OKI MSM64169-XXXK Built-in dual-slope type a/d converter and lcd driver 4-bit microcontroller Datasheet

E2E0037-27-Y3
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This version: MSM64169
Jan. 1998
Previous version: Mar. 1996
Built-in Dual-slope type A/D Converter and LCD Driver 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM64169 is a low-power 4-bit microcontroller that incorporates OKI's nX-4/30 CPU core.
The MSM64169 has a minimum instruction execution time of 4.3 ms (@ 700 kHz). The device
contains 8160 bytes of program memory, a 1024-nibble data memory, a dual-slopetype A/D
converter with a 4-channel input, LCD drivers that can drive up to 240 segments, a synchronous/
asynchronous selectable serial port, a 16-bit timer, and a buzzer output port.
Applications include high resolution thermometers with low power consumption, barometers,
and hygrometers.
FEATURES
• Operating range
Operating frequencies (dual clock)
Operating voltage
Operating temperature
• Memory space
Internal program memory
Internal data memory
• Minimum instruction execution time
• Dual-slope type A/D converter
• LCD drivers
(1) At 1/4 duty, 1/3 bias
(2) At 1/3 duty, 1/3 bias
(3) At 1/2 duty, 1/2 bias
• Buzzer driver
• Timer
Auto-reload mode
Capture mode
Clock frequency measuring mode
• Watchdog timer
• Clock
CPU clock
Time base clock
• Power supply voltage
• I/O port
• Output only port
• Serial port
Synchronous mode
Asynchronous mode
• Interrupts
: 32 kHz, 700 kHz
: 2.6 V to 3.6 V
: –40°C to +85°C
: 8160 bytes
: 1024 nibbles
: 4.3 ms (@ 700 kHz)
91.6 ms (@ 32.768 kHz)
: 1; 4-channel input
: 64; duty ratio switchable by software
: 240 segments (max.)
: 183 segments (max.)
: 124 segments (max.)
: 1; four modes for controlling buzzer output
ON/OFF
: 16-bit ¥ 1
: 32.768 kHz quartz oscillator and 700 kHz
RC oscillator (with an external resistor)
: 32.768 kHz/700 kHz (selectable by software)
: 32.768 kHz
: 3 V low power
: 3 ports ¥ 4 bits
: 2 ports ¥ 4 bits (8 out of 64 LCD drivers can be used
as output-only ports via mask programming)
: Synchronous/asynchronous mode support
: 32.768 kHz/external clock
: 9600 bps/4800 bps/2400 bps/1200 bps
: 10 sources (2 external, 8 internal)
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ar
¡ Semiconductor
MSM64169
¡ Semiconductor
¡ Semiconductor
MSM64169
• Capture circuit
: 2 channels
• Package:
128-pin plastic QFP (QFP128-P-1420-0.50-K) : (Product name: MSM64169-xxxGS-K)
Chip
: (Product name: MSM64169-xxx)
xxx indicates the code number.
• OTP version (under development)
: (Product name: MSM64P169)
Note: The MSM64P169 is diffrent from
the MSM64169 in the polarity of the
power supply voltage and the
operating voltage.Refer to the
MSM64P169 user's manual for details.
2/25
TR0
ROM
8160B
TR1
HALT
A11- A8
ALU
C
A7 - A0
H
(4)
A
(4)
MIEF
B
L
X
LCD
PORT ADDRESS
(4)
PCH
PCM PCL
L63
VSS
P0
P1
RAM
1024N
Y
L0
L1
¡ Semiconductor
BSR
TR2
BLOCK DIAGRAM
BIAS
VDD
VSS1
VSS2
VSS3
C1
C2
P0.0
P0.1
P1.3
DB7- DB0
INT
(8)
INT
OSC2
OSC1
XT
XT
SP
TBC
3
P2
ROMR
SIOP
2
INT
(8)
IR
RSTG
TIMING
CONTROLLER
IR
DECODER
RESET
2CLK
VSS
INT
VSS
INT
TST1
TST2
TST
VSSL
VR
DB7- DB0
WDT
INTC
TM
CAPR
BD
ADC
RCM
VG
CZ2
CI
CZ1
RI
RA
AIN3
AIN2
AIN1
AIN0
VrA
VDDA
BD
3/25
is the CPU core (nX-4/30).
INT
MSM64169
VSSA
OPP1
OPN1
OPO1
OPP0
OPN0
OPO0
VOF
PORT ADDRESS
INT
P2.0
P2.1
P2.2
P2.3
¡ Semiconductor
MSM64169
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
VDDA
VG
CZ2
CI
CZ1
RCM
RI
RA
AIN3
AIN2
AIN1
(NC)
AIN0
VOF
(NC)
(NC)
(NC)
(NC)
(NC)
VrA
VSSL
RESET
TST2
TST1
BD
VSS1
PIN CONFIGURATION (TOP VIEW)
102
101
100
99
98
97
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
VSS3
C1
C2
VSS2
XT
XT
VDD
OSC1
OSC2
L63
L62
L61
L60
L59
L58
L57
L56
(NC)
L55
L54
L53
(NC)
L52
L51
L50
L49
(NC)
L48
L47
L46
L45
L44
L43
L42
L41
L40
L39
L38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
L12
L13
L14
L15
L16
L17
L18
L19
L20
L21
L22
L23
L24
L25
L26
L27
L28
L29
L30
L31
L32
L33
L34
L35
L36
L37
OPO0
OPN0
OPP0
OP01
OPN1
OPP1
VSSA
VSS
P0.0
P0.1
(NC)
P0.2
(NC)
P0.3
(NC)
P1.0
P1.1
(NC)
P1.2
(NC)
P1.3
P2.0
(NC)
P2.1
P2.2
P2.3
L0
L1
L2
L3
L4
L5
L6
L7
L8
L9
L10
L11
NC: No-connection pin
128-Pin Plastic QFP
4/25
¡ Semiconductor
MSM64169
PIN DESCRIPTIONS
Basic Functions
Function
Power Supply
Pin
Pad Symbol Type
Description
96
86
VDD
—
0V power supply
103
93
VSS1
—
Bias output for LCD drive (–1.5V)
99
89
VSS2
—
Negative power supply: bias output for LCD drive (–3.0V)
102
92
VSS3
—
Bias output for LCD drive (–4.5V)
8
7
VSS
—
Negative power supply for input/output port interface
101
91
C1
—
Capacitor connection for LCD-drive bias generation
100
90
C2
—
108
98
VSSL
—
Negative power supply pin for internal logic (internally generated
constant voltage)
7
6
VSSA
—
Negative power supply for A/D converter: externally connects to
VSS2.
Oscillation
Test
0V power supply for A/D converter: externally connects to VDD.
128
112
VDDA
—
98
88
XT
I
Low speed clock oscillation input pin: connects to the crystal
97
87
XT
O
oscillator (32.768kHz).
95
85
OSC1
I
High speed clock pins: connects to the oscillation resistor (ROS).
94
84
OSC2
O
105
95
TST1
I
106
96
TST2
I
Input pins for test: pulled up to VDD internally.
System reset input: when this pin is asserted to "H" after being
pulled to "L", the microcontroller's internal state is initialized and
Reset
107
97
RESET
I
instruction execution starts from address 000H. This pin is pulled
up to VDD internally.
5/25
¡ Semiconductor
MSM64169
Basic Functions (Continued)
Function
Pin
Ports
Buzzer
A/D
Converter
Pad Symbol Type
Description
8
P0.0
I/O
4-bit I/O port (P0): each bit can be configured to be an
10
9
P0.1
I/O
input/output, pull-up/pull-down resistor input/high impedance
12
10
P0.2
I/O
input, or NMOS open drain output/CMOS output by port 0 control
14
11
P0.3
I/O
16
12
P1.0
I/O
4-bit I/O port (P1): each bit can be configured to be an
17
13
P1.1
I/O
input/output, pull-up/pull-down resistor input/high impedance
19
14
P1.2
I/O
input, or NMOS open drain output/CMOS output by port 1 control
21
15
P1.3
I/O
22
16
P2.0
I/O
4-bit I/O port (P2): each bit can be configured to be an
24
17
P2.1
I/O
input/output, pull-up/pull-down resistor input/high impedance
25
18
P2.2
I/O
input, or NMOS open drain output/CMOS output by port 2 control
26
19
P2.3
I/O
9
registers 0-3 (P00CON-P03CON). An external interrupt function is
assigned to each pin.
registers 0-3 (P10CON-P13CON). An external interrupt function is
assigned to each pin.
registers 0-3 (P20CON-P23CON). An external interrupt function is
assigned to each pin.
104
94
BD
O
Output pin of buzzer driver
116
101
AIN0
I/O
Analog voltage input pins. Each of these pins can be switched to
118
102
AIN1
I/O
provide a constant current output by AD control register 0
119
103
AIN2
I/O
(ADCON0).
120
104
AIN3
I/O
121
105
RA
—
Current-adjusting resistor connection pin
122
106
RI
—
Pin for connecting resistor for integration
123
107
RCM
—
124
108
CZ1
—
Pin for connecting capacitor 1 for offset compensation
125
109
CI
—
Pin for connecting capacitor for integration
126
110
CZ2
—
Pin for connecting capacitor 2 for offset compensation
127
111
VG
—
109
99
VrA
I
115
100
VOF
I
3
2
OPP0
I
6
5
OPP1
I
Common connection pin for resistor for integration, capacitor 1
for offset compensation, and capacitor for integration.
Reference voltage for A/D conversion (internally generated
constant voltage)
Pin for connecting resistor for voltage amplification circuit offset
adjustment
Analog micro-voltage input pin
2
1
OPN0
I
Pin for connecting resistor for voltage amplification factor
5
4
OPN1
I
adjustment
1
113
OPO0
O
4
3
OPO1
O
6/25
¡ Semiconductor
MSM64169
Basic Functions (Continued)
Function
LCD Drivers
Pin
Pad Symbol Type
Description
27
20
L0/P3.0
O
LCD segment/common signal output pins. These pins can also be
28
21
L1/P3.1
O
mask-programmed to provide an output port.
29
22
L2/P3.2
O
30
23
L3/P3.3
O
31
24
L4/P4.0
O
32
25
L5/P4.1
O
33
26
L6/P4.2
O
34
27
L7/P4.3
O
35
28
L8
O
36
29
L9
O
37
30
L10
O
38
31
L11
O
39
32
L12
O
40
33
L13
O
41
34
L14
O
42
35
L15
O
43
36
L16
O
44
37
L17
O
45
38
L18
O
46
39
L19
O
47
40
L20
O
48
41
L21
O
49
42
L22
O
50
43
L23
O
51
44
L24
O
52
45
L25
O
53
46
L26
O
54
47
L27
O
55
48
L28
O
56
49
L29
O
57
50
L30
O
LCD segment/common signal output pins
7/25
¡ Semiconductor
MSM64169
Basic Functions (Continued)
Function
LCD Drivers
Pin
Pad Symbol Type
58
51
L31
O
59
52
L32
O
60
53
L33
O
61
54
L34
O
62
55
L35
O
63
56
L36
O
64
57
L37
O
65
58
L38
O
66
59
L39
O
67
60
L40
O
68
61
L41
O
69
62
L42
O
70
63
L43
O
71
64
L44
O
72
65
L45
O
73
66
L46
O
74
67
L47
O
75
68
L48
O
77
69
L49
O
78
70
L50
O
79
71
L51
O
80
72
L52
O
82
73
L53
O
83
74
L54
O
84
75
L55
O
86
76
L56
O
87
77
L57
O
88
78
L58
O
89
79
L59
O
90
80
L60
O
91
81
L61
O
92
82
L62
O
93
83
L63
O
Description
LCD segment/common signal output pins
8/25
¡ Semiconductor
MSM64169
Secondary Functions
Function
Pin
9
Pad Symbol Type
8
P0.0
10
9
P0.1
12
10
P0.2
14
11
P0.3
Description
External level-sensitive interrupt input pins
16
12
P1.0
External
17
13
P1.1
Interrupts
19
14
P1.2
21
15
P1.3
22
16
P2.0
24
17
P2.1
25
18
P2.2
26
19
P2.3
Capture
16
12
P1.0
I
trigger
17
13
P1.1
I
10
9
P0.1
I
22
16
P2.0
I/O
Transmit clock input/output pin (TXT) of serial port
24
17
P2.1
I/O
Receive clock output pin (RXC) of serial port
25
18
P2.2
O
Transmit data output pin (TXD) of serial port
9
8
P0.0
I
Capture trigger input pin of timer
12
10
P0.2
I
External clock input pin (TMC) of timer
26
19
P2.3
O
Timer overflow flag output pin (TMO) of timer
Serial Port
Timer
I
Trigger input pin of the capture circuit
Receive data input pin (RXD) of serial port
9/25
¡ Semiconductor
MSM64169
MEMORY MAPS
Program Memory
Test program area
,,,,,,,,,,,,,
,,,,,,,,,,,,,
,,,,,,,,,,,,,
,,,,,,,,,,,,,
,,,,,,,,,,,,,
1FFFH
1FE0H
1FDFH
32 bytes
8160 bytes
03EH
Interrupt area
03BH
Watchdog interrupt
038H
External interrupt (0)
035H
Serial port receive interrupt
032H
Serial port transmit interrupt
02FH
External interrupt (1)
02CH
Timer interrupt
029H
ADC interrupt
026H
32 Hz interrupt
023H
16 Hz interrupt
020H
1 Hz interrupt
020H
CZP area
010H
000H
Start address
8 bits
Address 000H is the start address of the instruction execution at system reset.
The "CZP" area from address 010H to 01FH is the start address for the CZP subroutine of onebyte call instruction.
The interrupt area from address 020H to 3DH is assigned the start address of interrupt
subroutines. 8160 bytes from address 000H to 1FDFH are available for users. The test program
area cannot be used as a program memory area.
10/25
¡ Semiconductor
MSM64169
Data Memory
The data memory area consists of eight banks and each bank has 256 nibbles (256 ¥ 4 bits).
The data RAM is assigned to BANK 4 through BANK 7 and Special Function Registers (SFRs)
are assigned to BANK 0.
7FFH
700H
6FFH
600H
5FFH
500H
4FFH
400H
BANK 7
Stack area (256 nibbles)(also serves as data memory area)
BANK 6
BANK 5
Data RAM area
BANK 4
Contents of 000H to 0FFH
0FFH
Inaccessible area
SFR area
100H
0FFH
BANK 0
000H
000H
4 bits
Quarter the data RAM area (256 nibbles) also serves as the stack area.
The stack is a memory starting from address 7FFH toward the lower-order addresses where 4
nibbles are used by subroutine call instruction and 8 nibbles are used by an interrupt.
It has no access to the area from BANK 1 to BANK 3.
11/25
¡ Semiconductor
MSM64169
ABSOLUTE MAXIMUM RATINGS
Parameter
(VDD=VDDA=0 V)
Unit
Symbol
Condition
Rating
Power Supply Voltage 1
VSS1
Ta=25°C
–2.0 to +0.3
V
Power Supply Voltage 2
VSS2
Ta=25°C
–4.0 to +0.3
V
Power Supply Voltage 3
VSS3
Ta=25°C
–5.5 to +0.3
V
Power Supply Voltage 4
VSSL
Ta=25°C
–4.0 to +0.3
V
Power Supply Voltage 5
VSS
Ta=25°C
–5.5 to +0.3
V
Power Supply Voltage 6
VSSA
Ta=25°C
–4.0 to +0.3
V
Input Voltage 1
VIN1
VSS2 input, Ta=25°C
VSS2–0.3 to +0.3
V
Input Voltage 2
VIN2
VSS input, Ta=25°C
VSS–0.3 to +0.3
V
Input Voltage 3
VIN3
VSS1 input, Ta=25°C
VSS1–0.3 to +0.3
V
Input Voltage 4
VIN4
VSSA input, Ta=25°C
VSSA–0.3 to +0.3
V
Output Voltage 1
VOUT1
VSS2 output, Ta=25°C
VSS2–0.3 to +0.3
V
Output Voltage 2
VOUT2
VSS3 output, Ta=25°C
VSS3–0.3 to +0.3
V
Output Voltage 3
VOUT3
VSS output, Ta=25°C
VSS–0.3 to +0.3
V
Output Voltage 4
VOUT4
VSS1 output, Ta=25°C
VSS1–0.3 to +0.3
V
Output Voltage 5
VOUT5
VSSA output, Ta=25°C
VSSA–0.3 to +0.3
V
Storage Tempertaure
TSTG
—
–55 to +125
°C
RECOMMENDED OPERATING CONDITIONS
(VDD=VDDA=0 V)
Parameter
Symbol
Condition
Range
Unit
Operating Temperature
Top
—
–40 to +85
°C
Operating Voltage
VSS2
VSS2=VSSA
–3.6 to –2.6
V
VSSA
VSS
—
700 kHz OSC External Resistor
ROS
—
90 to 300
kW
Crystal Oscillator Frequency
fXT
—
30 to 66
kHz
*
–5.25 to (0.8 • VSS2, –2.6 max) (*)
V
Indicates that the value of VSS is 80% of VSS2 and should not exceed –2.6 V.
12/25
¡ Semiconductor
MSM64169
ELECTRICAL CHARACTERISTICS
DC Characteristics
(VDD=VDDA=0 V, VSS2=VSS= –3.0 V, Ta= –40 to +85°C unless otherwise specified)
Parameter
Symbol
Condition
VSS1 Voltage
VSS1
Ca, Cb, C12=0.1 mF
VSS3 Voltage
VSS3
Ca, Cb, C12=0.1 mF
VSSL Voltage
VSSL
XTOSC Oscillation Start Voltage
VSTA
XTOSC Oscillation Hold Voltage
VHOLD
XTOSC Stop Detection Time
TSTOP
XTOSC Internal Capacitance
CG
XTOSC External Capacitance
CGEX
XTOSC Internal Capacitance
CD
700kOSC Internal Capacitance
COS
700kOSC Oscillation Frequeney
fOSC
POR Generation Voltage
VPOR1
POR Non-generation Voltage
VPOR2
Notes: 1.
2.
3.
4.
Min. Typ. Max. Unit
+100%
–50%
+100%
–50%
—
Within 5 seconds after oscillation
–1.7 –1.5 –1.3
V
–4.7 –4.5 –4.3
V
–2.1 –1.5 –0.6
V
—
—
–2.6
V
—
—
—
–2.6
V
—
0.1
— 1000 ms
—
10
15
20
pF
10
—
30
pF
—
10
15
20
pF
—
8
12
16
pF
520 700
910
kHz
starts
When CG external option is used
External resistor ROS=100 kW,
VSS2=–2.6 to –3.6 V
POR generated when VSS2 is
between VPOR1 and –3.0 V
No POR generated when VSS2 is
between VPOR2 and –3.0 V
–0.7
—
0
V
–3
—
–2
V
Measuring
Circuit
1
"XTOSC" means a 32 kHz oscillation circuit.
"700kOSC" means 700 kHz RC oscillation circuit.
"POR" means Power-On Reset.
"TSTOP" means that system reset will occur if XTOSC stops oscillation over this time.
13/25
¡ Semiconductor
MSM64169
DC Characteristics (Continued)
(VDD=VDDA=0 V, VSS2=VSS= –3.0 V, Ta= –40 to +85°C unless otherwise specified)
Parameter
Current Consumption 1
Symbol
IDD1
Condition
CPU in HALT state
Min.
Typ. Max.
Unit
—
1.2
4.5
mA
—
5
15
mA
—
400
800
mA
—
200
300
mA
—
400
600
mA
Measuring
Circuit
(700kOSC stop)
Current Consumption 2
IDD2
CPU in operation
(700kOSC stop)
Current Consumption 3
IDD3
CPU in operation
(700kOSC in operation)
Current Consumption 4
IDD4
A/D converter
Voltage
in operation,
amplification
CPU in HALT
circuit stop
state
Voltage
1
(700kOSC stop) amplification
circuit in
operation
14/25
¡ Semiconductor
MSM64169
DC Characteristics (Continued)
(VDD=VDDA=0 V, VSS1=VSSL= –1.5 V, VSS2=VSS=VSSA= –3.0 V, VSS3= –4.5 V, Ta= –40 to +85°C
unless otherwise specified)
Parameter
Symbol
Condition
Min.
Typ. Max.
Unit
Output Current 1
IOH1
VOH1=–0.5 V
–6
–2
–0.7
mA
(P0.0 to P0.3)
IOL1
VOL1=VSS+0.5 V
0.7
2
6
mA
(P1.0 to P1.3)
IOH1S
VSS=–5 V, VOH1S=–0.5 V
–9
–3
–1
mA
(P2.0 to P2.3)
IOL1S
VSS=–5 V, VOL1S=VSS+0.5 V
1
3
9
mA
Output Current 2
IOH2
VOH2=–0.7 V
–6
–2
–0.7
mA
(BD)
IOL2
VOL2=VSS2+0.7 V
0.7
2
6
mA
Output Current 3
IOH3
VOH3=–0.5 V
–3.0
–1.2
–0.2
mA
(RI, CI, OPO0, OPO1)
IOL3
VOL3=VSS+0.5 V
15
30
100
mA
Output Current 4
IOH4
VOH4=–0.5 V
–1.5
–0.6
–0.15
mA
(When L0 to L7 are
IOL4
VOL4=VSS+0.5 V
0.15
0.6
1.5
mA
output ports)
IOH4S
VSS=–5 V, VOH4=–0.5 V
–2
–0.7
–0.2
mA
IOL4S
VSS=–5 V, VOL4S=VSS+0.5 V
0.2
0.7
2.0
mA
IOH5
VOH5=–0.5 V
–6
–2
–0.7
mA
(OSC2)
IOL5
VOL5=VSSL+0.5 V
0.7
2
6
mA
Output Current 6
IOH6
VOH6=–0.2 V (VDD level)
—
—
–4
mA
Output Current 5
(L0 to L30)
IOMH6
VOMH6=VSS1+0.2 V (VSS1 level)
4
—
—
mA
IOMH6S
VOMH6S=VSS1–0.2 V (VSS1 level)
—
—
–4
mA
IOML6
VOML6=VSS2+0.2 V (VSS2 level)
4
—
—
mA
IOML6S
VOML6S=VSS2–0.2 V (VSS2 level)
—
—
–4
mA
IOL6
VOL6=VSS3+0.2 V (VSS3 level)
4
—
—
mA
Output Leakage
IOOH
VOH=VDD
—
—
0.3
mA
(P0.0 to P0.3)
IOOL
VOL=VSS2
–0.3
—
—
mA
Measuring
Circuit
2
(P1.0 to P1.3)
(P1.0 to P1.3)
15/25
¡ Semiconductor
MSM64169
DC Characteristics (Continued)
(VDD=VDDA=0 V, VSS1=VSSL= –1.5 V, VSS2=VSS=VSSA= –3.0 V, VSS3= –4.5 V, Ta= –40 to +85°C
unless otherwise specified)
Parameter
Symbol
Condition
Min.
30
IIH1
VIH1=VDD (When pulled down)
Input Current 1
IIL1
VIL1=VSS
(P0.0 to P0.3)
IIH1S
VIH1=VDD, VSS=–5 V
80
Unit
90
300
mA
–90
–30
mA
250
800
mA
IIL1S
VIL1=VSS=–5 V(When pulled up) –800
–250
–80
mA
IIH1Z
VIH1=VDD (At high impedance)
0
—
1
mA
IIL1Z
VIL1=VSS
(At high impedance)
–1
—
0
mA
–90
–30
mA
—
1
mA
—
0
mA
–250
–125
mA
(When pulled up) –300
Input Current 2
IIL2
VIL2=VSSA
(OPP0, OPP1, OPN0,
IIH2Z
VIH2=VDD (At high impedance)
0
–1
OPN1, VOF)
IIL2Z
VIL2=VSSA (At high impedance)
Input Current 3
IIL3
VIL3=VSSA
(VrA)
IIH3
VIH3=VrA+30 mV
Input Current 4
IIL4
VIL4=VSS2
(OSC1)
IIH4Z
VIH4=VDD (At high impedance)
IIL4Z
VIL4=VSS2 (At high impedance)
Input Current 5
IIH5
VIH5=VDD
0
—
1
mA
(RESET, TST1, TST2)
IIL5
VIL5=VSS2
–3
–1.5
–0.75
mA
Input Current 6
IIH6Z
VIH6=VDD (At high impedance)
0
—
1
mA
IIL6Z
(At high impedance)
–1
—
0
mA
(RCM, CZ1, CZ2
Measuring
Circuit
(When pulled down)
(P1.0 to P1.3)
(P2.0 to P2.3)
(When pulled up) –300
Typ. Max.
VIL6=VSSA
(ENADC=0) –375
(ENADC=1)
1
8
—
mA
–110
–10
mA
0
—
1
mA
–1
—
0
mA
(When pulled up) –300
3
AIN0 to 3, RA)
Input Voltage 1
VIH1
–0.6
—
0
V
(P0.0 to P0.3)
VIL1
–3.0
—
–2.4
V
(P1.0 to P1.3)
VIH1S
VSS=–5 V
–1
—
0
V
(P2.0 to P2.3)
VIL1S
VSS=–5 V
–5
—
–4
V
Input Voltage 2
VIH2
–0.6
—
0
V
(OSC1, RESET, TST1, TST2)
VIL2
–3.0
—
–2.4
V
4
16/25
¡ Semiconductor
MSM64169
DC Characteristics (Continued)
(VDD=VDDA=0 V, VSS1=VSSL= –1.5 V, VSS2=VSS=VSSA= –3.0 V, VSS3= –4.5 V, Ta= –40 to +85°C
unless otherwise specified)
Parameter
Hysteresis Width
(P0.0 to P0.3)
(P1.0 to P1.3)
(P2.0 to P2.3)
Hysteresis Width
(RESET, TST1, TST2)
Symbol
Condition
Min.
DVT1
—
0.2
0.5
1
V
0.25
1.0
1.5
V
DVT1S
VSS=–5 V
Typ. Max.
Unit
DVT2
—
0.2
0.5
1
V
CIN
—
—
—
5
pF
Measuring
Circuit
4
Input Capacitance
(P0.0 to P0.3)
(P1.0 to P1.3)
1
(P2.0 to P2.3)
17/25
¡ Semiconductor
MSM64169
A/D Converter Characteristics
(VDD=VDDA=0 V, VSS2=VSS=VSSA= –3 V, Ta= –40 to +85°C, VrA=–1.2 V, at execution of 12-bit A/D conversion,
unless otherwise specified)
Parameter
Symbol
Condition
Min.
VAIN
—
–1.2
—
–0.4
V
VOPP
—
–1.6
—
–0.4
V
Resolution
—
—
—
—
12+S*
bits
Linearity Error
—
—
–1
—
+1
LSB
Zero Scale Error
—
—
–2
—
+2
LSB
–16
—
+16
LSB
(Pin Name)
Analog Input Voltage Range
(AIN0 to AIN3)
Analog Input Voltage Range
(OPP0, OPP1) (VOF)
*
Typ. Max.
Unit
Full Scale Error
—
—
VrA Voltage (VrA)
VrA
Ta=25°C
VrA Temperature Coefficient
—
—
–8
—
2
mV/°C
VG Voltage (VG)
VG
Ta=25°C
–867
–800
–733
mV
RA Voltage (RA)
VRA
Ta=25°C
–440
–400
–360
mV
–1300 –1200 –1100
Measuring
Circuit
5
mV
"S" indicates a sign bit.
Voltage Amplification Circuit Characteristics
(VDD=VDDA=0 V, VSS2=VSS=VSSA= –3 V, Ta= –40 to +85°C unless otherwise specified)
Parameter
(Pin Name)
Symbol
Condition (*1)
Min.
Typ. Max.
–3.0
–1.5
Unit
Measuring
Circuit
VOPP1–VOPP0=10 mA, Gain=40
Amplifier Gain Error *1
Level Shift Error *1
Eg (*2)
EI
(VOPO1–VOPO0)/(VOPP1–VOPP0)
–1
Eg=
Gain
(VAIN3–VVOF)
–1
EI=
(VOPO1–VOPO0)
0
%
5
–4
—
+4
%
*1 Errors caused by offset voltage are excluded.
*2 Errors decrease in proportion to gain.
18/25
¡ Semiconductor
MSM64169
Measuring Circuit 1
Rs1
Rs0
RI
CZ1
CI
CZ2
CN
VDD
AIN0
VrA RCM
RI
CZ1
CI
CZ2
VG
XT
XTAL
OSC1
OSC2
C1
VSSL
VDDA
C2
VDD
VSSA
VSS2
A
CL
XT
MSM64169
ROS
V
VSS1
VSS3
Ca
VSS
Cb
V
C12
V
Ca, Cb, C12, CL
ROS
XTAL
RI
CI, CZ1, CZ2
CN
Rs1
Rs0
: 0.1 mF
: 100 kW
: 32.768 kHz
: 750 kW
: 0.1 mF
: 1000 pF
: 100 kW
: 10 kW
Measuring Circuit 2
(*1)
MSM64169
Output
VIH
Input
(*2)
A
VIL
VDDA VDD
VSS1 VSS2
VSS3
VSSL VSS VSSA
19/25
¡ Semiconductor
MSM64169
Measuring Circuit 3
(*3)
VDD
Output
Input
A
MSM64169
VDDA VSS1
VSS2
VSS3
VSSL
VSS VSSA
VSSL
VSS VSSA
Output
(*3)
Input
VIH
MSM64169
Waveform Check
Measuring Circuit 4
VIL
VDDA
VDD
VSS1
VSS2
VSS3
*1 Input logic selects specified state.
*2 Repeated for each specified output pin.
*3 Repeated for each specified input pin.
20/25
¡ Semiconductor
MSM64169
Measuring Circuit 5
RA
RV0F
RS
RI
CZ1
CI
CZ2
CN
VDD
AIN0 VOF VrA RA RCM
RI
CZ1
CI
CZ2
OPO0
R0
XTAL
OPN0
Rg
XT
OPN1
R1
CL
VG
XT
OPO1
C1
VSSL
VDDA
C2
VDD
VSSA
VSS2
VSS1
Ca
VSS3
Cb
C12
VSS
Ca, Cb, C12, CL
XTAL
RI
CI, CZ1, CZ2
CN
RA
RVOF
RS
R0, R1
Rg
: 0.1 mF
: 32.768 kHz
: 750 kW
: 0.1 mF
: 1000 pF
: 10 kW
: 10 kW max
: 10 kW max
: 270 kW
: 100 kW max
21/25
¡ Semiconductor
MSM64169
FUNCTIONAL DESCRIPTION
CPU Peripheral Function
• A/D converter (ADC)
The MSM64169 has a 4-channel input dual slope A/D converter. In dual slope A/D conversion,
the relationship between integral voltage and time is given by:
Vin/Vr = t1/t2
where,
t1 = given time for which an analog input voltage is integrated
Vr = reference voltage
Vin = voltage resulted from charging for t1
t2 = time required to discharge the voltage, from Vr to Vin
From the above equation, Vin is found.
The range of Vin is –0.8 ±0.4 V. The A/D converter resolution time is programmable. The A/
D converter has a preamplifier for amplifying a microvoltage. It is suited to applications such
as thermometer, pressure gauge, and hygrometer.
• LCD driver (LCD)
The MSM64169 has a built-in LCD driver for 64 outputs.
The LCD driver consists of 64 ¥ 4-bit display registers (64 nibbles out of DSPR0 to 127), a display
control register (DSPCON), a 63-output LCD driver circuit, and a bias generation circuit (BIAS).
There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty.
A mask option can select either a common driver or a segment driver for each LCD driver pin.
A mask option can also specify the assignment of each bit of the display register to each segment.
L0 to L7 of the LCD driver can become output ports via a mask option.
The relationship between the duty, the bias method and the maximum segment number
follows:
1/4 duty 1/3 bias method ......... 240 segments
1/3 duty 1/3 bias method ......... 184 segments
1/2 duty 1/2 bias method ......... 124 segments
• Port (P0, P1, P2)
The MSM64169 has three input-output ports (P0, P1, P2) with 4 bits each. Each bit of the ports
can be configured to be an input or output, pull-up/pull-down resistor input or high impedance
input, or NMOS open drain output or CMOS output. A change in the input level of each pin
of P0 and P1 generates an external interrupt 0 request, and a change in the input level of each
pin of P2 generates an external interrupt 1 request.
The serial port function and the timer function area assigned as the secondary funciton.
• Buzzer driver (BD)
The MSM64169 has a built-in buzzer driver with two buzzer output frequencies and four buzzer
output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the
Buzzer Frequency Control Register (BFCON).
• Serial port (SIOP)
The MSM64169 has a serial port (SIOP). The serial port is a synchronous/asynchronous
selectable serial communication port. The transmit section and the receive section are independent
of each other, which allows simultaneous operation of transmission and receiving.
22/25
¡ Semiconductor
MSM64169
• Watchdog timer (WDT)
The MSM64169 has a built-in watchdog timer to detect CPU run-away. The watchdog timer
consists of a 6-bit watchdog timer counter (WDTC), which counts the 16 Hz output of the time
base counter, and a watchdog timer control register (WDTCON) to reset WDTC.
• Capture circuit (CAP)
The MSM64169 captures a 32 Hz to 256 Hz output of the time base counter at the falling edge
of Port 1.0 or 1.1 (P1.0 or P1.1) when the pull-up resistor input is chosen, or at the rising edge
when the pull-down resistor input is chosen.
The capture circuit is composed of the Capture Control Register (CAPCON) and the Capture
Registers (CAPR0, CAPR1) that fetch output from the time base counter.
•Timer (TM)
The MSM64169 has a 16-bit timer (TM). The timer has three operation modes: auto-reload
mode, capture mode, and clock frequency measuring mode. It counts at 32.768 kHz or 700 kHz
or by an external clock. The timer is used for pulse generation, time measurement, etc., and is
also used as an A/D conversion counter at A/D conversion and as a baud rate generator at serial
communication.
• Clock generation circuit (2CLK)
The MSM64169 has a clock generation circuit (2CLK) that generates clocks of two types: lowspeed and high-speed. The circuit consists of a 32.768 kHz crystal oscillation circuit, a 700 kHz
RC oscillation cricuit, and a clock control section. This circuit generates the system clock (CLK),
crystal oscillation clock (32.768 kHz), and RC oscillation clock (700 kHz).
The system clock is the basic operation clock of the CPU, and the crystal oscillation clock is the
basic operation clock of the time-base counter and the buzzer driver. The crystal oscillation
clock and RC oscillation clock are supplied to the timer to become a timer clock.
The system clock frequency is switched between 32.768 kHz (output of the crystal oscillation
circuit) and 700 kHz (output of the RC oscillation circuit) based on the contents of the frequency
control register (FCON).
Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of
external resistor (ROS), operating voltage (VSS2), and ambient temperature (Ta).
• Time base counter (TBC)
The MSM64169 has a built-in time base counter (TBC) that generates clocks to be supplied to
internal peripheral circuits. The time base counter is composed of 15 binary counters. The count
clock of the time base is supplied by the oscillation clock (32.768 kHz) of the crystal oscillation
circuit. Output of the time base counter is used for buzzer driver, system reset circuit, watchdog
timer, time base interrupt, sampling clocks for each port, and LCD driver.
• Interrupt (INTC)
The MSM64169 has ten interrupt sources (ten vector addresses) of which two are external
interrupts from ports and eight are internal interrupts.
Of the ten interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable
interrupt). The other nine interrupts are controlled by the master interrupt enable flag (MI) and
the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the
program branches to a vector address corresponding to the interrupt source, and then control
is passed to the interrupt routine.
23/25
ROS
OSC2
OSC1
RESET
VDD
XT
XT
32.768 kHz
L0
L63
VDD
C2
C1 C12
VSS3
C3
VSS2
VSS
VSS1
VSSL
TST2
TST1
BD
CGEX
P1.0
P1.1
P1.2
P1.3
P0.0
P0.2
P0.3
P2.1
Switch
Matrix
(4 ¥ 4)
TxD
RxD
P2.0
P0.1
VG
CZ2
RI
RCM
CZI
CI
VSSA
AIN2
AIN1
VrA
VOF
AIN3
OPP0
OPP1
AIN0
RA
VDDA
OPO0
OPN0
OPN1
OPO1
Asynchronous
serial
communication
MSM64169-XXX
RI
CZ2
CN
CS
3V
5V
C1
CL
• 5 V interface
• Pressure measurement
by pressure sensor
(AIN0, 3)
• Temperature
measurement by
thermistor
(AIN1)
• Detection of low voltage
(AIN2)
• CGEX for crystal
oscillation circuit
: external fixing
24/25
MSM64169
Pressure sensor
CI CZ
C2
¡ Semiconductor
APPLICATION CIRCUIT
LCD
¡ Semiconductor
MSM64169
PACKAGE DIMENSIONS
(Unit : mm)
QFP128-P-1420-0.50-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.19 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
25/25