TSC MBRS20H100CT Dual common cathode schottky rectifier Datasheet

MBRS20H100CT thru MBRS20H200CT
Taiwan Semiconductor
CREAT BY ART
FEATURES
Dual Common Cathode Schottky Rectifier
- Low power loss, high efficiency
- Ideal for automated placement
- Guardring for overvoltage protection
- High surge current capability
- Moisture sensitivity level: level 1, per J-STD-020
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
MECHANICAL DATA
2
TO-263AB (D PAK)
Case: TO-263AB (D2PAK)
Molding compound, UL flammability classification rating 94V-0
Base P/N with suffix "G" on packing code - halogen-free
Base P/N with prefix "H" on packing code - AEC-Q101 qualified
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 1A whisker test
with prefix "H" on packing code meet JESD 201 class 2 whisker test
Polarity: As marked
Weight: 1.4 g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25℃ unless otherwise noted)
PARAMETER
SYMBOL
MBRS
MBRS
MBRS
20H100CT
20H150CT
20H200CT
Unit
Maximum repetitive peak reverse voltage
VRRM
100
150
200
V
Maximum RMS voltage
VRMS
70
105
140
V
Maximum DC blocking voltage
VDC
100
150
200
V
Maximum average forward rectified current
IF(AV)
20
A
Peak repetitive forward current
(Rated VR, Square wave, 20KHz)
IFRM
20
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
150
A
Peak repetitive reverse surge current (Note 1)
IRRM
Maximum instantaneous forward voltage (Note 2)
IF=10A, TJ=25℃
IF=10A, TJ=125℃
IF=20A, TJ=25℃
IF=20A, TJ=125℃
Maximum reverse current @ rated VR
TJ=25 ℃
TJ=125 ℃
VF
IR
1
0.5
0.85
0.88
0.75
0.75
0.95
0.97
0.85
0.85
A
V
5
μA
2
mA
Voltage rate of change (Rated VR)
dV/dt
Typical thermal resistance
RθJC
1.5
TJ
- 55 to +175
O
C
TSTG
- 55 to +175
O
C
Operating junction temperature range
Storage temperature range
10000
V/μs
O
C/W
Note 1: tp = 2.0 μs, 1.0KHz
Note 2: Pulse test with PW=300μs, 1% duty cycle
Document Number: DS_D1309041
Version: H13
MBRS20H100CT thru MBRS20H200CT
Taiwan Semiconductor
ORDERING INFORMATION
PART NO.
AEC-Q101
PACKING CODE GREEN COMPOUND
QUALIFIED
MBRS20HxxxCT
(Note 1)
PACKAGE
PACKING
D2PAK
800 / 13" Paper reel
CODE
RN
Prefix "H"
Suffix "G"
C0
2
50 / Tube
D PAK
Note 1: "xx" defines voltage from 100V (MBRS20H100CT) to 200V (MBRS20H200CT)
EXAMPLE
AEC-Q101
PREFERRED P/N
PART NO.
PACKING CODE
MBRS20H100CT RN
MBRS20H100CT
RN
MBRS20H100CT RNG MBRS20H100CT
RN
QUALIFIED
MBRS20H100CTHRN MBRS20H100CT
H
GREEN COMPOUND
CODE
G
DESCRIPTION
Green compound
RN
AEC-Q101 qualified
RATINGS AND CHARACTERISTICS CURVES
(TA=25℃ unless otherwise noted)
FIG. 2 MAXIMUM NON-REPETITIVE FORWARD SURGE
CURRENT PER LEG
AVERAGE FORWARD A
CURRENT (A)
25
20
15
10
RESISTIVE OR
INDUCTIVE LOAD
WITH HEATSINK
5
0
0
25
50
75
100
125
150
175
200
PEAK FORWARD SURGE CURRENT (A)
FIG.1 FORWARD CURRENT DERATING CURVE
180
8.3ms Single Half Sine Wave
JEDEC Method
150
120
90
60
30
0
1
10
CASE TEMPERATURE (oC)
FIG. 3 TYPICAL FORWARD CHARACTERISTICS
PER LEG
FIG. 4 TYPICAL REVERSE CHARACTERISTICS
PER LEG
INSTANTANEOUS REVERSE CURRENT
(mA)
INSTANTANEOUS FORWARD CURRENT
(A)
100
10
100
NUMBER OF CYCLES AT 60 Hz
TJ=125℃
TJ=25℃
1
PULSE WIDTH=300μs
1% DUTY CYCLE
10
TJ=125℃
1
TJ=75℃
0.1
0.01
TJ=25℃
0.001
0.0001
0.1
0
0.2
0.4
0.6
0.8
1
FORWARD VOLTAGE (V)
Document Number: DS_D1309041
1.2
1.4
1.6
0
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE (%)
Version: H13
MBRS20H100CT thru MBRS20H200CT
Taiwan Semiconductor
FIG. 5 TYPICAL JUNCTION CAPACITANCE
FIG. 6 TYPICAL TRANSIENT THERMAL IMPEDANCE
PER LEG
100
f=1.0MHz
Vsig=50mVp-p
TRANSIENT THERMAL
IMPEDANCE (℃/W)
JUNCTION CAPACITANCE (pF) A
10000
1000
10
1
0.1
100
0.1
1
10
100
0.01
0.1
1
10
100
T-PULSE DURATION(s)
REVERSE VOLTAGE (V)
PACKAGE OUTLINE DIMENSIONS
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
-
10.5
-
0.413
B
14.60
15.88
0.575
0.625
C
2.41
2.67
0.095
0.105
D
0.68
0.94
0.027
0.037
E
2.29
2.79
0.090
0.110
F
4.44
4.70
0.175
0.185
G
1.14
1.40
0.045
0.055
H
1.14
1.40
0.045
0.055
I
8.25
9.25
0.325
0.364
J
0.36
0.53
0.014
0.021
K
2.03
2.79
0.080
0.110
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
10.8
0.425
B
8.3
0.327
C
1.1
0.043
D
3.5
0.138
E
16.9
0.665
F
9.5
0.374
G
2.5
0.098
MARKING DIAGRAM
P/N
= Specific Device Code
G
= Green Compound
YWW
= Date Code
F
= Factory Code
Document Number: DS_D1309041
Version: H13
MBRS20H100CT thru MBRS20H200CT
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied,to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or seling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1309041
Version: H13
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