Anpec APL5501-29DC Low iq, low dropout 500ma fixed voltage regulator Datasheet

APL5501/2/3
Low IQ, Low Dropout 500mA Fixed Voltage Regulator
Features
•
•
•
•
•
•
•
•
•
Low Noise : 50µVRMS (100Hz to 100kHz)
Low Quiescent Current : 50µA (No load)
Low Dropout Voltage : 170mV (@500mA)
Very low Shutdown Current : < 0.5uA
Fixed Output Voltage : 1.3V ~ 3.4V
Stable with 4.7uF Output Capacitor
Stable with Aluminum, Tantalum or Ceramic
Capacitors
Reverse Current Protection
No Protection Diodes Needed
•
Built in Thermal Protection
•
•
•
•
•
Built in Current Limit Protection
Controlled Short Circuit Current : 150mA
Fast Transient Response
Short Setting Time
SOT-23-5, SOT-89, SOT-89-5, SOT-223, SO-8,
TO-252 and TO-252-5 Packages
•
Design with an internal P-channel MOSFET pass
transistor, the APL5501/2/3 maintains a low supply
current, independent of the load current and dropout
voltage. Other features include reverse current
protection, thermal-shutdown protection, current limit
protection to ensure specified output current and controlled short-circuit current. The APL5501/2/3 regulator comes in a miniature SOT-23-5, SOT-89, SOT89-5, SOT-223, SO-8, TO-252 and TO-252-5
packages.
Pin Configuration
APL5501
BP
GND SHDN
TAB is GND
5
1
2
V IN
GND
3
4
1
2
V OUT GND
VOUT
3
V IN
Lead Free Available (RoHS Compliant)
SOT-89 (Top View)
SOT-89-5 (Top View)
Applications
Notebook Computer
PDA or Portable Equipments
Noise-Sensitive Instrumentation Systems
General Description
IN
1
8
OUT
GND
2
7
GND
GND
3
6
GND
SHDN
4
5
BYP
V IN
1
GND
2
SHDN
3
SO-8 (Top View)
The APL5501/2/3 is micropower, low noise, low dropout linear regulator. Operate from 2.7V to 6V input
voltage and deliver up to 500mA. Typical output noise
is just 50µVRMS with the addition of an external 0.1µF
bypass capacitor in BP pin and typical dropout voltage is only 170mV at 500mA loading . Designed for
use in battery-powered system, the low 50uA quiescent current makes it an ideal choice.
5
V OUT
4
BP
SOT-23-5 (Top View)
V IN
5
4
3
3
2
GND
2
1
VOUT
BP
SHDN
1
GND
TAB is GND
•
•
•
VIN
V OUT
TO-252 (Top View)
TO-252-5 (Top View)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
1
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APL5501/2/3
Pin Configuration (Cont.)
APL5501
APL5502
TAB is GND
APL5502
APL5503
TAB is V IN
TAB is GND
TAB is V IN
1
2
3
V IN
GND
V OUT
SOT-223 (Top View)
1
2
GND
V IN
3
V OUT
SOT-89 (Top View)
1
2
3
GND
V IN
V OUT
SOT-223 (Top View)
1
2
3
V O U T GND
V IN
SOT-223 (Top View)
Ordering and Marking Information
Package Code
B : SOT-23-5
D : S OT-89
D5 : SOT-89-5
U : TO-252
U5 : TO-252-5
V : SOT-223
K : SO-8
Temp. Range
C : 0 to 70 C
H a n d l i n g C o°d e
TR : Tape & Reel
Voltage Code :
13 : 1.3V ~ 34 : 3.4V
Lead Free Code
L : Lead Free Device
Blank : Original Device
APL5501/2/3 Lead Free Code
Handling Code
Temp. Range
Package Code
Voltage Code
APL5501/2/3 - 13 D/V/K :
APL5501/2/3
XXXXX13
XXXXX - Date Code , 13 - 1.3V
APL5501/2/3 - 13 U :
13
APL5501/2/3
XXXXX
XXXXX - Date Code , 13 - 1.3V
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte in plate termination finish; which are fully compliant with RoHS and compatible with both SnPb and lead-free soldiering operations.
ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J STD-020C for MSL classification at lead-free peak reflow temperature.
Marking Information
SOT-23-5 package
Product Name
Marking
Product Name
APL5501-13B
517X
APL5501-21B
APL5501-14B
518X
APL5501-22B
APL5501-15B
519X
APL5501-23B
APL5501-16B
51AX
APL5501-24B
APL5501-17B
51BX
APL5501-25B
APL5501-18B
51CX
APL5501-26B
APL5501-19B
51DX
APL5501-27B
APL5501-20B
51EX
The last character “X” in the marking is for data code.
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
2
Marking
51FX
51GX
51HX
51IX
51JX
51KX
51LX
Product Name
APL5501-28B
APL5501-29B
APL5501-30B
APL5501-31B
APL5501-32B
APL5501-33B
APL5501-34B
Marking
51MX
51NX
51OX
51PX
51QX
51RX
51SX
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APL5501/2/3
Pin Description
PIN
Name
V IN
No.
1
SHDN
3
(Note1)
2
GND
4
5
BP (Note1)
V OUT
I/O
Description
I
Supply voltage input.
Shutdown control pin, low = off , high = normal. Don’t leave
open.
Ground pins of the circuitry, and all ground pins must be
soldered to PCB with proper power dissipation.
Bypass signal pin in fixed output type device
Output pin of the regulator.
I
O
O
Note1: These pins do not exist in 3-pin package.
Absolute Maximum Ratings
Symbol
VIN, VOUT
SHDN
Parameter
Input Voltage or Out Voltage
Shutdown Control Pin
RTH,JA
Thermal Resistance - Junction to Ambient
RTH,JC
Thermal Resistance - Junction to Case
PD
Power Dissipation
TJ
Operating Junction Temperature
Control Section
Power Transistor
TSTG
TL
Storage Temperature Range
Lead Temperature (Soldering, 10 second)
Rating
6.5
Unit
V
6.5
V
SOT-89 : 180
SOT-223 : 135
SO-8 : 150
SOT-23-5 : 260
SOT-89 : 38
SOT-223 : 15
SO-8 :20
SOT-23-5 : 130
Internally Limited
°C/W
°C/W
W
°C
0 to 125
0 to 150
°C
°C
-65 to +150
260
Electrical Characteristics
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF,
SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C.
Symbol
VIN
V OUT
Parameter
Test Conditions
Input Voltage
Output Voltage
2.7
VOUT+1.0V< VCC<6.0V, 0mA< IOUT < IMAX VOUT -2%
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
APL5501/2/3
Min.
Typ.
Max.
3
VOUT
Unit
6
V
VOUT +2%
V
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APL5501/2/3
Electrical Characteristics
Unless otherwise noted these specifications apply over full temperature, VIN=3.6V, CIN=1µF, COUT=4.7µF,
SHDN=VIN, TJ=0 to 125°C. Typical values refer to TJ=25°C.
Symbol
Parameter
Test Conditions
ILIMIT
Circuit Current Limit
V IN =4.3V
ISHORT
Short Current
Load Current
V OUT=0V
IOUT
PSRR
IQ
Dropout Voltage
(Note2)
Ripple Rejection
Quiescent Current
Shutdown Supply
(Note3)
Current
Noise
(Note3)
Shutdown Recovery
(Note3)
Delay
OTS
C OUT
ISHDN
V OUT+0.5V< V CC <6.0V, IOUT = 1mA
V IN =V OUT +1.0V, 0mA< I OUT < IMAX
1.3V≤V OUT <1.5V515X
Typ.
Max.
0.7
A
200
mA
IOUT =500mA
mA
4
1
0.1
1100
1300
1.5V≤V OUT <2V
900
1050
2V≤V OUT <2.5V
500
700
2.5V≤V OUT <3.4V
280
380
F≤1kHz, 1Vpp at V IN = VOUT +1.0V
C
=10nf
No load
55
10
6
65
50
100
370
450
Shutdown = low
IOUT =0, V CC =6.0V
0.01
1
100Hz<f<100kHz, typical load,
C BP =0.01µF, C OUT = 1µF
100Hz<f<100kHz, typical load,
C BP =0.1µF, C OUT = 1µF
C BP =0.01µF,C OUT =1µF, no load
C BP =0.1µF,C OUT=1µF, no load
mV
mV
%
mV
dB
IOUT =500mA
µA
µA
µVrms
50
40
Over Temperature
Shutdown
Over Temperature
Shutdown Hysteresis
TC
Min.
Unit
500
REG LINE Line Regulation
REG LOAD Load Regulation
VDROP
APL5501/2/3
Hysteries
Output Voltage
Temperature
Coefficient
7
70
ms
150
°C
10
°C
50
ppm/
°C
Output Capacitor
4.2
4.7
5.2
µF
ESR
Shutdown Input
(Note3)
Threshold
Shutdown input Bias
(Note3)
current
Input Reverse
Leakage current
Reverse Protection
Threshold
0.02
0.1
1
Ohm
0.4
0.7
1.6
V
0.01
100
nA
0.1
0.5
µA
11
50
mV
V OUT+1.0V< V IN <6.0V
V SHDN =V IN
V OUT-VIN =0.1V
Note 2 : Dropout voltage definition : VIN-VOUT when VOUT is 2% below the value of VOUT for VIN = VOUT + 0.5V
Note 3 : For 5-pin devices only.
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
4
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APL5501/2/3
Application Circuit
INPUT
2.7V to 6V
V IN
V OUT
VOUT
APL5501/2/3
C IN
1uF
BP
SHDN
on
C OUT
4.7uF
GND
off
C BP
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
5
0.1uF
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APL5501/2/3
Typical Characteristics
Ground Pin Current vs. Load Current (uA)
Current Limit vs. Input Voltage
APL5501/2/3-33
3
Current Limit (mA)
2.5
2
1.5
1
0.5
0
3.5
4
4.5
5
5.5
6
Ground Pin Current vs. Output Current
APL5501/2/3-33
400
350
300
250
200
150
100
50
0
0
150
Ground Pin Current vs. Input Voltage
600
750
900
Input Voltage vs. Output Voltage
APL5501/2/3-33
APL5501/2/3-33
3.5
3
300
Output Voltage (V)
Ground Pin Current vs. Load Current (uA)
450
Output Current (mA)
Input Voltage (V)
350
300
250
200
150
100
2.5
2
1.5
1
0.5
50
0
0
0
1
2
3
4
5
0
6
Input Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
1
2
3
4
5
6
Input Voltage (V)
6
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APL5501/2/3
Typical Characteristics
Output Current vs. Output Voltage
Dropout Voltage vs. Output Current
1200
APL5501/2/3-33
0
1100
VOUT=1.5V
-2
Output Current (uA)
Dropout Voltage (mV)
1000
900
800
VOUT=1.8V
700
600
500
400
VOUT=3.3V
300
VOUT=2.5V
200
-4
VIN=0V
-6
-8
-10
100
0
-12
0
100
200
300
400
500
0
0.5
1
Output Current (mA)
1.5
2
2.5
Output Voltage (V)
SHDN Threshold Voltage vs. Input Voltage
PSRR vs. Frequency
APL5501/2/3-33
APL5501/2/3-33
1
3
0.9
-20
0.8
VIN=0V
PSRR (dB)
SHDN Threshold Voltage (V)
+0
-10
0.7
0.6
VIN=4V
-30
-40
IOUT =50mA
COUT=10uF
CBP=0.1uF
-50
-60
-70
0.5
VIN=5V
-80
-90
0.4
3
3.5
4
4.5
5
5.5
-100
6
Input Voltage (V)
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
20
50 100 200
500 1k
2k
5k 10k 20k
50k 100k 200k
Frequency (HZ)
7
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APL5501/2/3
Typical Characteristics
Output Noise vs. Bypass Capacitor
Output Noise
APL5501/2/3-33
100u
500
450
400
40u
Output Noise (uV)
VOUT (50uV/div)
VIN=4.3V
80u IOUT =0mA
COUT=10uF
60u CBP=0.1uF
20u
0
-20u
-40u
-60u
350
300
250
200
150
100
50
-80u
-100u
0
0
4m
2m
6m
8m
10m
0
0.1
0.2
0.3
Bypass Capacitor (uF)
Time (s)
Shutdown Exit Delay
Shutdown Exit Delay
APL5501/2/3-33
APL5501/2/3-33
3.3V
3.3V
VOUT
0.4
VOUT
CBP=10nF
No Load
CBP=100nF
No Load
0V
0V
4V
4V
vSHDN
vSHDN
0V
0V
Time (1ms/div)
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
Time (20ms/div)
8
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APL5501/2/3
Typical Characteristics
Region of Stable ESR vs. Load Current
Entering Shutdown
APL5501/2/3-33
APL5501/2/3-33
1
3.3V
VOUT=3.3V
COUT ESR (Ω)
VOUT
COUT=1µF
No Load
0V
4V
0.1
stable
0.01
unstable
0V
0.001
0
300
450
600
Output Voltage vs. Temperature
900
Line-Transient Response
APL5901/2-33
APL5501/2/3-33
Output Voltage (20mV/div)
3.35
750
Load Current (mA)
Time (200ms/div)
3.33
Output Voltage (V)
150
3.31
3.29
3.27
VIN
4V
3V
VOUT
3.25
-40
0
40
80
120
Temperature (°C )
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
Time (40µs/div)
9
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APL5501/2/3
Typical Characteristics
Load-Transient Response
Output Voltage (50mV/div)
APL5501/2/3-33
VOUT
COUT=1µF
VIN=VOUT+1V
IOUT=1mA~500mA
Time (10µs/div)
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
10
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APL5501/2/3
Application Information
Capacitor Selection and Regulator
Stability
end-of-life battery voltage. Because the APL5501/2/3
use a p-channel MOSFET pass transistor, the dropout voltage is a function of drain-to-source on-resistance (RDS(ON)) multiplied by the load current.
The APL5501/2/3 use at least a 1uF capacitor on the
input, and this capacitor can be Aluminum, Tantalum
or Ceramic capacitor. The input capacitor with larger
value and lower ESR provides better PSRR and linetransient response. The output capacitor also can use
Aluminum, Tantalum or Ceramic capacitor, and a minimum v alue of 1uF and ESR abov e 0.06Ω is
recommended. The curve of the stable region in typical characteristics shows the appropriate output capacitor ESR for different load current stable operation.
A larger output capacitor can reduce noise and improve load-transient response, stability, and PSRR.
Note that some ceramic dielectrics exhibit large capacitance and ESR variation with temperature. When
using this capacitor, a minimum 10uF or more may
be required to ensure the stability at low temperature
operation. Use a bypass capacitor at BP pin for low
output nvise. Increasing the capacitance will slightly
decrease the output noise, but increase the start-up
time.
Reverse Current Protection
The APL5501/2/3 have an internal reverse protection,
it does not need an external schottky diode to connect the regulator input and output. If the output voltage is forced above the input voltage by more than
11mV, the IC will be shutdown and the ground pin
current is below 0.1uA.
Shutdown/Enable
The APL5501/2/3 have an active high enable function.
Force EN high (>1.6V) enables the regulator, EN low
(<0.4V) disables the regulator and enter the shutdown
mode. In shutdown mode, the quiescent current can
reduce below 1uA. The EN pin cannot be floating, a
floating EN pin may cause an indeterminate state on
the output. If it is no use, connect to VIN for normal
operation.
Load-Transient Considerations
The APL5501/2/3 load-transient response graphs in
Current Limit
typical characteristics show the transient response.
A step change in the load current from 0mA to 500mA
at 1us will cause a 100mV transient spike. Larger
output capacitor and lower ESR can reduce transient
The APL5501/2/3 have a current limit protection. The
ouptut voltage will drop close to zero volt, when load
current reaches the limit, and then the load current
will be limited at 150mA after output voltage is below
0.7V. When the load current back to the value where
limiting started, the output voltage and current will return to normal value. When output is shorted to
ground, the APL5501/2/3 will keep short circuit current at 150mA .
spike.
Input-Output (Dropout)Voltage
The minimum input-output voltage difference (dropout)
determines the lowest usable supply voltage. In battery-powered systems, this will determine the useful
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
11
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APL5501/2/3
Thermal Protection
Thermal protection limits total power dissipation in the
device. When the junction temperature exceeds
TJ=+150℃, the thermal sensor generates a logic signal to turn off the pass transistor and allows IC to
cool. When the IC’s junction temperature is down by
10℃, the thermal sensor will turn the pass transistor
on again, resulting in a pulsed output during continuous thermal protection. Thermal protection is designed
to protect the APL5501/2/3 in the event of fault
conditions. For continuous operation, do not exceed
the absolute maximum junction temperature of
TJ=+150℃.
Operating Region and Power Dissipation
The thermal resistance of the case to circuit board,
and the rate of air flow all control the APL5501/2/3’s
maximum power dissipation. The power dissipation
across the device is PD = IOUT (VIN-VOUT) and the maximum power dissipation is:
PDMAX = (TJ-T A) / (θ JC + θ CA)
where TJ-TA is the temperature difference between the
junction and ambient air, θ JC is the thermal resistance of the package, and θ CA is the thermal resistance through the printed circuit board, copper traces,
and other materials to the ambient air.
The GND pin of the APL5501/3 provide an electrical
connection to ground and channeling heat away. If
power dissipation is large, connect the GND pin to
ground using a large pad or ground plane, can improve the problem of over heat of IC.
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
12
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APL5501/2/3
Packaging Information
SOT-23-5
e1
5
4
E1
1
E
3
2
e
b
D
A2
A
a
A1
Dim
A
A1
A2
D
E
E1
L
L1
L2
N
α
L
Millimeters
Min.
0.95
0.05
0.90
2.8
2.6
1.5
0.35
Inches
Max.
1.45
0.15
1.30
3.00
3.00
1.70
0.55
Min.
0.037
0.002
0.035
0.110
0.102
0.059
0.014
0.7
0.020
10°
0°
0.20 BSC
0.5
Max.
0.057
0.006
0.051
0 . 11 8
0 . 11 8
0.067
0.022
0.008 BSC
5
0°
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
L2
L1
0.028
5
13
10 °
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APL5501/2/3
Packaging Information
E
e1
0.015X45
SOP-8 pin ( Reference JEDEC Registration MS-012)
H
e2
D
A1
A
1
L
0.004max.
Dim
Millimeters
Inches
Min.
Max.
Min.
Max.
A
1.35
1.75
0.053
0.069
A1
0.10
0.25
0.004
0.010
D
4.80
5.00
0.189
0.197
E
3.80
4.00
0.150
0.157
H
5.80
6.20
0.228
0.244
L
0.40
1.27
0.016
0.050
e1
0.33
0.51
0.013
0.020
e2
1.27BSC
0.50BSC
φ 1
8°
8°
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
14
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APL5501/2/3
Packaging Information
SOT-223( Reference JEDEC Registration SOT-223)
D
A
B1
a
c
H
E
L
K
e
A1
e1
b
B
Dim
A
A1
B
B1
c
D
E
e
e1
H
L
K
α
β
Millimeters
Min.
1.50
0.02
0.60
2.90
0.28
6.30
3.30
Min.
0.06
Max.
0.07
0.02
0.11
0.01
0.25
0.13
0.03
0.12
0.01
0.26
0.15
2.3 BSC
4.6 BSC
6.70
0.91
1.50
0°
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
Inches
Max.
1.80
0.08
0.80
3.10
0.32
6.70
3.70
0.09 BSC
0.18 BSC
7.30
1.10
2.00
10°
13°
0.26
0.04
0.06
0°
0.29
0.04
0.08
10°
13°
15
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APL5501/2/3
Packaging Information
SOT-89 (Reference EIAJ ED-7500A Reg stration SC-62)
D
D1
a
E
H
1
2
3
L
C
B1
B
e
e1
A
a
Dim
A
B
B1
C
D
D1
e
e1
E
H
L
α
Millimeters
Min.
1.40
0.40
0.35
0.35
4.40
1.35
Min.
0.055
0.016
0.014
0.014
0.173
0.053
1.50 BSC
3.00 BSC
2.29
3.75
0.80
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Rev. B.2 - May., 2005
Inches
Max.
1.60
0.56
0.48
0.44
4.60
1.83
Max.
0.063
0.022
0.019
0.017
0.181
0.072
0.059 BSC
0.118 BSC
2.60
4.25
1.20
10°
16
0.090
0.148
0.031
0.102
0.167
0.047
10°
www.anpec.com.tw
APL5501/2/3
Packaging Information
SOT-89-5
Dim
A
B
C
D
E
F
G
H
I
J
K
L
Millimeters
Min.
4.40
4.05
1.50
1.30
2.40
0.80
Min.
0.17
0.16
0.06
0.05
0.09
0.03
3.00 REF
1.50 REF
0.40
1.40
0.35
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
Inches
Max.
4.60
4.25
1.70
1.50
2.60
-
Max.
0.18
0.17
0.07
0.06
0.1
0.12 REF
0.06 REF
0.52
1.60
0.41
5 TYP
0.01
0.05
0.01
0.02
0.06
0.02
0.2 TYP
17
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APL5501/2/3
Packaging Information
TO-252( Reference JEDEC Registration TO-252)
E
A
b2
C1
L2
D
H
L1
L
b
C
e1
Dim
A1
Millimeters
Inches
Min.
Max.
Min.
Max.
2.18
2.39
0.086
0.094
A1
0.89
1.27
0.035
0.050
b
0.508
0.89
0.020
0.035
b2
5.207
5.461
0.205
0.215
C
0.46
0.58
0.018
0.023
C1
0.46
0.58
0.018
0.023
D
5.334
6.22
0.210
0.245
E
6.35
6.73
0.250
0.265
e1
3.96
5.18
0.156
0.204
H
9.398
10.41
0.370
0.410
L
0.51
L1
0.64
1.02
0.025
0.040
L2
0.89
2.032
0.035
0.080
A
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
0.020
18
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APL5501/2/3
Packaging Information
TO-252-5
H
A
J
D
M
C
B
K
L
S
Dim
A
B
C
D
P
S
H
J
K
L
M
P
Millimeters
Min.
6.40
5.20
6.80
2.20
Inches
Max.
6.80
5.50
7.20
2.80
1.27 REF
Max.
0.26
0.21
0.27
0.11
0.05 REF
0.50
2.20
0.45
0
0.90
5.40
0.80
2.40
0.55
0.15
1.50
5.80
Copyright  ANPEC Electronics Corp.
19
Rev. B.2 - May., 2005
Min.
0.25
0.20
0.26
0.08
0.02
0.08
0.01
0
0.03
0.21
0.03
0.09
0.02
0.006
0.06
0.22
www.anpec.com.tw
APL5501/2/3
Physical Specifications
Terminal Material
Lead Solderability
Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb), 100%Sn
Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3.
Reflow Condition
(IR/Convection or VPR Reflow)
tp
TP
Critical Zone
T L to T P
Temperature
Ramp-up
TL
tL
Tsmax
Tsmin
Ramp-down
ts
Preheat
25
t 25 °C to Peak
Time
Classification Reflow Profiles
Profile Feature
Average ramp-up rate
(TL to TP)
Preheat
- Temperature Min (Tsmin)
- Temperature Max (Tsmax)
- Time (min to max) (ts)
Time maintained above:
- Temperature (TL)
- Time (tL)
Peak/Classificatioon Temperature (Tp)
Time within 5°C of actual
Peak Temperature (tp)
Ramp-down Rate
Sn-Pb Eutectic Assembly
Pb-Free Assembly
3°C/second max.
3°C/second max.
100°C
150°C
60-120 seconds
150°C
200°C
60-180 seconds
183°C
60-150 seconds
217°C
60-150 seconds
See table 1
See table 2
10-30 seconds
20-40 seconds
6°C/second max.
6°C/second max.
6 minutes max.
8 minutes max.
Time 25°C to Peak Temperature
Notes: All temperatures refer to topside of the package .Measured on the body surface.
(mm)
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
20
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APL5501/2/3
Classification Reflow Profiles(Cont.)
Table 1. SnPb Entectic Process – Package Peak Reflow Temperature s
3
3
Package Thickness
Volume mm
Volume mm
<350
≥350
<2.5 mm
240 +0/-5°C
225 +0/-5°C
≥2.5 mm
225 +0/-5°C
225 +0/-5°C
Table 2. Pb-free Process – Package Classification Reflow Temperatures
3
3
3
Package Thickness
Volume mm
Volume mm
Volume mm
<350
350-2000
>2000
<1.6 mm
260 +0°C*
260 +0°C*
260 +0°C*
1.6 mm – 2.5 mm
260 +0°C*
250 +0°C*
245 +0°C*
≥2.5 mm
250 +0°C*
245 +0°C*
245 +0°C*
*Tolerance: The device manufacturer/supplier shall assure process compatibility up to and
including the stated classification temperature (this means Peak reflow temperature +0°C.
For example 260°C+0°C) at the rated MSL level.
Reliability Test Program
Test item
SOLDERABILITY
HOLT
PCT
TST
ESD
Latch-Up
Method
MIL-STD-883D-2003
MIL-STD-883D-1005.7
JESD-22-B,A102
MIL-STD-883D-1011.9
MIL-STD-883D-3015.7
JESD 78
Description
245°C, 5 SEC
1000 Hrs Bias @125°C
168 Hrs, 100%RH, 121°C
-65°C~150°C, 200 Cycles
VHBM > 2KV, VMM > 200V
10ms, 1 tr > 100mA
Carrier Tape & Reel Dimensions
t
D
P
Po
E
P1
Bo
F
W
Ko
Ao
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
D1
21
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APL5501/2/3
Carrier Tape & Reel Dimensions(Cont.)
T2
J
C
A
B
T1
Reel Dimensions
Application
SOP- 8
Application
SOT-89
Application
SOT-223
Application
TO-252
A
B
C
J
T1
T2
W
P
E
330 ± 1
62 +1.5
12.75+ 0.15
2 ± 0.5
12.4 ± 0.2
2 ± 0.2
12 ± 0. 3
8± 0.1
1.75 ±0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
5.5 ± 1
1.55 +0.1
1.55+ 0.25
4.0 ± 0.1
2.0 ± 0.1
6.4 ± 0.1
5.2± 0. 1
2.1 ± 0.1
0.3 ±0.013
A
B
C
J
T1
T2
P
E
178 ±1
70 ± 2
13.5 ± 0.15
3 ± 0.15
14 ± 2
1.3 ± 0.3
W
12 + 0.3
12 - 0.1
8 ± 0.1
1.75± 0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
5.5 ± 0.05
1.5± 0.1
1.5 ± 0.1
4.0 ± 0.1
2.0 ± 0.1
4.8 ± 0.1
4.5± 0.1
1.80± 0.1
0.3 ±0.013
A
B
T1
T2
W
P
E
62±1.5
C
12.75 ±
0.15
J
330±1
2 ± 0.6
12.4 +0.2
2 ± 0.2
12 ± 0.3
8 ± 0.1
1.75± 0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
5.5 ± 0.05
1.5+ 0.1
1.5+ 0.1
4.0 ± 0.1
2.0 ± 0.05
6.9 ± 0.1
7.5± 0.1
2.1 ± 0.1
0.3 ±0.05
A
B
C
J
T2
E
100 ± 2
13 ± 0. 5
2 ± 0.5
2.5 ± 0.5
W
16+ 0.3
- 0.1
P
330 ±3
T1
16.4 + 0.3
-0.2
8 ± 0.1
1.75± 0.1
F
D
D1
Po
P1
Ao
Bo
Ko
t
7.5 ± 0.1
1.5 +0.1
1.5± 0.25
4.0 ± 0.1
2.0 ± 0.1
6.8 ± 0.1
10.4 ± 0.1
2.5 ± 0.1
0.3 ±0.05
(mm)
Cover Tape Dimensions
Application
SOP- 8
SOT- 89
SOT- 223
TO- 252
Carrier Width
12
12
12
16
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
Cover Tape Width
9.3
9.3
9.3
13.3
22
Devices Per Reel
2500
1000
2500
2500
www.anpec.com.tw
APL5501/2/3
Customer Service
Anpec Electronics Corp.
Head Office :
5F, No. 2 Li-Hsin Road, SBIP,
Hsin-Chu, Taiwan, R.O.C.
Tel : 886-3-5642000
Fax : 886-3-5642050
Taipei Branch :
7F, No. 137, Lane 235, Pac Chiao Rd.,
Hsin Tien City, Taipei Hsien, Taiwan, R. O. C.
Tel : 886-2-89191368
Fax : 886-2-89191369
Copyright  ANPEC Electronics Corp.
Rev. B.2 - May., 2005
23
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