CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com CMOS HEX BUFFER/CONVERTER Check for Samples: CD4010B-Q1 FEATURES 1 • • • • • Qualified for Automotive Applications 100% Tested for Quiescent Current at 20 V Maximum Input Current of 1 µA at 18 V Over Full Package-Temperature Range: 100 nA at 18 V and 25°C 5-V, 10-V, and 15-V Parametric Ratings Latch-Up Performance Meets 100 mA per JESD 78, Class I D PACKAGE (TOP VIEW) APPLICATIONS • • • • CMOS to DTL/TTL Hex Converter CMOS Current "Sink" or "Source" Driver CMOS High-to-Low Logic-Level Converter Multiplexer: 1-to-6 or 6-to-1 DESCRIPTION CD4010B hex buffer/converter may be used as CMOS to TTL or DTL logic-level converters or CMOS high-sink-current drivers. The CD4050B is the preferred hex buffer replacement for the CD4010B in all applications except multiplexers. For applications not requiring high sink current or voltage conversion, the CD4069UB hex inverter is recommended. The CD4010B is supplied in 16-lead hermetic dual-in-line ceramic (D) packages. ORDERING INFORMATION (1) PACKAGE (2) TA –40°C to 125°C (1) (2) SOIC – D Reel of 2500 ORDERABLE PART NUMBER CD4010BQDRQ1 TOP-SIDE MARKING CD4010BQ For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site at www.ti.com. Package drawings, thermal data, and symbolization are available at www.ti.com/packaging. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2010–2012, Texas Instruments Incorporated CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. Figure 1. Schematic Diagram – One of Six Identical Stages Functional Diagram 2 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com ABSOLUTE MAXIMUM RATINGS (1) over operating free-air temperature range (unless otherwise noted) VDD DC supply voltage range, voltages referenced to VSS terminal Input voltage range, all inputs DC input current, any one input PD Power dissipation per package Device dissipation per output transistor VALUE UNIT –0.5 to +20 V –0.5 to VDD +0.5 V ±10 mA TA = –40°C to +100°C 500 TA = +100°C to +125°C Derate linearly at 12 mW/°C to 200 mW mW 100 mW °C TA = full package-temperature range (all packages types) TA Operating temperature range –40 to +125 Tstg Storage temperature range –65 to +150 °C 100 mA Latch-up performance per JESD 78, Class I Human-body model (HBM) ESD (1) (2) Electrostatic discharge rating (2) 500 Machine model (MM) 100 Charged-Device Model (CDM) 1000 V Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Tested in accordance with AEC-Q100. RECOMMENDED OPERATING CONDITIONS MIN VDD VCC VI (1) Supply voltage range (1) Input voltage range MAX 3 18 3 VDD VCC VDD UNIT V V The CD4010B has high-to-low level voltage conversion capability, but not low-to-high level; therefore, it is recommended that VDD > VI > VCC. Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 3 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com STATIC ELECTRICAL CHARACTERISTICS over operating free-air temperature range (unless otherwise noted) PARAMETER IDD Max TEST CONDITIONS LIMITS AT INDICATED TEMPERATURES (°C) VO VDD –40 +85 +125 Quiescent device current 0.4 IOL Min Output low (sink) current IOH Min Output high (source) current VOL Max VOH Min VIL Max VIH Min IIN Max 4 Input current UNIT TYP MAX 0, 5 5 1 30 30 0.02 1 0, 10 10 2 60 60 0.02 2 0, 15 15 4 120 120 0.02 4 0.04 20 0,20 20 20 600 600 0, 5 4.5 3.1 2.1 1.8 2.6 0, 5 5 3.6 2.4 2.1 3 4 0, 10 10 9.6 6.4 5.6 8 10 1.5 0, 15 15 40 19 16 24 36 4.6 0, 5 5 –0.23 –0.18 –0.15 –0.2 –0.4 2.5 0, 5 5 –0.9 –0.65 –0.58 –0.8 –1.6 9.5 0, 10 10 –0.5 –0.38 –0.33 –0.45 –0.9 13.5 0, 15 15 –1.6 –1.25 –1.1 –1.5 –3 mA mA 0, 5 5 0.05 0 0.05 0, 10 10 0.05 0 0.05 0, 15 15 0.05 0 0.05 0, 5 5 4.95 4.95 5 0, 10 10 9.95 9.95 10 0, 15 15 14.95 14.95 15 0.5 5 1.5 1 10 3 3 1.5 15 4 4 4.5 5 3.5 9 10 7 7 13.5 15 11 11 0, 18 18 ±0.1 Submit Documentation Feedback ±1 µA 3.4 0.5 Output voltage: High-level Input high voltage +25 MIN 0.4 Output voltage: Low-level Input low voltage VIN V V 1.5 V 3.5 ±1 V ±10–5 ±0.1 µA Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com DYNAMIC ELECTRICAL CHARACTERISTICS TA = 25°C, Input tr/tf = 20 ns, CL = 50 pf, RL = 200 kΩ TEST CONDITIONS PARAMETER tPLH tPHL tTLH Propagation delay time: low-to-high Propagation time: high-to-low Transition time: low-to-high tTHL Transition time: high-to-low CIN Input capacitance VDD (V) VI (V) LIMITS ALL PKGS VCC (V) TYP MAX 5 5 5 100 200 10 10 10 50 100 10 10 5 50 100 15 15 15 35 70 15 15 5 35 70 5 5 5 65 130 10 10 10 35 70 10 10 5 30 70 15 15 15 25 50 15 15 5 20 40 5 5 5 150 350 10 10 10 75 150 15 15 15 55 110 5 5 5 35 90 10 10 10 20 45 15 15 15 15 40 5 7.5 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 UNIT ns ns ns ns pF 5 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com TYPICAL CHARACTERISTICS 6 Figure 2. Minimum and Maximum Voltage Transfer Characteristics (VDD = 5 V) Figure 3. Minimum and Maximum Voltage Transfer Characteristics (VDD = 10 V) Figure 4. Minimum and Maximum Voltage Transfer Characteristics (VDD = 15 V) Figure 5. Typical Voltage Transfer Characteristics as a Function of Temperature Figure 6. Typical Output Low (Sink) Current Characteristics Figure 7. Minimum Output Low (Sink) Current Characteristics Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 8. Typical Output High (Source) Current Characteristics Figure 9. Minimum Output High (Source) Current Characteristics Figure 10. Typical Low-to-High Propagation Delay Time vs Load Capacitance Figure 11. Typical High-to-Low Propagation Delay Time vs Load Capacitance Figure 12. Typical Low-to-High Transition Time vs Load Capacitance Figure 13. Typical High-to-Low Transition Time vs Load Capacitance Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 7 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com TYPICAL CHARACTERISTICS (continued) Figure 14. Typical Dissipation Characteristics 8 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com PARAMETER MEASUREMENT INFORMATION Figure 15. Quiescent Device Current Test Circuit Figure 16. Noise Immunity Test Circuit Figure 17. Input Current Test Circuit Note: Dimensions in parentheses are in millimeters and are dereived from the basic inch dimensions as indicated. Grid graduation are in mils (10–3 inch). Figure 18. Dimensions and Layout Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 9 CD4010B-Q1 SCHS379A – MARCH 2010 – REVISED JANUARY 2012 www.ti.com REVISION HISTORY Changes from Original (March 2010) to Revision A • 10 Page Changed STATIC ELECTRICAL CHARACTERISTICS table to correct typos and misplaced data .................................... 4 Submit Documentation Feedback Copyright © 2010–2012, Texas Instruments Incorporated Product Folder Link(s): CD4010B-Q1 PACKAGE OPTION ADDENDUM www.ti.com 16-Apr-2010 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing CD4010BQDRQ1 ACTIVE SOIC D Pins Package Eco Plan (2) Qty 16 2500 Green (RoHS & no Sb/Br) Lead/Ball Finish CU NIPDAU MSL Peak Temp (3) Level-1-260C-UNLIM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF CD4010B-Q1 : CD4010B • Catalog: • Military: CD4010B-MIL NOTE: Qualified Version Definitions: - TI's standard catalog product • Catalog • Military - QML certified for Military and Defense Applications Addendum-Page 1 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed. TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications. TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated products in automotive applications, TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions: Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap Wireless Connectivity www.ti.com/wirelessconnectivity TI E2E Community Home Page e2e.ti.com Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2012, Texas Instruments Incorporated