA
2, 3
0.0
500
nA
1
0.0
1500
nA
2, 3
0.0
500
nA
1
0.0
1500
nA
2, 3
0.0
500
nA
1
0.0
1500
nA
2, 3
mV
1, 2, 3
mV
1, 2, 3
6.0
See (1)
Input Offset Voltage Adjustment
Range
-6.0
+
Power Supply Rejection Ratio
RS = 50Ω, VCC = ±15V to ±5V
77
dB
1, 2, 3
-
PSRR
Power Supply Rejection Ratio
RS = 50Ω, VCC = ±15V to ±5V
77
dB
1, 2, 3
CMRR
Common Mode Rejection Ratio
RS = 50Ω, VCM = ±12V
70
dB
1, 2, 3
PSRR
IOS+
Output Short Circuit Current
IOS-
Output Short Circuit Current
ICC
(1)
Supply Current
-45
-9.0
mA
1, 2
-50
-9.0
mA
3
9.0
45
mA
1, 2
9.0
50
mA
3
5.6
mA
1
5.0
mA
2
6.6
mA
3
Tested for CDIP only.
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LM747QML
SNOSAR6A – DECEMBER 2010 – REVISED MARCH 2013
www.ti.com
LM747 Electrical Characteristics DC Parameters (continued)
The following conditions apply, unless otherwise specified.
Symbol
VOP+
Parameter
Output Voltage Swing
VOP-
Output Voltage Swing
VCC = ±15V, VCM = 0V
Conditions
Notes
Min
Units
Sub- groups
RL = 10KΩ
12
V
1, 2, 3
RL = 2KΩ
10
V
1, 2, 3
VCC = ±20V, RL = 10KΩ
16
V
1, 2, 3
VCC = ±20V, RL = 2KΩ
15
V
1, 2, 3
RL = 10KΩ
-12
V
1, 2, 3
RL = 2KΩ
-10
V
1, 2, 3
VCC = ±20V, RL = 10KΩ
-16
V
1, 2, 3
V
1, 2, 3
VCC = ±20V, RL = 2KΩ
-15
AVS+
Open Loop Voltage Gain
VO = 0 to +10V, RL = 2K
See (2)
AVS-
Open Loop Voltage Gain
VO = 0 to -10V, RL = 2K
See (2)
VI
Input Voltage Range
VOP
Output Voltage Swing
(2)
(3)
(4)
Max
VCC = ±5V
50
V/mV
1
25
V/mV
2, 3
50
V/mV
1
25
V/mV
2, 3
See (3)
12
−12
V
1, 2, 3
See (4)
2
−2
V
1, 2, 3
Datalog reading in K = V/mV
Parameter tested go-no-go only, specified by CMRR test.
Specified parameter, not tested.
LM747 Electrical Characteristics AC Parameters
The following conditions apply, unless otherwise specified.
AC:
VCC = ±15V, VCM = 0V
Units
Sub- groups
SR+
Symbol
Slew Rate
AV = 1, VI = -5V to +5V
0.2
V/µS
9
SR-
Slew Rate
AV = 1, VI = +5V to -5V
0.2
V/µS
9
Gain Bandwidth
VI = 50mV, ƒ = 20KHz,
RL = 2KΩ
0.25
Mhz
9
GBW
4
Parameter
Conditions
Notes
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Min
Max
Copyright © 2010–2013, Texas Instruments Incorporated
Product Folder Links: LM747QML
LM747QML
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SNOSAR6A – DECEMBER 2010 – REVISED MARCH 2013
Table 1. Revision History
Released
Revision
Section
Changes
12/16/2010
A
New Release, Corporate format
1 MDS data sheet converted into one Corp. data
sheet format. The drift table was eliminated from the
883 section since it did not apply; MNLM747-X Rev
0BL will be archived.
03/25/2013
A
All Sections
Changed layout of National Data Sheet to TI format
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Aug-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
456
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Green (RoHS
& no Sb/Br)
Call TI
Level-1-NA-UNLIM
-55 to 125
TBD
Call TI
Call TI
-55 to 125
Device Marking
(4/5)
LM747 MD8
ACTIVE
DIESALE
Y
0
LM747 MW8
ACTIVE
WAFERSALE
YS
0
LM747H/883
ACTIVE
TO-100
LME
10
20
TBD
Call TI
Call TI
-55 to 125
LM747H/883 Q ACO
LM747H/883 Q >T
LM747J/883
ACTIVE
CDIP
J
14
25
TBD
Call TI
Call TI
-55 to 125
LM747J/883 Q
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
10-Aug-2016
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MMBC006 – MARCH 2001
LME (O–MBCY–W10)
METAL CYLINDRICAL PACKAGE
ø
0.370 (9,40)
0.335 (8,51)
ø
0.335 (8,51)
0.305 (7,75)
0.040 (1,02)
0.010 (0,25)
0.185 (4,70)
0.165 (4,19)
0.040 (1,02)
0.010 (0,25)
0.500 (12,70) MIN
Seating
Plane
ø
ø
0.021 (0,53)
0.016 (0,41)
0.160 (4,06)
0.120 (3,05)
0.120 (3,05)
0.110 (2,79)
4
3
0.034 (0,86)
0.028 (0,71)
36°
5
2
6
1
10
7
9
8
0.230 (5,84)
0.045 (1,14)
0.029 (0,74)
4202488/A 03/01
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
Leads in true position within 0.010 (0,25) R @ MMC at seating plane.
Pin numbers shown for reference only. Numbers may not be marked on package.
Falls within JEDEC MO–006/TO-100.
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• DALLAS, TEXAS 75265
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