Product Folder Sample & Buy Support & Community Tools & Software Technical Documents LM285-2.5, LM385-2.5, LM385B-2.5 SLVS023K – JANUARY 1989 – REVISED MARCH 2016 LMx85-2.5, LM385B-2.5 Micropower Voltage References 1 Features • • • 1 • 3 Description The LMx85-2.5 and LM385B are micropower, twoterminal, band-gap voltage references that operate over a 20-μA to 20-mA current range and feature exceptionally low dynamic impedance and good temperature stability. On-chip trimming provides tight voltage tolerance. The band-gap reference for these devices has low noise and long-term stability. Operating Current Range 20 μA to 20 mA 1.5% and 3% Initial Voltage Tolerance Reference Impedance – LM385 1 Ω Maximum at 25°C – All Devices 1.5 Ω Maximum Over Full Temperature Range Very Low Power Consumption The design makes these devices exceptionally tolerant of capacitive loading and, thus, easier to use in most reference applications. The wide dynamic operating temperature range accommodates varying current supplies, with excellent regulation. 2 Applications • • • • • Portable Meter References Portable Test Instruments Battery-Operated Systems Current-Loop Instrumentation Panel Meters The extremely low power drain of this series makes these devices useful for micropower circuitry. These voltage references can be used to make portable meters, regulators, or general-purpose analog circuitry, with battery life approaching shelf life. The wide operating current range of these voltage references allows them to replace older references with tighter-tolerance parts. Device Information(1) PART NUMBER PACKAGE BODY SIZE (NOM) LMx85D-2-5, LM385BD-2-5 SOIC (8) 4.90 mm × 3.90 mm LMx85LP-2-5, LM385BLP-2-5 TO-92 (3) 4.30 mm × 4.30 mm LM385PW-2-5, LM385BPW-2-5 TSSOP (8) 3.00 mm × 4.40 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic ANODE CATHODE 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. LM285-2.5, LM385-2.5, LM385B-2.5 SLVS023K – JANUARY 1989 – REVISED MARCH 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 6 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics........................................... Typical Characteristics .............................................. Detailed Description .............................................. 8 7.1 Overview ................................................................... 8 7.2 Functional Block Diagram ......................................... 8 7.3 Feature Description................................................... 8 7.4 Device Functional Modes.......................................... 8 8 Application and Implementation .......................... 9 8.1 Application Information.............................................. 9 8.2 Typical Application .................................................... 9 8.3 System Examples ................................................... 10 9 Power Supply Recommendations...................... 11 10 Layout................................................................... 11 10.1 Layout Guidelines ................................................. 11 10.2 Layout Example .................................................... 11 11 Device and Documentation Support ................. 12 11.1 11.2 11.3 11.4 11.5 Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 12 12 12 12 12 12 Mechanical, Packaging, and Orderable Information ........................................................... 12 4 Revision History Changes from Revision J (March 2005) to Revision K • 2 Page Added Features section, Device Information table, Table of Contents, Revision History section, Pin Configuration and Functions section, Specifications section, Absolute Maximum Ratings table, ESD Ratings table, Thermal Information table, Detailed Description section, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section ...................................................................................................................... 1 Submit Documentation Feedback Copyright © 1989–2016, Texas Instruments Incorporated Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 LM285-2.5, LM385-2.5, LM385B-2.5 www.ti.com SLVS023K – JANUARY 1989 – REVISED MARCH 2016 5 Pin Configuration and Functions D or PW Package 8-Pin SOIC and TSSOP Top View NC NC NC ANODE 1 8 2 7 3 6 4 5 LP Package 3-Pin TO-92 Top View CATHODE NC NC NC ANODE CATHODE NC NC − No internal connection NC − No internal connection Pin Functions PIN NAME ANODE CATHODE NC NO. SOIC TSSOP TYPE DESCRIPTION TO-92 4 1 I Shunt Current/Voltage Input 8 1, 2, 3, 5, 6, 7 2 O Common pin, typically connected to ground 3 — No Internal Connection Copyright © 1989–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 3 LM285-2.5, LM385-2.5, LM385B-2.5 SLVS023K – JANUARY 1989 – REVISED MARCH 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT 30 mA Forward current 10 mA Lead temperature 1.6 mm (1/16 inch) from case for 10 seconds 260 °C TJ Junction temperature 150 °C Tstg Storage temperature 150 °C IR Reverse current IF (1) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 6.2 ESD Ratings VALUE V(ESD) (1) (2) Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) ±2000 Charged-device model (CDM), per JEDEC specification JESD22-C101 (2) ±1000 UNIT V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process 6.3 Recommended Operating Conditions over operating free-air temperature range (unless otherwise noted) IZ Reference current TA Operating free-air temperature LM285-2.5 MIN MAX 0.02 20 –40 85 0 70 LM385-2.5, LM385B-2.5 UNIT mA °C 6.4 Thermal Information LMx85-2.5, LM385B-2.5 THERMAL METRIC (1) D (SOIC) LP (T0-92) PW (TSSOP) 8 PINS 3 PINS 8 PINS UNIT RθJA Junction-to-ambient thermal resistance 112 157 168.3 °C/W RθJC(top) Junction-to-case (top) thermal resistance 58.5 80.3 53.7 °C/W RθJB Junction-to-board thermal resistance 52.1 N/A 96.4 °C/W ψJT Junction-to-top characterization parameter 15.8 24.6 4.5 °C/W ψJB Junction-to-board characterization parameter 51.7 136.2 94.7 °C/W (1) 4 For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 1989–2016, Texas Instruments Incorporated Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 LM285-2.5, LM385-2.5, LM385B-2.5 www.ti.com SLVS023K – JANUARY 1989 – REVISED MARCH 2016 6.5 Electrical Characteristics TA = 25°C unless otherwise noted. PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 2.462 2.5 2.538 V LM285-2.5 IZ = 20 μA to 20 mA VZ Reference voltage α Average temperature coefficient of reference voltage (1) VZ IZ = 20 μA to 20 mA IZ = 20 μA to 1 mA ΔVZ Change in reference voltage with current IZ = 1 mA to 20 mA ΔVZ/Δt Long-term change in reference voltage IZ = 100 μA IZ(MIN) Minimum reference current Full range Full range (2) ±20 ppm/°C TA = 25°C 1 Full range 1.5 TA = 25°C 10 Full range 30 ±20 TA = 25°C zz Reference impedance IZ = 100 µA Vn Broadband noise voltage IZ = 100 μA, f = 10 Hz to 10 kHz VZ Reference voltage IZ = 20 μA to 20 mA α Average temperature coefficient of reference voltage (1) mV ppm/khr 8 20 0.2 0.6 Full range µA Ω 1.5 120 µV LM385-2.5 VZ IZ = 20 μA to 20 mA IZ = 20 μA to 1 mA ΔVZ Change in reference voltage with current IZ = 1 mA to 20 mA ΔVZ/Δt Long-term change in reference voltage IZ = 100 μA IZ(MIN) Minimum reference current Full range 2.425 Full range (2) 2.5 2.575 ±20 TA = 25°C ppm/°C 2 Full range 2 TA = 25°C 20 Full range 30 ±20 TA = 25°C zz Reference impedance IZ = 100 µA Vn Broadband noise voltage IZ = 100 μA, f = 10 Hz to 10 kHz V ppm/khr 8 20 0.4 1 Full range mV µA Ω 1.5 120 µV LM385B-2.5 IZ = 20 μA to 20 mA VZ Reference voltage α Average temperature coefficient of reference voltage (1) VZ IZ = 20 μA to 20 mA IZ = 20 μA to 1 mA ΔVZ Change in reference voltage with current IZ = 1 mA to 20 mA ΔVZ/Δt Long-term change in reference voltage IZ = 100 μA IZ(MIN) Minimum reference current Full range 2.462 Full range 2.538 ±20 2 2 TA = 25°C 20 Full range 30 ±20 TA = 25°C IZ = 100 µA Vn Broadband noise voltage IZ = 100 μA, f = 10 Hz to 10 kHz V ppm/°C Full range Reference impedance (2) 2.5 TA = 25°C zz (1) (2) ppm/khr 8 20 0.4 1 Full range mV 1.5 120 µA Ω µV The average temperature coefficient of reference voltage is defined as the total change in reference voltage divided by the specified temperature range. Full range is 0°C to 70°C for the LM385-2.5 and LM385B-2.5, and −40°C to 85°C for the LM285-2.5. Copyright © 1989–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 5 LM285-2.5, LM385-2.5, LM385B-2.5 SLVS023K – JANUARY 1989 – REVISED MARCH 2016 www.ti.com 6.6 Typical Characteristics Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. 16 ∆V Z − Reference Voltage Change − mV I R − Reverse Current − µA 100 10 1 0.5 1 1.5 2.5 2 8 4 0 −4 0.01 0.1 0 12 3 0.1 1 Figure 1. Reverse Current vs Reverse Voltage Figure 2. Reference Voltage Change vs Reverse Current 1.6 2.525 IZ = 20 µA to 20 mA TA = 25°C 2.52 VZ − Reference Voltage − V V F − Forward Voltage − V 100 TA = 25°C TA = 25°C 1.4 10 IR − Reverse Current − mA VR − Reverse Voltage − V 1.2 1 0.8 0.6 0.4 2.51 2.505 2.5 2.495 2.49 0.2 0 0.01 2.515 2.485 0.1 1 10 2.48 − 55 − 35 − 15 100 IF − Forward Current − mA 5 25 45 65 85 105 125 TA − Free-Air Temperature − °C Figure 3. Forward Voltage vs Forward Current Figure 4. Reference Voltage vs Free-Air Temperature 1000 10 k z z − Reference Impedance − Ω z z − Reference Impedance − Ω IZ = 100 µA TA = 25°C 100 10 1 0.1 0.01 0.1 1 10 100 1k 100 10 1 0.1 0.01 0.1 f = 25 Hz 10 100 1000 TA = 25°C Figure 5. Reference Impedance vs Reference Current 6 1 f − Frequency − kHz Iz − Reference Current − mA Submit Documentation Feedback Figure 6. Reference Impedance vs Frequency Copyright © 1989–2016, Texas Instruments Incorporated Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 LM285-2.5, LM385-2.5, LM385B-2.5 www.ti.com SLVS023K – JANUARY 1989 – REVISED MARCH 2016 Typical Characteristics (continued) Data at high and low temperatures are applicable only within the rated operating free-air temperature ranges of the various devices. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions. 1400 IZ = 100 µA TA = 25°C Vn − Noise Voltage − nV/ Hz 1200 1000 800 600 400 200 0 10 100 1k 10 k 100 k f − Frequency − Hz Figure 7. Noise Voltage vs Frequency Copyright © 1989–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 7 LM285-2.5, LM385-2.5, LM385B-2.5 SLVS023K – JANUARY 1989 – REVISED MARCH 2016 www.ti.com 7 Detailed Description 7.1 Overview The LMx85-2.5 and LM385B-2.5 devices maintain a nearly constant voltage between the cathode and anode of 2.5 V when the minimum cathode current up to the recommended maximum is provided. See Recommended Operating Conditions for recommended minimum cathode current. 7.2 Functional Block Diagram CATHODE Q13 600 kΩ 7.5 kΩ Q12 Q4 Q7 200 kΩ Q11 Q3 50 kΩ Q10 Q1 20 pF 300 kΩ 20 pF 500 kΩ Q9 Q2 Q5 Q6 500 Ω 100 kΩ Q8 Q14 500 kΩ 60 kΩ ANODE 7.3 Feature Description A band-gap voltage reference controls a high-gain amplifier and shunt pass element to maintain a nearly constant voltage between the cathode and anode of 2.5 V. Regulation occurs after a minimum current is provided to power the voltage divider and amplifier. Internal frequency compensation provides a stable loop for all capacitive loads. Floating shunt design is useful for both positive and negative regulation applications. 7.4 Device Functional Modes The LMx85-2.5 and LM385B-2.5 devices have a single functional mode. These devices can be used as 2.5-V fixed voltage references. The reference voltage cannot be adjusted for these devices. In order for a proper Reverse Voltage to be developed, current must be sourced into the cathode of LM285. The minimum current needed for proper regulation is denoted in Electrical Characteristics as IZ(MIN). 8 Submit Documentation Feedback Copyright © 1989–2016, Texas Instruments Incorporated Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 LM285-2.5, LM385-2.5, LM385B-2.5 www.ti.com SLVS023K – JANUARY 1989 – REVISED MARCH 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The LMx85-2.5 and LM385B-2.5 devices create a voltage reference for use in a variety of applications including amplifiers, power supplies, and current-sensing circuits. 8.2 Typical Application Figure 8 shows how to use these devices to establish a 2.5-V source from a 9-V battery. 9V 221 kΩ 2.5 V LM385-2.5 Figure 8. Reference From a 9-V Battery 8.2.1 Design Requirements The key design requirement when using this device as a voltage reference is to supply the LM385 with a minimum Cathode Current (IZ), as indicated in Electrical Characteristics. 8.2.2 Detailed Design Procedure To generate a constant and stable reference voltage, a current greater than IZ(MIN) must be sourced into the cathode of this device. This can be accomplished using a current regulating device such as LM334 or a simple resistor. For a resistor, its value should be equal to or greater than (Vsupply - Vreference) ÷ IZ(MIN) . 8.2.3 Application Curve Input and Output Voltage − V 4 3 Output 24 kΩ 2 VI VO 1 0 5 Input 0 0 100 t − Time − µs 500 600 Figure 9. Device Transient Response Copyright © 1989–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 9 LM285-2.5, LM385-2.5, LM385B-2.5 SLVS023K – JANUARY 1989 – REVISED MARCH 2016 www.ti.com 8.3 System Examples 8.3.1 Thermocouple Cold-Junction Compensator Figure 10 shows how to use the LM385-2.5 in a circuit for thermocouple cold-junction compensation. IO ≈ 60 µA + Two Mercury Cells 2.6 V − V+ 3.3 kΩ 200 kΩ ±1% LM334 cw R 2.00 kΩ ±1% cw V− 20 kΩ 500 Ω 412 Ω† ±1% 953 Ω ±1% LM385-2.5 + Type K − Meter † Adjust for 12.17 mV at 25°C across 412 Ω Figure 10. Thermocouple Cold-Junction Compensator 8.3.2 Generating Reference Voltage with a Constant Current Source The LM334 device can be used to set the cathode current of the LM385-2.5 device over a wide range of input voltages to ensure proper voltage regulation by the LM385-2.5 device. V+ 3.7 V ≤ V+ ≤ 30 V LM334 R V− 2.74 kΩ 2.5 V LM385-2.5 Figure 11. Generating Reference Voltage With a Constant Current Source Device 10 Submit Documentation Feedback Copyright © 1989–2016, Texas Instruments Incorporated Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 LM285-2.5, LM385-2.5, LM385B-2.5 www.ti.com SLVS023K – JANUARY 1989 – REVISED MARCH 2016 9 Power Supply Recommendations The supply voltage should be current limited to ensure that the maximum cathode current is not exceeded. For applications shunting high currents (30 mA maximum), pay attention to the cathode and anode trace lengths, and adjust the width of the traces to have the proper current density. 10 Layout 10.1 Layout Guidelines Figure 12 shows an example of a PCB layout of LMx85x-2.5. Some key Vref noise considerations are: • It is optional to connect a low-ESR, 0.1-μF (CL) ceramic bypass capacitor on the cathode pin node. • Decouple other active devices in the system per the device specifications. • Using a solid ground plane helps distribute heat and reduces electromagnetic interference (EMI) noise pickup. • Place the external components as close to the device as possible. This configuration prevents parasitic errors (such as the Seebeck effect) from occurring. • Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if possible and only make perpendicular crossings when absolutely necessary. 10.2 Layout Example Rsup NC 1 NC 2 NC 3 8 CATHODE 7 6 4 5 NC NC NC ANODE GND Vsup CL GND Figure 12. Layout Diagram Copyright © 1989–2016, Texas Instruments Incorporated Submit Documentation Feedback Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 11 LM285-2.5, LM385-2.5, LM385B-2.5 SLVS023K – JANUARY 1989 – REVISED MARCH 2016 www.ti.com 11 Device and Documentation Support 11.1 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 1. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY LM285-2.5 Click here Click here Click here Click here Click here LM385-2.5 Click here Click here Click here Click here Click here LM385B-2.5 Click here Click here Click here Click here Click here 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 11.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 12 Submit Documentation Feedback Copyright © 1989–2016, Texas Instruments Incorporated Product Folder Links: LM285-2.5 LM385-2.5 LM385B-2.5 PACKAGE OPTION ADDENDUM www.ti.com 15-Jan-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM285D-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-25 LM285DG4-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-25 LM285DR-2-5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-25 LM285DRG4-2-5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 285-25 LM285LP-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type -40 to 85 285-25 LM285LPE3-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type -40 to 85 285-25 LM285LPR-2-5 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type -40 to 85 285-25 LM285LPRE3-2-5 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type -40 to 85 285-25 LM385BD-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B25 LM385BDE4-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B25 LM385BDR-2-5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B25 LM385BDRE4-2-5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B25 LM385BLP-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385B25 LM385BLPE3-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385B25 LM385BLPR-2-5 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385B25 LM385BPWR-2-5 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385B25 LM385D-2-5 ACTIVE SOIC D 8 75 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-25 Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Jan-2016 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) LM385DR-2-5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-25 LM385DRG4-2-5 ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-25 LM385LP-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385-25 LM385LPE3-2-5 ACTIVE TO-92 LP 3 1000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385-25 LM385LPR-2-5 ACTIVE TO-92 LP 3 2000 Pb-Free (RoHS) CU SN N / A for Pkg Type 0 to 70 385-25 LM385PWR-2-5 ACTIVE TSSOP PW 8 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 385-25 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Addendum-Page 2 Samples PACKAGE OPTION ADDENDUM www.ti.com 15-Jan-2016 (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. 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Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 15-Feb-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device LM285DR-2-5 Package Package Pins Type Drawing SOIC SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM385BDR-2-5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM385BPWR-2-5 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 LM385DR-2-5 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1 LM385PWR-2-5 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 15-Feb-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM285DR-2-5 SOIC D 8 2500 340.5 338.1 20.6 LM385BDR-2-5 SOIC D 8 2500 340.5 338.1 20.6 LM385BPWR-2-5 TSSOP PW 8 2000 367.0 367.0 35.0 LM385DR-2-5 SOIC D 8 2500 340.5 338.1 20.6 LM385PWR-2-5 TSSOP PW 8 2000 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE PW0008A TSSOP - 1.2 mm max height SCALE 2.800 SMALL OUTLINE PACKAGE C 6.6 TYP 6.2 SEATING PLANE PIN 1 ID AREA A 0.1 C 6X 0.65 8 1 3.1 2.9 NOTE 3 2X 1.95 4 5 B 4.5 4.3 NOTE 4 SEE DETAIL A 8X 0.30 0.19 0.1 C A 1.2 MAX B (0.15) TYP 0.25 GAGE PLANE 0 -8 0.15 0.05 0.75 0.50 DETAIL A TYPICAL 4221848/A 02/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-153, variation AA. www.ti.com EXAMPLE BOARD LAYOUT PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM 1 8 (R0.05) TYP SYMM 6X (0.65) 5 4 (5.8) LAND PATTERN EXAMPLE SCALE:10X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.05 MAX ALL AROUND 0.05 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4221848/A 02/2015 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN PW0008A TSSOP - 1.2 mm max height SMALL OUTLINE PACKAGE 8X (1.5) 8X (0.45) SYMM (R0.05) TYP 1 8 SYMM 6X (0.65) 5 4 (5.8) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:10X 4221848/A 02/2015 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. 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