NSC ADC11L066 11-bit, 66 msps, 450 mhz bandwidth a/d converter with internal sample-and-hold Datasheet

ADC11L066
11-Bit, 66 MSPS, 450 MHz Bandwidth A/D Converter with
Internal Sample-and-Hold
General Description
Features
The ADC11L066 is a monolithic CMOS analog-to-digital converter capable of converting analog input signals into 11-bit
digital words at 66 Megasamples per second (MSPS), minimum, with typical operation possible up to 80 MSPS. This
converter uses a differential, pipeline architecture with digital
error correction and an on-chip sample-and-hold circuit to
minimize die size and power consumption while providing
excellent dynamic performance. A unique sample-and-hold
stage yields a full-power bandwidth of 450 MHz. Operating
on a single 3.3V power supply, this device consumes just
357 mW at 66 MSPS, including the reference current. The
Power Down feature reduces power consumption to just
50 mW.
The differential inputs provide a full scale input swing equal
to ± VREF with the possibility of a single-ended input. Full use
of the differential input is recommended for optimum performance. For ease of use, the buffered, high impedance,
single-ended reference input is converted on-chip to a differential reference for use by the processing circuitry. Output
data format is 11-bit offset binary.
This device is available in the 32-lead LQFP package and
will operate over the industrial temperature range of −40˚C to
+85˚C.
n
n
n
n
Single supply operation
Low power consumption
Power down mode
On-chip reference buffer
Key Specifications
n
n
n
n
n
n
n
n
n
n
Resolution
Conversion Rate
Full Power Bandwidth
DNL
INL
SNR (fIN = 10 MHz)
SFDR (fIN = 10 MHz)
Data Latency
Supply Voltage
Power Consumption, 66 MHz
11 Bits
66 MSPS
450 MHz
± 0.2 LSB (typ)
± 0.5 LSB (typ)
65 dB (typ)
78 dB (typ)
6 Clock Cycles
+3.3V ± 300 mV
357 mW (typ)
Applications
n
n
n
n
n
n
n
Ultrasound and Imaging
Instrumentation
Cellular Base Stations/Communications Receivers
Sonar/Radar
Wireless Local Loops
Data Acquisition Systems
DSP Front Ends
Connection Diagram
20050701
TRI-STATE ® is a registered trademark of National Semiconductor Corporation.
© 2003 National Semiconductor Corporation
DS200507
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ADC11L066 11-Bit, 66 MSPS, 450 MHz Bandwidth A/D Converter with Internal Sample-and-Hold
December 2003
ADC11L066
Ordering Information
Industrial (−40˚C ≤ TA ≤ +85˚C)
Package
ADC11L066CIVY
32 Pin LQFP
ADC11L066CIVYX
32 Pin LQFP Tape and Reel
Block Diagram
20050702
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2
ADC11L066
Pin Descriptions and Equivalent Circuits
Pin No.
Symbol
Equivalent Circuit
Description
ANALOG I/O
2
VIN+
3
VIN−
1
VREF
31
VRP
32
VRM
30
VRN
Analog signal Input pins. With a 1.0V reference voltage the
differential input signal level is 2.0 VP-P. The VIN- pin may be
connected to VCM for single-ended operation, but a differential
input signal is required for best performance.
Reference input. This pin should be bypassed to AGND with
a 0.1 µF monolithic capacitor. VREF is 1.0V nominal and
should be between 0.8V and 1.5V.
These pins are high impedance reference bypass pins only.
Connect a 0.1 µF capacitor from each of these pins to AGND.
DO NOT connect anything else to these pins.
DIGITAL I/O
CLK
Digital clock input. The range of frequencies for this input is
10 MHz to 80 MHz (typical) with guaranteed performance at
66 MHz. The input is sampled on the rising edge of this input.
11
OE
OE is the output enable pin that, when low, enables the
TRI-STATE ® data output pins. When this pin is high, the
outputs are in a high impedance state.
8
PD
PD is the Power Down input pin. When high, this input puts
the converter into the power down mode. When this pin is
low, the converter is in the active mode.
10
3
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ADC11L066
Pin Descriptions and Equivalent Circuits
Pin No.
Symbol
15–19,
22–27
D0–D10
Equivalent Circuit
(Continued)
Description
Digital data output pins that make up the 11-bit conversion
results. D0 is the LSB, while D10 is the MSB of the offset
binary output word.
ANALOG POWER
5, 6, 29
VA
4, 7, 28
AGND
Positive analog supply pins. These pins should be connected
to a quiet +3.3V source and bypassed to AGND with 0.1 µF
monolithic capacitors located within 1 cm of these power pins,
and with a 10 µF capacitor.
The ground return for the analog supply.
DIGITAL POWER
13
VD
9, 12
DGND
21
20
Positive digital supply pin. This pin should be connected to
the same quiet +3.3V source as is VA and bypassed to
DGND with a 0.1 µF monolithic capacitor in parallel with a 10
µF capacitor, both located within 1 cm of the power pin.
The ground return for the digital supply.
VDR
Positive digital supply pin for the ADC11L066’s output drivers.
This pin should be connected to a voltage source of +1.8V to
VD and bypassed to DR GND with a 0.1 µF monolithic
capacitor. If the supply for this pin is different from the supply
used for VA and VD, it should also be bypassed with a 10 µF
tantalum capacitor. The voltage at this pin should never
exceed the voltage on VD by more than 300 mV. All bypass
capacitors should be located within 1 cm of the supply pin.
DR GND
The ground return for the digital supply for the ADC11L066’s
output drivers. This pin should be connected to the system
digital ground, but not be connected in close proximity to the
ADC11L066’s DGND or AGND pins. See Section 5.0 (Layout
and Grounding) for more details.
OTHER
14
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This pin is internally tied to DGND. It may be connected to
DGND, or left floating.
TEST
4
Operating Ratings (Notes 1, 2)
(Notes 1,
2)
Operating Temperature
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Supply Voltage (VA, VD)
VA, VD, VDR
Package Dissipation at TA = 25˚C
−0.05V to (VD + 0.05V)
VIN Input
−0V to (VA − 0.5V)
VCM
0.5V to (VA - 1.5V)
≤100 mV
|AGND–DGND|
± 25 mA
± 50 mA
Package Input Current (Note 3)
0.8V to 1.5V
CLK, PD, OE
−0.3V to VA or VD
+0.3V
Input Current at Any Pin (Note 3)
+1.8V to VD
VREF Input
≤ 100 mV
Voltage on Any Pin
+3.0V to +3.60V
Output Driver Supply (VDR)
4.2V
|VA–VD|
−40˚C ≤ TA ≤ +85˚C
See (Note 4)
ESD Susceptibility
Human Body Model (Note 5)
2500V
Machine Model (Note 5)
250V
Soldering Temperature,
Infrared, 10 sec. (Note 6)
235˚C
Storage Temperature
−65˚C to +150˚C
Converter Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V,
VDR = +2.5V, PD = 0V, VREF = +1.0V, VCM = 1.0V, fCLK = 66 MHz, tr = tf = 2 ns, CL = 15 pF/pin.
Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25˚C (Notes 7, 8, 9, 10)
Symbol
Parameter
Typical
(Note 10)
Conditions
Limits
(Note 10)
Units
(Limits)
11
Bits
1.8
LSB (max)
STATIC CONVERTER CHARACTERISTICS
Resolution with No Missing Codes
INL
Integral Non Linearity (Note 11)
DNL
Differential Non Linearity
± 0.5
± 0.2
Positive Error
GE
−0.5
Gain Error
Negative Error
−0.2
−1.7
LSB (min)
0.6
LSB (max)
−0.8
LSB (min)
2.9
%FS (max)
−4.0
%FS (min)
4.8
%FS (max)
−4.1
%FS (min)
Offset Error (VIN+ = VIN−(
−0.15
± 1.3
%FS (max)
Under Range Output Code
0
0
Over Range Output Code
2047
2047
REFERENCE AND ANALOG INPUT CHARACTERISTICS
VCM
Common Mode Input Voltage
CIN
VIN Input Capacitance (each pin to
GND)
VREF
VIN = 1.0 Vdc
+ 1 VP-P
Reference Voltage (Note 13)
Reference Input Resistance
5
V (min)
0.5
1.5
V (max)
(CLK LOW)
8
pF
(CLK HIGH)
7
pF
0.8
V (min)
1.5
V (max)
100
MΩ (min)
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ADC11L066
Absolute Maximum Ratings
ADC11L066
Converter Electrical Characteristics
(Continued)
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V,
VDR = +2.5V, PD = 0V, VREF = +1.0V, VCM = 1.0V, fCLK = 66 MHz, tr = tf = 2 ns, CL = 15 pF/pin.
Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25˚C (Notes 7, 8, 9, 10)
Symbol
Parameter
Typical
(Note 10)
Conditions
Limits
(Note 10)
Units
(Limits)
62.8
dB (min)
63.4
dB (min)
62.5
dB (min)
DYNAMIC CONVERTER CHARACTERISTICS
BW
Full Power Bandwidth
0 dBFS Input, Output at −3 dB
fIN = 10 MHz,
Differential VIN =
−0.5 dBFS
25˚C
Signal-to-Noise Ratio
fIN = 150 MHz,
Differential VIN =
−6 dBFS
85˚C
25˚C
Signal-to-Noise & Distortion
fIN = 150 MHz,
Differential VIN =
−6 dBFS
85˚C
25˚C
Effective Number of Bits
fIN = 150 MHz,
Differential VIN =
−6 dBFS
fIN = 240 Hz,
Differential VIN =
−6 dBFS
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64
−40˚C
52.8
dB (min)
53.5
dB (min)
52.1
dB (min)
dB
62.1
dB (min)
62.4
dB (min)
61.2
dB (min)
63
85˚C
25˚C
55
−40˚C
dB
52.3
dB (min)
52.7
dB (min)
50.6
dB (min)
50
85˚C
25˚C
dB
10.02
10.31
−40˚C
fIN = 25 MHz,
Differential VIN =
−0.5 dBFS
ENOB
dB
52
fIN = 240 Hz,
Differential VIN =
−6 dBFS
fIN = 10 MHz,
Differential VIN =
−0.5 dBFS
56
−40˚C
fIN = 25 MHz,
Differential VIN =
−0.5 dBFS
SINAD
MHz
64
fIN = 240 Hz,
Differential VIN =
−6 dBFS
fIN = 10 MHz,
Differential VIN =
−0.5 dBFS
65
−40˚C
fIN = 25 MHz,
Differential VIN =
−0.5 dBFS
SNR
450
85˚C
10.07
9.80
10.18
85˚C
25˚C
Bits(min)
Bits
8.36
8.76
−40˚C
8.46
Bits (min)
8.06
8.05
Bits
ADC11L066
Converter Electrical Characteristics
(Continued)
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V,
VDR = +2.5V, PD = 0V, VREF = +1.0V, VCM = 1.0V, fCLK = 66 MHz, tr = tf = 2 ns, CL = 15 pF/pin.
Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25˚C (Notes 7, 8, 9, 10)
Symbol
Parameter
fIN = 10 MHz,
Differential VIN =
−0.5 dBFS
2nd
Harm
Typical
(Note 10)
Conditions
85˚C
25˚C
fIN = 25 MHz,
Differential VIN =
−0.5 dBFS
Second Harmonic Distortion
fIN = 150 MHz,
Differential VIN =
−6 dBFS
3rd
Harm
85˚C
25˚C
fIN = 150 MHz,
Differential VIN =
−6 dBFS
85˚C
25˚C
Total Harmonic Distortion
fIN = 150 MHz,
Differential VIN =
−6 dBFS
fIN = 240 Hz,
Differential VIN =
−6 dBFS
7
−91
−40˚C
dB (max)
−69.5
dB (max)
−69.7
dB (max)
dB
−60.6
dB (max)
−62.0
dB (max)
−58.3
dB (max)
dB
−72.8
dB (max)
−76.8
dB (max)
−67.1
dB (max)
−80
85˚C
25˚C
dB
−69.8
−77
−40˚C
85˚C
25˚C
−74
−40˚C
dB (max)
−66.0
dB (max)
dB
−68.0
dB (max)
−67.0
dB (max)
−64.3
dB (max)
−73
85˚C
25˚C
−62
−40˚C
−55
dB (max)
−69.0
−74
fIN = 25 MHz,
Differential VIN =
−0.5 dBFS
THD
−68.7
−62
fIN = 240 Hz,
Differential VIN =
−6 dBFS
fIN = 10 MHz,
Differential VIN =
−0.5 dBFS
−67
−40˚C
fIN = 25 MHz,
Differential VIN =
−0.5 dBFS
Third Harmonic Distortion
Units
(Limits)
−86
fIN = 240 Hz,
Differential VIN =
−6 dBFS
fIN = 10 MHz,
Differential VIN =
−0.5 dBFS
−78
−40˚C
Limits
(Note 10)
dB
−56.6
dB (max)
−57.2
dB (max)
−54.1
dB (max)
dB
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ADC11L066
Converter Electrical Characteristics
(Continued)
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V,
VDR = +2.5V, PD = 0V, VREF = +1.0V, VCM = 1.0V, fCLK = 66 MHz, tr = tf = 2 ns, CL = 15 pF/pin.
Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25˚C (Notes 7, 8, 9, 10)
Symbol
Parameter
Typical
(Note 10)
Conditions
fIN = 10 MHz,
Differential VIN =
−0.5 dBFS
Spurious Free Dynamic Range
fIN = 150 MHz,
Differential VIN =
−6 dBFS
Units
(Limits)
68.7
dB (min)
69.5
dB (min)
68.7
dB (min)
85˚C
25˚C
78
−40˚C
fIN = 25 MHz,
Differential VIN =
−0.5 dBFS
SFDR
Limits
(Note 10)
77
dB
85˚C
25˚C
67
−40˚C
fIN = 240 Hz,
Differential VIN =
−6 dBFS
60.6
dB (min)
62.0
dB (min)
58.3
dB (min)
62
dB
DC and Logic Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V,
VDR = +2.5V, PD = 0V, VREF = +1.0V, VCM = 1.0V, fCLK = 66 MHz, tr = tf = 2 ns, CL = 15 pF/pin.
Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25˚C (Notes 7, 8, 9, 10)
Symbol
Parameter
Conditions
Typical
(Note 10)
Limits
(Note 10)
Units
(Limits)
2.0
V (min)
0.8
V (max)
CLK, PD, OE DIGITAL INPUT CHARACTERISTICS
VIN(1)
Logical “1” Input Voltage
VD = 3.3V
VIN(0)
Logical “0” Input Voltage
VD = 3.3V
IIN(1)
Logical “1” Input Current
VIN+, VIN− = 3.3V
10
µA
IIN(0)
Logical “0” Input Current
VIN+, VIN− = 0V
−10
µA
CIN
Digital Input Capacitance
5
pF
D0–D11 DIGITAL OUTPUT CHARACTERISTICS
VOUT(1)
Logical “1” Output Voltage
IOUT = −0.5 mA
VOUT(0)
Logical “0” Output Voltage
IOUT = 1.6 mA
VDR −
0.18
V (min)
0.4
V (max)
VOUT = 3.3V
100
nA
VOUT = 0V
−100
nA
VOUT = 0V
−20
mA
20
mA
IOZ
TRI-STATE Output Current
+ISC
Output Short Circuit Source
Current
−ISC
Output Short Circuit Sink Current VOUT = 2.5V
POWER SUPPLY CHARACTERISTICS
IA
Analog Supply Current
PD Pin = DGND, VREF = 1.0V
PD Pin = VDR
103
4
139
mA (max)
mA
ID
Digital Supply Current
PD Pin = DGND
PD Pin = VDR
5.3
2
6.2
mA (max)
mA
IDR
Digital Output Supply Current
PD Pin = DGND, (Note 14)
PD Pin = VDR
<1
Total Power Consumption
PD Pin = DGND, CL = 0 pF (Note 15)
PD Pin = VDR
357
50
Power Supply Rejection
Rejection of Full-Scale Error with
VA = 3.0V vs. 3.6V
58
PSRR1
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8
mA
mA
0
479
mW (max)
mW
dB
ADC11L066
AC Electrical Characteristics
Unless otherwise specified, the following specifications apply for AGND = DGND = DR GND = 0V, VA = VD = +3.3V,
VDR = +2/.5V, PD = 0V, VREF = +1.0V, VCM = 1.0V, fCLK = 66 MHz, tr = tf = 2 ns, CL = 15 pF/pin.
Boldface limits apply for TJ = TMIN to TMAX: all other limits TJ = 25˚C (Notes 7, 8, 9, 10, 12)
Typical
(Note 10)
Limits
(Note 10)
Units
(Limits)
Maximum Clock Frequency
80
66
MHz (min)
Minimum Clock Frequency
1
MHz
Clock Duty Cycle
40
60
%(min)
%(max)
tCH
Clock High Time
6.5
ns(min)
tCL
Clock Low Time
6.5
ns(min)
tCONV
Conversion Latency
tOD
Data Output Delay after Rising
CLK Edge
tAD
Aperture Delay
2
ns
tAJ
Aperture Jitter
1.2
ps rms
tDIS
Data outputs into TRI-STATE
Mode
10
ns
tEN
Data Outputs Active after
TRI-STATE
10
ns
tPD
Power Down Mode Exit Cycle
300
ns
Symbol
Parameter
Conditions
6
Clock
Cycles
VDR = 2.5V
7.5
11
ns (max)
VDR = 3.3V
6.7
10.5
ns(max)
0.1 µF on pins 30, 31, 32
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND = AGND = DGND = 0V, unless otherwise specified.
Note 3: When the input voltage at any pin exceeds the power supplies (that is, VIN < AGND, or VIN > VA, VD or VDR), the current at that pin should be limited to
25 mA. The 50 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 25 mA to two.
Note 4: The absolute maximum junction temperature (TJmax) for this device is 150˚C. The maximum allowable power dissipation is dictated by TJmax, the
junction-to-ambient thermal resistance (θJA), and the ambient temperature, (TA), and can be calculated using the formula PDMAX = (TJmax - TA )/θJA. In the 32-pin
LQFP, θJA is 79˚C/W, so PDMAX = 1,582 mW at 25˚C and 823 mW at the maximum operating ambient temperature of 85˚C. Note that the power consumption of
this device under normal operation will typically be about 612 mW (357 typical power consumption + 255 mW output loading with 250 MHz input). The values for
maximum power dissipation listed above will be reached only when the device is operated in a severe fault condition (e.g. when input or output pins are driven
beyond the power supply voltages, or the power supply polarity is reversed). Obviously, such conditions should always be avoided.
Note 5: Human body model is 100 pF capacitor discharged through a 1.5 kΩ resistor. Machine model is 220 pF discharged through 0Ω.
Note 6: The 235˚C reflow temperature refers to infrared reflow. For Vapor Phase Reflow (VPR), the following Conditions apply: Maintain the temperature at the top
of the package body above 183˚C for a minimum 60 seconds. The temperature measured on the package body must not exceed 220˚C. Only one excursion above
183˚C is allowed per reflow cycle.
Note 7: The inputs are protected as shown below. Input voltages above VA or below GND will not damage this device, provided current is limited per (Note 3).
However, errors in the A/D conversion can occur if the input goes above VA or below GND by more than 100 mV. As an example, if VA is 3.3V, the full-scale input
voltage must be ≤3.4V to ensure accurate conversions.
20050707
Note 8: To guarantee accuracy, it is required that |VA–VD| ≤ 100 mV and separate bypass capacitors are used at each power supply pin.
Note 9: With the test condition for VREF = +1.0V (2 VP-P differential input), the 11-bit LSB is 488 µV.
Note 10: Typical figures are at TA = TJ = 25˚C, and represent most likely parametric norms. Test limits are guaranteed to National’s AOQL (Average Outgoing Quality
Level).
Note 11: Integral Non Linearity is defined as the deviation of the analog value, expressed in LSBs, from the straight line that passes through positive and negative
full-scale.
Note 12: Timing specifications are tested at TTL logic levels, VIL = 0.4V for a falling edge and VIH = 2.4V for a rising edge.
Note 13: Optimum dynamic performance will be obtained by keeping the reference input in the 0.8V to 1.5V range. The LM4051CIM3-ADJ or the LM4051CIM3-1.2
bandgap voltage reference is recommended for this application.
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ADC11L066
AC Electrical Characteristics
(Continued)
Note 14: IDR is the current consumed by the switching of the output drivers and is primarily determined by load capacitance on the output pins, the supply voltage,
VDR, and the rate at which the outputs are switching (which is signal dependent). IDR=VDR(C0 x f0 + C1 x f1 +....C11 x f11) where VDR is the output driver power supply
voltage, Cn is total capacitance on the output pin, and fn is the average frequency at which that pin is toggling
Note 15: Power consumption excludes output driver power. See (Note 14).
PIPELINE DELAY (LATENCY) is the number of clock cycles
between initiation of conversion and when that data is presented to the output driver stage. Data for any given sample
is available at the output pins the Pipeline Delay plus the
Output Delay after the sample is taken. New data is available
at every clock cycle, but the data lags the conversion by the
pipeline delay.
Specification Definitions
APERTURE DELAY is the time after the rising edge of the
clock to when the input signal is acquired or held for conversion.
APERTURE JITTER (APERTURE UNCERTAINTY) is the
variation in aperture delay from sample to sample. Aperture
jitter manifests itself as noise in the output.
COMMON MODE VOLTAGE (VCM) is the d.c. potential
present at both signal inputs to the ADC.
POSITIVE FULL SCALE ERROR is the difference between
the actual last code transition and its ideal value of 11⁄2 LSB
below positive full scale.
CONVERSION LATENCY See PIPELINE DELAY.
DIFFERENTIAL NON-LINEARITY (DNL) is the measure of
the maximum deviation from the ideal step size of 1 LSB.
POWER SUPPLY REJECTION RATIO (PSRR) is a measure of how well the ADC rejects a change in the power
supply voltage. For the ADC11L066, PSRR1 is the ratio of
the change in Full-Scale Error that results from a change in
the dc power supply voltage, expressed in dB. PSRR2 is a
measure of how well an a.c. signal riding upon the power
supply is rejected at the output.
SIGNAL TO NOISE RATIO (SNR) is the ratio, expressed in
dB, of the rms value of the input signal to the rms value of the
sum of all other spectral components below one-half the
sampling frequency, not including harmonics or dc.
DUTY CYCLE is the ratio of the time that a repetitive digital
waveform is high to the total time of one period. The specification here refers to the ADC clock input signal.
EFFECTIVE NUMBER OF BITS (ENOB, or EFFECTIVE
BITS) is another method of specifying Signal-to-Noise and
Distortion or SINAD. ENOB is defined as (SINAD - 1.76) /
6.02 and says that the converter is equivalent to a perfect
ADC of this (ENOB) number of bits.
FULL POWER BANDWIDTH is a measure of the frequency
at which the reconstructed output fundamental drops 3 dB
below its low frequency value for a full scale input.
GAIN ERROR is the deviation from the ideal slope of the
transfer function. It can be calculated as:
Gain Error = Positive Full Scale Error − Offset Error
INTEGRAL NON LINEARITY (INL) is a measure of the
deviation of each individual code from a line drawn from
negative full scale (1⁄2 LSB below the first code transition)
through positive full scale (1⁄2 LSB above the last code
transition). The deviation of any given code from this straight
line is measured from the center of that code value.
INTERMODULATION DISTORTION (IMD) is the creation of
additional spectral components as a result of two sinusoidal
frequencies being applied to the ADC input at the same time.
It is defined as the ratio of the power in the second and third
order intermodulation products to the power in one of the
original frequencies. IMD is usually expressed in dBFS.
MISSING CODES are those output codes that will never
appear at the ADC outputs. The ADC11L066 is guaranteed
not to have any missing codes.
NEGATIVE FULL SCALE ERROR is the difference between
the input voltage (VIN+ − VIN−) just causing a transition from
negative full scale to the first code and its ideal value of 0.5
LSB.
OFFSET ERROR is the input voltage that will cause a transition from a code of 010 1111 1111 to a code of 100 0000
0000.
OUTPUT DELAY is the time delay after the rising edge of
the clock before the data update is presented at the output
pins.
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SIGNAL TO NOISE PLUS DISTORTION (S/N+D or SINAD)
Is the ratio, expressed in dB, of the rms value of the input
signal to the rms value of all of the other spectral components below half the clock frequency, including harmonics
but excluding dc.
SPURIOUS FREE DYNAMIC RANGE (SFDR) is the difference, expressed in dB, between the rms values of the input
signal and the peak spurious signal, where a spurious signal
is any signal present in the output spectrum that is not
present at the input.
TOTAL HARMONIC DISTORTION (THD) is the ratio, expressed in dBc, of the rms total of the first nine harmonic
levels at the output to the level of the fundamental at the
output. THD is calculated as
where f1 is the RMS power of the fundamental (output)
frequency and f2 through f10 are the RMS power in the first 9
harmonic frequencies.
SECOND HARMONIC DISTORTION (2ND HARM) is the
difference expressed in dB, between the RMS power in the
input frequency at the output and the power in its 2nd
harmonic level at the output.
THIRD HARMONIC DISTORTION (3RD HARM) is the difference, expressed in dB, between the RMS power in the
input frequency at the output and the power in its 3rd harmonic level at the output.
10
ADC11L066
Timing Diagram
20050709
Output Timing
Transfer Characteristic
20050710
FIGURE 1. Transfer Characteristic
11
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ADC11L066
Typical Performance Characteristics
VA = VD = 3.3V, VDR = 2.5V, fCLK = 66 MHz, fIN = 25 MHz,
VREF = 1.0V, unless otherwise stated.
DNL
DNL vs. fCLK
200507E6
20050791
DNL vs. Clock Duty Cycle
DNL vs. Temperature
20050793
20050792
INL
INL vs. fCLK
200507E7
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20050794
12
INL vs. Clock Duty Cycle
INL vs. Temperature
20050796
20050795
SNR vs. VA
SNR vs. VDR
20050797
20050798
SNR vs. VCM
SNR vs. fCLK
200507B2
200507B1
13
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ADC11L066
Typical Performance Characteristics VA = VD = 3.3V, VDR = 2.5V, fCLK = 66 MHz, fIN = 25 MHz,
VREF = 1.0V, unless otherwise stated. (Continued)
ADC11L066
Typical Performance Characteristics VA = VD = 3.3V, VDR = 2.5V, fCLK = 66 MHz, fIN = 25 MHz,
VREF = 1.0V, unless otherwise stated. (Continued)
SNR vs. Clock Duty Cycle
SNR vs. VREF
200507B3
200507B4
SNR vs. Temperature
THD vs. VA
200507B5
200507B6
THD vs. VDR
THD vs. VCM
200507B7
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200507B8
14
THD vs. fCLK
THD vs. Clock Duty Cycle
200507B9
200507C1
THD vs. VREF
THD vs. Temperature
200507C3
200507C2
SINAD vs. VA
SINAD vs. VDR
200507C5
200507C4
15
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ADC11L066
Typical Performance Characteristics VA = VD = 3.3V, VDR = 2.5V, fCLK = 66 MHz, fIN = 25 MHz,
VREF = 1.0V, unless otherwise stated. (Continued)
ADC11L066
Typical Performance Characteristics VA = VD = 3.3V, VDR = 2.5V, fCLK = 66 MHz, fIN = 25 MHz,
VREF = 1.0V, unless otherwise stated. (Continued)
SINAD vs. VCM
SINAD vs. fCLK
200507C7
200507C6
SINAD vs. Clock Duty Cycle
SINAD vs. VREF
200507C8
200507C9
SINAD vs. Temperature
SFDR vs. VA
200507D1
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200507D2
16
SFDR vs. VDR
SFDR vs. VCM
200507D4
200507D3
SFDR vs. fCLK
SFDR vs. Clock Duty Cycle
200507D6
200507D5
SFDR vs. VREF
SFDR vs. Temperature
200507D8
200507D7
17
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ADC11L066
Typical Performance Characteristics VA = VD = 3.3V, VDR = 2.5V, fCLK = 66 MHz, fIN = 25 MHz,
VREF = 1.0V, unless otherwise stated. (Continued)
ADC11L066
Typical Performance Characteristics VA = VD = 3.3V, VDR = 2.5V, fCLK = 66 MHz, fIN = 25 MHz,
VREF = 1.0V, unless otherwise stated. (Continued)
Power Consumption vs. fCLK
tOD vs. VDR
200507D9
200507E1
Spectral Response @ 10 MHz Input
Spectral Response @ 25MHz Input
200507E4
200507E8
Spectral Response @ 50 MHz Input
Spectral Response @ 75 MHz Input
200507E9
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200507J0
18
Spectral Response @ 150 MHz Input
Spectral Response @ 100 MHz Input
200507J2
200507J1
Spectral Response @ 240 MHz Input
200507E5
19
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ADC11L066
Typical Performance Characteristics VA = VD = 3.3V, VDR = 2.5V, fCLK = 66 MHz, fIN = 25 MHz,
VREF = 1.0V, unless otherwise stated. (Continued)
ADC11L066
1.1 Analog Inputs
Functional Description
The ADC11L066 has two analog signal inputs, VIN+ and
VIN−. These two pins form a differential input pair. There is
one reference input pin, VREF.
Operating on a single +3.3V supply, the ADC11L066 uses a
pipeline architecture and has error correction circuitry to help
ensure maximum performance.
Differential analog input signals are digitized to 11 bits. Each
analog input signal should have a peak-to-peak voltage
equal to the input reference voltage, VREF, be centered
around a common mode voltage, VCM and be 180˚ out of
phase with each other. Table 1. Input to Output Relationship–Differential Input and Table 2. Input to Output
Relationship–Single-Ended Input indicate the input to output
relationship of the ADC11L066. Biasing one input to VCM and
driving the other input with its full range signal results in a 6
dB reduction of the output range, limiting it to the range of 1⁄4
to 3⁄4 of the minimum output range obtainable if both inputs
were driven with complimentary signals. Section 1.3 explains
how to avoid this signal reduction.
1.2 Reference Pins
The ADC11L066 is designed to operate with a 1.0V reference, but performs well with reference voltages in the range
of 0.8V to 1.5V. Lower reference voltages will decrease the
signal-to-noise ratio (SNR) of the ADC11L066. Increasing
the reference voltage (and the input signal swing) beyond
1.5V will degrade THD for a full-scale input. It is very important that all grounds associated with the reference voltage
and the input signal make connection to the analog ground
plane at a single point to minimize the effects of noise
currents in the ground path.
The ADC11L066 will perform well with reference voltages up
to 1.5V for full-scale input frequencies up to 10 MHz. However, more headroom is needed as the input frequency
increases, so the maximum reference voltage (and input
swing) will decrease for higher full-scale input frequencies.
The three Reference Bypass Pins (VRP, VRM and VRN) are
made available for bypass purposes only. These pins should
each be bypassed to ground with a 0.1 µF capacitor. Smaller
capacitor values will allow faster recovery from the power
down mode, but may result in degraded noise performance.
DO NOT LOAD these pins. Loading any of these pins may
result in performance degradation.
The nominal voltages for the reference bypass pins are as
follows:
VRM = VA / 2
VRP = VRM + VREF / 2
VRN = VRM − VREF / 2
The VRM pin may be used as a common mode voltage
source (VCM) for the analog input pins as long as no d.c.
current is drawn from it. However, because the voltage at
this pin is half that of the VA supply pin, using these pins for
a common mode source will result in reduced input headroom (the difference between the VA supply voltage and the
peak signal voltage at either analog input) and the possibility
of reduced THD and SFDR performance. For this reason, it
is recommended that VA always exceed VREF by at least 2
Volts. For high input frequencies it may be necessary to
increase this headroom to maintain THD and SFDR performance. Alternatively, use VRN for a VCM source.
TABLE 1. Input to Output Relationship–Differential
Input
VIN+
VIN−
Output
VCM −0.5* VREF
VCM +0.5* VREF
000 0000 0000
VCM −0.25* VREF
VCM +0.25* VREF
010 0000 0000
VCM
VCM
100 0000 0000
VCM +0.25* VREF
VCM −0.25* VREF
110 0000 0000
VCM +0.5* VREF
VCM −0.5* VREF
111 1111 1111
TABLE 2. Input to Output Relationship–Single-Ended
Input
VIN+
VIN−
Output
VCM −VREF
VCM
000 0000 0000
VCM −0.5* VREF
VCM
010 0000 0000
VCM
VCM
100 0000 0000
VCM +0.5* VREF
VCM
110 0000 0000
VCM +VREF
VCM
111 1111 1111
The output word rate is the same as the clock frequency,
which can be between 10 MSPS and 80 MSPS (typical). The
analog input voltage is acquired at the rising edge of the
clock and the digital data for that sample is delayed by the
pipeline for 6 clock cycles.
A logic high on the power down (PD) pin reduces the converter power consumption to 50 mW.
1.3 Signal Inputs
The signal inputs are VIN+ and VIN−. The input signal, VIN, is
defined as
VIN = (VIN+) – (V−)
Figure 2 shows the expected input signal range.
Note that the nominal input common mode voltage is VREF
and the nominal input signals each run between the limits of
VREF/2 and 3VREF/2. The Peaks of the input signals should
never exceed the voltage described as
Peak Input Voltage = VA − 0.8
to maintain dynamic performance.
The ADC11L066 performs best with a differential input with
each input centered around a common mode voltage, VCM
(minimum of 0.5V). The peak-to-peak voltage swing at both
VIN+ and VIN− should not exceed the value of the reference
voltage or the output data will be clipped.
Applications Information
1.0 OPERATING CONDITIONS
We recommend that the following conditions be observed for
operation of the ADC11L066:
3.0 V ≤ VA ≤ 3.6V
VD = VA
1.8V ≤ VDR ≤ VD
10 MHz ≤ fCLK ≤ 80 MHz
0.8V ≤ VREF ≤ 1.5V
0.5V ≤ VCM ≤ 1.5V
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Relationship–Differential Input and Table 2. Input to Output
Relationship–Single-Ended Input indicate the input to output
relationship of the ADC11L066.
(Continued)
The two input signals should be exactly 180˚ out of phase
from each other and of the same amplitude. For single
frequency (sine wave) inputs, angular errors result in a reduction of the effective full scale input. For a complex waveform, however, angular errors will result in distortion.
1.3.2 Driving the Analog Inputs
The VIN+ and the VIN− inputs of the ADC11L066 consist of
an analog switch followed by a switched-capacitor amplifier.
The capacitance seen at the analog input pins changes with
the clock level, appearing as 8 pF when the clock is low, and
7 pF when the clock is high.
As the internal sampling switch opens and closes, current
pulses occur at the analog input pins, resulting in voltage
spikes at the signal input pins. As a driving amplifier attempts
to counteract these voltage spikes, a damped oscillation
may appear at the ADC analog input. To help isolate the
pulses at the ADC input from the amplifier output, use RCs at
the inputs, as can be seen in Figure 4 and Figure 5. These
components should be placed close to the ADC inputs because the input pins of the ADC is the most sensitive part of
the system and this is the last opportunity to filter that input.
Any amplifier driving the ADC11L066 input pins must be able
to react to the voltage spikes at the input and settle before
the sampling switch opens. The LMH6702 LMH6628,
LMH6622 and the LMH6655 are good amplifiers for driving
the ADC11L066.
For Nyquist applications the RC pole should be at the ADC
sample rate. The ADC input capacitance in the sample mode
should be considered when setting the RC pole. Setting the
pole in this manner will provide best SINAD performance.
20050711
FIGURE 2. Expected Input Signal Range
For angular deviations of up to 10 degrees from these two
signals being 180 out of phase with each other, the full scale
error in LSB can be described as approximately
EFS = dev1.79
Where dev is the angular difference between the two signals
having a 180˚ relative phase relationship to each other (see
Figure 2). Drive the analog inputs with a source impedance
less than 100Ω.
To obtain best SNR performance, leave the RC values as
calculated. To obtain best SINAD and ENOB performance,
reduce the RC time constant until SNR and THD are numerically equal to each other. To obtain best distortion and SFDR
performance, eliminate the RC altogether.
For undersampling applications, the RC pole should be set
at about 1.5 to 2 times the maximum input frequency to
maintain a linear delay response.
A single-ended to differential conversion circuit is shown in
Figure 5. Table 3 gives resistor values for that circuit to
provide input signals in a range of 1.0V ± 0.5V at each of the
differential input pins of the ADC11L066.
20050712
FIGURE 3. Angular Errors Between the Two Input
Signals Will Reduce the Output Level or Cause
Distortion
TABLE 3. Resistor values for Circuit of Figure 5
For differential operation, each analog input pin of the differential pair should have a peak-to-peak voltage equal to the
input reference voltage, VREF, and be centered around VCM.
1.3.1 Single-Ended Operation
Single-ended performance is lower than with differential input signals, so single-ended operation is not recommended.
However, if single-ended operation is required, one of the
analog inputs should be connected to the d.c. common
mode voltage of the driven input. The peak-to-peak differential input signal should be twice the reference voltage to
maximize SNR and SINAD performance (Figure 2b).
For example, set VREF to 0.5V, bias VIN− to 1.0V and drive
VIN+ with a signal range of 0.5V to 1.5V.
Because very large input signal swings can degrade distortion performance, better performance with a single-ended
input can be obtained by reducing the reference voltage
while maintaining a full-range output. Table 1. Input to Output
SIGNAL
RANGE
R1
0 - 0.25V
open
0Ω
124Ω
1500Ω 1000Ω
0 - 0.5V
0Ω
open
499Ω
1500Ω
499Ω
± 0.5V
100Ω
698Ω
100Ω
698Ω
499Ω
R2
R3
R4
R5, R6
1.3.3 Input Common Mode Voltage
The input common mode voltage, VCM, should be in the
range of 0.5V to 1.5V and be of a value such that the peak
excursions of the analog signal does not go more negative
than ground or more positive than 0.8 Volts below the VA
supply voltage. The nominal VCM should generally be about
1.0V, but VRM or VRN can be used as a VCM source as long
as no d.c. current is drawn from either of these pins.
2.0 DIGITAL INPUTS
Digital inputs are TTL/CMOS compatible and consist of CLK,
OE and PD.
21
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ADC11L066
Applications Information
ADC11L066
Applications Information
Since ADC noise increases with increased output capacitance at the digital output pins, do use the TRI-STATE outputs of the ADC11L066 to drive a bus. Rather, each output
pin should be located close to and drive a single digital input
pin. To further reduce ADC noise, a 100 Ω resistor in series
with each ADC digital output pin, located close to their respective pins, should be added to the circuit. See Section
3.0.
(Continued)
2.1 CLK
The CLK signal controls the timing of the sampling process.
Drive the clock input with a stable, low jitter clock signal in
the range of 10 MHz to 80 MHz with rise and fall times of less
than 2 ns. The trace carrying the clock signal should be as
short as possible and should not cross any other signal line,
analog or digital, not even at 90˚.
The CLK signal also drives an internal state machine. If the
CLK is interrupted, or its frequency is too low, the charge on
internal capacitors can dissipate to the point where the accuracy of the output data will degrade. This is what limits the
lowest sample rate to 1 MSPS.
2.3 PD
The PD pin, when high, holds the ADC11L066 in a powerdown mode to conserve power when the converter is not
being used. The power consumption in this state is 50 mW
with a 66 MHz clock and 30 mW if the clock is stopped. The
output data pins are undefined in this mode. The data in the
pipeline is corrupted while in the power down mode.
The Power Down Mode Exit Cycle time is determined by the
value of the capacitors on pins 30, 31 and 32 and is about
300 ns with the recommended 0.1 µF on these pins. These
capacitors loose their charge in the Power Down mode and
must be recharged by on-chip circuitry before conversions
can be accurate. Smaller capacitor values allow faster recovery from the power down mode, but can result in a
reduction in SNR, SINAD and ENOB performance.
The duty cycle of the clock signal can affect the performance
of any A/D Converter. Because achieving a precise duty
cycle is difficult, the ADC11L066 is designed to maintain
performance over a range of duty cycles. While it is specified
and performance is guaranteed with a 50% clock duty cycle,
performance is typically maintained over a clock duty cycle
range of 40% to 60%.
The clock line should be series terminated at the clock
source in the characteristic impedance of that line if the clock
line is longer than
3.0 OUTPUTS
The ADC11L066 has 11 TTL/CMOS compatible Data Output
pins. The offset binary data is present at these outputs while
the OE and PD pins are low. While the tOD time provides
information about output timing, a simple way to capture a
valid output is to latch the data on the rising edge of the
conversion clock (pin 10).
Be very careful when driving a high capacitance bus. The
more capacitance the output drivers must charge for each
conversion, the more instantaneous digital current flows
through VDR and DR GND. These large charging current
spikes can cause on-chip ground noise and couple into the
analog circuitry, degrading dynamic performance. Adequate
bypassing, limiting output capacitance and careful attention
to the ground plane will reduce this problem. Additionally,
bus capacitance beyond the specified 15 pF/pin will cause
tOD to increase, making it difficult to properly latch the ADC
output data. The result could be an apparent reduction in
dynamic performance.
To minimize noise due to output switching, minimize the load
currents at the digital outputs. This can be done by connecting buffers between the ADC outputs and any other circuitry
(74ACQ541, for example). Only one driven input should be
connected to each output pin. Additionally, inserting series
resistors of 100Ω at the digital outputs, close to the ADC
pins, will isolate the outputs from trace and other circuit
capacitances and limit the output currents, which could otherwise result in performance degradation. See Figure 4.
While the ADC11L066 will operate with VDR voltages down
to 1.8V, tOD increases with reduced VDR. Be careful of
external timing when using reduced VDR.
where tr is the clock rise time and tprop is the propagation rate
of the signal along the trace. For a typical board of FR-4
material, tPROP is about 150 ps/in, or 60 ps/cm.
The CLOCK pin may need to be a.c. terminated with a series
RC such that the resistor value is equal to the characteristic
impedance of the clock line and the capacitor value is
where "I" is the line length in inches and Zo is the characteristic impedance of the clock line. This termination should be
located as close as possible to, but within one centimeter of,
the ADC11L066 clock pin as shown in Figure 4. It should
also be located beyond the ADC clock pin as seen from the
clock source.
Take care to maintain a constant clock line impedance
throughout the length of the line and to properly terminate
the source end of the line with its characteristic impedance.
Refer to Application Note AN-905 for information on setting
characteristic impedance.
2.2 OE
The OE pin, when high, puts the output pins into a high
impedance state. When this pin is low the outputs are in the
active state. The ADC11L066 will continue to convert
whether this pin is high or low, but the output can not be read
while the OE pin is high.
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ADC11L066
Applications Information
(Continued)
20050713
FIGURE 4. Simple Application Circuit with Single-Ended to Differential Buffer
20050714
FIGURE 5. Differential Drive Circuit of Figure 4
23
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ADC11L066
Applications Information
(Continued)
20050715
FIGURE 6. Driving the Signal Inputs with a Transformer
exhibit high transients that could add noise to the conversion
process. To prevent this from happening, the DR GND pins
should NOT be connected to system ground in close proximity to any of the ADC11L066’s other ground pins.
Capacitive coupling between the typically noisy digital circuitry and the sensitive analog circuitry can lead to poor
performance. The solution is to keep the analog circuitry
separated from the digital circuitry, and to keep the clock line
as short as possible.
Digital circuits create substantial supply and ground current
transients. The logic noise thus generated could have significant impact upon system noise performance. The best
logic family to use in systems with A/D converters is one
which employs non-saturating transistor designs, or has low
noise characteristics, such as the 74LS, 74HC(T) and
74AC(T)Q families. The worst noise generators are logic
families that draw the largest supply current transients during clock or signal edges, like the 74F and the 74AC(T)
families.
The effects of the noise generated from the ADC output
switching can be minimized through the use of 47Ω to 100Ω
resistors in series with each data output line. Locate these
resistors as close to the ADC output pins as possible.
Since digital switching transients are composed largely of
high frequency components, total ground plane copper
4.0 POWER SUPPLY CONSIDERATIONS
The power supply pins should be bypassed with a 10 µF
capacitor and with a 0.1 µF ceramic chip capacitor within a
centimeter of each power pin. Leadless chip capacitors are
preferred because they have low series inductance.
As is the case with all high-speed converters, the
ADC11L066 is sensitive to power supply noise. Accordingly,
the noise on the analog supply pin should be kept below 100
mVP-P.
No pin should ever have a voltage on it that is in excess of
the supply voltages, not even on a transient basis. Be especially careful of this during turn on and turn off of power.
The VDR pin provides power for the output drivers and may
be operated from a supply in the range of 1.8V to VD. This
can simplify interfacing to devices and systems operating
with supplies less than VD. DO NOT operate the VDR pin at
a voltage higher than VD.
5.0 LAYOUT AND GROUNDING
Proper grounding and proper routing of all signals are essential to ensure accurate conversion. Maintaining separate
analog and digital areas of the board, with the ADC11L066
between these areas, is required to achieve specified performance.
The ground return for the data outputs (DR GND) carries the
ground current for the output drivers. The output current can
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24
This is because of the skin effect. Total surface area is more
important than is total ground plane volume.
(Continued)
weight will have little effect upon the logic-generated noise.
20050716
FIGURE 7. Example of a Suitable Layout
Generally, analog and digital lines should cross each other at
90˚ to avoid crosstalk. To maximize accuracy in high speed,
high resolution systems, however, avoid crossing analog and
digital lines altogether. It is important to keep clock lines as
short as possible and isolated from ALL other lines, including
other digital lines. Even the generally accepted 90˚ crossing
should be avoided with the clock line as even a little coupling
can cause problems at high frequencies. This is because
other lines can introduce jitter into the clock line, which can
lead to degradation of SNR. Also, the high speed clock can
introduce noise into the analog chain.
Best performance at high frequencies and at high resolution
is obtained with a straight signal path. That is, the signal path
through all components should form a straight line wherever
possible.
Be especially careful with the layout of inductors. Mutual
inductance can change the characteristics of the circuit in
which they are used. Inductors should not be placed side by
side, even with just a small part of their bodies beside each
other.
The analog input should be isolated from noisy signal traces
to avoid coupling of spurious signals into the input. Any
external component (e.g., a filter capacitor) connected between the converter’s input pins and ground or to the reference input pin and ground should be connected to a very
clean point in the ground plane.
Figure 7 gives an example of a suitable layout. All analog
circuitry (input amplifiers, filters, reference components, etc.)
should be placed in the analog area of the board. All digital
circuitry and I/O lines should be placed in the digital area of
the board. Furthermore, all components in the reference
circuitry and the input signal chain that are connected to
ground should be connected together with short traces and
enter the ground plane at a single point. All ground connections should have a low inductance path to ground.
6.0 DYNAMIC PERFORMANCE
To achieve the best dynamic performance, the clock source
driving the CLK input must be free of jitter. Isolate the ADC
clock from any digital circuitry with buffers, as with the clock
tree shown in Figure 8.
As mentioned in Section 5.0, it is good practice to keep the
ADC clock line as short as possible and to keep it well away
from any other signals. Other signals can introduce jitter into
the clock signal, which can lead to reduced SNR performance, and the clock can introduce noise into other lines.
Even lines with 90˚ crossings have capacitive coupling, so
try to avoid even these 90˚ crossings of the clock line.
20050717
FIGURE 8. Isolating the ADC Clock from other Circuitry
with a Clock Tree
7.0 COMMON APPLICATION PITFALLS
Driving the inputs (analog or digital) beyond the power
supply rails. For proper operation, all inputs should not go
more than 100 mV beyond the supply rails (more than
100 mV below the ground pins or 100 mV above the supply
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ADC11L066
Applications Information
ADC11L066
Applications Information
Using an inadequate amplifier to drive the analog input.
As explained in Section 1.3, the capacitance seen at the
input alternates between 8 pF and 7 pF, depending upon the
phase of the clock. This dynamic load is more difficult to
drive than is a fixed capacitance.
(Continued)
pins). Exceeding these limits on even a transient basis may
cause faulty or erratic operation. It is not uncommon for high
speed digital components (e.g., 74F and 74AC devices) to
exhibit overshoot or undershoot that goes above the power
supply or below ground. A resistor of about 50Ω to 100Ω in
series with any offending digital input, close to the signal
source, will eliminate the problem.
If the amplifier exhibits overshoot, ringing, or any evidence of
instability, even at a very low level, it will degrade performance. A small series resistor at each amplifier output and a
capacitor across the analog inputs (as shown in Figures 5, 6)
will improve performance. The LMH6702, LMH6628,
LMH6622 and LMH6655 have been successfully used to
drive the analog inputs of the ADC11L066.
Do not allow input voltages to exceed the supply voltage,
even on a transient basis. Not even during power up or
power down.
Be careful not to overdrive the inputs of the ADC11L066 with
a device that is powered from supplies outside the range of
the ADC11L066 supply. Such practice may lead to conversion inaccuracies and even to device damage.
Also, it is important that the signals at the two inputs have
exactly the same amplitude and be exactly 180o out of phase
with each other. Board layout, especially equality of the
length of the two traces to the input pins, will affect the
effective phase between these two signals. Remember that
an operational amplifier operated in the non-inverting configuration will exhibit more time delay than will the same
device operating in the inverting configuration.
Attempting to drive a high capacitance digital data bus.
The more capacitance the output drivers must charge for
each conversion, the more instantaneous digital current
flows through VDR and DR GND. These large charging current spikes can couple into the analog circuitry, degrading
dynamic performance. Adequate bypassing and maintaining
separate analog and digital areas on the pc board will reduce
this problem.
Additionally, bus capacitance beyond the specified 15 pF/pin
will cause tOD to increase, making it difficult to properly latch
the ADC output data. The result could, again, be a reduction
in dynamic performance.
The digital data outputs should be buffered (with 74ACQ541,
for example). Dynamic performance can also be improved
by adding series resistors at each digital output, close to the
ADC11L066, which reduces the energy coupled back into
the converter output pins by limiting the output current. A
reasonable value for these resistors is 100Ω.
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Operating with the reference pins outside of the specified range. As mentioned in Section 1.2, VREF should be in
the range of
0.8V ≤ VREF ≤ 1.5V
Operating outside of these limits could lead to performance
degradation.
Using a clock source with excessive jitter, using excessively long clock signal trace, or having other signals
coupled to the clock signal trace. This will cause the
sampling interval to vary, causing excessive output noise
and a reduction in SNR and SINAD performance.
26
inches (millimeters) unless otherwise noted
32-Lead LQFP Package
Ordering Number ADC11L066CIVY
NS Package Number VBE32A
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ADC11L066 11-Bit, 66 MSPS, 450 MHz Bandwidth A/D Converter with Internal Sample-and-Hold
Physical Dimensions