IPB77N06S2-12 IPP77N06S2-12 OptiMOS® Power-Transistor Product Summary Features V DS • N-channel - Enhancement mode 55 R DS(on),max (SMD version) • Automotive AEC Q101 qualified ID 11.7 77 V mΩ A • MSL1 up to 260°C peak reflow • 175°C operating temperature PG-TO263-3-2 PG-TO220-3-1 • Green package (lead free) • Ultra low Rds(on) • 100% Avalanche tested Type Package Ordering Code Marking IPB77N06S2-12 PG-TO263-3-2 SP0002-18173 2N0612 IPP77N06S2-12 PG-TO220-3-1 SP0002-18172 2N0612 Maximum ratings, at T j=25 °C, unless otherwise specified Parameter Symbol Continuous drain current1) ID Conditions T C=25 °C, V GS=10 V T C=100 °C, V GS=10 V2) Value 77 Unit A 56 Pulsed drain current2) I D,pulse T C=25 °C 308 Avalanche energy, single pulse2) E AS I D= 77 A 280 mJ Gate source voltage4) V GS ±20 V Power dissipation P tot 158 W Operating and storage temperature T j, T stg -55 ... +175 °C T C=25 °C IEC climatic category; DIN IEC 68-1 Rev. 1.0 55/175/56 page 1 2005-12-27 IPB77N06S2-12 IPP77N06S2-12 Parameter Symbol Values Conditions Unit min. typ. max. Thermal characteristics2) Thermal resistance, junction - case R thJC - - 0.95 Thermal resistance, junction ambient, leaded R thJA - - 62 SMD version, device on PCB R thJA minimal footprint - - 62 6 cm2 cooling area5) - - 40 K/W Electrical characteristics, at T j=25 °C, unless otherwise specified Static characteristics Drain-source breakdown voltage V (BR)DSS V GS=0 V, I D= 1 mA 55 - - Gate threshold voltage V GS(th) V DS=V GS, I D=93 µA 2.1 3.0 4.0 Zero gate voltage drain current I DSS V DS=55 V, V GS=0 V, T j=25 °C - 0.01 1 - 1 100 V DS=55 V, V GS=0 V, T j=125 °C2) V µA Gate-source leakage current I GSS V GS=20 V, V DS=0 V - 1 100 nA Drain-source on-state resistance RDS(on) V GS=10 V, I D=38 A, - 9.8 12.0 mΩ V GS=10 V, I D=38 A, SMD version - 9.5 11.7 Rev. 1.0 page 2 2005-12-27 IPB77N06S2-12 IPP77N06S2-12 Parameter Symbol Values Conditions Unit min. typ. max. - 1770 - - 460 - Dynamic characteristics2) Input capacitance C iss Output capacitance C oss Reverse transfer capacitance Crss - 120 - Turn-on delay time t d(on) - 14 - Rise time tr - 27 - Turn-off delay time t d(off) - 34 - Fall time tf - 26 - Gate to source charge Q gs - 9 12 Gate to drain charge Q gd - 18 28 Gate charge total Qg - 45 60 Gate plateau voltage V plateau - 5.6 - V - - 77 A - - 308 V GS=0 V, V DS=25 V, f =1 MHz V DD=30 V, V GS=10 V, I D=77 A, R G=6.2 Ω pF ns Gate Charge Characteristics2) V DD=44 V, I D=77 A, V GS=0 to 10 V nC Reverse Diode Diode continous forward current2) IS Diode pulse current2) I S,pulse Diode forward voltage V SD V GS=0 V, I F=77 A, T j=25 °C - 0.9 1.3 V Reverse recovery time2) t rr V R=30 V, I F=I S, di F/dt =100 A/µs - 45 60 ns Reverse recovery charge2) Q rr - 64 80 nC T C=25 °C 1) Current is limited by die area; with an R thJC = 0.95 K/W the chip is able to carry 77 A at 25°C. For detailed information see Application Note ANPS071E at www.infineon.com/optimos 2) Defined by design. Not subject to production test. 3) See diagram 13. 4) Qualified at -20V and +20V. 5) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 µm thick) copper area for drain connection. PCB is vertical in still air. Rev. 1.0 page 3 2005-12-27 IPB77N06S2-12 IPP77N06S2-12 1 Power dissipation 2 Drain current P tot = f(T C); V GS ≥ 6 V I D = f(T C); V GS ≥ 10 V 180 100 160 80 140 120 I D [A] P tot [W] 60 100 80 40 60 40 20 20 0 0 0 50 100 150 200 0 50 T C [°C] 100 150 200 T C [°C] 3 Safe operating area 4 Max. transient thermal impedance I D = f(V DS); T C = 25 °C; D = 0 Z thJC = f(t p) parameter: t p parameter: D =t p/T 1000 100 0.5 1 µs 10 µs 0.1 10-1 100 100 µs Z thJC [K/W] 1 ms I D [A] 0.05 0.01 10-2 10 single pulse 10-3 1 0.1 1 10 100 10-6 10-5 10-4 10-3 10-2 10-1 100 t p [s] V DS [V] Rev. 1.0 10-7 page 4 2005-12-27 IPB77N06S2-12 IPP77N06S2-12 5 Typ. output characteristics 6 Typ. drain-source on-state resistance I D = f(V DS); T j = 25 °C R DS(on) = (I D); T j = 25 °C parameter: V GS parameter: V GS 300 20 10 V 18 250 16 7V R DS(on) [mΩ] 200 I D [A] 6V 5.5 V 5V 150 100 14 12 8V 6V 10 5.5 V 50 10 V 8 5V 4.5 V 0 0 2 4 6 6 8 10 0 20 40 60 80 120 I D [A] V DS [V] 7 Typ. transfer characteristics 8 Typ. Forward transconductance I D = f(V GS); V DS = 6V g fs = f(I D); T j = 25°C parameter: T j parameter: g fs 120 150 100 125 80 100 g fs [S] I D [A] 100 60 40 75 50 20 25 175 °C 25 °C -55 °C 0 0 2 3 4 5 6 Rev. 1.0 0 50 100 150 200 I D [A] V GS [V] page 5 2005-12-27 IPB77N06S2-12 IPP77N06S2-12 9 Typ. Drain-source on-state resistance 10 Typ. gate threshold voltage R DS(ON) = f(T j) V GS(th) = f(T j); V GS = V DS parameter: I D = 80 A; VGS = 10 V parameter: I D 20 4 18 3.5 16 14 V GS(th) [V] R DS(on) [mΩ] 465 µA 3 12 93 µA 2.5 10 2 8 1.5 6 4 1 -60 -20 20 60 100 140 180 -60 -20 20 60 100 140 180 T j [°C] T j [°C] 11 Typ. capacitances 12 Typical forward diode characteristicis C = f(V DS); V GS = 0 V; f = 1 MHz IF = f(VSD) parameter: T j 104 103 102 I F [A] C [pF] Ciss 103 Coss 175 °C 101 25 °C Crss 102 100 0 5 10 15 20 25 30 V DS [V] Rev. 1.0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 V SD [V] page 6 2005-12-27 IPB77N06S2-12 IPP77N06S2-12 13 Typical avalanche energy 14 Typ. gate charge E AS = f(T j) V GS = f(Q gate); I D = 80 A pulsed parameter: I D 600 12 40 A 11 V 500 44 V 10 50 A 300 V GS [V] 8 E AS [mJ] 400 77 A 6 200 4 100 2 0 0 0 50 100 150 200 0 20 T j [°C] 40 60 Q gate [nC] 15 Typ. drain-source breakdown voltage 16 Gate charge waveforms V BR(DSS) = f(T j); I D = 1 mA 66 64 V GS Qg 62 V BR(DSS) [V] 60 58 56 54 52 50 Q gate 48 Q gs Q gd 46 -60 -20 20 60 100 140 180 T j [°C] Rev. 1.0 page 7 2005-12-27 IPB77N06S2-12 IPP77N06S2-12 Published by Infineon Technologies AG St.-Martin-Straße 53 D-81541 München © Infineon Technologies AG 2004 All Rights Reserved. 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Infineon Technologies' components may only be used in life-support devices or systems with the expressed written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 1.0 page 8 2005-12-27