ISSI IS61LV10248-10TI 1m x 8 high-speed cmos static ram Datasheet

ISSI
IS61LV10248
1M x 8 HIGH-SPEED CMOS STATIC RAM
FEATURES
• High-speed access times:
8, 10 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for
greater noise immunity
• Easy memory expansion with CE and OE
options
• CE power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single 3.3V power supply
• Packages available:
– 48-ball miniBGA (9mm x 11mm)
– 36-ball miniBGA (9mm x 11mm)
– 44-pin TSOP (Type II)
• Lead-free available
®
APRIL 2006
DESCRIPTION
The ISSI IS61LV10248 is a very high-speed, low power,
1M-word by 8-bit CMOS static RAM. The IS61LV10248 is
fabricated using ISSI's high-performance CMOS technology. This highly reliable process coupled with innovative
circuit design techniques, yields higher performance and
low power consumption devices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down with CMOS input levels.
The IS61LV10248 operates from a single 3.3V power
supply and all inputs are TTL-compatible.
The IS61LV10248 is available in 48 ball mini BGA, 36-ball
mini BGA, and 44-pin TSOP (Type II) packages.
FUNCTIONAL BLOCK DIAGRAM
A0-A19
DECODER
1M X 8
MEMORY ARRAY
I/O
DATA
CIRCUIT
COLUMN I/O
VDD
GND
I/O0-I/O7
CE
OE
CONTROL
CIRCUIT
WE
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
04/13/06
1
ISSI
IS61LV10248
®
PIN CONFIGURATION
36 mini BGA (B) (9mm x 11mm)
1
2
3
4
5
6
A
NC
OE
A0
A1
A2
NC
I/O0
B
NC
NC
A3
A4
CE
I/O0
I/O1
C
NC
NC
A5
A6
I/O1
I/O2
VDD
D
GND
NC
A17
A7
I/O3
VDD
GND
E
VDD
NC
NC
A16
I/O4
GND
I/O2
F
NC
NC
A14
A15
I/O5
I/O6
G
NC
NC
A12
A13
WE
I/O7
H
A18
A8
A9
A10
A11
A19
1
2
3
4
5
6
A
A0
A1
NC
A3
A6
A8
B
I/O4
A2
WE
A4
A7
C
I/O5
A19
A5
D
GND
E
VDD
F
I/O6
G
I/O7
H
A9
A18
A17
OE
CE
A16
A15
I/O3
A10
A11
A12
A13
A14
PIN DESCRIPTIONS
2
48-pin Mini BGA (M ) (9mm x 11mm)
A0-A19
Address Inputs
CE
Chip Enable Input
OE
Output Enable Input
WE
Write Enable Input
I/O0-I/O7
Data Input / Output
VDD
Power
GND
Ground
NC
No Connection
44-pin TSOP (Type II )
NC
NC
A0
A1
A2
A3
A4
CE
I/O0
I/O1
VDD
GND
I/O2
I/O3
WE
A5
A6
A7
A8
A9
NC
NC
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
NC
NC
NC
A18
A17
A16
A15
OE
I/O7
I/O6
GND
VDD
I/O5
I/O4
A14
A13
A12
A11
A10
A19
NC
NC
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
04/13/06
ISSI
IS61LV10248
®
TRUTH TABLE
WE
Mode
Not Selected
(Power-down)
Output Disabled
Read
Write
CE
OE
I/O Operation
VDD Current
X
H
X
High-Z
ISB1, ISB2
H
H
L
L
L
L
H
L
X
High-Z
DOUT
DIN
ICC
ICC
ICC
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VTERM
VDD
TSTG
PT
Parameter
Terminal Voltage with Respect to GND
VDD Relates to GND
Storage Temperature
Power Dissipation
Value
–0.5 to VDD + 0.5
–0.3 to 4.0
–65 to +150
1.0
Unit
V
V
°C
W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage
to the device. This is a stress rating only and functional operation of the device at these or any other
conditions above those indicated in the operational sections of this specification is not implied. Exposure
to absolute maximum rating conditions for extended periods may affect reliability.
OPERATING RANGE
Range
Ambient Temperature
VDD
0°C to +70°C
3.3V +10%, -5%
–40°C to +85°C
3.3V +10%, -5%
Commercial
Industrial
CAPACITANCE(1,2)
Symbol
Parameter
CIN
Input Capacitance
CI/O
Input/Output Capacitance
Conditions
Max.
Unit
VIN = 0V
6
pF
VOUT = 0V
8
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz, VDD = 3.3V.
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Rev. C
04/13/06
3
ISSI
IS61LV10248
®
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter
Test Conditions
Min.
Max.
Unit
VOH
Output HIGH Voltage
VDD = Min., IOH = –4.0 mA
2.4
—
V
VOL
Output LOW Voltage
VDD = Min., IOL = 8.0 mA
—
0.4
V
VIH
Input HIGH Voltage
2.2
VDD + 0.3
V
VIL
Input LOW Voltage(1)
–0.3
0.8
V
ILI
Input Leakage
GND ≤ VIN ≤ VDD
Com.
Ind.
–1
–5
1
5
µA
ILO
Output Leakage
GND ≤ VOUT ≤ VDD, Outputs Disabled
Com.
Ind.
–1
–5
1
5
µA
Note:
1. VIL = –3.0V for pulse width less than 10 ns.
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
-8
Symbol Parameter
Test Conditions
ICC
VDD Dynamic Operating
Supply Current
VDD = Max.,
IOUT = 0 mA, f = fMAX
ISB1
TTL Standby Current
(TTL Inputs)
ISB2
CMOS Standby
Current (CMOS Inputs)
-10
Min. Max.
Min.
Max.
Unit
Com.
Ind.
—
—
110
120
—
—
100
110
mA
VDD = Max.,
VIN = VIH or VIL
CE ≥ VIH, f = 0
Com.
Ind.
—
—
30
35
—
—
30
35
mA
VDD = Max.,
CE ≥ VDD – 0.2V,
VIN ≥ VDD – 0.2V, or
VIN ≤ 0.2V, f = 0
Com.
Ind.
—
—
20
25
—
—
20
25
mA
Note:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
4
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Rev. C
04/13/06
ISSI
IS61LV10248
®
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Levels
Output Load
Unit
0V to 3.0V
3 ns
1.5V
See Figures 1 and 2
AC TEST LOADS
319 Ω
ZO = 50Ω
3.3V
50Ω
1.5V
OUTPUT
OUTPUT
30 pF
Including
jig and
scope
Figure 1
5 pF
Including
jig and
scope
Figure 2
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Rev. C
04/13/06
353 Ω
5
ISSI
IS61LV10248
®
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
-8
Symbol
Parameter
Min.
Max.
-10
Min. Max.
Unit
tRC
tAA
tOHA
tACE
tDOE
tHZOE(2)
tLZOE(2)
tHZCE(2
tLZCE(2)
tPU
Read Cycle Time
8
—
10
—
ns
Address Access Time
—
8
—
10
ns
Output Hold Time
3
—
3
—
ns
CE Access Time
—
8
—
10
ns
OE Access Time
—
3.5
—
4
ns
OE to High-Z Output
—
3
—
4
ns
OE to Low-Z Output
0
—
0
—
ns
CE to High-Z Output
—
3
0
4
ns
CE to Low-Z Output
3
—
3
—
ns
Power Up Time
0
—
0
—
ns
tPD
Power Down Time
—
8
—
10
ns
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse
levels of 0V to 3.0V and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage.
6
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Rev. C
04/13/06
ISSI
IS61LV10248
®
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = VIL)
t RC
ADDRESS
t AA
t OHA
t OHA
DOUT
DATA VALID
PREVIOUS DATA VALID
READ1.eps
READ CYCLE NO. 2(1,3) (CE and OE Controlled)
t RC
ADDRESS
t AA
t OHA
OE
t HZOE
t DOE
t LZOE
CE
t ACE
t HZCE
t LZCE
DOUT
HIGH-Z
DATA VALID
CE_RD2.eps
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE = VIL.
3. Address is valid prior to or coincident with CE LOW transitions.
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Rev. C
04/13/06
7
ISSI
IS61LV10248
®
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
-8
Symbol
Parameter
-10
Min.
Max.
Min.
Max.
Unit
tWC
Write Cycle Time
8
—
10
—
ns
tSCE
CE to Write End
6.5
—
8
—
ns
tAW
Address Setup Time
to Write End
6.5
—
8
—
ns
tHA
Address Hold from Write End
0
—
0
—
ns
tSA
Address Setup Time
0
—
0
—
ns
tPWE1
WE Pulse Width
6.5
—
8
—
ns
tPWE2
WE Pulse Width (OE = LOW)
8
—
10
—
ns
tSD
Data Setup to Write End
5
—
6
—
ns
tHD
Data Hold from Write End
0
—
0
—
ns
(2)
tHZWE
WE LOW to High-Z Output
—
3.5
—
5
ns
(2)
tLZWE
WE HIGH to Low-Z Output
2
—
2
—
ns
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0V to 3.0V
and output loading specified in Figure 1.
2. Tested with the load in Figure 2. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write,
but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling
edge of the signal that terminates the write.
8
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
04/13/06
ISSI
IS61LV10248
®
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)
t WC
VALID ADDRESS
ADDRESS
t SA
t SCE
t HA
CE
t AW
t PWE1
t PWE2
WE
t HZWE
DOUT
DATA UNDEFINED
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
CE_WR1.eps
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
04/13/06
9
ISSI
IS61LV10248
®
AC WAVEFORMS
WRITE CYCLE NO. 2(1,2) (WE Controlled: OE is HIGH During Write Cycle)
t WC
ADDRESS
VALID ADDRESS
t HA
OE
CE
LOW
t AW
t PWE1
WE
t SA
DOUT
t HZWE
DATA UNDEFINED
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
CE_WR2.eps
Notes:
1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but
any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of
the signal that terminates the Write.
2. I/O will assume the High-Z state if OE > VIH.
10
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Rev. C
04/13/06
ISSI
IS61LV10248
®
AC WAVEFORMS
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
t WC
ADDRESS
VALID ADDRESS
OE
LOW
CE
LOW
t HA
t AW
t PWE2
WE
t SA
DOUT
DATA UNDEFINED
t HZWE
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
CE_WR3.eps
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Rev. C
04/13/06
11
ISSI
IS61LV10248
®
ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Speed (ns)
Order Part No.
Package
8
IS61LV10248-8M
IS61LV10248-8T
IS61LV10248-8B
48 mini BGA (9mm x 11mm)
TSOP (Type II)
36 mini BGA (9mm x 11mm)
10
IS61LV10248-10T
TSOP (Type II)
Industrial Range: -40°C to +85°C
Speed (ns)
12
Order Part No.
Package
8
IS61LV10248-8MI
IS61LV10248-8TI
IS61LV10248-8BI
48 mini BGA (9mm x 11mm)
TSOP (Type II)
36 mini BGA (9mm x 11mm)
10
IS61LV10248-10MI
IS61LV10248-10TI
IS61LV10248-10TLI
IS61LV10248-10BI
IS61LV10248-10BLI
48 mini BGA (9mm x 11mm)
TSOP (Type II)
TSOP (Type II), Lead-free
36 mini BGA (9mm x 11m)
36 mini BGA (9mm x 11m), Lead-free
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. C
04/13/06
ISSI
IS61LV10248
®
Mini Ball Grid Array
Package Code: B (36-pin)
Top View
Bottom View
φ b (36x)
1
2
3
4
5 6
6
A
4
3
2
1
A
e
B
B
C
C
D
D
D
5
D1
E
E
F
F
G
G
H
H
e
E
E1
A2
A
Notes:
1. Controlling dimensions are in millimeters.
A1
SEATING PLANE
mBGA - 9mm x 11mm
MILLIMETERS
INCHES
Sym.
Min. Typ. Max.
Min. Typ. Max.
N0.
Leads
36
A
—
—
1.20
—
—
0.047
A1
0.24
—
0.30
0.009
—
0.012
A2
0.60
—
—
0.024
—
—
D
D1
E
10.90 11.00 11.10
5.25 BSC
8.90
9.00
9.10
0.429 0.433 0.437
0.207 BSC
0.350 0.354 0.358
E1
3.75 BSC
0.148 BSC
e
0.75 BSC
0.030 BSC
b
0.30
0.35
0.40
0.012 0.014 0.016
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Rev. C
04/13/06
13
ISSI
PACKAGING INFORMATION
®
Mini Ball Grid Array
Package Code: M (48-pin)
Top View
Bottom View
φ b (48x)
1
2
3
4
5 6
6
A
D
5
4
3
2
1
A
e
B
B
C
C
D
D
D1
E
E
F
F
G
G
H
H
e
E
E1
A2
A
SEATING PLANE
Notes:
1. Controlling dimensions are in millimeters.
A1
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. D
01/15/03
ISSI
PACKAGING INFORMATION
®
Mini Ball Grid Array
Package Code: M (48-pin)
mBGA - 6mm x 8mm
MILLIMETERS
INCHES
Sym.
Min. Typ. Max.
Min. Typ. Max.
N0.
Leads
48
A
—
—
1.20
.—
— 0.047
A1
0.25
—
0.40
0.010
— 0.016
A2
0.60
—
—
0.024
—
D
7.90 8.00 8.10
0.311 0.314 0.319
5.60BSC
0.220BSC
E
5.90 6.00 6.10
0.232 0.236 0.240
E1
4.00BSC
0.157BSC
e
0.80BSC
0.031BSC
D1
b
0.40
0.45
0.50
—
0.016 0.018 0.020
mBGA - 7.2mm x 8.7mm
mBGA - 9mm x 11mm
MILLIMETERS
INCHES
Sym.
Min. Typ. Max.
Min. Typ. Max.
N0.
Leads
48
MILLIMETERS
INCHES
Sym.
Min. Typ. Max.
Min. Typ. Max.
N0.
Leads
48
A
—
—
1.20
—
—
0.047
A
A1
0 .24
—
0.30
0.009
—
0.012
A1
A2
0.60
—
—
0.024
—
—
A2
D
8.60 8.70 8.80
D
10.90 11.00 11.10
0.429 0.433 0.437
5.25BSC
0.207BSC
D1
0.339 0.343 0.346
—
—
1.20
—
—
0.047
0.24
—
0.30
0.60
—
—
0.009
—
0.012
0.024
—
—
5.25BSC
0.207BSC
E
7.10 7.20 7.30
0.280 0.283 0.287
E
E1
3.75BSC
0.148BSC
E1
3.75BSC
0.148BSC
e
0.75BSC
0.030BSC
e
0.75BSC
0.030BSC
0.012 0.014 0.016
b
b
2
0.30
0.35
0.40
D1
8.90
0.30
9.00
0.35
9.10
0.40
0.350 0.354 0.358
0.012 0.014 0.016
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Rev. D
01/15/03
ISSI
®
PACKAGING INFORMATION
Plastic TSOP
Package Code: T (Type II)
N
N/2+1
E1
1
Notes:
1. Controlling dimension: millimieters,
unless otherwise specified.
2. BSC = Basic lead spacing
between centers.
3. Dimensions D and E1 do not
include mold flash protrusions and
should be measured from the
bottom of the package.
4. Formed leads shall be planar with
respect to one another within
0.004 inches at the seating plane.
E
N/2
D
SEATING PLANE
A
ZD
.
b
e
Symbol
Ref. Std.
No. Leads
A
A1
b
C
D
E1
E
e
L
ZD
α
Millimeters
Min
Max
Inches
Min
Max
(N)
32
—
1.20
—
0.047
0.05 0.15
0.002 0.006
0.30 0.52
0.012 0.020
0.12 0.21
0.005 0.008
20.82 21.08
0.820 0.830
10.03 10.29
0.391 0.400
11.56 11.96
0.451 0.466
1.27 BSC
0.050 BSC
0.40 0.60
0.016 0.024
0.95 REF
0.037 REF
0°
5°
0°
5°
L
α
A1
Plastic TSOP (T - Type II)
Millimeters
Inches
Min
Max
Min Max
44
—
1.20
—
0.047
0.05 0.15
0.002 0.006
0.30 0.45
0.012 0.018
0.12 0.21
0.005 0.008
18.31 18.52
0.721 0.729
10.03 10.29
0.395 0.405
11.56 11.96
0.455 0.471
0.80 BSC
0.032 BSC
0.41 0.60
0.016 0.024
0.81 REF
0.032 REF
0°
5°
0°
5°
Millimeters
Min
Max
C
Inches
Min
Max
50
—
1.20
0.05 0.15
0.30 0.45
0.12 0.21
20.82 21.08
10.03 10.29
11.56 11.96
0.80 BSC
0.40 0.60
0.88 REF
0°
5°
—
0.047
0.002 0.006
0.012 0.018
0.005 0.008
0.820 0.830
0.395 0.405
0.455 0.471
0.031 BSC
0.016 0.024
0.035 REF
0°
5°
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. F
06/18/03
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