ISSI IS63LV1024L-10B 128k x 8 high-speed cmos static ram 3.3v revolutionary pinout Datasheet

ISSI
IS63LV1024L
128K x 8 HIGH-SPEED CMOS STATIC RAM
3.3V REVOLUTIONARY PINOUT
®
AUGUST 2002
FEATURES
• High-speed access times:
8, 10, 12 ns
• High-performance, low-power CMOS process
• Multiple center power and ground pins for
greater noise immunity
• Easy memory expansion with CE and OE
options
• CE power-down
• Fully static operation: no clock or refresh
required
• TTL compatible inputs and outputs
• Single 3.3V power supply
• Packages available:
– 32-pin 300-mil SOJ
– 32-pin 400-mil SOJ
– 32-pin TSOP (Type II)
– 32-pin STSOP (Type I)
– 36-pin BGA (8mmx10mm)
DESCRIPTION
The ISSI IS63LV1024L is a very high-speed, low power,
131,072-word by 8-bit CMOS static RAM in revolutionary
pinout. The IS63LV1024L is fabricated using ISSI's
high-performance CMOS technology. This highly reliable
process coupled with innovative circuit design
techniques, yields higher performance and low power
consumption devices.
When CE is HIGH (deselected), the device assumes a
standby mode at which the power dissipation can be
reduced down to 250 µW (typical) with CMOS input levels.
The IS63LV1024L operates from a single 3.3V power
supply and all inputs are TTL-compatible.
FUNCTIONAL BLOCK DIAGRAM
A0-A16
DECODER
128K X 8
MEMORY ARRAY
VCC
GND
I/O
DATA
CIRCUIT
I/O0-I/O7
COLUMN I/O
CE
OE
CONTROL
CIRCUIT
WE
Copyright © 2002 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice.
ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
08/07/02
1
ISSI
IS63LV1024L
PIN CONFIGURATION
PIN CONFIGURATION
32-Pin SOJ
32-Pin TSOP (Type II) (T)
32-Pin STSOP (Type I) (H)
A0
1
32
A16
A1
2
31
A15
A2
3
30
A14
A3
4
29
A13
CE
5
28
OE
I/O0
6
27
I/O7
I/O1
7
26
I/O6
Vcc
8
25
GND
GND
9
24
Vcc
I/O2
10
23
I/O5
I/O3
11
22
I/O4
WE
12
21
A12
A4
13
20
A11
A5
14
19
A10
A6
15
18
A9
A7
16
17
A8
PIN DESCRIPTIONS
2
A0
A1
A2
A3
CE
I/O0
I/O1
Vcc
GND
I/O2
I/O3
WE
A4
A5
A6
A7
32
31
30
29
28
27
26
25
24
23
22
21
20
19
18
17
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
®
A16
A15
A14
A13
OE
I/o7
I/O6
GND
Vcc
I/O5
I/O4
A12
A11
A10
A9
A8
PIN CONFIGURATION
36-mini BGA (B) (8 mm x 10 mm)
A0-A16
Address Inputs
CE
Chip Enable Input
OE
Output Enable Input
WE
Write Enable Input
I/O0-I/O7
Bidirectional Ports
Vcc
Power
A
GND
Ground
1
2
3
4
5
6
A0
A1
NC
A3
A6
A8
B
I/O4
A2
WE
A4
A7
I/O0
C
I/O5
NC
A5
D
GND
E
Vcc
F
I/O6
G
I/O7
H
A9
I/O1
Vcc
GND
NC
NC
OE
CE
A16
A15
I/O3
A10
A11
A12
A13
A14
I/O2
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
08/07/02
ISSI
IS63LV1024L
®
TRUTH TABLE
Mode
WE
CE
OE
I/O Operation
Vcc Current
X
H
X
High-Z
ISB1, ISB2
H
H
L
L
L
L
H
L
X
High-Z
DOUT
DIN
ICC1, ICC2
ICC1, ICC2
ICC1, ICC2
Not Selected
(Power-down)
Output Disabled
Read
Write
ABSOLUTE MAXIMUM RATINGS(1)
Symbol
VTERM
TBIAS
TSTG
PT
Parameter
Terminal Voltage with Respect to GND
Temperature Under Bias
Storage Temperature
Power Dissipation
Value
–0.5 to Vcc + 0.5
–55 to +125
–65 to +150
1.0
Unit
V
°C
°C
W
Notes:
1. Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a
stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect
reliability.
OPERATING RANGE
Range
Commercial
Industrial
Ambient Temperature
0°C to +70°C
–40°C to +85°C
VCC
3.3V ± 0.3V
3.3V ± 0.15V
DC ELECTRICAL CHARACTERISTICS (Over Operating Range)
Symbol Parameter
Test Conditions
Min.
Max.
Unit
VOH
Output HIGH Voltage
VCC = Min., IOH = –4.0 mA
2.4
—
V
VOL
Output LOW Voltage
VCC = Min., IOL = 8.0 mA
—
0.4
V
VIH
Input HIGH Voltage
2.2
VCC + 0.3
V
VIL
Input LOW Voltage(1)
–0.3
0.8
V
ILI
Input Leakage
GND ≤ VIN ≤ VCC
Com.
Ind.
–1
–5
1
5
µA
ILO
Output Leakage
GND ≤ VOUT ≤ VCC, Outputs Disabled
Com.
Ind.
–1
–5
1
5
µA
Notes:
1. VIL = –3.0V for pulse width less than 10 ns.
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
08/07/02
3
ISSI
IS63LV1024L
®
POWER SUPPLY CHARACTERISTICS(1) (Over Operating Range)
Symbol Parameter
-8 ns
Min. Max.
Test Conditions
-10 ns
Min. Max.
-12 ns
Min. Max.
Unit
ICC1
Vcc Operating
Supply Current
VCC = Max., CE = VIL
IOUT = 0 mA, f = Max.
Com.
Ind.
—
—
100
110
—
—
95
105
—
—
90
100
mA
ISB
TTL Standby
Current
(TTL Inputs)
VCC = Max.,
VIN = VIH or VIL
CE ≥ VIH, f = Max
Com.
Ind.
—
—
35
40
—
—
30
35
—
—
25
30
mA
ISB1
TTL Standby
Current
(TTL Inputs)
VCC = Max.,
VIN = VIH or VIL
CE ≥ VIH, f = 0
Com.
Ind.
—
—
15
20
—
—
15
20
—
—
15
20
mA
ISB2
CMOS Standby
Current
VCC = Max.,
CE ≤ VCC – 0.2V,
Com.
Ind.
—
—
1
1.5
—
—
1
1.5
—
—
1
1.5
mA
(CMOS Inputs)
VIN ≥ VCC – 0.2V, or
VIN ≤ 0.2V, f = 0
Notes:
1. At f = fMAX, address and data inputs are cycling at the maximum frequency, f = 0 means no input lines change.
CAPACITANCE(1,2)
Symbol
Parameter
CIN
Input Capacitance
CI/O
Input/Output Capacitance
Conditions
Max.
Unit
VIN = 0V
6
pF
VOUT = 0V
8
pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: TA = 25°C, f = 1 MHz, Vcc = 3.3V.
4
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
08/07/02
ISSI
IS63LV1024L
®
READ CYCLE SWITCHING CHARACTERISTICS(1) (Over Operating Range)
Symbol
-8 ns
Min.
Max.
Parameter
-10 ns
Min.
Max.
-12 ns
Min.
Max.
Unit
tRC
Read Cycle Time
8
—
10
—
12
—
ns
tAA
Address Access Time
—
8
—
10
—
12
ns
tOHA
Output Hold Time
2
—
2
—
2
—
ns
tACE
CE Access Time
—
8
—
10
—
12
ns
tDOE
OE Access Time
—
4
—
5
—
6
ns
tLZOE(2) OE to Low-Z Output
0
—
0
—
0
—
ns
tHZOE(2) OE to High-Z Output
0
4
0
5
0
6
ns
CE to Low-Z Output
3
—
3
—
3
—
ns
CE to High-Z Output
0
4
0
5
0
6
ns
tPU
CE to Power Up Time
0
—
0
—
0
—
ns
tPD
CE to Power Down Time
—
8
—
10
—
12
ns
tLZCE
(2)
tHZCE
(2)
Notes:
1. Test conditions assume signal transition times of 3 ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and C1
output loading specified in Figure 1.
2. Tested with the C2 load in Figure 1. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
AC TEST CONDITIONS
Parameter
Input Pulse Level
Input Rise and Fall Times
Input and Output Timing
and Reference Levels
Output Load
Unit
0V to 3.0V
3 ns
1.5V
See Figures 1a and 1b
AC TEST LOADS
317 Ω
ZOUT = 50 Ω
3.3V
OUTPUT
OUTPUT
50 Ω
5 pF
Including
jig and
scope
VT = 1.5V
Figure 1
Figure 2
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
08/07/02
351 Ω
5
ISSI
IS63LV1024L
®
AC WAVEFORMS
READ CYCLE NO. 1(1,2)
t RC
ADDRESS
t AA
t OHA
t OHA
DOUT
DATA VALID
PREVIOUS DATA VALID
READ1.eps
READ CYCLE NO. 2(1,3)
t RC
ADDRESS
t AA
t OHA
OE
t HZOE
t DOE
t LZOE
CE
t ACE
t HZCE
t LZCE
DOUT
HIGH-Z
DATA VALID
CE_RD2.eps
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE = VIL.
3. Address is valid prior to or coincident with CE LOW transitions.
6
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
08/07/02
ISSI
IS63LV1024L
®
WRITE CYCLE SWITCHING CHARACTERISTICS(1,3) (Over Operating Range)
Symbol
-8 ns
Min. Max.
Parameter
-10 ns
Min. Max.
-12 ns
Min. Max.
Unit
tWC
Write Cycle Time
8
—
10
—
12
—
ns
tSCE
CE to Write End
7
—
7
—
8
—
ns
tAW
Address Setup Time to
Write End
8
—
8
—
8
—
ns
tHA
Address Hold from
Write End
0
—
0
—
0
—
ns
tSA
Address Setup Time
0
—
0
—
0
—
ns
(1)
WE Pulse Width (OE High)
7
—
7
—
8
—
ns
tPWE2(2)
WE Pulse Width (OE Low)
8
—
10
—
12
—
ns
tSD
Data Setup to Write End
5
—
5
—
6
—
ns
tPWE1
tHD
Data Hold from Write End
0
—
0
—
0
—
ns
(2)
WE LOW to High-Z Output
—
4
—
5
—
6
ns
tLZWE(2)
WE HIGH to Low-Z Output
3
—
3
—
3
—
ns
tHZWE
Notes:
1. Test conditions assume signal transition times of 3ns or less, timing reference levels of 1.5V, input pulse levels of 0 to 3.0V and
output loading specified in Figure 1a.
2. Tested with the load in Figure 1b. Transition is measured ±500 mV from steady-state voltage. Not 100% tested.
3. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write, but
any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling edge of
the signal that terminates the Write.
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2 (CE Controlled, OE = HIGH or LOW)
t WC
VALID ADDRESS
ADDRESS
t SA
t SCE
t HA
CE
t AW
t PWE1
t PWE2
WE
t HZWE
DOUT
DATA UNDEFINED
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
CE_WR1.eps
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
08/07/02
7
ISSI
IS63LV1024L
®
AC WAVEFORMS
WRITE CYCLE NO. 2(1) (WE Controlled, OE = HIGH during Write Cycle)
t WC
ADDRESS
VALID ADDRESS
t HA
OE
CE
LOW
t AW
t PWE1
WE
t SA
DOUT
t HZWE
t LZWE
HIGH-Z
DATA UNDEFINED
t SD
t HD
DATAIN VALID
DIN
CE_WR2.eps
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
t WC
ADDRESS
VALID ADDRESS
OE
LOW
CE
LOW
t HA
t AW
t PWE2
WE
tSA
DOUT
DATA UNDEFINED
t HZWE
t LZWE
HIGH-Z
t SD
DIN
t HD
DATAIN VALID
CE_WR3.eps
Notes:
1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write,
but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling
edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if OE • VIH.
8
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
08/07/02
ISSI
IS63LV1024L
®
ORDERING INFORMATION
Commercial Range: 0°C to +70°C
Speed (ns)
Order Part No.
Package
8
IS63LV1024L-8T
IS63LV1024L-8H
IS63LV1024L-8J
IS63LV1024L-8K
IS63LV1024L-8B
TSOP (Type II)
STSOP (Type I) (8mm x13.4mm)
300-mil Plastic SOJ
400-mil Plastic SOJ
mBGA(8mmx10mm)
10
IS63LV1024L-10T
IS63LV1024L-10J
IS63LV1024L-10K
IS63LV1024L-10B
TSOP (Type II)
300-mil Plastic SOJ
400-mil Plastic SOJ
mBGA(8mmx10mm)
12
IS63LV1024L-12T
IS63LV1024L-12H
IS63LV1024L-12J
IS63LV1024L-12K
IS63LV1024L-12B
TSOP (Type II)
STSOP (Type I) (8mm x13.4mm)
300-mil Plastic SOJ
400-mil Plastic SOJ
mBGA(8mmx10mm)
Industrial Range: –40°C to +85°C
Speed (ns)
Order Part No.
Package
8
IS63LV1024L-8TI
IS63LV1024L-8JI
IS63LV1024L-8KI
IS63LV1024L-8BI
TSOP (Type II)
300-mil Plastic SOJ
400-mil Plastic SOJ
mBGA(8mmx10mm)
10
IS63LV1024L-10TI
IS63LV1024L-10HI
IS63LV1024L-10JI
IS63LV1024L-10KI
IS63LV1024L-10BI
TSOP (Type II)
STSOP (Type I) (8mm x13.4mm)
300-mil Plastic SOJ
400-mil Plastic SOJ
mBGA(8mmx10mm)
12
IS63LV1024L-12TI
IS63LV1024L-12JI
IS63LV1024L-12KI
IS63LV1024L-12BI
TSOP (Type II)
300-mil Plastic SOJ
400-mil Plastic SOJ
mBGA(8mmx10mm)
Integrated Silicon Solution, Inc. — www.issi.com — 1-800-379-4774
Rev. B
08/07/02
9
Similar pages