Freescale MPC8280 Powerquicc iiâ ¢ family hardware specification Datasheet

Freescale Semiconductor
MPC8280EC
Rev. 1.7, 12/2006
Technical Data
MPC8280
PowerQUICC II™ Family
Hardware Specifications
This document contains detailed information about power
considerations, DC/AC electrical characteristics, and AC timing
specifications for .13µm (HiP7) members of the
PowerQUICC II™ family of integrated communications
processors—the MPC8280, the MPC8275, and the MPC8270
(collectively called 'the MPC8280' throughout this document).
© Freescale Semiconductor, Inc., 2004, 2006. All rights reserved.
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Contents
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . 7
DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . 8
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . 11
Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
AC Electrical Characteristics . . . . . . . . . . . . . . . . . . 14
Clock Configuration Modes . . . . . . . . . . . . . . . . . . . 24
Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 73
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 76
Document Revision History . . . . . . . . . . . . . . . . . . . 76
Overview
1
Overview
Table 1 shows the functionality supported by each device in the MPC8280 family.
Table 1. MPC8280 PowerQUICC II Family Functionality
Devices
Functionality
MPC8270
Package 1 480 TBGA
MPC8275
MPC8280
516 PBGA
516 PBGA
480 TBGA
Serial communications controllers (SCCs)
4
4
4
4
QUICC multi-channel controller (QMC)
—
—
—
—
Fast communication controllers (FCCs)
3
3
3
3
I-Cache (Kbyte)
16
16
16
16
D-Cache (Kbyte)
16
16
16
16
Ethernet (10/100)
3
3
3
3
UTOPIA II Ports
0
0
2
2
Multi-channel controllers (MCCs)
1
1
1
2
PCI bridge
Yes
Yes
Yes
Yes
Transmission convergence (TC) layer
—
—
—
Yes
Inverse multiplexing for ATM (IMA)
—
—
—
Yes
Universal serial bus (USB) 2.0 full/low rate
1
1
1
1
Security engine (SEC)
—
—
—
—
1
Refer to Table 2.
Devices in the MPC8280 family are available in three packages—the standard ZU package and the alternate VR or
ZQ packages—as shown in Table 2. Note that throughout this document references to the MPC8280 and the
MPC8270 are inclusive of VR and ZQ package devices unless otherwise specified. For more information on VR and
ZQ packages, contact your Freescale sales office. For package ordering information, refer to Section 10, “Ordering
Information.”
Table 2. HiP7 PowerQUICC II Device Packages
Code
(Package)
ZU
(480 TBGA—Leaded)
VR
(516 PBGA—Lead free)
ZQ
(516 PBGA—Lead spheres)
MPC8280
MPC8275VR
MPC8275ZQ
MPC8270
MPC8270VR
MPC8270ZQ
Device
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
2
Freescale Semiconductor
Overview
Figure 1 shows the block diagram. Shaded portions are device-specific; refer to the notes below.
16 Kbytes
I-Cache
I-MMU
System Interface Unit
(SIU)
G2_LE Core
16 Kbytes
D-Cache
Bus Interface Unit
Communication Processor Module (CPM)
Timers
Interrupt
Controller
Parallel I/O
MCC2
Serial
DMAs
FCC2
FCC3
SCC1
SCC2
32 bits, up to 100 MHz
Clock Counter
4 Virtual
IDMAs
IMA 1
Microcode
FCC1
or
Local Bus
Memory Controller
32 KB
Data
RAM
32-bit RISC Microcontroller
and Program ROM
Baud Rate
Generators
MCC11
32 KB
Instruction
RAM
PCI Bus
32 bits, up to 66 MHz
60x-to-PCI
Bridge
60x-to-Local
Bridge
D-MMU
60x Bus
SCC3
TC Layer Hardware1
SCC4/
USB
System Functions
SMC1
SMC2
SPI
I2C
Time Slot Assigner
Serial Interface2
8 TDM Ports2
3 MII or RMII
Ports
2 UTOPIA
Ports3
Non-Multiplexed
I/O
Notes:
1 MPC8280 only (not on MPC8270, the VR package, nor the ZQ package)
2 MPC8280 has 2 serial interface (SI) blocks and 8 TDM ports. MPC8270 and the VR and ZQ packages have
only 1 SI block and 4 TDM ports (TDM2[A–D]).
3 MPC8280, MPC8275VR, MPC8275ZQ only (not on MPC8270, MPC8270VR, nor MPC8270ZQ)
Figure 1. MPC8280 Block Diagram
1.1 Features
The major features of the MPC8280 are as follows:
•
Dual-issue integer (G2_LE) core
— A core version of the EC603e microprocessor
— System core microprocessor supporting frequencies of 166–450 MHz
— Separate 16-Kbyte data and instruction caches:
– Four-way set associative
– Physically addressed
– LRU replacement algorithm
— Architecture-compliant memory management unit (MMU)
— Common on-chip processor (COP) test interface
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
3
Overview
•
•
•
•
•
•
— High-performance (SPEC95 benchmark at 450 MHz; 855 Dhrystones MIPS at 450 MHz)
— Supports bus snooping for data cache coherency
— Floating-point unit (FPU)
Separate power supply for internal logic and for I/O
Separate PLLs for G2_LE core and for the CPM
— G2_LE core and CPM can run at different frequencies for power/performance optimization
— Internal core/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 4.5:1, 5:1, 6:1, 7:1, 8:1 ratios
— Internal CPM/bus clock multiplier that provides 2:1, 2.5:1, 3:1, 3.5:1, 4:1, 5:1, 6:1, 8:1 ratios
64-bit data and 32-bit address 60x bus
— Bus supports multiple master designs
— Supports single- and four-beat burst transfers
— 64-, 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
— Supports data parity or ECC and address parity
32-bit data and 18-bit address local bus
— Single-master bus, supports external slaves
— Eight-beat burst transfers
— 32-, 16-, and 8-bit port sizes controlled by on-chip memory controller
60x-to-PCI bridge
— Programmable host bridge and agent
— 32-bit data bus, 66.67/83.3/100 MHz, 3.3 V
— Synchronous and asynchronous 60x and PCI clock modes
— All internal address space available to external PCI host
— DMA for memory block transfers
— PCI-to-60x address remapping
PCI bridge
— PCI Specification Revision 2.2 compliant and supports frequencies up to 66 MHz
— On-chip arbitration
— Support for PCI-to-60x-memory and 60x-memory-to-PCI streaming
— PCI host bridge or peripheral capabilities
— Includes 4 DMA channels for the following transfers:
– PCI-to-60x to 60x-to-PCI
– 60x-to-PCI to PCI-to-60x
– PCI-to-60x to PCI-to-60x
– 60x-to-PCI to 60x-to-PCI
— Includes all of the configuration registers (which are automatically loaded from the EPROM and used
to configure the MPC8280) required by the PCI standard as well as message and doorbell registers
— Supports the I2O standard
— Hot-swap friendly (supports the hot swap specification as defined by PICMG 2.1 R1.0 August 3, 1998)
— Support for 66.67/83.33/100 MHz, 3.3 V specification
— 60x-PCI bus core logic that uses a buffer pool to allocate buffers for each port
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
4
Freescale Semiconductor
Overview
•
•
•
•
— Uses the local bus signals, removing need for additional pins
System interface unit (SIU)
— Clock synthesizer
— Reset controller
— Real-time clock (RTC) register
— Periodic interrupt timer
— Hardware bus monitor and software watchdog timer
— IEEE 1149.1 JTAG test access port
12-bank memory controller
— Glueless interface to SRAM, page mode SDRAM, DRAM, EPROM, Flash and other user- definable
peripherals
— Byte write enables and selectable parity generation
— 32-bit address decodes with programmable bank size
— Three user-programmable machines, general-purpose chip-select machine, and page-mode pipeline
SDRAM machine
— Byte selects for 64-bus width (60x) and byte selects for 32-bus width (local)
— Dedicated interface logic for SDRAM
CPU core can be disabled and the device can be used in slave mode to an external core
Communications processor module (CPM)
— Embedded 32-bit communications processor (CP) uses a RISC architecture for flexible support for
communications protocols
— Interfaces to G2_LE core through an on-chip 32-Kbyte dual-port data RAM, an on-chip 32-Kbyte
dual-port instruction RAM and DMA controller
— Serial DMA channels for receive and transmit on all serial channels
— Parallel I/O registers with open-drain and interrupt capability
— Virtual DMA functionality executing memory-to-memory and memory-to-I/O transfers
— Three fast communications controllers supporting the following protocols:
– 10/100-Mbit Ethernet/IEEE 802.3 CDMA/CS interface through media independent interface (MII)
or reduced media independent interface (RMII)
– ATM—Full-duplex SAR protocols at 155 Mbps, through UTOPIA interface, AAL5, AAL1, AAL0
protocols, TM 4.0 CBR, VBR, UBR, ABR traffic types, up to 64 K external connections (no ATM
support for the MPC8270)
– Transparent
– HDLC—Up to T3 rates (clear channel)
– FCC2 can also be connected to the TC layer (MPC8280 only)
— Two multichannel controllers (MCCs) (one MCC on the MPC8270)
– Each MCC handles 128 serial, full-duplex, 64-Kbps data channels. Each MCC can be split into four
subgroups of 32 channels each.
– Almost any combination of subgroups can be multiplexed to single or multiple TDM interfaces up
to four TDM interfaces per MCC
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
5
Overview
— Four serial communications controllers (SCCs) identical to those on the MPC860, supporting the digital
portions of the following protocols:
– Ethernet/IEEE 802.3 CDMA/CS
– HDLC/SDLC and HDLC bus
– Universal asynchronous receiver transmitter (UART)
– Synchronous UART
– Binary synchronous (BISYNC) communications
– Transparent
— Universal serial bus (USB) controller
– Supports USB 2.0 full/low rate compatible
– USB host mode
– Supports control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– NRZI encoding/decoding with bit stuffing
– Supports both 12- and 1.5-Mbps data rates (automatic generation of preamble token and data rate
configuration). Note that low-speed operation requires an external hub.
– Flexible data buffers with multiple buffers per frame
– Supports local loopback mode for diagnostics (12 Mbps only)
– Supports USB slave mode
– Four independent endpoints support control, bulk, interrupt, and isochronous data transfers
– CRC16 generation and checking
– CRC5 checking
– NRZI encoding/decoding with bit stuffing
– 12- or 1.5-Mbps data rate
– Flexible data buffers with multiple buffers per frame
– Automatic retransmission upon transmit error
— Two serial management controllers (SMCs), identical to those of the MPC860
– Provide management for BRI devices as general circuit interface (GCI) controllers in timedivision-multiplexed (TDM) channels
– Transparent
– UART (low-speed operation)
— One serial peripheral interface identical to the MPC860 SPI
— One inter-integrated circuit (I2C) controller (identical to the MPC860 I2C controller)
– Microwire compatible
– Multiple-master, single-master, and slave modes
— Up to eight TDM interfaces (four on the MPC8270)
– Supports two groups of four TDM channels for a total of eight TDMs (one group of four on the
MPC8270 and the MPC8275)
– 2,048 bytes of SI RAM
– Bit or byte resolution
– Independent transmit and receive routing, frame synchronization
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
6
Freescale Semiconductor
Operating Conditions
•
•
2
– Supports T1, CEPT, T1/E1, T3/E3, pulse code modulation highway, ISDN basic rate, ISDN primary
rate, Freescale interchip digital link (IDL), general circuit interface (GCI), and user-defined TDM
serial interfaces
— Eight independent baud rate generators and 20 input clock pins for supplying clocks to FCCs, SCCs,
SMCs, and serial channels
— Four independent 16-bit timers that can be interconnected as two 32-bit timers
Inverse multiplexing for ATM capabilities (IMA) (MPC8280 only).Supported by eight transfer transmission
convergence (TC) layers between the TDMs and FCC2.
Transmission convergence (TC) layer (MPC8280 only)
Operating Conditions
Table 3 shows the maximum electrical ratings.
Table 3. Absolute Maximum Ratings 1
Rating
Core supply voltage 2
PLL supply
voltage2
I/O supply voltage
Input voltage
3
4
Junction temperature
Storage temperature range
Symbol
Value
Unit
VDD
-0.3 – 2.25
V
VCCSYN
-0.3 – 2.25
V
VDDH
-0.3 – 4.0
V
VIN
GND(-0.3) – 3.6
V
Tj
120
°C
TSTG
(-55) – (+150)
°C
1
Absolute maximum ratings are stress ratings only; functional operation (see Table 4) at the maximums is not
guaranteed. Stress beyond those listed may affect device reliability or cause permanent damage.
2 Caution: VDD/VCCSYN must not exceed VDDH by more than 0.4 V during normal operation. It is recommended
that VDD/VCCSYN should be raised before or simultaneous with VDDH during power-on reset. VDD/VCCSYN may
exceed VDDH by more than 0.4 V during power-on reset for no more than 100 ms.
3
Caution: VDDH can exceed VDD/VCCSYN by 3.3 V during power on reset by no more than 100 mSec. VDDH
should not exceed VDD/VCCSYN by more than 2.5 V during normal operation.
4 Caution: VIN must not exceed VDDH by more than 2.5 V at any time, including during power-on reset.
Table 4 lists recommended operational voltage conditions.
Table 4. Recommended Operating Conditions 1
Rating
Symbol
Value
Unit
Core supply voltage
VDD
1.45 – 1.60
V
PLL supply voltage
VCCSYN
1.45 – 1.60
V
I/O supply voltage
VDDH
3.135 – 3.465
V
VIN
GND (-0.3) – 3.465
V
Tj
105 2
°C
TA
0–702
°C
Input voltage
Junction temperature (maximum)
Ambient temperature
1
Caution: These are the recommended and tested operating conditions. Proper operation outside of these conditions
is not guaranteed.
2
Note that for extended temperature parts the range is (-40)T – 105Tj.
A
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
7
DC Electrical Characteristics
This device contains circuitry protecting against damage due to high static voltage or electrical fields; however, it is
advised that normal precautions be taken to avoid application of any voltages higher than maximum-rated voltages
to this high-impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic
voltage level (either GND or VCC).
Figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the MPC8280.
Note that in PCI mode the I/O interface is different.
4V
GVDD + 5%
GVDD
VIH
GND
GND – 0.3 V
VIL
GND – 1.0 V
Not to exceed 10%
of tSDRAM_CLK
Figure 2. Overshoot/Undershoot Voltage
3
DC Electrical Characteristics
Table 5 shows DC electrical characteristics.
Table 5. DC Electrical Characteristics 1
Characteristic
Symbol
Min
Max
Unit
Input high voltage—
all inputs except TCK, TRST and PORESET 2
VIH
2.0
3.465
V
Input low voltage
VIL
GND
0.8
V
VIHC
2.4
3.465
V
VILC
GND
0.4
V
CLKIN input high voltage
CLKIN input low voltage
Input leakage current, VIN =
VDDH 3
IIN
—
10
µA
IOZ
—
10
µA
V4
IL
—
1
µA
Signal high input current, VIH = 2.0 V
IH
—
1
µA
VOH
2.4
—
V
Hi-Z (off state) leakage current, VIN = VDDH3
Signal low input current, VIL = 0.8
Output high voltage, IOH = –2 mA
except UTOPIA mode, and open drain pins
In UTOPIA mode 5 (UTOPIA pins only): IOH = -8.0mA
PA[0-31]
PB[4-31]
PC[0-31]
PD[4-31]
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
8
Freescale Semiconductor
DC Electrical Characteristics
Table 5. DC Electrical Characteristics 1 (continued)
Characteristic
In UTOPIA
PA[0-31]
PB[4-31]
PC[0-31]
PD[4-31]
mode5
(UTOPIA pins only): IOL = 8.0mA
IOL = 6.0mA
BR
BG
ABB/IRQ2
TS
A[0-31]
TT[0-4]
TBST
TSIZE[0–3]
AACK
ARTRY
DBG
DBB/IRQ3
D[0-63]
DP(0)/RSRV/EXT_BR2
DP(1)/IRQ1/EXT_BG2
DP(2)/TLBISYNC/IRQ2/EXT_DBG2
DP(3)/IRQ3/EXT_BR3/CKSTP_OUT
DP(4)/IRQ4/EXT_BG3/CORE_SREST
DP(5)/TBEN/EXT_DBG3/IRQ5/CINT
DP(6)/CSE(0)/IRQ6
DP(7)/CSE(1)/IRQ7
PSDVAL
TA
TEA
GBL/IRQ1
CI/BADDR29/IRQ2
WT/BADDR30/IRQ3
L2_HIT/IRQ4
CPU_BG/BADDR31/IRQ5/CINT
CPU_DBG
CPU_BR
IRQ0/NMI_OUT
IRQ7/INT_OUT/APE
PORESET
HRESET
SRESET
RSTCONF
Symbol
Min
Max
Unit
VOL
—
0.5
V
VOL
—
0.4
V
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
9
DC Electrical Characteristics
Table 5. DC Electrical Characteristics 1 (continued)
Characteristic
IOL = 5.3mA
CS[0-9]
CS(10)/BCTL1
CS(11)/AP(0)
BADDR[27–28]
ALE
BCTL0
PWE[0–7]/PSDDQM[0–7]/PBS[0–7]
PSDA10/PGPL0
PSDWE/PGPL1
POE/PSDRAS/PGPL2
PSDCAS/PGPL3
PGTA/PUPMWAIT/PGPL4/PPBS
PSDAMUX/PGPL5
LWE[0–3]LSDDQM[0–3]/LBS[0–3]/PCI_CFG[0–3]
LSDA10/LGPL0/PCI_MODCKH0
LSDWE/LGPL1/PCI_MODCKH1
LOE/LSDRAS/LGPL2/PCI_MODCKH2
LSDCAS/LGPL3/PCI_MODCKH3
LGTA/LUPMWAIT/LGPL4/LPBS
LSDAMUX/LGPL5/PCI_MODCK
LWR
MODCK[1–3]/AP[1–3]/TC[0–2]/BNKSEL[0–2]
IOL = 3.2mA
L_A14/PAR
L_A15/FRAME/SMI
L_A16/TRDY
L_A17/IRDY/CKSTP_OUT
L_A18/STOP
L_A19/DEVSEL
L_A20/IDSEL
L_A21/PERR
L_A22/SERR
L_A23/REQ0
L_A24/REQ1/HSEJSW
L_A25/GNT0
L_A26/GNT1/HSLED
L_A27/GNT2/HSENUM
L_A28/RST/CORE_SRESET
L_A29/INTA
L_A30/REQ2
L_A31
LCL_D[0-31]/AD[0-31]
LCL_DP[0-3]/C/BE[0-3]
PA[0–31]
PB[4–31]
PC[0–31]
PD[4–31]
TDO
QREQ
Symbol
Min
Max
Unit
VOL
—
0.4
V
1
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
2 TCK, TRST and PORESET have min VIH = 2.5V.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
10
Freescale Semiconductor
Thermal Characteristics
3
The leakage current is measured for nominal VDDH,VCCSYN, and VDD.
VIL for IIC interface does not match IIC standard, but does meet IIC standard for VOL and should not cause any
compatibility issue.
5
MPC8280, MPC8275VR, MPC8275ZQ only.
4
4
Thermal Characteristics
Table 6 describes thermal characteristics for both the packages. See Table 2 for information about a given device’s
package. For the discussions sections 4.1 and 4.5, PD = (VDD × IDD) + PI/O, where PI/O is the power dissipation of
the I/O drivers.
Table 6. Thermal Characteristics
Value
Characteristic
Symbol
Junction to ambient—
single-layer board 1
RθJA
Junction to ambient—
four-layer board
RθJA
Unit
480 TBGA
516 PBGA
16
27
11
21
12
19
Air Flow
Natural convection
°C/W
1 m/s
Natural convection
°C/W
9
16
RθJB
6
11
°C/W
—
Junction to case 3
RθJC
2
8
°C/W
—
Junction-to-package top 4
ΨJT
2
2
°C/W
—
Junction to board
2
1 m/s
1
Assumes no thermal vias.
Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is
measured on the top surface of the board near the package.
3 Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
4 Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is
written as Psi-JT.
2
4.1 Estimation with Junction-to-Ambient Thermal Resistance
An estimation of the chip junction temperature, TJ, in
C can be obtained from the following equation:
TJ = TA + (RθJA × PD)
where:
TA = ambient temperature (ºC)
RθJA = package junction-to-ambient thermal resistance (ºC/W)
PD = power dissipation in package
The junction-to-ambient thermal resistance is an industry standard value that provides a quick and easy estimation
of thermal performance. However, the answer is only an estimate; test cases have demonstrated that errors of a factor
of two (in the quantity TJ – TA) are possible.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
11
Thermal Characteristics
4.2 Estimation with Junction-to-Case Thermal Resistance
Historically, the thermal resistance has frequently been expressed as the sum of a junction-to-case thermal resistance
and a case-to-ambient thermal resistance:
RθJA = RθJC + RθCA
where:
RθJA = junction-to-ambient thermal resistance (ºC/W)
RθJC = junction-to-case thermal resistance (ºC/W)
RθCA = case-to-ambient thermal resistance (ºC/W)
RθJC is device related and cannot be influenced by the user. The user adjusts the thermal environment to affect the
case-to-ambient thermal resistance, RθCA. For instance, the user can change the air flow around the device, add a
heat sink, change the mounting arrangement on the printed circuit board, or change the thermal dissipation on the
printed circuit board surrounding the device. This thermal model is most useful for ceramic packages with heat sinks
where some 90% of the heat flows through the case and the heat sink to the ambient environment. For most
packages, a better model is required.
4.3 Estimation with Junction-to-Board Thermal Resistance
A simple package thermal model which has demonstrated reasonable accuracy (about 20%) is a two-resistor model
consisting of a junction-to-board and a junction-to-case thermal resistance. The junction-to-case thermal resistance
covers the situation where a heat sink is used or where a substantial amount of heat is dissipated from the top of the
package. The junction-to-board thermal resistance describes the thermal performance when most of the heat is
conducted to the printed circuit board. It has been observed that the thermal performance of most plastic packages,
especially PBGA packages, is strongly dependent on the board temperature.
If the board temperature is known, an estimate of the junction temperature in the environment can be made using
the following equation:
TJ = TB + (RθJB × PD)
where:
RθJB = junction-to-board thermal resistance (ºC/W)
TB = board temperature (ºC)
PD = power dissipation in package
If the board temperature is known and the heat loss from the package case to the air can be ignored, acceptable
predictions of junction temperature can be made. For this method to work, the board and board mounting must be
similar to the test board used to determine the junction-to-board thermal resistance, namely a 2s2p (board with a
power and a ground plane) and by attaching the thermal balls to the ground plane.
4.4 Estimation Using Simulation
When the board temperature is not known, a thermal simulation of the application is needed. The simple two-resistor
model can be used with the thermal simulation of the application, or a more accurate and complex model of the
package can be used in the thermal simulation.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
12
Freescale Semiconductor
Power Dissipation
4.5 Experimental Determination
To determine the junction temperature of the device in the application after prototypes are available, the thermal
characterization parameter (ΨJT) can be used to determine the junction temperature with a measurement of the
temperature at the top center of the package case using the following equation:
TJ = TT + (ΨJT × PD)
where:
ΨJT = thermal characterization parameter
TT = thermocouple temperature on top of package
PD = power dissipation in package
The thermal characterization parameter is measured per JEDEC JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned so that the
thermocouple junction rests on the package. A small amount of epoxy is placed over the thermocouple junction and
over 1 mm of wire extending from the junction. The thermocouple wire is placed flat against the case to avoid
measurement errors caused by cooling effects of the thermocouple wire.
4.6 Layout Practices
Each VDD and VDDH pin should be provided with a low-impedance path to the board’s power supplies. Each
ground pin should likewise be provided with a low-impedance path to ground. The power supply pins drive distinct
groups of logic on chip. The VDD and VDDH power supplies should be bypassed to ground using by-pass
capacitors located as close as possible to the four sides of the package. For filtering high frequency noise, a capacitor
of 0.1uF on each VDD and VDDH pin is recommended. Further, for medium frequency noise, a total of 2 capacitors
of 47uF for VDD and 2 capacitors of 47uF for VDDH are also recommnded. The capacitor leads and associated
printed circuit traces connecting to chip VDD, VDDH and ground should be kept to less than half an inch per
capacitor lead. Boards should employ separate inner layers for power and GND planes.
All output pins on the MPC8280 have fast rise and fall times. Printed circuit (PC) trace interconnection length should
be minimized to minimize overdamped conditions and reflections caused by these fast output switching times. This
recommendation particularly applies to the address and data buses. Maximum PC trace lengths of six inches are
recommended. Capacitance calculations should consider all device loads as well as parasitic capacitances due to the
PC traces. Attention to proper PCB layout and bypassing becomes especially critical in systems with higher
capacitive loads because these loads create higher transient currents in the VDD and GND circuits. Pull up all
unused inputs or signals that will be inputs during reset. Special care should be taken to minimize the noise levels
on the PLL supply pins.
5
Power Dissipation
Table 7 provides preliminary, estimated power dissipation for various configurations. Note that suitable thermal
management is required to ensure the junction temperature does not exceed the maximum specified value. Also note
that the I/O power should be included when determining whether to use a heat sink. For a complete list of possible
clock configurations, refer to Section 7, “Clock Configuration Modes.”
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
13
AC Electrical Characteristics
Table 7. Estimated Power Dissipation for Various Configurations 1
Bus
(MHz)
CPM
Multiplication
Factor
CPM
(MHz)
CPU
Multiplication
Factor
PINT(W) 2, 3
CPU
(MHz)
Vddl 1.5 Volts
Nominal
Maximum
66.67
2.5
166
3.5
233
0.95
1.0
66.67
2.5
166
4
266
1.0
1.05
66.67
3
200
4
266
1.05
1.1
66.67
3.5
233
4.5
300
1.05
1.15
83.33
3
250
4
333
1.25
1.35
83.33
3
250
4.5
375
1.3
1.4
83.33
3.5
292
5
417
1.45
1.55
100
3
300
4
400
1.5
1.6
100
3
300
4.5
450
1.55
1.65
1
Test temperature = 105° C
PINT = IDD x VDD Watts
3 Values do not include I/O. Add the following estimates for active I/O based on the following bus speeds:
66.7 MHz = 0.45 W (nominal), 0.5 W (maximum)
83.3 MHz = 0.5W (nominal), 0.6 W (maximum)
100 MHz = 0.6 W (nominal), 0.7 W (maximum)
2
6
AC Electrical Characteristics
The following sections include illustrations and tables of clock diagrams, signals, and CPM outputs and inputs for
66.67/83.33/100 MHz devices. Note that AC timings are based on a 50-pf load for MAX Delay and 10-pf load for
MIN delay. Typical output buffer impedances are shown in Table 8.
Table 8. Output Buffer Impedances 1
Output Buffers
60x bus
Local bus
Memory controller
Typical Impedance (Ω)
45 or 27 2
45
45 or 272
Parallel I/O
45
PCI
27
1
2
These are typical values at 65° C. Impedance may vary by ±25% with process and temperature.
On silicon revision 0.0 (mask #: 0K49M), selectable impedance is not available. Impedance is set at 45 Ω.
On all other revisions, impedance value is selected through the SIUMCR[20,21]. Refer to the MPC8280
PowerQUICC II Family Reference Manual.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
14
Freescale Semiconductor
AC Electrical Characteristics
6.1 CPM AC Characteristics
Table 9 lists CPM output characteristics.
Table 9. AC Characteristics for CPM Outputs 1
Spec Number
Max
Characteristic
Value (ns)
Min
Maximum Delay
66 MHz
Minimum Delay
83 MHz 100 MHz 66 MHz
83 MHz 100 MHz
sp36a sp37a FCC outputs—internal clock (NMSI)
6
5.5
5.5
0.5
0.5
0.5
sp36b sp37b FCC outputs—external clock (NMSI)
8
8
8
2
2
2
sp38a sp39a SCC/SMC/SPI/I2C outputs—internal
clock (NMSI)
10
10
10
0
0
0
sp38b sp39b SCC/SMC/SPI/I2C outputs—external
clock (NMSI)
8
8
8
2
2
2
sp40
sp41 TDM outputs/SI
11
11
11
2.5
2.5
2.5
sp42
sp43 TIMER/IDMA outputs
11
11
11
0.5
0.5
0.5
11
11
11
0.5
0.5
0.5
sp42a sp43a PIO outputs
1
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
Table 10 lists CPM input characteristics.
NOTE: Rise/Fall Time on CPM Input Pins
It is recommended that the rise/fall time on CPM input pins should not exceed 5 ns.
This should be enforced especially on clock signals. Rise time refers to signal
transitions from 10% to 90% of VCC; fall time refers to transitions from 90% to
10% of VCC.
Table 10. AC Characteristics for CPM Inputs 1
Spec Number
Setup
Hold
Value (ns)
Characteristic
Setup
66 MHz
Hold
83 MHz 100 MHz 66 MHz
83 MHz 100 MHz
sp16a sp17a FCC inputs—internal clock (NMSI)
6
6
6
0
0
0
sp16b sp17b FCC inputs—external clock (NMSI)
2.5
2.5
2.5
2
2
2
sp18a sp19a SCC/SMC/SPI/I2C inputs—internal
clock (NMSI)
6
6
6
0
0
0
sp18b sp19b SCC/SMC/SPI/I2C inputs—external
clock (NMSI)
4
4
4
2
2
2
sp20
sp21 TDM inputs/SI
5
5
5
2.5
2.5
2.5
sp22
sp23 PIO/TIMER/IDMA inputs
8
8
8
0.5
0.5
0.5
1
Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN.
Timings are measured at the pin.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
15
AC Electrical Characteristics
NOTE
Although the specifications generally reference the rising edge of the clock, the
following AC timing diagrams also apply when the falling edge is the active edge.
Figure 3 shows the FCC internal clock.
BRG_OUT
sp17a
sp16a
FCC input signals
sp36a/sp37a
FCC output signals
Note: When GFMR[TCI] = 0
sp36a/sp37a
FCC output signals
Note: When GFMR.[TCI] = 1
Figure 3. FCC Internal Clock Diagram
Figure 4 shows the FCC external clock.
Serial ClKin
sp17b
sp16b
FCC input signals
sp36b/sp37b
FCC output signals
Note: When GFMR[TCI] = 0
sp36b/sp37b
FCC output signals
Note: When GFMR[TCI] = 1
Figure 4. FCC External Clock Diagram
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
16
Freescale Semiconductor
AC Electrical Characteristics
Figure 5 shows the SCC/SMC/SPI/I2C external clock.
Serial CLKin
sp18b
sp19b
SCC/SMC/SPI/I2C input signals
(See note)
sp38b/sp39b
SCC/SMC/SPI/I2C output signals
(See note)
Note: There are four possible timing conditions for SCC and SPI:
1. Input sampled on the rising edge and output driven on the rising edge (shown).
2. Input sampled on the rising edge and output driven on the falling edge.
3. Input sampled on the falling edge and output driven on the falling edge.
4. Input sampled on the falling edge and output driven on the rising edge.
Figure 5. SCC/SMC/SPI/I2C External Clock Diagram
Figure 6 shows the SCC/SMC/SPI/I2C internal clock.
BRG_OUT
sp18a
sp19a
SCC/SMC/SPI/I2C input signals
(See note)
sp38a/sp39a
SCC/SMC/SPI/I2C output signals
(See note)
Note: There are four possible timing conditions for SCC and SPI:
1. Input sampled on the rising edge and output driven on the rising edge (shown).
2. Input sampled on the rising edge and output driven on the falling edge.
3. Input sampled on the falling edge and output driven on the falling edge.
4. Input sampled on the falling edge and output driven on the rising edge.
Figure 6. SCC/SMC/SPI/I2C Internal Clock Diagram
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
17
AC Electrical Characteristics
Figure 7 shows TDM input and output signals.
Serial CLKin
sp20
sp21
TDM input signals
sp40/sp41
TDM output signals
Note: There are four possible TDM timing conditions:
1. Input sampled on the rising edge and output driven on the rising edge (shown).
2. Input sampled on the rising edge and output driven on the falling edge.
3. Input sampled on the falling edge and output driven on the falling edge.
4. Input sampled on the falling edge and output driven on the rising edge.
Figure 7. TDM Signal Diagram
Figure 8 shows PIO and timer signals.
Sys clk
sp23
sp22
PIO/IDMA/TIMER[TGATE assertion] input signals
(See note)
sp23
sp22
TIMER input signal [TGATE deassertion]
(See note)
sp42/sp43
IDMA output signals
sp42/sp43
sp42a/sp43a
TIMER(sp42/43)/ PIO(sp42a/sp43a)
output signals
Note: TGATE is asserted on the rising edge of the clock; it is deasserted on the falling edge.
Figure 8. PIO and Timer Signal Diagram
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
18
Freescale Semiconductor
AC Electrical Characteristics
6.2 SIU AC Characteristics
NOTE: CLKIN Jitter and Duty Cycle
The CLKIN input to the MPC8280 should not exceed +/– 150 psec of jitter
(peak-to-peak). This represents total input jitter—the combination of short term
(cycle-to-cycle) and long term (cumulative). The duty cycle of CLKIN should not
exceed the ratio of 40:60. The rise/file time of CLKIN should adhere to the typical
SDRAM device AC clock requirement of 1 V/ns to meet SDRAM AC specs.
NOTE: Spread Spectrum Clocking
Spread spectrum clocking is allowed with 1% input frequency down-spread at
maximum 60 KHz modulation rate regardless of input frequency.
NOTE: PCI AC Timing
The MPC8280 meets the timing requirements of PCI Specification Revision 2.2.
Refer to Sections 7.2 and 7.3 and “Note: Tval (Output Hold)” to determine if a
specific clock configuration is compliant.
Table 11 lists SIU input characteristics.
Table 11. AC Characteristics for SIU Inputs 1
Spec Number
Setup
Value (ns)
Hold
Characteristic
Setup
66 MHz
Hold
83 MHz 100 MHz 66 MHz
83 MHz 100 MHz
sp11
sp10 AACK/TA/TS/DBG/BG/BR/ARTRY/
TEA
6
5
3.5
0.5
0.5
0.5
sp12
sp10 Data bus in normal mode
5
4
3.5
0.5
0.5
0.5
sp13
sp10 Data bus in ECC and PARITY modes
7
5
3.5
0.5
0.5
0.5
sp13a
sp10 Pipeline mode—Data bus (with or
without ECC/PARITY)
5
4
2.5
0.5
0.5
0.5
sp14
sp10 DP pins
7
5
3.5
0.5
0.5
0.5
sp14a
sp10 Pipeline mode—DP pins
—
4
2.5
—
0.5
0.5
sp15
sp10 All other pins
5
4
3.5
0.5
0.5
0.5
1
Input specifications are measured from the 50% level of the signal to the 50% level of the rising edge of CLKIN.
Timings are measured at the pin.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
19
AC Electrical Characteristics
Table 12 lists SIU output characteristics.
Table 12. AC Characteristics for SIU Outputs 1
Spec Number
Max
Value (ns)
Min
Characteristic
Maximum Delay
66 MHz
Minimum Delay
83 MHz 100 MHz 66 MHz
83 MHz 100 MHz
sp31
sp30 PSDVAL/TEA/TA
7
6
5.5
1
1
1
sp32
sp30 ADD/ADD_atr./BADDR/CI/GBL/WT
8
6.5
5.5
1
1
1
sp33a
sp30 Data bus 2
6.5
6.5
5.5
0.7
0.7
0.7
sp33b
sp30 DP
6
5.5
5.5
1
1
1
sp34
sp30 Memory controller signals/ALE
6
5.5
5.5
1
1
1
sp35
sp30 All other signals
6
5.5
5.5
1
1
1
sp35a
sp30 AP
7
7
7
1
1
1
1
Output specifications are measured from the 50% level of the rising edge of CLKIN to the 50% level of the signal.
Timings are measured at the pin.
2
To achieve 1 ns of hold time at 66, 83, or 100 MHz, a minimum loading of 20 pF is required.
NOTE
Activating data pipelining (setting BRx[DR] in the memory controller) improves
the AC timing.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
20
Freescale Semiconductor
AC Electrical Characteristics
Figure 9 shows the interaction of several bus signals.
CLKin
sp11
sp10
sp11a
sp10
AACK/TA/TS/
DBG/BG/BR input signals
ARTRY/TEA input signals
sp12
sp10
sp15
sp10
DATA bus normal mode
input signal
All other input signals
sp31
sp30
sp32
sp30
sp33a
sp30
sp35
sp30
sp35a
sp30
PSDVAL/TEA/TA output signals
ADD/ADD_atr/BADDR/CI/
GBL/WT output signals
DATA bus output signals
All other output signals
(except AP)
AP signals
Figure 9. Bus Signals
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
21
AC Electrical Characteristics
Figure 10 shows signal behavior for all parity modes (including ECC, RMW parity, and standard parity).
CLKin
sp10
sp13
DATA bus, ECC, and PARITY mode
input signals
sp10
sp13a
Pipeline mode—
DATA bus, ECC, and PARITY mode
input signals
sp10
sp14
DP mode input signal
sp10
sp14a
Pipeline mode—
DP mode input signal
sp33b
sp30
DP mode output signal
Figure 10. Parity Mode Diagram
Figure 11 shows signal behavior in MEMC mode.
CLKin
V_CLK
Memory controller signals
sp34/sp30
Figure 11. MEMC Mode Diagram
NOTE
Generally, all MPC8280 bus and system output signals are driven from the rising
edge of the input clock (CLKin). Memory controller signals, however, trigger on
four points within a CLKin cycle. Each cycle is divided by four internal ticks: T1,
T2, T3, and T4. T1 always occurs at the rising edge, and T3 at the falling edge, of
CLKin. However, the spacing of T2 and T4 depends on the PLL clock ratio
selected, as shown in Table 13.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
22
Freescale Semiconductor
AC Electrical Characteristics
Table 13. Tick Spacing for Memory Controller Signals
Tick Spacing (T1 Occurs at the Rising Edge of CLKin)
PLL Clock Ratio
T2
T3
T4
1:2, 1:3, 1:4, 1:5, 1:6
1/4 CLKin
1/2 CLKin
3/4 CLKin
1:2.5
3/10 CLKin
1/2 CLKin
8/10 CLKin
1:3.5
4/14 CLKin
1/2 CLKin
11/14 CLKin
Figure 12 is a representation of the information in Table 13.
CLKin
for 1:2, 1:3, 1:4, 1:5, 1:6
T1
T2
T3
T4
CLKin
for 1:2.5
T1
T2
T3
T4
for 1:3.5
CLKin
T1
T2
T3
T4
Figure 12. Internal Tick Spacing for Memory Controller Signals
NOTE
The UPM machine outputs change on the internal tick determined by the memory
controller programming; the AC specifications are relative to the internal tick. Note
that SDRAM and GPCM machine outputs change on CLKin’s rising edge.
6.3 JTAG Timings
Table 14 lists the JTAG timings.
Table 14. JTAG Timings1
Symbol2
Min
Max
Unit
JTAG external clock frequency of operation
fJTG
0
33.3
MHz
JTAG external clock cycle time
tJTG
30
—
ns
tJTKHKL
15
—
ns
tJTGR and
tJTGF
0
5
ns
6
tTRST
25
—
ns
3, 6
tJTDVKH
tJTIVKH
4
4
—
—
ns
ns
4, 7
Parameter
JTAG external clock pulse width measured at 1.4V
JTAG external clock rise and fall times
TRST assert time
Notes
Input setup times
Boundary-scan data
TMS, TDI
4 7
,
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
23
Clock Configuration Modes
Table 14. JTAG Timings1 (continued)
Symbol2
Min
Max
Unit
Notes
Boundary-scan data
TMS, TDI
tJTDXKH
tJTIXKH
10
10
—
—
ns
ns
4 7
Boundary-scan data
TDO
tJTKLDV
tJTKLOV
—
—
10
10
ns
ns
5 7
Boundary-scan data
TDO
tJTKLDX
tJTKLOX
1
1
—
—
ns
ns
5 7
JTAG external clock to output high impedance
Boundary-scan data
TDO
tJTKLDZ
tJTKLOZ
1
1
10
10
ns
ns
5 6
Parameter
Input hold times
,
,
4 7
Output valid times
,
.
5 7
Output hold times
1
2
3
4
5
6
7
7
,
5, 7
,
5 6
,
All outputs are measured from the midpoint voltage of the falling/rising edge of tTCLK to the midpoint of the signal
in question. The output timings are measured at the pins. All output timings assume a purely resistive 50-Ω load.
Time-of-flight delays must be added for trace lengths, vias, and connectors in the system.
The symbols used for timing specifications herein follow the pattern of t(first two letters of functional block)(signal)(state)
(reference)(state) for inputs and t((first two letters of functional block)(reference)(state)(signal)(state) for outputs. For example,
tJTDVKH symbolizes JTAG device timing (JT) with respect to the time data input signals (D) reaching the valid state
(V) relative to the tJTG clock reference (K) going to the high (H) state or setup time. Also, tJTDXKH symbolizes JTAG
timing (JT) with respect to the time data input signals (D) went invalid (X) relative to the tJTG clock reference (K)
going to the high (H) state. Note that, in general, the clock reference symbol representation is based on three letters
representing the clock of a particular functional. For rise and fall times, the latter convention is used with the
appropriate letter: R (rise) or F (fall).
TRST is an asynchronous level sensitive signal. The setup time is for test purposes only.
Non-JTAG signal input timing with respect to tTCLK.
Non-JTAG signal output timing with respect to tTCLK.
Guaranteed by design.
Guaranteed by design and device characterization.
Clock Configuration Modes
The MPC8280 has three clocking modes: local, PCI host, and PCI agent. The clocking mode is set according to three
input pins—PCI_MODE, PCI_CFG[0], PCI_MODCK—as shown in Table 15.
Table 15. MPC8280 Clocking Modes
Pins
PCI_MODE
1
PCI_CFG[0] PCI_MODCK 1
Clocking Mode
PCI Clock
Frequency Range
(MHZ)
Reference
1
—
—
Local bus
—
Table 16
0
0
0
PCI host
50–66
Table 17
0
0
1
25–50
Table 18
0
1
0
50–66
Table 19
0
1
1
25–50
Table 20
PCI agent
Determines PCI clock frequency range. Refer to Sections 7.2 and 7.3.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
24
Freescale Semiconductor
Clock Configuration Modes
In each clocking mode, the configuration of bus, core, PCI, and CPM frequencies is determined by seven bits during
the power-up reset—three hardware configuration pins (MODCK[1–3]) and four bits from hardware configuration
word[28–31] (MODCK_H). Both the PLLs and the dividers are set according to the selected MPC8280 clock
operation mode as described in the following sections.
7.1 Local Bus Mode
Table 16 lists clock configurations for the MPC8280 in local bus mode. The frequencies listed are for the purpose
of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not
exceed the frequency rating of the user’s device.
NOTE
Clock configurations change only after PORESET is asserted.
Table 16. Clock Configurations for Local Bus Mode 1
Bus Clock 3
(MHz)
Mode 2
MODCK_H-MODCK[1-3]
Low
High
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low
High
CPU
Multiplication
Factor 5
CPU Clock
(MHz)
Low
High
Default Modes (MODCK_H= 0000)
0000_000
37.5
133.3
3
112.5
400.0
4
150.0
533.3
0000_001
33.3
133.3
3
100.0
400.0
5
166.7
666.7
0000_010
37.5
100.0
4
150.0
400.0
4
150.0
400.0
0000_011
30.0
100.0
4
120.0
400.0
5
150.0
500.0
0000_100
60.0
167.0
2
120.0
334.0
2.5
150.0
417.5
0000_101
50.0
167.0
2
100.0
334.0
3
150.0
501.0
0000_110
60.0
160.0
2.5
150.0
400.0
2.5
150.0
400.0
0000_111
50.0
160.0
2.5
125.0
400.0
3
150.0
480.0
Full Configuration Modes
0001_000
50.0
167.0
2
100.0
334.0
4
200.0
668.0
0001_001
50.0
167.0
2
100.0
334.0
5
250.0
835.0
0001_010
50.0
145.8
2
100.0
291.7
6
300.0
875.0
0001_011
Reserved
0001_100
Reserved
0001_101
37.5
133.3
3
112.5
400.0
4
150.0
533.3
0001_110
33.3
133.3
3
100.0
400.0
5
166.7
666.7
1000_111
33.3
133.3
3
100.0
400.0
5.5
183.3
733.3
0001_111
33.3
133.3
3
100.0
400.0
6
200.0
800.0
0010_000
Reserved
0010_001
Reserved
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
25
Clock Configuration Modes
Table 16. Clock Configurations for Local Bus Mode 1 (continued)
Bus Clock 3
(MHz)
Mode 2
MODCK_H-MODCK[1-3]
Low
High
0010_010
37.5
100.0
0010_011
30.0
0010_100
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low
High
4
150.0
400.0
100.0
4
120.0
25.0
100.0
4
0010_101
25.0
100.0
0010_110
25.0
100.0
CPU
Multiplication
Factor 5
CPU Clock
(MHz)
Low
High
4
150.0
400.0
400.0
5
150.0
500.0
100.0
400.0
6
150.0
600.0
4
100.0
400.0
7
175.0
700.0
4
100.0
400.0
8
200.0
800.0
0010_111
Reserved
0011_000
30.0
80.0
5
150.0
400.0
5
150.0
400.0
0011_001
25.0
80.0
5
125.0
400.0
6
150.0
480.0
0011_010
25.0
80.0
5
125.0
400.0
7
175.0
560.0
0011_011
25.0
80.0
5
125.0
400.0
8
200.0
640.0
0011_100
Reserved
0011_101
Reserved
0011_110
25.0
66.7
6
150.0
400.0
6
150.0
400.0
0011_111
25.0
66.7
6
150.0
400.0
7
175.0
466.7
0100_000
25.0
66.7
6
150.0
400.0
8
200.0
533.3
0101_101
75.0
167.0
2
150.0
334.0
2
166.7
334.0
0101_110
60.0
167.0
2
120.0
334.0
2.5
166.7
417.5
0101_111
50.0
167.0
2
100.0
334.0
3
200.0
501.0
0110_000
50.0
167.0
2
100.0
334.0
3.5
250.0
584.5
0110_001
50.0
167.0
2
100.0
334.0
4
250.0
668.0
0110_010
50.0
167.0
2
100.0
334.0
4.5
250.0
751.5
0110_011
Reserved
0110_100
60.0
160.0
2.5
150.0
400.0
2.5
150.0
400.0
0110_101
50.0
160.0
2.5
125.0
400.0
3
150.0
480.0
0110_110
42.9
160.0
2.5
107.1
400.0
3.5
150.0
560.0
0110_111
40.0
160.0
2.5
100.0
400.0
4
160.0
640.0
0111_000
40.0
160.0
2.5
100.0
400.0
4.5
180.0
720.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
26
Freescale Semiconductor
Clock Configuration Modes
Table 16. Clock Configurations for Local Bus Mode 1 (continued)
Bus Clock 3
(MHz)
Mode 2
MODCK_H-MODCK[1-3]
1
2
3
4
5
Low
High
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low
High
0111_001
Reserved
0111_010
Reserved
CPU
Multiplication
Factor 5
CPU Clock
(MHz)
Low
High
0111_011
50.0
133.3
3
150.0
400.0
3
150.0
400.0
0111_100
42.9
133.3
3
128.6
400.0
3.5
150.0
466.7
0111_101
37.5
133.3
3
112.5
400.0
4
150.0
533.3
0111_110
33.3
133.3
3
100.0
400.0
4.5
150.0
600.0
0111_111
Reserved
1000_000
Reserved
1000_001
Reserved
1000_010
42.9
114.3
3.5
150.0
400.0
3.5
150.0
400.0
1000_011
37.5
114.3
3.5
131.3
400.0
4
150.0
457.1
1000_100
33.3
114.3
3.5
116.7
400.0
4.5
150.0
514.3
1000_101
30.0
114.3
3.5
105.0
400.0
5
150.0
571.4
1000_110
28.6
114.3
3.5
100.0
400.0
5.5
150.0
628.6
1100_000
Reserved
1100_001
Reserved
1100_010
Reserved
1101_000
Reserved
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a
table entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose
of illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not
violate the frequency rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency
is determined by the clock mode. For modes with a CPU multiplication factor <= 3, the minimum CPU frequency is
150 MHz for commercial temperature devices and 175 MHz for extended temperature devices. For modes with a CPU
multiplication factor >= 3.5: for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU
frequency is 150 MHz for commercial temperature devices and 175 MHz for extended temperature devices.
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
60x and local bus frequency. Identical to CLKIN.
CPM multiplication factor = CPM clock/bus clock
CPU multiplication factor = Core PLL multiplication factor
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
27
Clock Configuration Modes
7.2 PCI Host Mode
Table 17 and Table 18 show clock configurations for PCI host mode. The frequencies listed are for the purpose of
illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not
exceed the frequency rating of the user’s device. In addition, note the following:
NOTE: PCI_MODCK
In PCI mode only, PCI_MODCK comes from the LGPL5 pin and
MODCK_H[0–3] comes from {LGPL0, LGPL1, LGPL2, LGPL3}.
NOTE: Tval (Output Hold)
The minimum Tval = 2 ns when PCI_MODCK = 1, and the minimum Tval = 1 ns
when PCI_MODCK = 0. Therefore, designers should use clock configurations that
fit this condition to achieve PCI-compliant AC timing.
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0) 1, 2
Mode 3
MODCK_HMODCK[1-3]
Bus Clock 4
(MHz)
Low
High
CPM
Multiplication
Factor 5
CPM Clock
(MHz)
Low High
CPU
Multiplication
Factor 6
CPU Clock
(MHz)
Low
High
PCI
Division
Factor
PCI Clock
(MHz)
Low High
Default Modes (MODCK_H=0000)
0000_000
60.0
66.7
2
120.0 133.3
2.5
150.0 166.7
2
60.0 66.7
0000_001
50.0
66.7
2
100.0 133.3
3
150.0 200.0
2
50.0 66.7
0000_010
60.0
80.0
2.5
150.0 200.0
3
180.0 240.0
3
50.0 66.7
0000_011
60.0
80.0
2.5
150.0 200.0
3.5
210.0 280.0
3
50.0 66.7
0000_100
60.0
80.0
2.5
150.0 200.0
4
240.0 320.0
3
50.0 66.7
0000_101
50.0
66.7
3
150.0 200.0
3
150.0 200.0
3
50.0 66.7
0000_110
50.0
66.7
3.5
150.0 200.0
3.5
175.0 233.3
3
50.0 66.7
0000_111
50.0
66.7
3
150.0 200.0
4
200.0 266.6
3
50.0 66.7
Full Configuration Modes
0001_000
50.0
66.7
3
150.0 200.0
5
250.0 333.3
3
50.0 66.7
0001_001
50.0
66.7
3
150.0 200.0
6
300.0 400.0
3
50.0 66.7
0001_010
50.0
66.7
3
150.0 200.0
7
350.0 466.6
3
50.0 66.7
0001_011
50.0
66.7
3
150.0 200.0
8
400.0 533.3
3
50.0 66.7
0010_000
50.0
66.7
4
200.0 266.6
5
250.0 333.3
4
50.0 66.7
0010_001
50.0
66.7
4
200.0 266.6
6
300.0 400.0
4
50.0 66.7
0010_010
50.0
66.7
4
200.0 266.6
7
350.0 466.6
4
50.0 66.7
0010_011
50.0
66.7
4
200.0 266.6
8
400.0 533.3
4
50.0 66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
28
Freescale Semiconductor
Clock Configuration Modes
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3
Bus Clock 4
(MHz)
CPM
Multiplication
Factor 5
CPM Clock
(MHz)
CPU
Multiplication
Factor 6
CPU Clock
(MHz)
PCI
Division
Factor
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low
High
0010_100
75.0
100.0
4
300.0 400.0
5
375.0 500.0
6
50.0 66.7
0010_101
75.0
100.0
4
300.0 400.0
5.5
412.5 549.9
6
50.0 66.7
0010_110
75.0
100.0
4
300.0 400.0
6
450.0 599.9
6
50.0 66.7
0011_000
50.0
66.7
5
250.0 333.3
5
250.0 333.3
5
50.0 66.7
0011_001
50.0
66.7
5
250.0 333.3
6
300.0 400.0
5
50.0 66.7
0011_010
50.0
66.7
5
250.0 333.3
7
350.0 466.6
5
50.0 66.7
0011_011
50.0
66.7
5
250.0 333.3
8
400.0 533.3
5
50.0 66.7
Low High
0100_000
Low
High
Low High
Reserved
0100_001
50.0
66.7
6
300.0 400.0
6
300.0 400.0
6
50.0 66.7
0100_010
50.0
66.7
6
300.0 400.0
7
350.0 466.6
6
50.0 66.7
0100_011
50.0
66.7
6
300.0 400.0
8
400.0 533.3
6
50.0 66.7
0101_000
60.0
66.7
2
120.0 133.3
2.5
150.0 166.7
2
60.0 66.7
0101_001
50.0
66.7
2
100.0 133.3
3
150.0 200.0
2
50.0 66.7
0101_010
50.0
66.7
2
100.0 133.3
3.5
175.0 233.3
2
50.0 66.7
0101_011
50.0
66.7
2
100.0 133.3
4
200.0 266.6
2
50.0 66.7
0101_100
50.0
66.7
2
100.0 133.3
4.5
225.0 300.0
2
50.0 66.7
0110_000
60.0
80.0
2.5
150.0 200.0
2.5
150.0 200.0
3
50.0 66.7
0110_001
60.0
80.0
2.5
150.0 200.0
3
180.0 240.0
3
50.0 66.7
0110_010
60.0
80.0
2.5
150.0 200.0
3.5
210.0 280.0
3
50.0 66.7
0110_011
60.0
80.0
2.5
150.0 200.0
4
240.0 320.0
3
50.0 66.7
0110_100
60.0
80.0
2.5
150.0 200.0
4.5
270.0 360.0
3
50.0 66.7
0110_101
60.0
80.0
2.5
150.0 200.0
5
300.0 400.0
3
50.0 66.7
0110_110
60.0
80.0
2.5
150.0 200.0
6
360.0 480.0
3
50.0 66.7
0111_000
Reserved
0111_001
50.0
66.7
3
150.0 200.0
3
150.0 200.0
3
50.0 66.7
0111_010
50.0
66.7
3
150.0 200.0
3.5
175.0 233.3
3
50.0 66.7
0111_011
50.0
66.7
3
150.0 200.0
4
200.0 266.6
3
50.0 66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
29
Clock Configuration Modes
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3
Bus Clock 4
(MHz)
MODCK_HMODCK[1-3]
Low
High
0111_100
50.0
66.7
CPM
Multiplication
Factor 5
3
CPM Clock
(MHz)
Low High
150.0 200.0
1000_000
CPU
Multiplication
Factor 6
4.5
CPU Clock
(MHz)
Low
High
PCI
Division
Factor
PCI Clock
(MHz)
Low High
225.0 300.0
3
50.0 66.7
Reserved
1000_001
66.7
88.9
3
200.0 266.6
3
200.0 266.6
4
50.0 66.7
1000_010
66.7
88.9
3
200.0 266.6
3.5
233.3 311.1
4
50.0 66.7
1000_011
66.7
88.9
3
200.0 266.6
4
266.7 355.5
4
50.0 66.7
1000_100
66.7
88.9
3
200.0 266.6
4.5
300.0 400.0
4
50.0 66.7
1000_101
66.7
88.9
3
200.0 266.6
6
400.0 533.3
4
50.0 66.7
1000_110
66.7
88.9
3
200.0 266.6
6.5
433.3 577.7
4
50.0 66.7
1001_000
Reserved
1001_001
Reserved
1001_010
57.1
76.2
3.5
200.0 266.6
3.5
200.0 266.6
4
50.0 66.7
1001_011
57.1
76.2
3.5
200.0 266.6
4
228.6 304.7
4
50.0 66.7
1001_100
57.1
76.2
3.5
200.0 266.6
4.5
257.1 342.8
4
50.0 66.7
1001_101
85.7
114.3
3.5
300.0 400.0
5
428.6 571.4
6
50.0 66.7
1001_110
85.7
114.3
3.5
300.0 400.0
5.5
471.4 628.5
6
50.0 66.7
1001_111
85.7
114.3
3.5
300.0 400.0
6
514.3 685.6
6
50.0 66.7
1010_000
75.0
100.0
2
150.0 200.0
2
150.0 200.0
3
50.0 66.7
1010_001
75.0
100.0
2
150.0 200.0
2.5
187.5 250.0
3
50.0 66.7
1010_010
75.0
100.0
2
150.0 200.0
3
225.0 300.0
3
50.0 66.7
1010_011
75.0
100.0
2
150.0 200.0
3.5
262.5 350.0
3
50.0 66.7
1010_100
75.0
100.0
2
150.0 200.0
4
300.0 400.0
3
50.0 66.7
1011_000
Reserved
1011_001
80.0
106.7
2.5
200.0 266.6
2.5
200.0 266.6
4
50.0 66.7
1011_010
80.0
106.7
2.5
200.0 266.6
3
240.0 320.0
4
50.0 66.7
1011_011
80.0
106.7
2.5
200.0 266.6
3.5
280.0 373.3
4
50.0 66.7
1011_100
80.0
106.7
2.5
200.0 266.6
4
320.0 426.6
4
50.0 66.7
1011_101
80.0
106.7
2.5
200.0 266.6
4.5
360.0 480.0
4
50.0 66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
30
Freescale Semiconductor
Clock Configuration Modes
Table 17. Clock Configurations for PCI Host Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3
MODCK_HMODCK[1-3]
1
2
3
4
5
6
Bus Clock 4
(MHz)
Low
High
CPM
Multiplication
Factor 5
CPM Clock
(MHz)
Low High
CPU
Multiplication
Factor 6
CPU Clock
(MHz)
Low
High
PCI
Division
Factor
PCI Clock
(MHz)
Low High
1101_000
100.0 133.3
2.5
250.0 333.3
3
300.0 400.0
5
50.0 66.7
1101_001
100.0 133.3
2.5
250.0 333.3
3.5
350.0 466.6
5
50.0 66.7
1101_010
100.0 133.3
2.5
250.0 333.3
4
400.0 533.3
5
50.0 66.7
1101_011
100.0 133.3
2.5
250.0 333.3
4.5
450.0 599.9
5
50.0 66.7
1101_100
100.0 133.3
2.5
250.0 333.3
5
500.0 666.6
5
50.0 66.7
1101_101
125.0 166.7
2
250.0 333.3
3
375.0 500.0
5
50.0 66.7
1101_110
125.0 166.7
2
250.0 333.3
4
500.0 666.6
5
50.0 66.7
1110_000
100.0 133.3
3
300.0 400.0
3.5
350.0 466.6
6
50.0 66.7
1110_001
100.0 133.3
3
300.0 400.0
4
400.0 533.3
6
50.0 66.7
1110_010
100.0 133.3
3
300.0 400.0
4.5
450.0 599.9
6
50.0 66.7
1110_011
100.0 133.3
3
300.0 400.0
5
500.0 666.6
6
50.0 66.7
1110_100
100.0 133.3
3
300.0 400.0
5.5
550.0 733.3
6
50.0 66.7
1100_000
Reserved
1100_001
Reserved
1100_010
Reserved
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table
entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of
illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not violate
the frequency rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is
determined by the clock mode. For modes with a CPU multiplication factor <= 3, the minimum CPU frequency is 150
MHz for commercial temperature devices and 175 MHz for extended temperature devices. For modes with a CPU
multiplication factor >= 3.5: for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU
frequency is 150 MHz for commercial temperature devices and 175 MHz for extended temperature devices.
As Table 15 shows, PCI_MODCK determines the PCI clock frequency range. Refer to Table 18 for lower configurations.
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
60x and local bus frequency. Identical to CLKIN.
CPM multiplication factor = CPM clock/bus clock
CPU multiplication factor = Core PLL multiplication factor
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
31
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1) 1, 2
Mode 3
MODCK_HMODCK[1-3]
Bus Clock 4
(MHz)
Low
High
CPM
Multiplication
Factor 5
CPM Clock
(MHz)
Low High
CPU
Multiplication
Factor 6
CPU Clock
(MHz)
Low
High
PCI
Division
Factor
PCI Clock
(MHz)
Low High
Default Modes (MODCK_H=0000)
0000_000
60.0
100.0
2
120.0 200.0
2.5
150.0 250.0
4
30.0 50.0
0000_001
50.0
100.0
2
100.0 200.0
3
150.0 300.0
4
25.0 50.0
0000_010
60.0
120.0
2.5
150.0 300.0
3
180.0 360.0
6
25.0 50.0
0000_011
60.0
120.0
2.5
150.0 300.0
3.5
210.0 420.0
6
25.0 50.0
0000_100
60.0
120.0
2.5
150.0 300.0
4
240.0 480.0
6
25.0 50.0
0000_101
50.0
100.0
3
150.0 300.0
3
150.0 300.0
6
25.0 50.0
0000_110
50.0
100.0
3
150.0 300.0
3.5
175.0 350.0
6
25.0 50.0
0000_111
50.0
100.0
3
150.0 300.0
4
200.0 400.0
6
25.0 50.0
Full Configuration Modes
0001_000
50.0
100.0
3
150.0 300.0
5
250.0 500.0
6
25.0 50.0
0001_001
50.0
100.0
3
150.0 300.0
6
300.0 600.0
6
25.0 50.0
0001_010
50.0
100.0
3
150.0 300.0
7
350.0 700.0
6
25.0 50.0
0001_011
50.0
100.0
3
150.0 300.0
8
400.0 800.0
6
25.0 50.0
0010_000
50.0
100.0
4
200.0 400.0
5
250.0 500.0
8
25.0 50.0
0010_001
50.0
100.0
4
200.0 400.0
6
300.0 600.0
8
25.0 50.0
0010_010
50.0
100.0
4
200.0 400.0
7
350.0 700.0
8
25.0 50.0
0010_011
50.0
100.0
4
200.0 400.0
8
400.0 800.0
8
25.0 50.0
0010_100
37.5
75.0
4
150.0 300.0
5
187.5 375.0
6
25.0 50.0
0010_101
37.5
75.0
4
150.0 300.0
5.5
206.3 412.5
6
25.0 50.0
0010_110
37.5
75.0
4
150.0 300.0
6
225.0 450.0
6
25.0 50.0
0011_000
30.0
50.0
5
150.0 250.0
5
150.0 250.0
5
30.0 50.0
0011_001
25.0
50.0
5
125.0 250.0
6
150.0 300.0
5
25.0 50.0
0011_010
25.0
50.0
5
125.0 250.0
7
175.0 350.0
5
25.0 50.0
0011_011
25.0
50.0
5
125.0 250.0
8
200.0 400.0
5
25.0 50.0
0100_000
Reserved
0100_001
25.0
50.0
6
150.0 300.0
6
150.0 300.0
6
25.0 50.0
0100_010
25.0
50.0
6
150.0 300.0
7
175.0 350.0
6
25.0 50.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
32
Freescale Semiconductor
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3
Bus Clock 4
(MHz)
CPM
Multiplication
Factor 5
CPM Clock
(MHz)
CPU
Multiplication
Factor 6
CPU Clock
(MHz)
PCI
Division
Factor
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low
High
0100_011
25.0
50.0
6
150.0 300.0
8
200.0 400.0
6
25.0 50.0
0101_000
60.0
100.0
2
120.0 200.0
2.5
150.0 250.0
4
30.0 50.0
0101_001
50.0
100.0
2
100.0 200.0
3
150.0 300.0
4
25.0 50.0
0101_010
50.0
100.0
2
100.0 200.0
3.5
175.0 350.0
4
25.0 50.0
0101_011
50.0
100.0
2
100.0 200.0
4
200.0 400.0
4
25.0 50.0
0101_100
50.0
100.0
2
100.0 200.0
4.5
225.0 450.0
4
25.0 50.0
0110_000
60.0
120.0
2.5
150.0 300.0
2.5
150.0 300.0
6
25.0 50.0
0110_001
60.0
120.0
2.5
150.0 300.0
3
180.0 360.0
6
25.0 50.0
0110_010
60.0
120.0
2.5
150.0 300.0
3.5
210.0 420.0
6
25.0 50.0
0110_011
60.0
120.0
2.5
150.0 300.0
4
240.0 480.0
6
25.0 50.0
0110_100
60.0
120.0
2.5
150.0 300.0
4.5
270.0 540.0
6
25.0 50.0
0110_101
60.0
120.0
2.5
150.0 300.0
5
300.0 600.0
6
25.0 50.0
0110_110
60.0
120.0
2.5
150.0 300.0
6
360.0 720.0
6
25.0 50.0
Low High
0111_000
Low
High
Low High
Reserved
0111_001
50.0
100.0
3
150.0 300.0
3
150.0 300.0
6
25.0 50.0
0111_010
50.0
100.0
3
150.0 300.0
3.5
175.0 350.0
6
25.0 50.0
0111_011
50.0
100.0
3
150.0 300.0
4
200.0 400.0
6
25.0 50.0
0111_100
50.0
100.0
3
150.0 300.0
4.5
225.0 450.0
6
25.0 50.0
1000_000
Reserved
1000_001
66.7
133.3
3
200.0 400.0
3
200.0 400.0
8
25.0 50.0
1000_010
66.7
133.3
3
200.0 400.0
3.5
233.3 466.7
8
25.0 50.0
1000_011
66.7
133.3
3
200.0 400.0
4
266.7 533.3
8
25.0 50.0
1000_100
66.7
133.3
3
200.0 400.0
4.5
300.0 600.0
8
25.0 50.0
1000_101
66.7
133.3
3
200.0 400.0
6
400.0 800.0
8
25.0 50.0
1000_110
66.7
133.3
3
200.0 400.0
6.5
433.3 866.7
8
25.0 50.0
1001_000
Reserved
1001_001
Reserved
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
33
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3
Bus Clock 4
(MHz)
CPM
Multiplication
Factor 5
CPM Clock
(MHz)
CPU
Multiplication
Factor 6
CPU Clock
(MHz)
PCI
Division
Factor
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low
High
1001_010
57.1
114.3
3.5
200.0 400.0
3.5
200.0 400.0
8
25.0 50.0
1001_011
57.1
114.3
3.5
200.0 400.0
4
228.6 457.1
8
25.0 50.0
1001_100
57.1
114.3
3.5
200.0 400.0
4.5
257.1 514.3
8
25.0 50.0
1001_101
42.9
85.7
3.5
150.0 300.0
5
214.3 428.6
6
25.0 50.0
1001_110
42.9
85.7
3.5
150.0 300.0
5.5
235.7 471.4
6
25.0 50.0
1001_111
42.9
85.7
3.5
150.0 300.0
6
257.1 514.3
6
25.0 50.0
1010_000
75.0
150.0
2
150.0 300.0
2
150.0 300.0
6
25.0 50.0
1010_001
75.0
150.0
2
150.0 300.0
2.5
187.5 375.0
6
25.0 50.0
1010_010
75.0
150.0
2
150.0 300.0
3
225.0 450.0
6
25.0 50.0
1010_011
75.0
150.0
2
150.0 300.0
3.5
262.5 525.0
6
25.0 50.0
1010_100
75.0
150.0
2
150.0 300.0
4
300.0 600.0
6
25.0 50.0
Low High
1011_000
Low
High
Low High
Reserved
1011_001
80.0
160.0
2.5
200.0 400.0
2.5
200.0 400.0
8
25.0 50.0
1011_010
80.0
160.0
2.5
200.0 400.0
3
240.0 480.0
8
25.0 50.0
1011_011
80.0
160.0
2.5
200.0 400.0
3.5
280.0 560.0
8
25.0 50.0
1011_100
80.0
160.0
2.5
200.0 400.0
4
320.0 640.0
8
25.0 50.0
1011_101
80.0
160.0
2.5
200.0 400.0
4.5
360.0 720.0
8
25.0 50.0
1101_000
50.0
100.0
2.5
125.0 250.0
3
150.0 300.0
5
25.0 50.0
1101_001
50.0
100.0
2.5
125.0 250.0
3.5
175.0 350.0
5
25.0 50.0
1101_010
50.0
100.0
2.5
125.0 250.0
4
200.0 400.0
5
25.0 50.0
1101_011
50.0
100.0
2.5
125.0 250.0
4.5
225.0 450.0
5
25.0 50.0
1101_100
50.0
100.0
2.5
125.0 250.0
5
250.0 500.0
5
25.0 50.0
1101_101
62.5
125.0
2
125.0 250.0
3
187.5 375.0
5
25.0 50.0
1101_110
62.5
125.0
2
125.0 250.0
4
250.0 500.0
5
25.0 50.0
1110_000
50.0
100.0
3
150.0 300.0
3.5
175.0 350.0
6
25.0 50.0
1110_001
50.0
100.0
3
150.0 300.0
4
200.0 400.0
6
25.0 50.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
34
Freescale Semiconductor
Clock Configuration Modes
Table 18. Clock Configurations for PCI Host Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3
1
2
3
4
5
6
Bus Clock 4
(MHz)
CPM
Multiplication
Factor 5
CPM Clock
(MHz)
CPU
Multiplication
Factor 6
CPU Clock
(MHz)
PCI
Division
Factor
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low
High
1110_010
50.0
100.0
3
150.0 300.0
4.5
225.0 450.0
6
25.0 50.0
1110_011
50.0
100.0
3
150.0 300.0
5
250.0 500.0
6
25.0 50.0
1110_100
50.0
100.0
3
150.0 300.0
5.5
275.0 550.0
6
25.0 50.0
Low High
1100_000
Reserved
1100_001
Reserved
1100_010
Reserved
Low
High
Low High
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table
entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of illustration
only. Users must select a mode and input bus frequency so that the resulting configuration does not violate the frequency
rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is determined by the clock
mode. For modes with a CPU multiplication factor <= 3, the minimum CPU frequency is 150 MHz for commercial
temperature devices and 175 MHz for extended temperature devices. For modes with a CPU multiplication factor >= 3.5:
for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU frequency is 150 MHz for
commercial temperature devices and 175 MHz for extended temperature devices.
As Table 15 shows, PCI_MODCK determines the PCI clock frequency range. Refer to Table 17 for higher configurations.
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
60x and local bus frequency. Identical to CLKIN.
CPM multiplication factor = CPM clock/bus clock
CPU multiplication factor = Core PLL multiplication factor
7.3 PCI Agent Mode
Table 19 and Table 20 show configurations for PCI agent mode. The frequencies listed are for the purpose of
illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not
exceed the frequency rating of the user’s device. In addition, note the following:
NOTE: PCI_MODCK
In PCI mode only, PCI_MODCK comes from the LGPL5 pin and
MODCK_H[0–3] comes from {LGPL0, LGPL1, LGPL2, LGPL3}.
NOTE: Tval (Output Hold)
The minimum Tval = 2 ns when PCI_MODCK = 1, and the minimum Tval = 1 ns
when PCI_MODCK = 0. Therefore, designers should use clock configurations that
fit this condition to achieve PCI-compliant AC timing.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
35
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0) 1, 2
Mode 3
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low High
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low High
CPU Clock
(MHz)
CPU
Multiplication
Factor 5
Low
High
Bus
Division
Factor
Bus Clock
(MHz)
Low
High
Default Modes (MODCK_H=0000
0000_000
60.0 66.7
2
120.0 133.3
2.5
150.0 166.7
2
60.0
66.7
0000_001
50.0 66.7
2
100.0 133.3
3
150.0 200.0
2
50.0
66.7
0000_010
50.0 66.7
3
150.0 200.0
3
150.0 200.0
3
50.0
66.7
0000_011
50.0 66.7
3
150.0 200.0
4
200.0 266.6
3
50.0
66.7
0000_100
50.0 66.7
3
150.0 200.0
3
180.0 240.0
2.5
60.0
80.0
0000_101
50.0 66.7
3
150.0 200.0
3.5
210.0 280.0
2.5
60.0
80.0
0000_110
50.0 66.7
4
200.0 266.6
3.5
233.3 311.1
3
66.7
88.9
0000_111
50.0 66.7
4
200.0 266.6
3
240.0 320.0
2.5
80.0
106.7
Full Configuration Modes
0001_001
60.0 66.7
2
120.0 133.3
5
150.0 166.7
4
30.0
33.3
0001_010
50.0 66.7
2
100.0 133.3
6
150.0 200.0
4
25.0
33.3
0001_011
50.0 66.7
2
100.0 133.3
7
175.0 233.3
4
25.0
33.3
0001_100
50.0 66.7
2
100.0 133.3
8
200.0 266.6
4
25.0
33.3
0010_001
50.0 66.7
3
150.0 200.0
3
180.0 240.0
2.5
60.0
80.0
0010_010
50.0 66.7
3
150.0 200.0
3.5
210.0 280.0
2.5
60.0
80.0
0010_011
50.0 66.7
3
150.0 200.0
4
240.0 320.0
2.5
60.0
80.0
0010_100
50.0 66.7
3
150.0 200.0
4.5
270.0 360.0
2.5
60.0
80.0
0011_000
Reserved
0011_001
Reserved
0011_010
Reserved
0011_011
Reserved
0011_100
Reserved
0100_000
Reserved
0100_001
50.0 66.7
3
150.0 200.0
3
150.0 200.0
3
50.0
66.7
0100_010
50.0 66.7
3
150.0 200.0
3.5
175.0 200.0
3
50.0
66.7
0100_011
50.0 66.7
3
150.0 200.0
4
200.0 266.6
3
50.0
66.7
0100_100
50.0 66.7
3
150.0 200.0
4.5
225.0 300.0
3
50.0
66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
36
Freescale Semiconductor
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low High
0101_000
50.0 66.7
5
250.0 333.3
2.5
250.0 333.3
2.5
100.0 133.3
0101_001
50.0 66.7
5
250.0 333.3
3
300.0 400.0
2.5
100.0 133.3
0101_010
50.0 66.7
5
250.0 333.3
3.5
350.0 466.6
2.5
100.0 133.3
0101_011
50.0 66.7
5
250.0 333.3
4
400.0 533.3
2.5
100.0 133.3
0101_100
50.0 66.7
5
250.0 333.3
4.5
450.0 599.9
2.5
100.0 133.3
0101_101
50.0 66.7
5
250.0 333.3
5
500.0 666.6
2.5
100.0 133.3
0101_110
50.0 66.7
5
250.0 333.3
5.5
550.0 733.3
2.5
100.0 133.3
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low High
0110_000
CPU
Multiplication
Factor 5
CPU Clock
(MHz)
Low
High
Bus
Division
Factor
Bus Clock
(MHz)
Low
High
Reserved
0110_001
50.0 66.7
4
200.0 266.6
3
200.0 266.6
3
66.7
88.9
0110_010
50.0 66.7
4
200.0 266.6
3.5
233.3 311.1
3
66.7
88.9
0110_011
50.0 66.7
4
200.0 266.6
4
266.7 355.5
3
66.7
88.9
0110_100
50.0 66.7
4
200.0 266.6
4.5
300.0 400.0
3
66.7
88.9
0111_000
50.0 66.7
3
150.0 200.0
2
150.0 200.0
2
75.0
100.0
0111_001
50.0 66.7
3
150.0 200.0
2.5
187.5 250.0
2
75.0
100.0
0111_010
50.0 66.7
3
150.0 200.0
3
225.0 300.0
2
75.0
100.0
0111_011
50.0 66.7
3
150.0 200.0
3.5
262.5 350.0
2
75.0
100.0
1000_000
Reserved
1000_001
50.0 66.7
3
150.0 200.0
2.5
150.0 166.7
2.5
60.0
80.0
1000_010
50.0 66.7
3
150.0 200.0
3
180.0 240.0
2.5
60.0
80.0
1000_011
50.0 66.7
3
150.0 200.0
3.5
210.0 280.0
2.5
60.0
80.0
1000_100
50.0 66.7
3
150.0 200.0
4
240.0 320.0
2.5
60.0
80.0
1000_101
50.0 66.7
3
150.0 200.0
4.5
270.0 360.0
2.5
60.0
80.0
1001_000
Reserved
1001_001
Reserved
1001_010
Reserved
1001_011
50.0 66.7
4
200.0 266.6
4
200.0 266.6
4
50.0
66.7
1001_100
50.0 66.7
4
200.0 266.6
4.5
225.0 300.0
4
50.0
66.7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
37
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0) 1, 2 (continued)
Mode 3
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low High
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low High
1010_000
CPU
Multiplication
Factor 5
CPU Clock
(MHz)
Low
High
Bus
Division
Factor
Bus Clock
(MHz)
Low
High
Reserved
1010_001
50.0 66.7
4
200.0 266.6
3
200.0 266.6
3
66.7
88.9
1010_010
50.0 66.7
4
200.0 266.6
3.5
233.3 311.1
3
66.7
88.9
1010_011
50.0 66.7
4
200.0 266.6
4
266.7 355.5
3
66.7
88.9
1010_100
50.0 66.7
4
200.0 266.6
4.5
300.0 400.0
3
66.7
88.9
1011_000
Reserved
1011_001
50.0 66.7
4
200.0 266.6
2.5
200.0 266.6
2.5
80.0
106.7
1011_010
50.0 66.7
4
200.0 266.6
3
240.0 320.0
2.5
80.0
106.7
1011_011
50.0 66.7
4
200.0 266.6
3.5
280.0 373.3
2.5
80.0
106.7
1011_100
50.0 66.7
4
200.0 266.6
4
320.0 426.6
2.5
80.0
106.7
1100_101
50.0 66.7
6
300.0 400.0
4
400.0 533.3
3
100.0 133.3
1100_110
50.0 66.7
6
300.0 400.0
4.5
450.0 599.9
3
100.0 133.3
1100_111
50.0 66.7
6
300.0 400.0
5
500.0 666.6
3
100.0 133.3
1101_000
50.0 66.7
6
300.0 400.0
5.5
550.0 733.3
3
100.0 133.3
1101_001
50.0 66.7
6
300.0 400.0
3.5
420.0 559.9
2.5
120.0 160.0
1101_010
50.0 66.7
6
300.0 400.0
4
480.0 639.9
2.5
120.0 160.0
1101_011
50.0 66.7
6
300.0 400.0
4.5
540.0 719.9
2.5
120.0 160.0
1101_100
50.0 66.7
6
300.0 400.0
5
600.0 799.9
2.5
120.0 160.0
1110_000
50.0 66.7
5
250.0 333.3
2.5
312.5 416.6
2
125.0 166.7
1110_001
50.0 66.7
5
250.0 333.3
3
375.0 500.0
2
125.0 166.7
1110_010
50.0 66.7
5
250.0 333.3
3.5
437.5 583.3
2
125.0 166.7
1110_011
50.0 66.7
5
250.0 333.3
4
500.0 666.6
2
125.0 166.7
1110_100
50.0 66.7
5
250.0 333.3
4
333.3 444.4
3
83.3
111.1
1110_101
50.0 66.7
5
250.0 333.3
4.5
375.0 500.0
3
83.3
111.1
1110_110
50.0 66.7
5
250.0 333.3
5
416.7 555.5
3
83.3
111.1
1110_111
50.0 66.7
5
250.0 333.3
5.5
458.3 611.1
3
83.3
111.1
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
38
Freescale Semiconductor
Clock Configuration Modes
Table 19. Clock Configurations for PCI Agent Mode (PCI_MODCK=0) 1, 2 (continued)
1
2
3
4
5
Mode 3
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low High
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low High
CPU
Multiplication
Factor 5
1100_000
Reserved
1100_001
Reserved
1100_010
Reserved
CPU Clock
(MHz)
Low
High
Bus
Division
Factor
Bus Clock
(MHz)
Low
High
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table
entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of
illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not violate
the frequency rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is
determined by the clock mode. For modes with a CPU multiplication factor <= 3, the minimum CPU frequency is 150
MHz for commercial temperature devices and 175 MHz for extended temperature devices. For modes with a CPU
multiplication factor >= 3.5: for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU
frequency is 150 MHz for commercial temperature devices and 175 MHz for extended temperature devices.
As shown in Table 15, PCI_MODCK determines the PCI clock frequency range. Refer to Table 20 for lower
configurations.
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
CPM multiplication factor = CPM clock/PCI clock
CPU multiplication factor = Core PLL multiplication factor
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1) 1, 2
Mode 3
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low High
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low High
CPU
Multiplication
Factor 5
CPU Clock
(MHz)
Low
High
Bus
Division
Factor
Bus Clock
(MHz)
Low
High
Default Modes (MODCK_H=0000)
0000_000
30.0
50.0
4
120.0 200.0
2.5
150.0 250.0
2
60.0
100.0
0000_001
25.0
50.0
4
100.0 200.0
3
150.0 300.0
2
50.0
100.0
0000_010
25.0
50.0
6
150.0 300.0
3
150.0 300.0
3
50.0
100.0
0000_011
25.0
50.0
6
150.0 300.0
4
200.0 400.0
3
50.0
100.0
0000_100
25.0
50.0
6
150.0 300.0
3
180.0 360.0
2.5
60.0
120.0
0000_101
25.0
50.0
6
150.0 300.0
3.5
210.0 420.0
2.5
60.0
120.0
0000_110
25.0
50.0
8
200.0 400.0
3.5
233.3 466.7
3
66.7
133.3
0000_111
25.0
50.0
8
200.0 400.0
3
240.0 480.0
2.5
80.0
160.0
Full Configuration Modes
0001_001
30.0
50.0
4
120.0 200.0
5
150.0 250.0
4
30.0
50.0
0001_010
25.0
50.0
4
100.0 200.0
6
150.0 300.0
4
25.0
50.0
0001_011
25.0
50.0
4
100.0 200.0
7
175.0 350.0
4
25.0
50.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
39
Clock Configuration Modes
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low High
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low High
CPU
Multiplication
Factor 5
CPU Clock
(MHz)
Low
High
Bus
Division
Factor
Bus Clock
(MHz)
Low
High
0001_100
25.0
50.0
4
100.0 200.0
8
200.0 400.0
4
25.0
50.0
0010_001
25.0
50.0
6
150.0 300.0
3
180.0 360.0
2.5
60.0
120.0
0010_010
25.0
50.0
6
150.0 300.0
3.5
210.0 420.0
2.5
60.0
120.0
0010_011
25.0
50.0
6
150.0 300.0
4
240.0 480.0
2.5
60.0
120.0
0010_100
25.0
50.0
6
150.0 300.0
4.5
270.0 540.0
2.5
60.0
120.0
0011_000
Reserved
0011_001
37.5
50.0
4
150.0 200.0
3
150.0 200.0
3
50.0
66.7
0011_010
32.1
50.0
4
128.6 200.0
3.5
150.0 233.3
3
42.9
66.7
0011_011
28.1
50.0
4
112.5 200.0
4
150.0 266.7
3
37.5
66.7
0011_100
25.0
50.0
4
100.0 200.0
4.5
150.0 300.0
3
33.3
66.7
0100_000
Reserved
0100_001
25.0
50.0
6
150.0 300.0
3
150.0 300.0
3
50.0
100.0
0100_010
25.0
50.0
6
150.0 300.0
3.5
175.0 350.0
3
50.0
100.0
0100_011
25.0
50.0
6
150.0 300.0
4
200.0 400.0
3
50.0
100.0
0100_100
25.0
50.0
6
150.0 300.0
4.5
225.0 450.0
3
50.0
100.0
0101_000
30.0
50.0
5
150.0 250.0
2.5
150.0 250.0
2.5
60.0
100.0
0101_001
25.0
50.0
5
125.0 250.0
3
150.0 300.0
2.5
50.0
100.0
0101_010
25.0
50.0
5
125.0 250.0
3.5
175.0 350.0
2.5
50.0
100.0
0101_011
25.0
50.0
5
125.0 250.0
4
200.0 400.0
2.5
50.0
100.0
0101_100
25.0
50.0
5
125.0 250.0
4.5
225.0 450.0
2.5
50.0
100.0
0101_101
25.0
50.0
5
125.0 250.0
5
250.0 500.0
2.5
50.0
100.0
0101_110
25.0
50.0
5
125.0 250.0
5.5
275.0 550.0
2.5
50.0
100.0
0110_000
Reserved
0110_001
25.0
50.0
8
200.0 400.0
3
200.0 400.0
3
66.7
133.3
0110_010
25.0
50.0
8
200.0 400.0
3.5
233.3 466.7
3
66.7
133.3
0110_011
25.0
50.0
8
200.0 400.0
4
266.7 533.3
3
66.7
133.3
0110_100
25.0
50.0
8
200.0 400.0
4.5
300.0 600.0
3
66.7
133.3
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
40
Freescale Semiconductor
Clock Configuration Modes
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1) 1, 2 (continued)
Mode 3
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low High
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low High
CPU
Multiplication
Factor 5
CPU Clock
(MHz)
Low
High
Bus
Division
Factor
Bus Clock
(MHz)
Low
High
0111_000
25.0
50.0
6
150.0 300.0
2
150.0 300.0
2
75.0
150.0
0111_001
25.0
50.0
6
150.0 300.0
2.5
187.5 375.0
2
75.0
150.0
0111_010
25.0
50.0
6
150.0 300.0
3
225.0 450.0
2
75.0
150.0
0111_011
25.0
50.0
6
150.0 300.0
3.5
262.5 525.0
2
75.0
150.0
1000_000
Reserved
1000_001
25.0
50.0
6
150.0 300.0
2.5
150.0 300.0
2.5
60.0
120.0
1000_010
25.0
50.0
6
150.0 300.0
3
180.0 360.0
2.5
60.0
120.0
1000_011
25.0
50.0
6
150.0 300.0
3.5
210.0 420.0
2.5
60.0
120.0
1000_100
25.0
50.0
6
150.0 300.0
4
240.0 480.0
2.5
60.0
120.0
1000_101
25.0
50.0
6
150.0 300.0
4.5
270.0 540.0
2.5
60.0
120.0
1001_000
Reserved
1001_001
Reserved
1001_010
Reserved
1001_011
25.0
50.0
8
200.0 400.0
4
200.0 400.0
4
50.0
100.0
1001_100
25.0
50.0
8
200.0 400.0
4.5
225.0 450.0
4
50.0
100.0
1010_000
Reserved
1010_001
25.0
50.0
8
200.0 400.0
3
200.0 400.0
3
66.7
133.3
1010_010
25.0
50.0
8
200.0 400.0
3.5
233.3 466.7
3
66.7
133.3
1010_011
25.0
50.0
8
200.0 400.0
4
266.7 533.3
3
66.7
133.3
1010_100
25.0
50.0
8
200.0 400.0
4.5
300.0 600.0
3
66.7
133.3
1011_000
Reserved
1011_001
25.0
50.0
8
200.0 400.0
2.5
200.0 400.0
2.5
80.0
160.0
1011_010
25.0
50.0
8
200.0 400.0
3
240.0 480.0
2.5
80.0
160.0
1011_011
25.0
50.0
8
200.0 400.0
3.5
280.0 560.0
2.5
80.0
160.0
1011_100
25.0
50.0
8
200.0 400.0
4
320.0 640.0
2.5
80.0
160.0
1100_101
25.0
50.0
6
150.0 300.0
4
200.0 400.0
3
50.0
100.0
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
41
Clock Configuration Modes
Table 20. Clock Configurations for PCI Agent Mode (PCI_MODCK=1) 1, 2 (continued)
1
2
3
4
5
Mode 3
PCI Clock
(MHz)
MODCK_HMODCK[1-3]
Low High
CPM
Multiplication
Factor 4
CPM Clock
(MHz)
Low High
CPU
Multiplication
Factor 5
CPU Clock
(MHz)
Low
High
Bus
Division
Factor
Bus Clock
(MHz)
Low
High
1100_110
25.0
50.0
6
150.0 300.0
4.5
225.0 450.0
3
50.0
100.0
1100_111
25.0
50.0
6
150.0 300.0
5
250.0 500.0
3
50.0
100.0
1101_000
25.0
50.0
6
150.0 300.0
5.5
275.0 550.0
3
50.0
100.0
1101_001
25.0
50.0
6
150.0 300.0
3.5
210.0 420.0
2.5
60.0
120.0
1101_010
25.0
50.0
6
150.0 300.0
4
240.0 480.0
2.5
60.0
120.0
1101_011
25.0
50.0
6
150.0 300.0
4.5
270.0 540.0
2.5
60.0
120.0
1101_100
25.0
50.0
6
150.0 300.0
5
300.0 600.0
2.5
60.0
120.0
1110_000
25.0
50.0
5
125.0 250.0
2.5
156.3 312.5
2
62.5
125.0
1110_001
25.0
50.0
5
125.0 250.0
3
187.5 375.0
2
62.5
125.0
1110_010
25.0
50.0
5
125.0 250.0
3.5
218.8 437.5
2
62.5
125.0
1110_011
25.0
50.0
5
125.0 250.0
4
250.0 500.0
2
62.5
125.0
1110_100
25.0
50.0
5
125.0 250.0
4
166.7 333.3
3
41.7
83.3
1110_101
25.0
50.0
5
125.0 250.0
4.5
187.5 375.0
3
41.7
83.3
1110_110
25.0
50.0
5
125.0 250.0
5
208.3 416.7
3
41.7
83.3
1110_111
25.0
50.0
5
125.0 250.0
5.5
229.2 458.3
3
41.7
83.3
1100_000
Reserved
1100_001
Reserved
1100_010
Reserved
The “low” values are the minimum allowable frequencies for a given clock mode. The minimum bus frequency in a table
entry guarantees only the required minimum CPU operating frequency. The “high” values are for the purpose of
illustration only. Users must select a mode and input bus frequency so that the resulting configuration does not violate
the frequency rating of the user’s device. The minimum CPM frequency is 120 MHz. Minimum CPU frequency is
determined by the clock mode. For modes with a CPU multiplication factor <= 3, the minimum CPU frequency is 150
MHz for commercial temperature devices and 175 MHz for extended temperature devices. For modes with a CPU
multiplication factor >= 3.5: for Rev0.1 the minimum CPU frequency is 250 MHz; for RevA or later the minimum CPU
frequency is 150 MHz for commercial temperature devices and 175 MHz for extended temperature devices.
As shown in Table 15, PCI_MODCK determines the PCI clock range. Refer to Table 19 for higher range configurations.
MODCK_H = hard reset configuration word [28–31]. MODCK[1-3] = three hardware configuration pins.
CPM multiplication factor = CPM clock/PCI clock
CPU multiplication factor = Core PLL multiplication factor
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
42
Freescale Semiconductor
Pinout
8
Pinout
This section provides the pin assignments and pinout lists for both HiP7 PowerQUICC II packages.
8.1 ZU Package—MPC8280 and MPC8270
The following figures and table represent the standard 480 TBGA package. For information on the alternate
package, refer to Section 8.2, “VR and ZQ Packages—MPC8275 and MPC8270,” on page -58.
Figure 13 shows the pinout of the ZU package as viewed from the top surface.
1
2
3
4 5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
AG
AH
AJ
1
2
3
4 5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29
Not to Scale
Figure 13. Pinout of the 480 TBGA Package (View from Top)
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
43
Pinout
Figure 14 shows the side profile of the TBGA package to indicate the direction of the top surface view.
View
Copper Heat Spreader
(Oxidized for Insulation)
Die
Attach
Polymide Tape
Etched
Cavity
Pressure Sensitive
Adhesive
Die
Soldermask
1.27 mm Pitch
Glob-Top Filled Area
Glob-Top Dam
Copper Traces
Wire Bonds
Figure 14. Side View of the TBGA Package
Table 21 shows the pinout list of the MPC8280 and MPC8270. Table 22 defines conventions and acronyms used in
Table 21.
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
BR
W5
BG
F4
ABB/IRQ2
E2
TS
E3
A0
G1
A1
H5
A2
H2
A3
H1
A4
J5
A5
J4
A6
J3
A7
J2
A8
J1
A9
K4
A10
K3
A11
K2
A12
K1
A13
L5
A14
L4
A15
L3
A16
L2
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
44
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
A17
L1
A18
M5
A19
N5
A20
N4
A21
N3
A22
N2
A23
N1
A24
P4
A25
P3
A26
P2
A27
P1
A28
R1
A29
R3
A30
R5
A31
R4
TT0
F1
TT1
G4
TT2
G3
TT3
G2
TT4
F2
TBST
D3
TSIZ0
C1
TSIZ1
E4
TSIZ2
D2
TSIZ3
F5
AACK
F3
ARTRY
E1
DBG
V1
DBB/IRQ3
V2
D0
B20
D1
A18
D2
A16
D3
A13
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
45
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
D4
E12
D5
D9
D6
A6
D7
B5
D8
A20
D9
E17
D10
B15
D11
B13
D12
A11
D13
E9
D14
B7
D15
B4
D16
D19
D17
D17
D18
D15
D19
C13
D20
B11
D21
A8
D22
A5
D23
C5
D24
C19
D25
C17
D26
C15
D27
D13
D28
C11
D29
B8
D30
A4
D31
E6
D32
E18
D33
B17
D34
A15
D35
A12
D36
D11
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
46
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
D37
C8
D38
E7
D39
A3
D40
D18
D41
A17
D42
A14
D43
B12
D44
A10
D45
D8
D46
B6
D47
C4
D48
C18
D49
E16
D50
B14
D51
C12
D52
B10
D53
A7
D54
C6
D55
D5
D56
B18
D57
B16
D58
E14
D59
D12
D60
C10
D61
E8
D62
D6
D63
C2
DP0/RSRV/EXT_BR2
B22
IRQ1/DP1/EXT_BG2
A22
IRQ2/DP2/TLBISYNC/EXT_DBG2
E21
IRQ3/DP3/CKSTP_OUT/EXT_BR3
D21
IRQ4/DP4/CORE_SRESET/EXT_BG3
C21
IRQ5/CINT/DP5/TBEN/EXT_DBG3
B21
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
47
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
IRQ6/DP6/CSE0
A21
IRQ7/DP7/CSE1
E20
PSDVAL
V3
TA
C22
TEA
V5
GBL/IRQ1
W1
CI/BADDR29/IRQ2
U2
WT/BADDR30/IRQ3
U3
L2_HIT/IRQ4
Y4
CPU_BG/BADDR31/IRQ5/CINT
U4
CPU_DBG
R2
CPU_BR
Y3
CS0
F25
CS1
C29
CS2
E27
CS3
E28
CS4
F26
CS5
F27
CS6
F28
CS7
G25
CS8
D29
CS9
E29
CS10/BCTL1
F29
CS11/AP0
G28
BADDR27
T5
BADDR28
U1
ALE
T2
BCTL0
A27
PWE0/PSDDQM0/PBS0
C25
PWE1/PSDDQM1/PBS1
E24
PWE2/PSDDQM2/PBS2
D24
PWE3/PSDDQM3/PBS3
C24
PWE4/PSDDQM4/PBS4
B26
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
48
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
PWE5/PSDDQM5/PBS5
A26
PWE6/PSDDQM6/PBS6
B25
PWE7/PSDDQM7/PBS7
A25
PSDA10/PGPL0
E23
PSDWE/PGPL1
B24
POE/PSDRAS/PGPL2
A24
PSDCAS/PGPL3
B23
PGTA/PUPMWAIT/PGPL4/PPBS
A23
PSDAMUX/PGPL5
D22
LWE0/LSDDQM0/LBS0/PCI_CFG0
H28
LWE1/LSDDQM1/LBS1/PCI_CFG1
H27
LWE2/LSDDQM2/LBS2/PCI_CFG2
H26
LWE3/LSDDQM3/LBS3/PCI_CFG3
G29
LSDA10/LGPL0/PCI_MODCKH0
D27
LSDWE/LGPL1/PCI_MODCKH1
C28
LOE/LSDRAS/LGPL2/PCI_MODCKH2
E26
LSDCAS/LGPL3/PCI_MODCKH3
D25
LGTA/LUPMWAIT/LGPL4/LPBS
C26
LGPL5/LSDAMUX/PCI_MODCK
B27
LWR
D28
L_A14/PAR
N27
L_A15/FRAME/SMI
T29
L_A16/TRDY
R27
L_A17/IRDY/CKSTP_OUT
R26
L_A18/STOP
R29
L_A19/DEVSEL
R28
L_A20/IDSEL
W29
L_A21/PERR
P28
L_A22/SERR
N26
L_A23/REQ0
AA27
L_A24/REQ1/HSEJSW
P29
L_A25/GNT0
AA26
L_A26/GNT1/HSLED
N25
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
49
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
L_A27/GNT2/HSENUM
AA25
L_A28/RST/CORE_SRESET
AB29
L_A29/INTA
AB28
L_A30/REQ2
P25
L_A31/DLLOUT
AB27
LCL_D0/AD0
H29
LCL_D1/AD1
J29
LCL_D2/AD2
J28
LCL_D3/AD3
J27
LCL_D4/AD4
J26
LCL_D5/AD5
J25
LCL_D6/AD6
K25
LCL_D7/AD7
L29
LCL_D8/AD8
L27
LCL_D9/AD9
L26
LCL_D10/AD10
L25
LCL_D11/AD11
M29
LCL_D12/AD12
M28
LCL_D13/AD13
M27
LCL_D14/AD14
M26
LCL_D15/AD15
N29
LCL_D16/AD16
T25
LCL_D17/AD17
U27
LCL_D18/AD18
U26
LCL_D19/AD19
U25
LCL_D20/AD20
V29
LCL_D21/AD21
V28
LCL_D22/AD22
V27
LCL_D23/AD23
V26
LCL_D24/AD24
W27
LCL_D25/AD25
W26
LCL_D26/AD26
W25
LCL_D27/AD27
Y29
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
50
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
LCL_D28/AD28
Y28
LCL_D29/AD29
Y25
LCL_D30/AD30
AA29
LCL_D31/AD31
AA28
LCL_DP0/C0/BE0
L28
LCL_DP1/C1/BE1
N28
LCL_DP2/C2/BE2
T28
LCL_DP3/C3/BE3
W28
IRQ0/NMI_OUT
T1
IRQ7/INT_OUT/APE
D1
TRST 1
AH3
TCK
AG5
TMS
AJ3
TDI
AE6
TDO
AF5
TRIS
AB4
PORESET1
AG6
HRESET
AH5
SRESET
AF6
QREQ
AA3
RSTCONF
AJ4
MODCK1/AP1/TC0/BNKSEL0
W2
MODCK2/AP2/TC1/BNKSEL1
W3
MODCK3/AP3/TC2/BNKSEL2
W4
CLKIN1
AH4
PA0/RESTART1/DREQ3
FCC2_UTM_TXADDR2
AC29 2
PA1/REJECT1/DONE3
FCC2_UTM_TXADDR1
AC252
PA2/CLK20/DACK3
FCC2_UTM_TXADDR0
AE282
PA3/CLK19/DACK4/L1RXD1A2
FCC2_UTM_RXADDR0
AG292
PA4/REJECT2/DONE4
FCC2_UTM_RXADDR1
AG282
PA5/RESTART2/DREQ4
FCC2_UTM_RXADDR2/FCC1_UT_RX
PRTY
AG262
PA6/FCC2_RXADDR3
L1RSYNCA1
AE242
PA7/SMSYN2/FCC2_TXADDR3
L1TSYNCA1/L1GNTA1
AH252
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
51
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
PA8/SMRXD2/FCC2_TXADDR4
L1RXD0A1/L1RXDA1
AF232
PA9/SMTXD2
L1TXD0A1
AH232
PA10/MSNUM5
FCC1_UT8_RXD0/FCC1_UT16_RXD8
AE222
PA11/MSNUM4
FCC1_UT8_RXD1/FCC1_UT16_RXD9
AH222
PA12/MSNUM3
FCC1_UT8_RXD2/
FCC1_UT16_RXD10
AJ212
PA13/MSNUM2
FCC1_UT8_RXD3/
FCC1_UT16_RXD11
AH202
PA14/FCC1_MII_HDLC_RXD3
FCC1_UT8_RXD4/
FCC1_UT16_RXD12
AG192
PA15/FCC1_MII_HDLC_RXD2
FCC1_UT8_RXD5/
FCC1_UT16_RXD13
AF182
PA16/FCC1_MII_HDLC_RXD1/
FCCI_RMII_RXD1
FCC1_UT8_RXD6/
FCC1_UT16_RXD14
AF172
PA17/FCC1_MII_HDLC_RXD0/
FCC1_MII_TRAN_RXD/
FCCI_RMII_RXD0
FCC1_UT8_RXD7/
FCC1_UT16_RXD15
AE162
PA18/FCC1_MII_HDLC_TXD0/
FCC1_MII_TRAN_TXD/
FCC1_RMII_TXD0
FCC1_UT8_TXD7/FCC1_UT16_TXD15
AJ162
PA19/FCC1_MII_HDLC_TXD1/
FCC1_RMII_TXD1
FCC1_UT8_TXD6/FCC1_UT16_TXD14
AG152
PA20/FCC1_MII_HDLC_TXD2
FCC1_UT8_TXD5/FCC1_UT16_TXD13
AJ132
PA21/FCC1_MII_HDLC_TXD3
FCC1_UT8_TXD4/FCC1_UT16_TXD12
AE132
PA22
FCC1_UT8_TXD3/FCC1_UT16_TXD11
AF122
PA23
FCC1_UT8_TXD2/FCC1_UT16_TXD10
AG112
PA24/MSNUM1
FCC1_UT8_TXD1/FCC1_UT16_TXD9
AH92
PA25/MSNUM0
FCC1_UT8_TXD0/FCC1_UT16_TXD8
AJ82
PA26/FCC1_RMII_RX_ER
FCC1_UTM_RXCLAV/
FCC1_UTS_RXCLAV
AH72
PA27/FCC1_MII_RX_DV/
FCC1_RMII_CRS_DV
FCC1_UT_RXSOC
AF72
PA28/FCC1_MII_TX_EN/
FCC1_RMII_TX_EN
FCC1_UTM_RXENB/
FCC1_UTS_RXENB
AD52
PA29/FCC1_MII_TX_ER
FCC1_UT_TXSOC
AF12
PA30/FCC1_MII_CRS/FCC1_RTS
FCC1_UTM_TXCLAV/
FCC1_UTS_TXCLAV
AD32
PA31/FCC1_MII_COL
FCC1_UTM_TXENB/
FCC1_UTS_TXENB
AB52
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
52
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
PB4/FCC3_MII_HDLC_TXD3/
L1RSYNCA2/FCC3_RTS
FCC2_UT8_RXD0
AD282
PB5/FCC3_MII_HDLC_TXD2/
L1TSYNCA2/L1GNTA2
FCC2_UT8_RXD1
AD262
PB6/FCC3_MII_HDLC_TXD1/
FCC3_RMII_TXD1/
L1RXDA2/L1RXD0A2
FCC2_UT8_RXD2
AD252
PB7/FCC3_MII_HDLC_TXD0/
FCC3_RMII_TXD0/
FCC3_TXD/L1TXDA2/L1TXD0A2
FCC2_UT8_RXD3
AE262
PB8/FCC3_MII_HDLC_RXD0/
FCC3_RMII_RXD0/
FCC3_RXD/TXD3
FCC2_UT8_TXD3/L1RSYNCD1
AH272
PB9/FCC3_MII_HDLC_RXD1/
FCC3_RMII_RXD1/L1TXD2A2
FCC2_UT8_TXD2/L1TSYNCD1/
L1GNTD1
AG242
PB10/FCC3_MII_HDLC_RXD2
FCC2_UT8_TXD1/L1RXDD1
AH242
PB11/FCC3_MII_HDLC_RXD3
FCC2_UT8_TXD0/L1TXDD1
AJ242
PB12/FCC3_MII_CRS/TXD2
L1CLKOB1/L1RSYNCC1
AG222
PB13/FCC3_MII_COL/L1TXD1A2
L1RQB1/L1TSYNCC1/L1GNTC1
AH212
PB14/FCC3_MII_RMII_TX_EN//RXD3
L1RXDC1
AG202
PB15/FCC3_MII_TX_ER/RXD2
L1TXDC1
AF192
PB16/FCC3_MII_RMII_RX_ER/CLK18
L1CLKOA1
AJ182
PB17/FCC3_MII_RX_DV/CLK17/
FCC3_RMII_CRS_DV
L1RQA1
AJ172
PB18/FCC2_MII_HDLC_RXD3/
L1CLKOD2/L1RXD2A2
FCC2_UT8_RXD4
AE142
PB19FCC2_MII_HDLC_RXD2/
L1RQD2/L1RXD3A2
FCC2_UT8_RXD5
AF132
PB20/FCC2_MII_HDLC_RMII_RXD1/
L1RSYNCD2
FCC2_UT8_RXD6/L1TXD1A1
AG122
PB21//FCC2_MII_HDLC_RMII_RXD0/
FCC2_TRAN_RXD/L1TSYNCD2/
L1GNTD2
FCC2_UT8_RXD7/L1TXD2A1
AH112
PB22/FCC2_MII_HDLC_TXD0/
FCC2_TXD/FCC2_RMII_TXD0/
L1RXDD2
FCC2_UT8_TXD7/L1RXD1A1
AH162
PB23/FCC2_MII_HDLC_TXD1/
L1RXD2A1/L1TXDD2/
FCC2_RMII_TXD1
FCC2_UT8_TXD6/L1RXD2A1
AE152
PB24/FCC2_MII_HDLC_TXD2/
L1RSYNCC2
FCC2_UT8_TXD5/L1RXD3A1
AJ92
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
53
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
PB25/FCC2_MII_HDLC_TXD3/
L1TSYNCC2/L1GNTC2
FCC2_UT8_TXD4/L1TXD3A1
AE92
PB26/FCC2_MII_CRS/L1RXDC2
FCC2_UT8_TXD1
AJ72
PB27/FCC2_MII_COL/L1TXDC2
FCC2_UT8_TXD0
AH62
PB28/FCC2_MII_RX_ER/
FCC2_RMII_RX_ER/FCC2_RTS/
L1TSYNCB2/L1GNTB2/TXD1
AE32
PB29/L1RSYNCB2/FCC2_MII_TX_EN/ FCC2_UTM_RXCLAV/
FCC2_RMII_TX_EN
FCC2_UTS_RXCLAV
AE22
PB30/FCC2_MII_RX_DV/
FCC2_RMII_CRS_DV/L1RXDB2
FCC2_UT_TXSOC
AC52
PB31/FCC2_MII_TX_ER/L1TXDB2
FCC2_UT_RXSOC
AC42
PC0/DREQ1/BRGO7/SMSYN2/
L1CLKOA2
AB262
PC1/DREQ2/BRGO6/L1RQA2/ SPISEL
AD292
PC2/FCC3_CD/DONE2
FCC2_UT8_TXD3
AE292
PC3/FCC3_CTS/DACK2/CTS4/
USB_RP
FCC2_UT8_TXD2
AE272
PC4/SI2_L1ST4/FCC2_CD
FCC2_UTM_RXENB/
FCC2_UTS_RXENB
AF272
PC5/SI2_L1ST3/FCC2_CTS
FCC2_UTM_TXCLAV/
FCC2_UTS_TXCLAV
AF242
PC6/FCC1_CD
L1CLKOC1/FCC1_UTM_RXADDR2/
FCC1_UTS_RXADDR2/
FCC1_UTM_RXCLAV1
AJ262
PC7/FCC1_CTS
L1RQC1/FCC1_UTM_TXADDR2/
FCC1_UTS_TXADDR2/
FCC1_UTM_TXCLAV1
AJ252
PC8/CD4/RENA4/SI2_L1ST2/CTS3/
USBRN
FCC1_UT16_TXD0
AF222
PC9/CTS4/CLSN4/SI2_L1ST1/
L1TSYNCA2/L1GNTA2/USB_RP
FCC1_UT16_TXD1
AE212
PC10/CD3/RENA3
FCC1_UT16_TXD2/SI1_L1ST4/
FCC2_UT8_RXD3
AF202
PC11/CTS3/CLSN3/L1TXD3A2
L1CLKOD1/FCC2_UT8_RXD2
AE192
PC12/CD2/RENA2
SI1_L1ST3/FCC1_UTM_RXADDR1/
FCC1_UTS_RXADDR1
AE182
PC13/CTS2/CLSN2
L1RQD1/FCC1_UTM_TXADDR1/
FCC1_UTS_TXADDR1
AH182
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
54
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
PC14/CD1/RENA1
FCC1_UTM_RXADDR0/
FCC1_UTS_RXADDR0
AH172
PC15/CTS1/CLSN1/SMTXD2
FCC1_UTM_TXADDR0/
FCC1_UTS_TXADDR0
AG162
PC16/CLK16/TIN4
AF152
PC17/CLK15/TIN3/BRGO8
AJ152
PC18/CLK14/TGATE2
AH142
PC19/CLK13/BRGO7/SPICLK
AG132
PC20/CLK12/TGATE1/USB_OE
AH122
PC21/CLK11/BRGO6
AJ112
PC22/CLK10/DONE1/FCC1_UT_TXPRTY
AG102
PC23/CLK9/BRGO5/DACK1
AE102
PC24/CLK8/TOUT4
FCC2_UT8_TXD3
AF92
PC25/CLK7/BRGO4
FCC2_UT8_TXD2
AE82
PC26/CLK6/TOUT3/TMCLK
AJ62
PC27/FCC3_TXD/FCC3_MII_TXD0/
FCC3_RMII_TXD0/CLK5/BRGO3
AG22
PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2/
FCC2_RXADDR4
AF32
PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1
AF22
PC30/CLK2/TOUT1
FCC2_UT8_TXD3
AE12
AD12
PC31/CLK1/BRGO1
PD4/BRGO8/FCC3_RTS/SMRXD2
L1TSYNCD1/L1GNTD1
AC282
PD5/DONE1
FCC1_UT16_TXD3
AD272
PD6/DACK1
FCC1_UT16_TXD4
AF292
PD7/SMSYN1/FCC1_TXCLAV2
FCC1_UTM_TXADDR3/
FCC1_UTS_TXADDR3/
FCC2_UTM_TXADDR4
FCC2_UTS_TXADDR1
AF282
PD8/SMRXD1/BRGO5
FCC2_UT_TXPRTY
AG252
PD9/SMTXD1/BRGO3
FCC2_UT_RXPRTY
AH262
PD10/L1CLKOB2/BRGO4
FCC2_UT8_RXD1/L1RSYNCB1
AJ272
PD11/L1RQB2
FCC2_UT8_RXD0/L1TSYNCB1/
L1GNTB1
AJ232
PD12
SI1_L1ST2/L1RXDB1
AG232
PD13
SI1_L1ST1/L1TXDB1
AJ222
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
55
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
PD14/L1CLKOC2/I2CSCL
FCC1_UT16_RXD0
AE202
PD15/L1RQC2/I2CSDA
FCC1_UT16_RXD1
AJ202
PD16/SPIMISO
FCC1_UT_TXPRTY/L1TSYNCC1/
L1GNTC1
AG182
PD17/BRGO2/SPIMOSI
FCC1_UT_RXPRTY
AG172
PD18/SPICLK
FCC1_UTM_RXADDR4/
FCC1_UTS_RXADDR4/
FCC1_UTM_RXCLAV3/
FCC2_UTM_RXADDR3/
FCC2_UTS_RXADDR0
AF162
PD19/SPISEL/BRGO1
FCC1_UTM_TXADDR4/
FCC1_UTS_TXADDR4/
FCC1_UTM_TXCLAV3/
FCC2_UTM_TXADDR3/
FCC2_UTS_TXADDR0
AH152
PD20/RTS4/TENA4/L1RSYNCA2/
USB_TP
FCC1_UT16_RXD2
AJ142
PD21/TXD4/L1RXD0A2/L1RXDA2/
USB_TN
FCC1_UT16_RXD3
AH132
PD22/RXD4L1TXD0A2/L1TXDA2/
USB_RXD
FCC1_UT16_TXD5
AJ122
PD23/RTS3/TENA3
FCC1_UT16_RXD4/L1RSYNCD1
AE122
PD24/TXD3
FCC1_UT16_RXD5/L1RXDD1
AF102
PD25/RXD3
FCC1_UT16_TXD6/L1TXDD1
AG92
PD26/RTS2/TENA2
FCC1_UT16_RXD6/L1RSYNCC1
AH82
PD27/TXD2
FCC1_UT16_RXD7/L1RXDC1
AG72
PD28/RXD2
FCC1_UT16_TXD7/L1TXDC1
AE42
PD29/RTS1/TENA1
FCC1_UTM_RXADDR3/
FCC1_UTS_RXADDR3/
FCC1_UTM_RXCLAV2/
FCC2_UTM_RXADDR4/
FCC2_UTS_RXADDR1
AG12
PD30/TXD1
FCC2_UTM_TXENB/
FCC2_UTS_TXENB
AD42
PD31/RXD1
AD22
VCCSYN
AB3
VCCSYN1
B9
CLKIN2
AE11
SPARE4 3
U5
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
56
Freescale Semiconductor
Pinout
Table 21. MPC8280 and MPC8270 (ZU Package) Pinout List (continued)
Pin Name
Ball
MPC8280/MPC8270
MPC8280 only
PCI_MODE 4
SPARE6
AF25
3
V4
No connect 5
AA1, AG4
I/O power
AG21, AG14, AG8, AJ1, AJ2,
AH1, AH2, AG3, AF4, AE5, AC27,
Y27, T27, P27, K26, G27, AE25,
AF26, AG27, AH28, AH29, AJ28,
AJ29, C7, C14, C16, C20, C23,
E10, A28, A29, B28, B29, C27,
D26, E25, H3, M4, T3, AA4, A1,
A2, B1, B2, C3, D4, E5
Core power
U28, U29, K28, K29, A9, A19,
B19, M1, M2, Y1, Y2, AC1, AC2,
AH19, AJ19, AH10, AJ10, AJ5
Ground
AA5, AB1 6, AB2 7, AF21, AF14,
AF8, AE7, AF11, AE17, AE23,
AC26, AB25, Y26, V25, T26, R25,
P26, M25, K27, H25, G26, D7,
D10, D14, D16, D20, D23, C9,
E11, E13, E15, E19, E22, B3, G5,
H4, K5, M3, P5, T4, Y5, AA2, AC3
1
2
3
4
5
6
7
Should be tied to VDDH via a 2K Ω external pull-up resistor.
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
Must be pulled down or left floating.
If PCI is not desired, must be pulled up or left floating.
Sphere is not connected to die.
GNDSYN (AB1): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate
ground signal on the MPC8280. New designs must connect AB1 to GND and follow the suggestions in Section 4.6,
“Layout Practices.” Old designs in which the MPC8280 is used as a drop-in replacement can leave the pin connected
to GND with the noise filtering capacitors.
XFC (AB2) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8280 because there is no need for
external capacitor to operate the PLL. New designs should connect AB2 (XFC) pin to GND. Old designs in which the
MPC8280 is used as a drop-in replacement can leave the pin connected to the current capacitor.
Symbols used in Table 21 are described in Table 22.
Table 22. Symbol Legend
Symbol
Meaning
OVERBAR
Signals with overbars, such as TA, are active low.
UTM
Indicates that a signal is part of the UTOPIA master interface.
UTS
Indicates that a signal is part of the UTOPIA slave interface.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
57
Pinout
Table 22. Symbol Legend (continued)
Symbol
Meaning
UT8
Indicates that a signal is part of the 8-bit UTOPIA interface.
UT16
Indicates that a signal is part of the 16-bit UTOPIA interface.
MII
Indicates that a signal is part of the media independent interface.
RMII
Indicates that a signal is part of the reduced media independent interface.
8.2 VR and ZQ Packages—MPC8275 and MPC8270
The following figures and table represent the alternate 516 PBGA package. For information on the standard package
for the MPC8280 and the MPC8270, refer to Section 8.1, “ZU Package—MPC8280 and MPC8270,” on page -43.
Figure 15 shows the pinout of the VR and ZQ packages as viewed from the top surface.
1
2
3
4 5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
V
W
Y
AA
AB
AC
AD
AE
AF
1
2
3
4 5 6
7
8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26
Not to Scale
Figure 15. Pinout of the 516 PBGA Package (View from Top)
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
58
Freescale Semiconductor
Pinout
Figure 16 shows the side profile of the PBGA package to indicate the direction of the top surface view.
Transfer molding compound
Die
attach
Wire bonds
Ball bond
Plated substrate via
Screen-printed
solder mask
DIE
Cu substrate traces
BT resin glass epoxy
1 mm pitch
Figure 16. Side View of the PBGA Package Remove
NOTE: Temperature Reflow for the VR Package
In the VR package, sphere composition is lead-free (refer to Table 2). This requires
higher temperature reflow than what is required for other PowerQUICC II
packages. Users should consult “Freescale PowerQUICC II™ Pb-Free Packaging
Information” (MPC8250PBFREEPKG) available at www.freescale.com.
Table 23 shows the pinout list of the MPC8275 and MPC8270. Table 22 defines conventions and acronyms used in
Table 23.
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
BR
C16
BG
D2
ABB/IRQ2
C1
TS
D1
A0
D5
A1
E8
A2
C4
A3
B4
A4
A4
A5
D7
A6
D8
A7
C6
A8
B5
A9
B6
A10
C7
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
59
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
A11
C8
A12
A6
A13
D9
A14
F11
A15
B7
A16
B8
A17
C9
A18
A7
A19
B9
A20
E11
A21
A8
A22
D11
A23
B10
A24
C11
A25
A9
A26
B11
A27
C12
A28
D12
A29
A10
A30
B12
A31
B13
TT0
E7
TT1
B3
TT2
F8
TT3
A3
TT4
C3
TBST
F5
TSIZ0
E3
TSIZ1
E2
TSIZ2
E1
TSIZ3
E4
AACK
D3
ARTRY
C2
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
60
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
DBG
A14
DBB/IRQ3
C15
D0
W4
D1
Y1
D2
V1
D3
P4
D4
N3
D5
K5
D6
J4
D7
G1
D8
AB1
D9
U4
D10
U2
D11
N6
D12
N1
D13
L1
D14
J5
D15
G3
D16
AA2
D17
W1
D18
T3
D19
T1
D20
M2
D21
K2
D22
J1
D23
G4
D24
U5
D25
T5
D26
P5
D27
P3
D28
M3
D29
K3
D30
H2
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
61
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
D31
G5
D32
AA1
D33
V2
D34
U1
D35
P2
D36
M4
D37
K4
D38
H3
D39
F2
D40
Y2
D41
U3
D42
T2
D43
N2
D44
M5
D45
K1
D46
H4
D47
F1
D48
W2
D49
T4
D50
R3
D51
N4
D52
M1
D53
J2
D54
H5
D55
F3
D56
V3
D57
R5
D58
R2
D59
N5
D60
L2
D61
J3
D62
H1
D63
F4
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
62
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
DP0/RSRV/EXT_BR2
AB3
IRQ1/DP1/EXT_BG2
W5
IRQ2/DP2/TLBISYNC/EXT_DBG2
AC2
IRQ3/DP3/CKSTP_OUT/EXT_BR3
AA3
IRQ4/DP4/CORE_SRESET/EXT_BG3
AD1
IRQ5/CINT/DP5/TBEN/EXT_DBG3
AC1
IRQ6/DP6/CSE0
AB2
IRQ7/DP7/CSE1
Y3
PSDVAL
D15
TA
Y4
TEA
D16
GBL/IRQ1
E15
CI/BADDR29/IRQ2
D14
WT/BADDR30/IRQ3
E14
L2_HIT/IRQ4
A17
CPU_BG/BADDR31/IRQ5/CINT
B14
CPU_DBG
F13
CPU_BR
B17
CS0
AC6
CS1
AD6
CS2
AE6
CS3
AB7
CS4
AF7
CS5
AC7
CS6
AD7
CS7
AF8
CS8
AE8
CS9
AD8
CS10/BCTL1
AC8
CS11/AP0
AB8
BADDR27
C13
BADDR28
A12
ALE
D13
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
63
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
BCTL0
AF4
PWE0/PSDDQM0/PBS0
AA5
PWE1/PSDDQM1/PBS1
AE4
PWE2/PSDDQM2/PBS2
AD4
PWE3/PSDDQM3/PBS3
AF3
PWE4/PSDDQM4/PBS4
AB4
PWE5/PSDDQM5/PBS5
AE3
PWE6/PSDDQM6/PBS6
AF2
PWE7/PSDDQM7/PBS7
AD3
PSDA10/PGPL0
AE2
PSDWE/PGPL1
AD2
POE/PSDRAS/PGPL2
AE1
PSDCAS/PGPL3
AC3
PGTA/PUPMWAIT/PGPL4/PPBS
W6
PSDAMUX/PGPL5
AA4
LWE0/LSDDQM0/LBS0/PCI_CFG0
AC9
LWE1/LSDDQM1/LBS1/PCI_CFG1
AD9
LWE2/LSDDQM2/LBS2/PCI_CFG2
AE9
LWE3/LSDDQM3/LBS3/PCI_CFG3
AF9
LSDA10/LGPL0/PCI_MODCKH0
AB6
LSDWE/LGPL1/PCI_MODCKH1
AF5
LOE/LSDRAS/LGPL2/PCI_MODCKH2
AE5
LSDCAS/LGPL3/PCI_MODCKH3
AD5
LGTA/LUPMWAIT/LGPL4/LPBS
AC5
LGPL5/LSDAMUX/PCI_MODCK
AB5
LWR
AF6
L_A14/PAR
AE13
L_A15/FRAME/SMI
AD15
L_A16/TRDY
AF16
L_A17/IRDY/CKSTP_OUT
AF15
L_A18/STOP
AE15
L_A19/DEVSEL
AE14
L_A20/IDSEL
AC17
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
64
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
L_A21/PERR
AD14
L_A22/SERR
AF13
L_A23/REQ0
AE20
L_A24/REQ1/HSEJSW
AC14
L_A25/GNT0
AC19
L_A26/GNT1/HSLED
AD13
L_A27/GNT2/HSENUM
AF21
L_A28/RST/CORE_SRESET
AF22
L_A29/INTA
AE21
L_A30/REQ2
AB14
L_A31/DLLOUT
AD20
LCL_D0/AD0
AB9
LCL_D1/AD1
AB10
LCL_D2/AD2
AC10
LCL_D3/AD3
AD10
LCL_D4/AD4
AE10
LCL_D5/AD5
AF10
LCL_D6/AD6
AF11
LCL_D7/AD7
AB12
LCL_D8/AD8
AB11
LCL_D9/AD9
AF12
LCL_D10/AD10
AE11
LCL_D11/AD11
AC13
LCL_D12/AD12
AC12
LCL_D13/AD13
AB13
LCL_D14/AD14
AD12
LCL_D15/AD15
AF14
LCL_D16/AD16
AF17
LCL_D17/AD17
AE16
LCL_D18/AD18
AD16
LCL_D19/AD19
AC16
LCL_D20/AD20
AB16
LCL_D21/AD21
AF18
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
65
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
LCL_D22/AD22
AE17
LCL_D23/AD23
AD17
LCL_D24/AD24
AB17
LCL_D25/AD25
AE18
LCL_D26/AD26
AD18
LCL_D27/AD27
AC18
LCL_D28/AD28
AE19
LCL_D29/AD29
AF20
LCL_D30/AD30
AD19
LCL_D31/AD31
AB18
LCL_DP0/C0/BE0
AE12
LCL_DP1/C1/BE1
AA13
LCL_DP2/C2/BE2
AC15
LCL_DP3/C3/BE3
AF19
IRQ0/NMI_OUT
A11
IRQ7/INT_OUT/APE
E5
TRST 1
F22
TCK
A24
TMS
C24
TDI
A25
TDO
B24
TRIS
C19
PORESET1
B25
HRESET
D24
SRESET
E23
QREQ
D18
RSTCONF
E24
MODCK1/AP1/TC0/BNKSEL0
B16
MODCK2/AP2/TC1/BNKSEL1
F16
MODCK3/AP3/TC2/BNKSEL2
A15
CLKIN1
G22
PA0/RESTART1/DREQ3
FCC2_UTM_TXADDR2
AC20 2
PA1/REJECT1/DONE3
FCC2_UTM_TXADDR1
AC212
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
66
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
PA2/CLK20/DACK3
FCC2_UTM_TXADDR0
AF252
PA3/CLK19/DACK4/L1RXD1A2
FCC2_UTM_RXADDR0
AE242
PA4/REJECT2/DONE4
FCC2_UTM_RXADDR1
AA212
PA5/RESTART2/DREQ4
FCC2_UTM_RXADDR2
AD252
PA6
FCC2_UT_RXADDR3
AC242
PA7/SMSYN2
FCC2_UT_TXADDR3
AA222
PA8/SMRXD2
FCC2_UT_TXADDR4
AA232
Y262
PA9/SMTXD2
PA10/MSNUM5
FCC1_UT8_RXD0/FCC1_UT16_RXD8
W222
PA11/MSNUM4
FCC1_UT8_RXD1/FCC1_UT16_RXD9
W232
PA12/MSNUM3
FCC1_UT8_RXD2/
FCC1_UT16_RXD10
V262
PA13/MSNUM2
FCC1_UT8_RXD3/
FCC1_UT16_RXD11
V252
PA14/FCC1_MII_HDLC_RXD3
FCC1_UT8_RXD4/
FCC1_UT16_RXD12
T222
PA15/FCC1_MII_HDLC_RXD2
/FCC1_UT8_RXD5/
FCC1_UT16_RXD13
T252
PA16/FCC1_MII_HDLC_RXD1/
FCC1_RMII_RXD1
FCC1_UT8_RXD6/
FCC1_UT16_RXD14
R242
PA17/FCC_MII_HDLC_RXD0/
FCC1_MII_TRAN_RXD/
FCCI_RMII_RXD0
FCC1_UT8_RXD7/
FCC1_UT16_RXD15
P222
PA18/FCC1_MII_HDLC_TXD0/
FCC1_MIITRAN_TXD/
FCC1_RMII_TXD0
FCC1_UT8_TXD7/FCC1_UT16_TXD15
N262
PA19/FCC1_MII_HDLC_TXD1/
FCC1_RMII_TXD1
FCC1_UT8_TXD6/FCC1_UT16_TXD14
N232
PA20/FCC1_MII_HDLC_TXD2
FCC1_UT8_TXD5/FCC1_UT16_TXD13
K262
PA21/FCC1_MII_HDLC_TXD3
FCC1_UT8_TXD4/FCC1_UT16_TXD12
L232
PA22
FCC1_UT8_TXD3/FCC1_UT16_TXD11
K232
PA23
FCC1_UT8_TXD2/FCC1_UT16_TXD10
H262
PA24/MSNUM1
FCC1_UT8_TXD1/FCC1_UT16_TXD9
F252
PA25/MSNUM0
FCC1_UT8_TXD0/FCC1_UT16_TXD8
D262
PA26/FCC1_MII_RMII_RX_ER/
FCC1_UTM_RXCLAV/
FCC1_UTS_RXCLAV
D252
PA27/FCC1_MII_RX_DV/
FCC1_RMII_CRS_DV
FCC1_UT_RXSOC
C252
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
67
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
PA28/FCC1_MII_TX_EN/
FCC1_RMII_TX_EN
FCC1_UTM_RXENB/
FCC1_UTS_RXENB
C222
PA29/FCC1_MII_TX_ER
FCC1_UT_TXSOC
B212
PA30/FCC1_MII_CRS/FCC1_RTS
FCC1_UTM_TXCLAV/
FCC1_UTS_TXCLAV
A202
PA31/FCC1_MII_COL
FCC1_UTM_TXENB/
FCC1_UTS_TXENB
A192
PB4/FCC3_MII_HDLC_TXD3/
L1RSYNCA2/FCC3_RTS
FCC2_UT8_RXD0
AD212
PB5/FCC3_MII_HDLC_TXD2/
L1TSYNCA2/L1GNTA2
FCC2_UT8_RXD1
AD222
PB6/FCC3_MII_HDLC_TXD1/
FCC3_RMII_TXD1/
L1RXDA2/L1RXD0A2
FCC2_UT8_RXD2
AC222
PB7/FCC3_MII_HDLC_TXD0/
FCC3_RMII_TXD0/
FCC3_TXD/L1TXDA2/L1TXD0A2
FCC2_UT8_RXD3
AE262
PB8/FCC3_MII_HDLC_RXD0/
FCC3_RMII_RXD0/
FCC3_RXD/TXD3
FCC2_UT8_TXD3
AB232
PB9/FCC3_MII_HDLC_RXD1/
FCC3_RMII_RXD1/L1TXD2A2
FCC2_UT8_TXD2
AC262
PB10/FCC3_MII_HDLC_RXD2
FCC2_UT8_TXD1
AB262
PB11/FCC3_MII_HDLC_RXD3
FCC2_UT8_TXD0
AA252
PB12/FCC3_MII_CRS/TXD2
W262
PB13/FCC3_MII_COL/L1TXD1A2
W252
PB14/FCC3_MII_RMII_TX_EN/RXD3
V242
PB15/FCC3_MII_TX_ER/RXD2
U242
PB16/FCC3_MII_RMII_RX_ER/CLK18
R222
PB17/FCC3_MII_RX_DV/CLK17/
FCC3_RMII_CRS_DV
R232
PB18/FCC2_MII_HDLC_RXD3/
L1CLKOD2/L1RXD2A2
FCC2_UT8_RXD4
M232
PB19FCC2_MII_HDLC_RXD2/
L1RQD2/L1RXD3A2
FCC2_UT8_RXD5
L242
PB20/FCC2_MII_HDLC_RMII_RXD1/
L1RSYNCD2
FCC2_UT8_RXD6
K242
PB21//FCC2_MII_HDLC_RMII_RXD0/
FCC2_TRAN_RXD/L1TSYNCD2/
L1GNTD2
FCC2_UT8_RXD7
L212
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
68
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
PB22/FCC2_MII_HDLC_RMII_TXD0/
FCC2_TXD/FCC2_RMII_TXD0/
L1RXDD2
FCC2_UT8_TXD7
P252
PB23/FCC2_MII_HDLC_TXD1/
L1RXD2A1/L1TXDD2/
FCC2_RMII_TXD1
FCC2_UT8_TXD6
N252
PB24/FCC2_MII_HDLC_TXD2/
L1RSYNCC2
FCC2_UT8_TXD5
E262
PB25/FCC2_MII_HDLC_TXD3/
L1TSYNCC2/L1GNTC2
FCC2_UT8_TXD4
H232
PB26/FCC2_MII_CRS/L1RXDC2
FCC2_UT8_TXD1
C262
PB27/FCC2_MII_COL/L1TXDC2
FCC2_UT8_TXD0
B262
PB28/FCC2_MII_RX_ER/FCC2_RMII_RX_ER/
FCC2_RTS/L1TSYNCB2/L1GNTB2/TXD1
A222
PB29/L1RSYNCB2/
FCC2_UTM_RXCLAV/
FCC2_MII_TX_EN/FCC2_RMII_TX_EN FCC2_UTS_RXCLAV
A212
PB30/FCC2_MII_RX_DV/L1RXDB2/
FCC2_RMII_CRS_DV
FCC2_UT_TXSOC
E202
PB31/FCC2_MII_TX_ER/L1TXDB2
FCC2_UT_RXSOC
C202
PC0/DREQ1/BRGO7/SMSYN2/
L1CLKOA2
AE222
PC1/DREQ2/SPISEL/BRGO6/L1RQA2
AA192
PC2/FCC3_CD/DONE2
FCC2_UT8_TXD3
AF242
PC3/FCC3_CTS/DACK2/CTS4/
USB_RP
FCC2_UT8_TXD2
AE252
PC4/SI2_L1ST4/FCC2_CD
FCC2_UTM_RXENB/
FCC2_UTS_RXENB
AB222
PC5/SI2_L1ST3/FCC2_CTS
FCC2_UTM_TXCLAV/
FCC2_UTS_TXCLAV
AC252
PC6/FCC1_CD
FCC1_UTM_RXADDR2/
FCC1_UTS_RXADDR2/
FCC1_UTM_RXCLAV1
AB252
PC7/FCC1_CTS
FCC1_UTM_TXADDR2/
FCC1_UTS_TXADDR2/
FCC1_UTM_TXCLAV1
AA242
PC8/CD4/RENA4/SI2_L1ST2/CTS3/
USB_RN
FCC1_UT16_TXD0
Y242
PC9/CTS4/CLSN4/SI2_L1ST1/
L1TSYNCA2/L1GNTA2/USB_RP
FCC1_UT16_TXD1
U222
PC10/CD3/RENA3
FCC1_UT16_TXD2/FCC2_UT8_RXD3
V232
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
69
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
PC11/CTS3/CLSN3/L1TXD3A2
FCC2_UT8_RXD2
U232
PC12/CD2/RENA2
FCC1_UTM_RXADDR1/
FCC1_UTS_RXADDR1
T262
PC13/CTS2/CLSN2
FCC1_UTM_TXADDR1/
FCC1_UTS_TXADDR1
R262
PC14/CD1/RENA1
FCC1_UTM_RXADDR0/
FCC1_UTS_RXADDR0
P262
PC15/CTS1/CLSN1/SMTXD2
FCC1_UTM_TXADDR0/
FCC1_UTS_TXADDR0
P242
PC16/CLK16/TIN4
M262
PC17/CLK15/TIN3/BRGO8
L262
PC18/CLK14/TGATE2
M242
PC19/CLK13/BRGO7/SPICLK
L222
PC20/CLK12/TGATE1/USB_OE
K252
PC21/CLK11/BRGO6
J252
PC22/CLK10/DONE1
FCC1_UT_TXPRTY
G262
F262
PC23/CLK9/BRGO5/DACK1
PC24/CLK8/TOUT4
FCC2_UT8_TXD3
G242
PC25/CLK7/BRGO4
FCC2_UT8_TXD2
E252
PC26/CLK6/TOUT3/TMCLK
G232
PC27/FCC3_TXD/FCC3_MII_TXD0/
FCC3_RMII_TXD0/CLK5/BRGO3
B232
PC28/CLK4/TIN1/TOUT2/CTS2/CLSN2 FCC2_UT_RXADDR4
E222
PC29/CLK3/TIN2/BRGO2/CTS1/CLSN1
E212
PC30/CLK2/TOUT1
FCC2_UT8_TXD3
D212
B202
PC31/CLK1/BRGO1
AF232
PD4/BRGO8/FCC3_RTS/SMRXD2
PD5/DONE1
FCC1_UT16_TXD3
AE232
PD6/DACK1
FCC1_UT16_TXD4
AB212
PD7/SMSYN1/FCC1_TXCLAV2
FCC1_UTM_TXADDR3/
FCC1_UTS_TXADDR3/
FCC2_UTM_TXADDR4
FCC2_UTS_TXADDR1
AD232
PD8/SMRXD1/BRGO5
FCC2_UT_TXPRTY
AD262
PD9/SMTXD1/BRGO3
FCC2_UT_RXPRTY
Y222
PD10/L1CLKOB2/BRGO4
FCC2_UT8_RXD1
AB242
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
70
Freescale Semiconductor
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
PD11/L1RQB2
MPC8275 only
FCC2_UT8_RXD0
L1GNTB1
Y232
PD12
AA262
PD13
W242
PD14/L1CLKOC2/I2CSCL
FCC1_UT16_RXD0
V222
PD15/L1RQC2/I2CSDA
FCC1_UT16_RXD1
U262
PD16/SPIMISO
FCC1_UT_TXPRTY
T232
PD17/BRGO2/SPIMOSI
FCC1_UT_RXPRTY
R252
PD18/SPICLK
FCC1_UTM_RXADDR4/
FCC1_UTS_RXADDR4/
FCC1_UTM_RXCLAV3/
FCC2_UTM_RXADDR3/
FCC2_UTS_RXADDR0
P232
PD19/SPISEL/BRGO1
FCC1_UTM_TXADDR4/
FCC1_UTS_TXADDR4/
FCC1_UTM_TXCLAV3/
FCC2_UTM_TXADDR3/
FCC2_UTS_TXADDR0
N222
PD20/RTS4/TENA4/L1RSYNCA2/
USB_TP
FCC1_UT16_RXD2
M252
PD21/TXD4/L1RXD0A2/L1RXDA2/
USB_TN
FCC1_UT16_RXD3
L252
PD22/RXD4L1TXD0A2/L1TXDA2/
USB_RXD
FCC1_UT16_TXD5
J262
PD23/RTS3/TENA3
FCC1_UT16_RXD4
K222
PD24/TXD3
FCC1_UT16_RXD5
G252
PD25/RXD3
FCC1_UT16_TXD6
H242
PD26/RTS2/TENA2
FCC1_UT16_RXD6
F242
PD27/TXD2
FCC1_UT16_RXD7
H222
PD28/RXD2
FCC1_UT16_TXD7
B222
PD29/RTS1/TENA1
FCC1_UTM_RXADDR3/
FCC1_UTS_RXADDR3/
FCC1_UTM_RXCLAV2/
FCC2_UTM_RXADDR4/
FCC2_UTS_RXADDR1
D222
PD30/TXD1
FCC2_UTM_TXENB/
FCC2_UTS_TXENB
C212
PD31/RXD1
E192
VCCSYN
D19
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
Freescale Semiconductor
71
Pinout
Table 23. MPC8275 and MPC8270 (VR and ZQ Packages) Pinout List (continued)
Pin Name
Ball
MPC8275/MPC8270
MPC8275 only
VCCSYN1
K6
CLKIN2
K21
SPARE4 3
C14
PCI_MODE 4
SPARE6
No
AD24
3
B15
connect 5
E17, C23
I/O power
E6, F6, H6, L5, L6, P6, T6, U6, V5,
Y5, AA6, AA8, AA10, AA11,
AA14, AA16, AA17, AB19, AB20,
W21, U21, T21, P21, N21, M22,
J22, H21, F21, F19, F17, E16,
F14, E13, E12, F10, E10, E9
Core Power
L3, V4, W3, AC11, AD11, AB15,
U25, T24, J24, H25, F23, B19,
D17, C17, D10, C10
Ground
B18 6, A18 7, A2, B1, B2, A5, C5,
C18, D4, D6, G2, L4, P1, R1, R4,
AC4, AE7, AC23, Y25, N24, J23,
A23, D23, D20, E18, A13, A16,
K10, K11, K12, K13, K14, K15,
K16, K17, L10, L11, L12, L13,
L14, L15, L16, L17, M10, M11,
M12, M13, M14, M15, M16, M17,
N10, N11, N12, N13, N14, N15,
N16, N17, P10, P11, P12, P13,
P14, P15, P16, P17, R10,
R11,R12, R13, R14, R15, R16,
R17, T10, T11, T12, T13, T14,
T15, T16, T17, U10, U11, U12,
U13, U14, U15, U16, U17
1
2
3
4
5
6
7
Should be tied to VDDH via a 2K Ω external pull-up resistor.
The default configuration of the CPM pins (PA[0–31], PB[4–31], PC[0–31], PD[4–31]) is input. To prevent excessive
DC current, it is recommended to either pull unused pins to GND or VDDH, or to configure them as outputs.
Must be pulled down or left floating.
If PCI is not desired, must be pulled up or left floating.
Sphere is not connected to die.
GNDSYN (B18): This pin exists as a separate ground signal in MPC826x(A) devices; it does not exist as a separate
ground signal on the MPC8275/MPC8270. New designs must connect B18 to GND and follow the suggestions in
Section 4.6, “Layout Practices.” Old designs in which the MPC8275/MPC8270 is used as a drop-in replacement can
leave the pin connected to GND with the noise filtering capacitors.
XFC (A18) pin: This pin is used in MPC826x(A) devices; it is not used in MPC8275/MPC8270 because there is no
need for external capacitor to operate the PLL. New designs should connect A18 (XFC) pin to GND. Old designs in
which the MPC8275/MPC8270 is used as a drop-in replacement can leave the pin connected to the current capacitor.
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Package Description
9
Package Description
The following sections provide the package parameters and mechanical dimensions.
9.1 Package Parameters
Package parameters are provided in Table 24.
Table 24. Package Parameters
Package
Devices
Outline
(mm)
Type
Interconnects
Pitch
(mm)
Nominal Unmounted
Height (mm)
37.5 x 37.5
TBGA
480
1.27
1.55
ZU
MPC8280
MPC8270
VR
MPC8275VR
MPC8270VR
27 x 27
PBGA
516
1
2.25
ZQ
MPC8275ZQ
MPC8270ZQ
27 x 27
PBGA
516
1
2.25
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73
Package Description
9.2 Mechanical Dimensions
Figure 17 provides the mechanical dimensions and bottom surface nomenclature of the 480 TBGA (ZU) package.
Refer to Table 2.
Notes:
1. Dimensions and Tolerancing per ASME
Y14.5M-1994.
2. Dimensions in millimeters.
3. Dimension b is measured at the
maximum solder ball diameter, parallel to
primary data A.
4. Primary data A and the seating plane are
defined by the spherical crowns of the
solder balls.
Millimeters
Dim
Min
Max
A
1.45
1.65
A1
0.60
0.70
A2
0.85
0.95
A3
0.25
—
b
0.65
0.85
D
37.50 BSC
D1
35.56 REF
e
1.27 BSC
E
37.50 BSC
E1
35.56 REF
Figure 17. Mechanical Dimensions and Bottom Surface Nomenclature—480 TBGA
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
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Freescale Semiconductor
Package Description
Figure 18 provides the mechanical dimensions and bottom surface nomenclature of the 516 PBGA (VR/ZQ)
packages.
Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature—516 PBGA
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75
Ordering Information
10 Ordering Information
Figure 19 provides an example of the Freescale part numbering nomenclature for the MPC8280. In addition to the
processor frequency, the part numbering scheme also consists of a part modifier that indicates any enhancement(s)
in the part from the original production design. Each part number also contains a revision code that refers to the die
mask revision number and is specified in the part numbering scheme for identification purposes only. For more
information, contact your local Freescale sales office.
MPC 82XX C ZU XXX X
Die Revision Level
Product Code
Device Number
Processor Frequency
(CPU/CPM/Bus)
Temperature Range
Blank = 0T to 105Tj
Package
ZU = 480 TBGA Lead spheres
VR = 516 PBGA Lead-free spheres
ZQ = 516 PBGA Lead spheres
A
C = (-40)T – 105Tj
A
Figure 19. Freescale Part Number Key
11 Document Revision History
Table 25. Document Revision History
Revision
Date
Substantive Changes
1.7
12/2006
• Section 6, “AC Electrical Characteristics,” removed deratings statement and clarified AC timing
descriptions.
1.6
05/2006
•
•
•
•
1.5
03/2006
• Added Section 6.3, “JTAG Timings”
1.4
11/2005
• In Section 6.2, “SIU AC Characteristics”, modified the note on CLKIN Jitter and Duty Cycle.
• Modified Figure 17 to display all text.
1.3
01/2005
• Modification for correct display of assertion level (“overbar”) for some signals
Table 11: Added text to clarify that Data Bus Parity is not supported at 66 Mhz.
Table 11: Added text to clarify that Data Bus ECC is supported at 66 Mhz
Table 11: Added note to DP pins to show it is not supported at 66 MHz
Table 12: Added note to support 1 ns hold time
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Document Revision History
Table 25. Document Revision History (continued)
Revision
Date
Substantive Changes
1.2
12/2004
• Section 2: removed voltage tracking note
• Table 3: Note 2 updated regarding VDD/VCCSYN relationship to VDDH during power-on reset
• Table 5: Note 2 updated to reflect VIH=2.5 for TCK, TRST, PORESET; request for external
pullup removed.
• Table 5: Note 4 added regarding IIC compatibility
• Section 4.2: New information about jumper-to-case thermal resistance
• Section 4.3: New information about jumper-to-board thermal resistance
• Section 4.4: New information about estimation with simulation
• Section 4.6: Updated description of layout practices
• Section 6: Added sentence providing derating factor
• Section 6.1, “CPM AC Characteristics”: added Note: Rise/Fall Time on CPM Input Pins
• Table 9: updated values for following specs: sp42, sp43, sp42a
• Table 10: updated values for following specs: sp16b, sp18b, sp20, sp22
• Section 6.2: added spread sprectrum clocking note
• Table 11: combined specs sp11 and sp11a
• Sections 7.2, 7.3: unit of ns added to Tval notes
• Section 7, “Clock Configuration Modes”: Updated all table footnotes reflect updated CPU Fmin
of 150 MHz commercial temp devices, 175 MHz extended temp; CPM Fmin of 120 MHz.
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
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Document Revision History
Table 25. Document Revision History (continued)
Revision
Date
1.0
2/2004
Substantive Changes
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Removal of “Advance Information” and “Preliminary.” The MPC8280 is fully qualified.
Table 1: New
Figure 1: Modification to note 2
Section 1.1: Core frequency range is 166–450 MHz
Addition of ZQ (516 PBGA with Lead spheres) package references
Table 4: VDD and VCCSYN modified to 1.45–1.60 V
Note following Table 4: Modified
Table 5: Addition of note 2 regarding TRST and PORESET (see VIH row of Table 5)
Table 5: Changed IOL for 60x signals to 6.0 mA
Table 5: Moved QREQ to VOL: IOL= 3.2 mA
Table 5: Addition of critical interrupt (CINT) to IRQ5 for VOL (IOL = 6.0mA)
Table 6: Addition of ΨJT and note 4
Sections 4.1–4.5: New
Table 7: Modified power values (+ 150mW to each)
Table 8: Addition of note 2. Changed PCI impedance to 27 Ω.
Table 9: Changes to sp36b, SP38a, sp38b, sp37a, sp39a, sp40 and sp41
Table 10: Changes to sp16a, sp18a, sp20 and sp21
Section 6.2: Addition of Note: CLKIN Jitter and Duty Cycle
Table 11: Changes to sp13 @ 66 and 83 MHz, sp14 @ 83 MHz
Table 12: Change to sp30 (data bus signals). Changes to sp33b. Removal of note 2.
Table 16 through Table 20: Modification of note 1 regarding CPU and CPM Fmin. Modification
to corresponding values in tables.
Table 21: Addition of note 1 to TRST (AH3) and PORESET (AG6)
Table 21: Addition of RXD3 to CPM port pin PB14. Previously omitted.
Table 21: Addition of critical interrupt (CINT) to B21 and U4. Previously omitted.
Table 21: Addition of note 5 to ‘No connect’ (AA1, AG4)
Addition of “Note: Temperature Reflow for the VR Package" on page 59
Table 23: Addition of note 1 to TRST (F22) and PORESET (B25)
Table 23: Addition of previously omitted signals that are multiplexed with CPM port pins:
PA6—FCC2_UT_RXADDR3
PA7—FCC2_UT_TXADDR3
PA8—FCC2_UT_TXADDR4
PB14—RXD3
PC19—SPICLK
PC22—FCC1_UT_TXPRTY
PC28—FCC2_UT_RXADDR4
Table 23: Removal of serial interface 1 (SI1) signals from port pins (see note 2 in Figure 1):
PA[6–9], PB[8–17, 20–25], PC[6–7, 10–13], PD[4, 10–13, 16, 23–28]
Table 23: Addition of critical interrupt (CINT) to AC1 and B14. Previously omitted.
Table 23: Addition of note 5 to ‘No connect’ (E17, C23)
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Document Revision History
Table 25. Document Revision History (continued)
Revision
Date
Substantive Changes
0.3
6/2003
• Removal of notes stating “no local bus” on VR-package devices. The MPC8270VR and the
MPC8275VR have local bus support.
• References to “G2 core” changed to “G2_LE core.” Refer to the G2 Core Reference Manual
(G2CORERM/D).
• Addition of VCCSYN to “Note” below Table 4, and to note 3 of Table 5
• Figure 2: New
• Table 5: Addition of note 1
• Table 6: Addition of θJB and θJC. Modifications to ZU package values.
• Table 7: Addition of various configurations, Modification of values. Addition of note 3.
• Table 9: Addition of 66 MHZ and 100 MHz values. Addition of sp42a/sp43a.
• Table 10: Addition of 66 MHZ and 100 MHz values
• Table 12: sp30 values. sp33b @100 MHz value. Removal of previous note 2. Modification of
current note 2.
• Figure 5, Figure 6, Figure 7, and Figure 8: Addition of notes
• Section 6.2: Addition of note on PCI timing
• Table 16, Table 17, Table 18, Table 19, Table 20: Addition of note 1 concerning minimum
operating frequencies
• Addition of statement before clock tables about selection of clock configuration and input
frequency
• Table 21 and Table 23: Addition of note 1 to CPM pins
0.2
11/2002 Table 23, “VR Pinout”: Addition of C18 to the Ground (GND) pin list (page 63)
0.1
—
Initial public release
MPC8280 PowerQUICC II™ Family Hardware Specifications, Rev. 1.7
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79
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