Material Content Data Sheet Sales Product Name 2EDL05I06PJ Issued MA# MA001331390 Package PG-DSO-14-49 5. February 2015 Weight* 138.83 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal noble metal organic material plastics inorganic material non noble metal noble metal plastics noble metal < 10% silicon phosphorus zinc iron copper gold carbon black epoxy resin silicondioxide tin silver acrylic resin silver 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-57-5 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 0.952 0.69 0.014 0.01 0.057 0.04 414 1.150 0.83 8280 46.675 33.62 34.50 336194 344991 0.228 0.16 0.16 1644 1644 0.175 0.13 wire encapsulation leadfinish plating glue *deviation Sum [%] Average Mass [ppm] Sum [ppm] 0.69 6858 6858 103 1263 9.470 6.82 78.036 56.21 63.16 562090 631562 1.226 0.88 0.88 8832 8832 0.307 0.22 0.22 2208 2208 0.119 0.09 0.423 0.30 68209 859 0.39 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 3046 3905 1000000