Formosa MMBZ5245B Zener diode Datasheet

Formosa MS
Zener Diode
MMBZ5221B THRU MMBZ5270B
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Electrical characteristics................................................................... 3
Rating and characteristic curves........................................................ 4
Pinning information........................................................................... 5
Suggested solder pad layout............................................................. 5
Packing information.......................................................................... 6
Reel packing.................................................................................... 7
Suggested thermal profiles for soldering processes............................. 7
High reliability test capabilities........................................................... 8
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Page 1
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221744
2009/08/10
2010/04/12
B
8
Formosa MS
Zener Diode
MMBZ5221B THRU MMBZ5270B
225mW Surface Mount
Zener Diodes - 2.4V-91V
Package outline
Features
Mechanical data
0.020 (0.50)
0.034 (0.85)
(B)
0.012 (0.30)
.084(2.10)
.068(1.70)
0.120 (3.04)
0.110 (2.80)
0.045 (1.15)
SOT-23
• 225 mW Rating on FR–4 or FR–5 Board.
• Silicon epitaxial planar chip strucuction.
• Wide zener reverse voltage range 2.4V to 91V.
• Small package size for high density applications.
• Ideally suited for automated assembly processes.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
• ESD Rating of Class 3 (>16 KV) per Human Body Model.
• Suffix "-H" indicates Halogen-free part, ex.MMBZ5221B-H.
(C)
(A)
0.063 (1.60)
0.027 (0.67)
0.013 (0.32)
0.047 (1.20)
0.108 (2.75)
0.051 (1.30)
0.003 (0.09)
0.007 (0.18)
0.083 (2.10)
• Epoxy:UL94-V0 rated flame retardant
• Case : Molded plastic, SOT-23
• Terminals : Solder plated, solderable per
0.035 (0.89)
MIL-STD-750, Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.008 gram
Dimensions in inches and (millimeters)
Maximum ratings (at T =25 C unless otherwise noted)
o
A
PARAMETER
Forward Voltage
CONDITIONS
I F=10mA
Power Dissipation
Thermal resistance
MIN.
UNIT
VF
0.9
V
PD
225
R θJA
Junction to ambient
Operating temperature
Storage temperature
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MAX.
Symbol
Page 2
TYP.
mW
O
556
C/W
TJ
-55
+150
o
C
T STG
-65
+175
o
C
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221744
2009/08/10
2010/04/12
B
8
Formosa MS
Zener Diode
MMBZ5221B THRU MMBZ5270B
MMBZ5256B
MMBZ5257B
MMBZ5258B
MMBZ5259B
MMBZ5260B
Note:
1. Zener voltage is measured with a pulse test current I Z at an ambient temperature of 25 ° C
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Page 3
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221744
2009/08/10
2010/04/12
B
8
Figure 1 . Temperature Coefficients
( Temperature Range −55°C to + 150°C )
8
θ VZ , TEMPERATURE COEFFICIENT ( mV / ° C )
θ VZ , TEMPERATURE COEFFICIENT ( mV / ° C )
Rating and characteristic curves (MMBZ5221B THRU MMBZ5270B)
TYPICAL T C VALUES
FOR MMBZ5221B SERIES
7
6
5
4
3
2
1
0
-1
-2
-3
2
3
4
5
6
7
8
9
10
11
12
Figure 2 . Temperature Coefficients
( Temperature Range −55°C to + 150°C )
100
TYPICAL T C VALUES
FOR MMBZ5221B SERIES
10
1
10
100
VZ, NOMINAL ZENER VOLTAGE (V)
VZ, NOMINAL ZENER VOLTAGE (V)
1000
Ω
75 V (MMBZ5267B)
91 V (MMBZ5270B)
100
10
150°C
°C
°C
°C
1
1
10
100
0.4
0.5
0.6
VZ, NOMINAL ZENER VOLTAGE (V)
0.7
0.8
0.9
1.0
1.1
1.2
VF, FORWARD VOLTAGE (V)
Figure 5. Typical Capacitance
Figure 6. Typical Leakage Current
1000
μ
=25°C
100
10
1
0.1
0.01
0.001
0.0001
0.00001
0
VZ, NOMINAL ZENER VOLTAGE (V)
10
20
30
40
50
60
80
90
=25°C
=25°C
VZ, ZENER VOLTAGE (V)
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70
VZ, NOMINAL ZENER VOLTAGE (V)
VZ, ZENER VOLTAGE (V)
Page 4
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221744
2009/08/10
2010/04/12
B
8
Formosa MS
Zener Diode
MMBZ5221B THRU MMBZ5270B
Pinning information
Pin
Simplified outline
Symbol
(C)
PinA
PinB
PinC
no connection
anode
cathode
(C)
(A)
(B)
(B)
(A)
Suggested solder pad layout
SOT-23
0.037(0.95)
0.037(0.95)
0.079(2.0)
0.035(0.90)
0.031(0.80)
Dimensions in inches and (millimeters)
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Page 5
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221744
2009/08/10
2010/04/12
B
8
Formosa MS
Zener Diode
MMBZ5221B THRU MMBZ5270B
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOT-23
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
3.15
2.77
1.22
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
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Page 6
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221744
2009/08/10
2010/04/12
B
8
Formosa MS
Zener Diode
MMBZ5221B THRU MMBZ5270B
Reel packing
PACKAGE
SOT-23
REEL SIZE
7"
REEL
(pcs)
COMPONENT
SPACING
(m/m)
BOX
(pcs)
3,000
4.0
30,000
REEL
DIA,
(m/m)
INNER
BOX
(m/m)
183*183*123
CARTON
SIZE
(m/m)
178
CARTON
(pcs)
382*262*387
APPROX.
GROSS WEIGHT
(kg)
11.6
240,000
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%±25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<6 C /sec
o
o
Time 25 C to Peak Temperature
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<6minutes
Page 7
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221744
2009/08/10
2010/04/12
B
8
Formosa MS
Zener Diode
MMBZ5221B THRU MMBZ5270B
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
immerse body into solder 1/16" ± 1/32"
2. Solderability
at 245 ± 5 C for 5 sec.
3. High Temperature Reverse Bias
V R=80% rate at T J=150 C for 168 hrs.
4. Pressure Cooker
15P SIG at T A=121 C for 4 hrs.
5. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
JESD22-A102
O
O
MIL-STD-750D
METHOD-1051
O
O
6. Thermal Shock
MIL-STD-750D
METHOD-1038
O
MIL-STD-750D
METHOD-1056
O
0 C for 5 min. rise to 100 C for 5 min. total 10 cycles.
MIL-STD-750D
METHOD-1021
O
7. Humidity
at T A=85 C , RH=85% for 1000hrs.
MIL-STD-750D
METHOD-1031
O
8. High Temperature Storage Life
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at 175 C for 1000 hrs.
Page 8
Document ID
Issued Date
Revised Date
Revision
Page.
DS-221744
2009/08/10
2010/04/12
B
8
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