Formosa FM340-MHT Chip schottky barrier rectifier Datasheet

Chip Schottky Barrier Rectifier
Formosa
MS
FM320-MHT THRU FM3100-MHT
List
List................................................................................................. 1
Package outline............................................................................... 2
Features.......................................................................................... 2
Mechanical data............................................................................... 2
Maximum ratings ............................................................................. 2
Rating and characteristic curves........................................................ 3
Pinning information........................................................................... 4
Marking........................................................................................... 4
Suggested solder pad layout............................................................. 4
Packing information.......................................................................... 5
Reel packing.................................................................................... 6
Suggested thermal profiles for soldering processes............................. 6
High reliability test capabilities........................................................... 7
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TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 1
DS-12163O
Issued Date
Revised Date
2010/05/10
2011/11/15
Revision
B
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
FM320-MHT THRU FM3100-MHT
3.0A Surface Mount Schottky Barrier
Rectifiers - 20V-100V
Features
Package outline
• Batch process design, excellent power dissipation offers
better reverse leakage current and thermal resistance.
SOD-123HT
• Low profile surface mounted application in order to
optimize board space.
• Tiny plastic SMD package.
• Low power loss, high efficiency.
• High current capability, l ow forward voltage drop.
• High surge capability.
• Guardring for overvoltage protection.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Lead-free parts meet environmental standards of
0.146(3.7)
0.130(3.3)
0.012(0.3) Typ.
0.071(1.8)
0.055(1.4)
MIL-STD-19500 /228
0.039(1.0)
0.024(0.6)
• Suffix "-H" indicates Halogen-free part, ex.FM320-MHT-H.
0.031(0.8) Typ.
0.083(2.1)
Mechanical data
0.075(1.9)
0.004(0.10)Typ.
• Epoxy : UL94-V0 rated flame retardant
• Case : Molded plastic, SOD-123HT
• Terminals :Plated terminals, solderable per MIL-STD-750,
0.016(0.4)Typ.
0.051(1.3)
0.043(1.1)
0.032(0.8)
0.024(0.6)
0.0335(0.85)
0.0296(0.75)
0.047(1.2)
0.039(1.0)
Method 2026
• Polarity : Indicated by cathode band
• Mounting Position : Any
• Weight : Approximated 0.011 gram
0.047(1.2)
0.039(1.0)
Dimensions in inches and (millimeters)
Maximum ratings and Electrical Characteristics (AT
PARAMETER
o
T A=25 C unless otherwise noted)
Symbol
CONDITIONS
Forward rectified current
See Fig.1
Forward surge current
8.3ms single half sine-wave (JEDEC methode)
MIN.
TYP.
O
V R = V RRM T J = 100 C
Thermal resistance
Diode junction capacitance
3.0
A
I FSM
50
A
10
mA
R θJA
70
O
C/W
Junction to case
R θJC
35
O
CJ
160
C/W
pF
f=1MHz and applied 4V DC reverse voltage
T STG
*1
V RRM
(V)
V RMS*2
(V)
*3
VR
(V)
FM320-MHT
20
14
20
FM330-MHT
30
21
30
FM340-MHT
40
28
40
FM350-MHT
50
35
50
FM360-MHT
60
42
60
FM380-MHT
80
56
80
FM3100-MHT
100
70
100
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TEL:886-2-22696661
FAX:886-2-22696141
0.2
IR
Junction to ambient
Storage temperature
SYMBOLS
UNIT
IO
O
V R = V RRM T J = 25 C
Reverse current
MAX.
*4
VF
(V)
Operating
temperature
T J, ( OC)
0.55
-55 to +125
-65
O
+175
C
*1 Repetitive peak reverse voltage
*2 RMS voltage
*3 Continuous reverse voltage
0.70
-55 to +150
*4 Maximum forward [email protected] F=3.0A
0.85
Document ID
Page 2
DS-12163O
Issued Date
Revised Date
2010/05/10
2011/11/15
Revision
B
Page.
7
Rating and characteristic curves (FM320-MHT THRU FM3100-MHT)
FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE
FIG.2-TYPICAL FORWARD
AVERAGE FORWARD CURRENT,(A)
CHARACTERISTICS
3.0
50
HT
0-M
10
M3
~F
HT
0-M
35
FM
HT
-M
40
M3
~F
HT
0-M
32
FM
2.0
1.5
1.0
0.5
0
0
20
40
60
80
100
120
140
160
180
200
LEAD TEMPERATURE,(°C)
FIG.3-MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
INSTANTANEOUS FORWARD CURRENT,(A)
2.5
20V ~ 40V
10
50V ~ 60V
80V ~ 100V
3.0
1.0
0.1
TJ=25 C
Pulse Width 300us
1% Duty Cycle
PEAK FORWARD SURGE CURRENT,(A)
50
.01
40
.1
.3
.5
.7
.9
1.1
1.3
1.5
FORWARD VOLTAGE,(V)
30
8.3ms Single Half
TJ=25 C
Sine Wave
20
JEDEC method
10
FIG.5 - TYPICAL REVERSE
0
1
5
50
10
CHARACTERISTICS
100
100
20V~40V
50V~100V
NUMBER OF CYCLES AT 60Hz
10
REVERSE LEAKAGE CURRENT, (mA)
FIG.4-TYPICAL JUNCTION CAPACITANCE
JUNCTION CAPACITANCE,(pF)
700
600
500
400
300
200
TJ=100°C
1.0
0.1
TJ=25°C
0.01
100
0
.01
.05
.1
.5
1
5
10
50
100
REVERSE VOLTAGE,(V)
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0.001
0
20
40
60
80
100
PERCENT OF RATED PEAK REVERSE VOLTAGE,(%)
Document ID
Page 3
DS-12163O
Issued Date
Revised Date
2010/05/10
2011/11/15
Revision
B
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
FM320-MHT THRU FM3100-MHT
Pinning information
Pin
Pin1
Pin2
Simplified outline
cathode
anode
Symbol
1
2
1
2
Marking
Type number
Marking code
FM320-MHT
FM330-MHT
FM340-MHT
FM350-MHT
FM360-MHT
FM380-MHT
FM3100-MHT
32
33
34
35
36
38
310
Suggested solder pad layout
SOD-123HT
0.036 (0.90)
0.044 (1.10)
0.048 (1.20)
0.075 (1.90)
0.036 (0.90)
0.028 (0.70)
Dimensions in inches and (millimeters)
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 4
DS-12163O
Issued Date
Revised Date
2010/05/10
2011/11/15
Revision
B
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
FM320-MHT THRU FM3100-MHT
Packing information
P0
P1
d
E
F
B
A
W
P
D2
D1
T
C
W1
D
unit:mm
Item
Symbol
Tolerance
SOD-123HT
Carrier width
Carrier length
Carrier depth
Sprocket hole
13" Reel outside diameter
13" Reel inner diameter
7" Reel outside diameter
7" Reel inner diameter
Feed hole diameter
Sprocket hole position
Punch hole position
Punch hole pitch
Sprocket hole pitch
Embossment center
Overall tape thickness
Tape width
Reel width
A
B
C
d
D
D1
D
D1
D2
E
F
P
P0
P1
T
W
W1
0.1
0.1
0.1
0.1
2.0
min
2.0
min
0.5
0.1
0.1
0.1
0.1
0.1
0.1
0.3
1.0
2.00
3.85
1.10
1.50
178.00
62.00
13.00
1.75
3.50
4.00
4.00
2.00
0.23
8.00
11.40
Note:Devices are packed in accor dance with EIA standar RS-481-A and specifications listed above.
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
Document ID
Page 5
DS-12163O
Issued Date
Revised Date
2010/05/10
2011/11/15
Revision
B
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
FM320-MHT THRU FM3100-MHT
Reel packing
PACKAGE
REEL SIZE
SOD-123HT
7"
COMPONENT
SPACING
REEL
(pcs)
(m/m)
4.0
3,000
BOX
(pcs)
30,000
INNER
BOX
REEL
DIA,
CARTON
SIZE
CARTON
APPROX.
GROSS WEIGHT
(m/m)
(m/m)
(m/m)
(pcs)
(kg)
183*123*183
178
382*257*387
240,000
9.0
Suggested thermal profiles for soldering processes
1.Storage environment: Temperature=5 oC ~40 oC Humidity=55%± 25%
2.Reflow soldering of surface-mount devices
Critical Zone
TL to TP
Tp
TP
Ramp-up
TL
TL
Tsmax
Temperature
Tsmin
tS
Preheat
Ramp-down
25
t25o C to Peak
Time
3.Reflow soldering
Profile Feature
Soldering Condition
Average ramp-up rate(T L to T P )
o
<3 C /sec
Preheat
-Temperature Min(Tsmin)
-Temperature Max(Tsmax)
-Time(min to max)(t s )
o
150 C
o
200 C
60~120sec
Tsmax to T L
-Ramp-upRate
o
<3 C /sec
Time maintained above:
-Temperature(T L )
-Time(t L )
o
217 C
60~260sec
o
o
255 C- 0/ + 5 C
Peak Temperature(T P )
o
Time within 5 C of actual Peak
Temperature(t P )
10~30sec
Ramp-down Rate
<3 C /sec
o
o
Time 25 C to Peak Temperature
http://www.formosams.com/
TEL:886-2-22696661
FAX:886-2-22696141
<6minutes
Document ID
Page 6
DS-12163O
Issued Date
Revised Date
2010/05/10
2011/11/15
Revision
B
Page.
7
Chip Schottky Barrier Rectifier
Formosa
MS
FM320-MHT THRU FM3100-MHT
High reliability test capabilities
Item Test
Conditions
Reference
O
MIL-STD-750D
METHOD-2031
O
MIL-STD-202F
METHOD-208
1. Solder Resistance
at 260 ± 5 C for 10 ± 2sec.
2. Solderability
at 245 ± 5 C for 5 sec.
3. High Temperature Reverse Bias
V R=80% rate at T J=125 C for 168 hrs.
4. Forward Operation Life
Rated average rectifier current at T A=25 C for 500hrs.
MIL-STD-750D
METHOD-1038
O
MIL-STD-750D
METHOD-1027
O
O
5. Intermittent Operation Life
6. Pressure Cooker
T A = 25 C, I F = I O
On state: power on for 5 min.
off state: power off for 5 min.
on and off for 500 cycles.
MIL-STD-750D
METHOD-1036
JESD22-A102
O
15P SIG at T A=121 C for 4 hrs.
O
MIL-STD-750D
METHOD-1051
O
7. Temperature Cycling
-55 C to +125 C dwelled for 30 min.
and transferred for 5min. total 10 cycles.
8. Forward Surge
8.3ms single half sine-wave , one surge.
9. Humidity
at T A=85 C , RH=85% for 1000hrs.
10. High Temperature Storage Life
at 175 C for 1000 hrs.
MIL-STD-750D
METHOD-4066-2
MIL-STD-750D
METHOD-1021
O
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TEL:886-2-22696661
FAX:886-2-22696141
MIL-STD-750D
METHOD-1031
O
Document ID
Page 7
DS-12163O
Issued Date
Revised Date
2010/05/10
2011/11/15
Revision
B
Page.
7
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