BTA08, BTB08 and T8 Series ® 8A TRIACS SNUBBERLESS™, LOGIC LEVEL & STANDARD Table 1: Main Features A2 Symbol Value Unit IT(RMS) 8 A VDRM/VRRM 600 and 800 V IGT (Q1) 5 to 50 mA G A1 A2 A2 A1 A2 A1 A2 G G DESCRIPTION Available either in through-hole or surface-mount packages, the BTA08, BTB08 and T8 triac series is suitable for general purpose AC switching. They can be used as an ON/OFF function in applications such as static relays, heating regulation, induction motor starting circuits... or for phase control operation in light dimmers, motor speed controllers,... The snubberless versions (BTA/BTB...W and T8 series) are specially recommended for use on inductive loads, thanks to their high commutation performances. Logic level versions are designed to interface directly with low power drivers such as microcontrollers. By using an internal ceramic pad, the BTA series provides voltage insulated tab (rated at 2500VRMS) complying with UL standards (file ref.: E81734). D2PAK (T8-G) IPAK (T8-H) A2 A1 A2 G DPAK (T8-B) A2 A1 A2 G TO-220AB Insulated (BTA08) Table 2: Order Codes Part Number BTA08-xxxxxRG BTB08-xxxxxRG T8xx-xxxG T8xx-xxxH T8xx-xxxB February 2006 REV. 6 A1 A2 G TO-220AB (BTB08) Marking See page table 8 on page 10 1/11 BTA08, BTB08 and T8 Series Table 3: Absolute Maximum Ratings Symbol IT(RMS) Parameter RMS on-state current (full sine wave) tp = 10 ms dI/dt Critical rate of rise of on-state current IG = 2 x IGT , tr ≤ 100 ns F = 120 Hz IGM Peak gate current tp = 20 µs PG(AV) Tstg Tj 8 A Tc = 100°C Non repetitive surge peak on-state F = 50 Hz current (full cycle, Tj initial = 25°C) F = 60 Hz I²t Value for fusing I²t Unit IPAK/D2PAK/ T = 110°C DPAK/TO-220AB c TO-220AB Ins. ITSM Value Average gate power dissipation t = 20 ms 80 t = 16.7 ms 84 A 36 A ²s Tj = 125°C 50 A/µs Tj = 125°C 4 A Tj = 125°C 1 W - 40 to + 150 - 40 to + 125 °C Storage junction temperature range Operating junction temperature range Tables 4: Electrical Characteristics (Tj = 25°C, unless otherwise specified) ■ SNUBBERLESS and Logic Level (3 quadrants) Symbol IGT (1) VGT T8 Quadrant Test Conditions VD = 12 V RL = 30 Ω T810 T835 I - II - III MAX. VD = VDRM RL = 3.3 kΩ I - II - III Tj = 125°C MIN. IH (2) IT = 100 mA MAX. IL IG = 1.2 IGT I - III II VD = 67 %VDRM gate open Tj = 125°C (dV/dt)c = 0.1 V/µs Tj = 125°C (dI/dt)c (2) (dV/dt)c = 10 V/µs Tj = 125°C Without snubber 2/11 10 35 TW SW CW BW 5 10 35 50 I - II - III MAX. VGD dV/dt (2) BTA08 / BTB08 Tj = 125°C MAX. MIN. MIN. Unit mA 1.3 V 0.2 V 15 35 10 15 35 50 25 50 10 25 50 70 30 60 15 30 60 80 40 400 20 40 400 5.4 - 3.5 5.4 - - 2.8 - 1.5 2.98 - - - 4.5 - - 4.5 7 mA mA 1000 V/µs A/ms BTA08, BTB08 and T8 Series ■ Standard (4 quadrants) Symbol IGT (1) Quadrant RL = 30 Ω I - II - III IV MAX. ALL MAX. 1.3 V ALL MIN. 0.2 V VD = 12 V VGT VGD VD = VDRM RL = 3.3 kΩ Tj = 125°C IH (2) IT = 500 mA IL IG = 1.2 IGT dV/dt (2) BTA08 / BTB08 Test Conditions MAX. I - III - IV II VD = 67 %VDRM gate open Tj = 125°C (dV/dt)c (2) (dI/dt)c = 5.3 A/ms Tj = 125°C C B 25 50 50 100 Unit mA 25 50 40 50 80 100 MIN. 200 400 V/µs MIN. 5 10 V/µs MAX. mA mA Table 5: Static Characteristics Symbol Test Conditions VT (2) ITM = 11 A Vto (2) tp = 380 µs Value Unit Tj = 25°C MAX. 1.55 V Threshold voltage Tj = 125°C MAX. 0.85 V Rd (2) Dynamic resistance Tj = 125°C MAX. 50 mΩ IDRM IRRM VDRM = VRRM 5 µA 1 mA Tj = 25°C Tj = 125°C MAX. Note 1: minimum IGT is guaranted at 5% of IGT max. Note 2: for both polarities of A2 referenced to A1. Table 6: Thermal resistance Symbol Rth(j-c) Rth(j-a) Parameter IPAK / D2PAK / DPAK / TO-220AB 1.6 TO-220AB Insulated 2.5 S = 1 cm² D2PAK 45 S = 0.5 cm² DPAK 70 TO-220AB / TO-220AB Insulated 60 IPAK 100 Junction to case (AC) Junction to ambient Value Unit °C/W °C/W S = Copper surface under tab. 3/11 BTA08, BTB08 and T8 Series Figure 1: Maximum power dissipation versus RMS on-state current (full cycle) Figure 2: RMS on-state current versus case temperature (full cycle) P(W) IT(RMS)(A) 10 10 9 9 8 8 7 7 6 6 5 5 4 4 3 3 2 2 1 BTB / T8 BTA 1 IT(RMS)(A) TC(°C) 0 0 0 1 2 3 4 5 6 7 0 8 Figure 3: RMS on-state current versus ambient temperature (printed circuit board FR4, copper thickness: 35µm) (full cycle) 25 50 75 100 125 Figure 4: Relative variation of thermal impedance versus pulse duration IT(RMS)(A) K=[Zth/Rth] 3.5 1E+0 Zth(j-c) 3.0 D2PAK (S=1CM2) DPAK/IPAK Zth(j-a) 2.5 1E-1 TO-220AB/D2PAK Zth(j-a) 2.0 DPAK (S=0.5CM2) 1.5 1E-2 1.0 0.5 tp(s) TC(°C) 1E-3 0.0 0 25 50 75 100 1E-3 125 Figure 5: On-state characteristics (maximum values) 1E-2 1E-1 1E+0 1E+1 1E+2 5E+2 Figure 6: Surge peak on-state current versus number of cycles ITM(A) ITSM(A) 100 90 Tj max. Vto = 0.85V Rd = 50 mΩ Tj = Tj max. 80 70 t=20ms 60 One cycle Non repetitive Tj initial=25°C 50 10 Tj = 25°C. 40 Repetitive TC=110°C 30 20 10 VTM(V) Number of cycles 0 1 0.5 4/11 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 1 10 100 1000 BTA08, BTB08 and T8 Series Figure 7: Non-repetitive surge peak on-state current for a sinusoidal pulse with width tp < 10 ms and corresponding value of I2t 2 Figure 8: Relative variation of gate trigger current, holding current and latching current versus junction temperature (typical values) IGT,IH,IL[Tj] / IGT,IH,IL[Tj=25°C] 2 ITSM(A), I t (A s) 2.5 1000 Tj initial=25°C 2.0 IGT dI/dt limitation: 50A/µs ITSM 1.5 100 IH & IL 1.0 I2t 0.5 Tj(°C) tp(ms) 10 0.01 0.0 0.10 1.00 10.00 Figure 9: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (Snubberless & Logic level types) -20 0 20 40 60 80 100 120 140 Figure 10: Relative variation of critical rate of decrease of main current versus (dV/dt)c (typical values) (Standard types) (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c (dI/dt)c [(dV/dt)c] / Specified (dI/dt)c 2.0 2.2 2.0 -40 TW 1.8 1.8 1.6 1.6 C 1.4 1.4 1.2 T835/CW/BW 1.2 1.0 B 1.0 0.8 T810/SW 0.6 0.8 0.4 0.2 0.6 (dV/dt)c (V/µs) 0.0 (dV/dt)c (V/µs) 0.4 0.1 1.0 10.0 100.0 Figure 11: Relative variation of critical rate of decrease of main current versus junction temperature 0.1 1.0 10.0 100.0 Figure 12: DPAK and D2PAK Thermal resistance junction to ambient versus copper surface under tab (printed circuit board FR4, copper thickness: 35 µm) (dI/dt)c [Tj] / (dI/dt)c [Tj specified] Rth(j-a)(°C/W) 6 100 90 5 80 70 4 60 DPAK 50 3 40 2 30 D2PAK 20 1 S(cm²) 10 Tj(°C) 0 0 0 25 50 75 100 125 0 4 8 12 16 20 24 28 32 36 40 5/11 BTA08, BTB08 and T8 Series Figure 13: Ordering Information Scheme (BTA08 and BTB08 series) BT A 08 - 600 BW (RG) Triac series Insulation A = insulated B = non insulated Current 08 = 8A Voltage 600 = 600V 800 = 800V Sensitivity and type B = 50mA Standard C = 25mA Standard SW = 10mA Logic Level BW = 50mA Snubberless CW = 35mA Snubberless TW = 5mA Logic Level Packing mode RG = Tube Figure 14: Ordering Information Scheme (T8 series) T 8 10 - 600 B (-TR) Triac series Current 8 = 8A Sensitivity 10 = 10mA 35 = 35mA Voltage 600 = 600V 800 = 800V Package B = DPAK G = D2PAK R = I2PAK Packing mode Blanck = Tube -TR = Tape & Reel Table 7: Product Selector Part Number Voltage (xxx) Sensitivity Type X X X X X X 50 mA 50 mA 25 mA 35 mA 10 mA 5 mA Standard Snubberless Standard Snubberless Logic level Logic Level X X 10 mA Logic Level T810-xxxH T835-xxxB X X X X 10 mA 35 mA Logic Level Snubberless T835-xxxG X X 35 mA Snubberless T835-xxxH X X 35 mA Snubberless 600 V 800 V BTA/BTB08-xxxB BTA/BTB08-xxxBW BTA/BTB08-xxxC BTA/BTB08-xxxCW BTA/BTB08-xxxSW BTA/BTB08-xxxTW X X X X X X T810-xxxG BTB: non insulated TO-220AB package 6/11 Package TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB TO-220AB D2PAK IPAK DPAK D2PAK IPAK BTA08, BTB08 and T8 Series Figure 15: D2PAK Package Mechanical Data DIMENSIONS REF. E C2 L2 D L L3 A1 B2 R C Millimeters Min. A B G A2 2mm min. FLAT ZONE V2 Typ. Inches Max. Min. Typ. Max. A 4.30 4.60 0.169 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009 B 0.70 0.93 0.027 0.037 B2 1.25 C 0.45 0.60 0.017 C2 1.21 1.36 0.047 0.054 D 8.95 9.35 0.352 0.368 E 10.00 10.28 0.393 0.405 G 4.88 5.28 0.192 0.208 1.40 0.048 0.055 0.024 L 15.00 15.85 0.590 0.624 L2 1.27 1.40 0.050 0.055 L3 1.40 1.75 0.055 0.069 R V2 0.40 0° 0.016 8° 0° 8° Figure 16: D2PAK Foot Print Dimensions (in millimeters) 16.90 10.30 5.08 1.30 3.70 8.90 7/11 BTA08, BTB08 and T8 Series Figure 17: DPAK Package Mechanical Data DIMENSIONS REF. E A B2 C2 L2 D R H L4 A1 B R G C A2 V2 Figure 18: DPAK Foot Print Dimensions (in millimeters) 6.7 3 3 1.6 2.3 6.7 2.3 1.6 8/11 Inches Max Min. Max. A 2.20 2.40 0.086 0.094 A1 0.90 1.10 0.035 0.043 A2 0.03 0.23 0.001 0.009 B 0.64 0.90 0.025 0.035 B2 5.20 5.40 0.204 0.212 C 0.45 0.60 0.017 0.023 C2 0.48 0.60 0.018 0.023 D 6.00 6.20 0.236 0.244 E 6.40 6.60 0.251 0.259 G 4.40 4.60 0.173 0.181 H 9.35 10.10 0.368 0.397 L2 0.60 MIN. Millimeters Min. 0.80 typ. 0.031 typ. L4 0.60 1.00 0.023 0.039 V2 0° 8° 0° 8° BTA08, BTB08 and T8 Series Figure 19: TO-220AB Package Mechanical Data REF. C B ØI b2 L F A I4 l3 c2 a1 l2 a2 M c1 b1 e A a1 a2 B b1 b2 C c1 c2 e F ØI I4 L l2 l3 M DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 15.20 15.90 0.598 3.75 0.147 13.00 14.00 0.511 10.00 10.40 0.393 0.61 0.88 0.024 1.23 1.32 0.048 4.40 4.60 0.173 0.49 0.70 0.019 2.40 2.72 0.094 2.40 2.70 0.094 6.20 6.60 0.244 3.75 3.85 0.147 15.80 16.40 16.80 0.622 0.646 2.65 2.95 0.104 1.14 1.70 0.044 1.14 1.70 0.044 2.60 0.102 Max. 0.625 0.551 0.409 0.034 0.051 0.181 0.027 0.107 0.106 0.259 0.151 0.661 0.116 0.066 0.066 Figure 20: IPAK Package Mechanical Data REF. A E C2 B2 L2 D H L B3 L1 B A1 V1 B5 e G C A3 A A1 A3 B B2 B3 B5 C C2 D E e G H L L1 L2 V1 DIMENSIONS Millimeters Inches Min. Typ. Max. Min. Typ. 2.20 2.40 0.086 0.90 1.10 0.035 0.70 1.30 0.027 0.64 0.90 0.025 5.20 5.40 0.204 0.95 0.30 0.035 0.45 0.60 0.017 0.48 0.60 0.019 6 6.20 0.236 6.40 6.60 0.252 2.28 0.090 4.40 4.60 0.173 16.10 0.634 9 9.40 0.354 0.8 1.20 0.031 0.80 1 0.031 10° 10° Max. 0.094 0.043 0.051 0.035 0.212 0.037 0.023 0.023 0.244 0.260 0.181 0.370 0.047 0.039 9/11 BTA08, BTB08 and T8 Series In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com. Table 8: Ordering Information Ordering type Marking Package Weight Base qty Delivery mode BTA/BTB08-xxxyzRG BTA/BTB08-xxxyz TO-220AB 2.3 g 50 Tube T8yy-xxxG T8yyxx Tube T8yyxx 1.5 g 50 T8yy-xxxG-TR D2PAK 1000 Tape & reel T8yy-xxxB T8yyxx Tube T8yyxx 0.3 g 75 T8yy-xxxB-TR DPAK 2500 Tape & reel T8yy-xxxH T8yyxx IPAK 0.4 g 75 Tube Note: xxx = voltage, yy = sensitivity, z = type Table 9: Revision History Date Revision Apr-2002 5A 13-Feb-2006 6 10/11 Description of Changes Last update. TO-220AB delivery mode changed from bulk to tube. ECOPACK statement added. BTA08, BTB08 and T8 Series Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 11/11