Click to see this datasheet in Simplified Chinese! FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Features ? ? ? ? ? ? ? Description Low On Capacitance: 3.7pF (Typical) Low On Resistance: 6.5 (Typical) Low Power Consumption: 1µA (Maximum) – 10µA Maximum ICCT over an Expanded Control Voltage Range (VIN = 2.6V, VCC = 4.3V) Wide -3dB Bandwidth, >720MHz 8KV ESD Protection Power-Off Protection when VCC = 0V; D+/D- Pins can Tolerate up to 5.5V Packaged in: – 10-lead MicroPak™ (1.6 x 2.1mm) – 14-lead DQFN – 10-lead MSOP – 10-lead UMLP (1.4 x 1.8mm) Applications ? Cell phone, PDA, Digital Camera, and Notebook LCD Monitor, TV, and Set-top Box Related Application Notes ? AN-6022 Using the FSUSB30 / FSUSB31 to Comply with USB 2.0 Fault Condition Requirements The FSUSB30 is a low-power, two-port, high-speed USB 2.0 switch. Configured as a double-pole double-throw (DPDT) switch, it is optimized for switching between two high-speed (480Mbps) sources or a Hi-Speed and FullSpeed (12Mbps) source. The FSUSB30 is compatible with the requirements of USB2.0 and features an extremely low on capacitance (CON) of 3.7pF. The wide bandwidth of this device (720MHz), exceeds the bandwidth needed to pass the third harmonic, resulting in signals with minimum edge and phase distortion. Superior channel-to-channel crosstalk minimizes interference. The FSUSB30 contains special circuitry on the D+/ Dpins which allows the device to withstand an overvoltage condition when powered off. This device is also designed to minimize current consumption even when the control voltage applied to the S pin, is lower than the supply voltage (VCC). This feature is especially valuable to ultraportable applications such as cell phones, allowing for direct interface with the general purpose I/Os of the baseband processor. Other applications include switching and connector sharing in portable cell phones, PDAs, digital cameras, printers, and notebook computers. Ordering Information Order Number Package Number Product Code Top Mark FSUSB30L10X MAC010A FJ FSUSB30BQX MLP014A USB30 FSUSB30MUX MUA10A FSUSB30 FSUSB30UMX MLP010A GJ Package Description 10-Lead MicroPak, 1.6 x 2.1mm 14-Terminal Depopulated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm 10-Lead Molded Small Outline Package (MSOP), JEDEC MO187, 3.0mm Wide 10-Lead, Quad, Ultrathin, MLP (UMLP) 1.4 x 1.8mm 1D+ USB2.0 Controller Set Top Box (STB) CPU or DSP Processor VCC FSUSB30 D+ 1D– USB Connector D– 2D+ DVR or Mass Storage 2D– Controller Control S OE Figure 1. Typical Application MicroPak is a trademark of Fairchild Semiconductor Corporation. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.7 www.fairchildsemi.com FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch February 2012 Analog Symbol OE HSD1– HSD2– D– Pad Assignments for MicroPak 9 8 7 6 HSD1+ D+ HSD2+ HSD1– D– VCC 10 GND 5 3 S 4 HSD2+ HSD1+ S 2 OE D+ 1 HSD2– (Top View) Pin Descriptions Pad Assignments for DQFN NC VCC 1 14 S 2 13 OE HSD1+ 3 12 HSD1– NC 4 11 NC HSD2+ 5 10 HSD2– D+ 6 9 D– 7 Pin Name Description OE Bus Switch Enable S Select Input D+, D, HSDn+, HSDn Data Ports NC No Connect Truth Table 8 GND NC (Top Through View) Pin Assignment for MSOP 1 10 VCC HSD1+ 2 9 OE HSD2+ 3 8 HSD1– D+ 4 7 HSD2– GND 5 6 D– S Control S OE Function X HIGH Disconnect LOW LOW D+, D = HSD1n HIGH LOW D+, D = HSD2n (Top Through View) 9 Sel 10 HSD2– VCC 7 6 1 2 HSD1+ 8 HSD2+ OE HSD1– Pad Assignments for µMLP 5 D– 4 GND 3 D+ (Top Through View) © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 2 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Connection Diagrams Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol VCC VCNTRL VSW IIK Parameter Minimum Maximum Unit -0.5 +5.5 V Supply Voltage (1) DC Input Voltage (1) DC Switch Voltage -0.5 VCC V HSDnX 0.5 VCC V D+,D- when VCC > 0 0.5 VCC V D+,D- when VCC = 0 -0.50 VCC V DC Input Diode Current IOUT DC Output Current TSTG Storage Temperature ESD Human Body Model -50 mA 50 mA +150 °C All Pins 8 kV I/O to GND 8 kV -65 Note: 1. The input and output negative voltage ratings may be exceeded if the input and output diode current ratings are observed. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings.(2) Symbol Parameter Minimum Maximum Unit VCC Supply Voltage 3.0 4.3 V VIN Control Input Voltage 0 VCC V VSW Switch Input Voltage 0 VCC V -40 +85 °C 250 °C/W TA JA Operating Temperature Thermal Resistance, 10 MicroPak Note: 2. Control input must be held HIGH or LOW and it must not float. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 3 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Absolute Maximum Ratings All typical values are at 25°C unless otherwise specified. Symbol Parameter VIK Clamp Diode Voltage VIH Input Voltage HIGH TA = 40°C to +85°C VCC (V) Conditions IIN = -18mA Min. Typ. Max. 3.0 -1.2 3.0 to 3.6 1.3 4.3 1.7 Unit V V V 3.0 to 3.6 0.5 V 4.3 0.7 V VIL Input Voltage LOW IIN Control Input Leakage VSW = 0.0V to VCC 4.3 -1.0 1.0 µA IOZ OFF State Leakage 0 Dn, HSD1n, HSD2n VCC 4.3 -2.0 2.0 µA IOFF Power OFF Leakage Current (D+, D–) VSW = 0V to 4.3V, VCC = 0V 0 -2.0 2.0 µA RON Switch On Resistance(3) 10.0 7.0 RON Delta RON(4) RON Flatness RON Flatness(3) VSW = 0.4V, ION = -8mA 3.0 6.5 VSW = 0V, IO = 30mA at 25°C 3.6 VSW = 0.4V, ION = -8mA 3.0 0.35 VSW = 0.0V - 1.0V, ION = -8mA 3.0 2.0 ICC Quiescent Supply Current VCNTRL = 0.0V or VCC, IOUT = 0 4.3 1.0 µA ICCT Increase in ICC Current per Control Voltage VCNTRL (control input) = 2.6V 4.3 10.0 µA Notes: 3. Measured by the voltage drop between Dn, HSD1n, HSD2n pins at the indicated current through the switch. On resistance is determined by the lower of the voltage on the two ports. 4.Guaranteed by characterization. AC Electrical Characteristics All typical values are for VCC = 3.3V at 25°C unless otherwise specified. Symbol Parameter VCC (V) Conditions TA = 40°C to +85°C Figure Number Typ. Max. 3.0 to 3.6 13 30 ns Figure 9 HD1n, HD2n = 0.8V, RL = 50, CL = 5pF 3.0 to 3.6 12 25 ns Figure 9 Propagation Delay(4) RL = 50, CL = 5pF 3.3 0.25 ns Figure 7 Figure 8 tBBM Break-Before-Make RL = 50, CL = 5pF, VIN = 0.8V 3.0 to 3.6 ns Figure 10 OIRR Off Isolation (Non-Adjacent) f = 240MHz, RT = 50 3.0 to 3.6 -30 dB Figure 13 Xtalk Non-Adjacent Channel Crosstalk RT = 50, f = 240MHz 3.0 to 3.6 -45 dB Figure 14 BW 3dB Bandwidth MHz Figure 12 tON Turn-On Time S, OE to Output HD1n, HD2n = 0.8V, RL = 50, CL = 5pF tOFF Turn-Off Time S, OE to Output tPD © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 RT = 50, CL = 0pF 3.0 to 3.6 RT = 50, CL = 5pF Min. Unit 2.0 6.5 720 550 www.fairchildsemi.com 4 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch DC Electrical Characteristics Figure Number 50 ps Figure 7 Figure 11 3.0 to 3.6 20 ps Figure 7 Figure 11 3.0 to 3.6 200 ps Parameter tSK(O) Channel-to-Channel Skew(5) RL = 50, CL = 5pF 3.0 to 3.6 tSK(P) Skew of Opposite Transitions of the Same Output(5) RL = 50, CL = 5pF Total Jitter(5) RL = 50, CL = 5pF, tR = tF = 500ps at 480 Mbps (PRBS = 215 1) tJ TA = 40°C to +85°C Units VCC (V) Symbol Conditions Min. Typ. Max. Note: 5. Guaranteed by characterization. Capacitance Symbol Parameter Conditions TA = 40°C to +85°C Min. Typ. Max. Units Figure Number CIN Control Pin Input Capacitance VCC = 0V 1.5 pF Figure 16 CON D1n, D2n, Dn On Capacitance VCC = 3.3, OE = 0V 3.7 pF Figure 15 COFF D1n, D2n Off Capacitance VCC and OE = 3.3 2.5 pF Figure 16 © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 5 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch USB Hi-Speed Related AC Electrical Characteristics FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Typical Characteristics Frequency Response 0 -1 Gain (dB) -2 -3 -4 -5 -6 -7 -8 1 10 100 1000 10000 CL = 0pF, VCC = 3.3V Frequency (MHz) Figure 2. Gain vs. Frequency Off Isolation (dB) Frequency Response 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1 10 100 1000 Frequency (MHz) Figure 3. Off Isolation Crosstalk (dB) Frequency Response 0 -10 -20 -30 -40 -50 -60 -70 -80 -90 -100 -110 -120 1 10 100 Frequency (MHz) 1000 VCC = 3.3V Figure 4. Crosstalk © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 6 VON IDn(OFF) NC A HSDn Dn VIN VIN ION Select GND Select GND VS = 0 or VCC GND VS = 0 to VCC Each switch port is tested separately. RON = VON / ION Figure 5. On Resistance Figure 6. Off Leakage D+, D– 800mV Input: HSDn+, HSDn– 400mV VIN RS GND tFALL = 500ps tRISE = 500ps HSDn RL VOUT CL GND VSel 90% 90% 50% 50% 10% 10% VOH GND Output: D+, D– RL, RS, and CL are functions of the application environment (see AC Electrical tables for specific values). 50% VOL tPLH CL includes test fixture and stray capacitance. Figure 7. AC Test Circuit Load tPHL Figure 8. Switch Propagation Delay Waveforms tFALL = 2.5ns tRISE = 2.5ns VCC 90% Input – S, OE VCC/2 GND 50% 90% VCC/2 10% 10% VOH 90% 90% Output – VOUT VOL tON tOFF Figure 9. Turn-On / Turn-Off Waveform © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 7 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Test Diagrams VCC HSDn VO VOUT D+, D– Control Input HSDn RL CL* VCC 50% 0V tR = tF = 2.5ns (10–90%) S Control Input VOUT GND 0.9 x VOUT tD *CL includes test fixture and stray capacitance. Figure 10. Break-Before-Make (tBBM) tFALL = 500ps tRISE = 500ps 800mV 90% Input: D+, D– 50% 10% 400mV 10% tFALL = 500ps tRISE = 500ps 800mV 90% Input: HSDn+ HSDn– VOH Output1: HSD1+ HSD1– 90% 50% 50% 10% 400mV 90% 50% 50% 50% VOL 10% VOH tPLH1 tPHL1 50% 50% VOH 50% Output: D+, D– 50% Output1: D2+, D2– VOL VOL tPLH tPHL tPLH2 tPHL2 TSK(P) = | tPHL – tPLH | TSK(O) = | tPLH1 – tPLH2 | or | tPHL1 – tPHL2 | Pulse Skew, TSK(P) Output Skew, TSK(OUT) Figure 11. Switch Skew Tests Network Analyzer FSUSB30 RS VIN VS GND GND VSel GND VOUT GND RS and RT are functions of the application environment (See AC Electrical Tables for specific values). RT GND Figure 12. Bandwidth © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 8 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch VCC FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Network Analyzer FSUSB30 RS VIN VS GND RT GND VSel GND GND VOUT RT GND OFF-Isolation = 20 Log (VOUT / VIN) GND Figure 13. Channel Off Isolation NC Network Analyzer FSUSB30 RS VIN VS GND GND VSel RT GND GND GND RS and RT are functions of the application environment (50, 75 or 100Ω) RT VOUT GND Crosstalk = 20 Log (VOUT / VIN) Figure 14. Non-Adjacent Channel-to-Channel Crosstalk Capacitance Meter Dn FSUSB30 f = 240MHz Dn S S Capacitance Meter VSel = 0 or VCC f = 240MHz D1n, D2n Figure 15. Channel On Capacitance © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 FSUSB30 VSel = 0 or VCC D1n, D2n Figure 16. Channel Off Capacitance www.fairchildsemi.com 9 Power-On Protection In section 7.1.1 of the USB 2.0 specification, it notes that USB devices must be able to withstand a Vbus short to D+ or D- when the USB devices is either powered off or powered on. The FSUSB30 can be successfully configured to meet both these requirements. The USB 2.0 specification also notes that the USB device should be capable of withstanding a Vbus short during transmission of data. Fairchild recommends adding a 100 series resister between the switch VCC pin and supply rail to protect against this case. This modification works by limiting current flow back into the VCC rail during the over-voltage event so current remains within the safe operating range. In this application, the switch passes the full 5.25V input signal through to the selected output, while maintaining specified off isolation on the un-selected pins. Power-Off Protection For a Vbus short circuit, the switch is expected to withstand such a condition for at least 24 hours. The FSUSB30 has specially designed circuitry which prevents unintended signal bleed through as well as guaranteed system reliability during a power-down, overvoltage condition. The protection has been added to the common pins (D+, D-). VCC= 3.6 V 100 Ohms HSD+ HSD+ HSD- D+ = 5.25V FSUSB30 D- = 5.25V HSD- Figure 17. Adding 100 resistor in series with the VCC supply allows the FSUSB30 to withstand a Vbus short when powered up For more information, see Applications Note AN-6022 Using the FSUSB30 to Comply with USB 2.0 Fault Condition Requirements at www.fairchildsemi.com © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 10 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Application Guidance: Meeting USB 2.0 Vbus Short Requirements Tape Format for DQFN Package Designator Tape Section Number Cavities Cavity Status Cover Tape Status Leader (Start End) 125 (typ) Empty Sealed Carrier 2500/3000 Filled Sealed Trailer (Hub End) 75 (typ) Empty Sealed BQX Tape Dimensions Dimenions are in millimeters unless otherwise specified. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 11 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Tape and Reel Specifications Dimensions are in inches (millimeters) unless otherwise specified. Tape Size A B C D N W1 W2 (12mm) 13.0 (330) 0.059 (1.50) 0.512 (13.00) 0.795 (20.20) 7.008 (178) 0.488 (12.4) 0.724 (18.4) © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 12 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Reel Dimensions for DQFN FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Tape Dimensions for MSOP Dimensions are in inches (millimeters) unless otherwise specified. Reel Dimensions for MSOP Dimensions are in inches (millimeters) unless otherwise specified Tape Size A B C D N W1 W2 W3 (12mm) 13 (330) 0.059 (1.5) 0.512 (13) 0.795 (20.2) 7.008 (178) 0.448 (12.4) 0.724 (18.4) 0.468-0.606 (11.9 -15.4) © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.7 www.fairchildsemi.com 13 0.10 C 2.10 2X A 1.62 B KEEPOUT ZONE, NO TRACES OR VIAS ALLOWED (0.11) 0.56 1.12 1.60 PIN1 IDENT IS 2X LONGER THAN OTHER LINES 0.10 C 2X TOP VIEW (0.35) 10X (0.25) 10X 0.50 RECOMMENDED LAND PATTERN 0.55 MAX 0.05 C 0.05 C 0.05 0.00 (0.20) C 0.35 0.25 SIDE VIEW (0.15) D 0.65 0.55 DETAIL A 0.35 0.25 (0.36) 1 0.35 0.25 DETAIL A 2X SCALE 4 0.56 10 5 (0.29) 0.35 9X 0.25 6 9 0.50 0.25 9X 0.15 1.62 0.10 0.05 C A B C ALL FEATURES BOTTOM VIEW NOTES: A. PACKAGE CONFORMS TO JEDEC REGISTRATION MO-255, VARIATION UABD . B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. D. PRESENCE OF CENTER PAD IS PACKAGE SUPPLIER DEPENDENT. IF PRESENT IT IS NOT INTENDED TO BE SOLDERED AND HAS A BLACK OXIDE FINISH. E. DRAWING FILENAME: MKT-MAC10Arev5. Figure 17. 10-Lead MicroPak, 1.6 x 2.1mm For tape and reel specifications, visit Fairchild’s website: http://www.fairchildsemi.com/products/logic/pdf/micropak_tr.pdf. Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.7 www.fairchildsemi.com 14 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Physical Dimensions FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Physical Dimensions Figure 18. 14-Terminal De-populated Quad Very-Thin Flat Pack No Leads (DQFN), JEDEC MO-241, 2.5 x 3.0mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 15 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Physical Dimensions Figure 19. 10-Lead Molded Small Outline Package (MSOP), JEDEC MO-187, 3.0mm Wide Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.6 www.fairchildsemi.com 16 1.40 0.15 C A 1.70 B 2X (9X) 0.563 0.663 1 2.10 1.80 PIN#1 IDENT 0.40 0.15 C TOP VIEW 0.10 C 0.55 MAX. (10X) 0.225 2X RECOMMENDED LAND PATTERN 0.152 1.45 0.08 C 0.55 SEATING C PLANE 0.05 SIDE VIEW 9X 0.45 0.40 1.85 0.35 (9X) 0.45 3 (10X) 0.225 6 DETAIL A OPTIONAL MINIMIAL TOE LAND PATTERN 0.40 1 NOTES: PIN#1 IDENT 0.15 (10X) 0.25 10 BOTTOM VIEW 0.55 0.45 0.10 C A B 0.05 C 0.10 A. PACKAGE DOES NOT FULLY CONFORM TO JEDEC STANDARD. B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS AND TOLERANCES PER ASME Y14.5M, 1994. D. LAND PATTERN RECOMMENDATION IS BASED ON FSC DESIGN ONLY. E. DRAWING FILENAME: MKT-UMLP10Arev3. 0.10 0.10 DETAIL A SCALE : 2X PACKAGE EDGE LEAD OPTION 1 SCALE : 2X LEAD OPTION 2 SCALE : 2X Figure 20. 10-Lead, Quad, Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8mm Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specifically the warranty therein, which covers Fairchild products. Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings: http://www.fairchildsemi.com/packaging/. © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.7 www.fairchildsemi.com 17 FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch Physical Dimensions FSUSB30 Low-Power, Two-Port, High-Speed USB 2.0 (480Mbps) Switch © 2006 Fairchild Semiconductor Corporation FSUSB30 Rev. 1.1.7 www.fairchildsemi.com 18