www.fairchildsemi.com FAN1537 Dual 1A Adjustable/Fixed Low Dropout Linear Regulators Features Description • • • • • • The FAN1537 provides 2 output voltages: 3.3V, and either adjustable or 2.5V or 1.8V fixed with 1.0A each output current capability. These devices have been optimized for low voltage where transient response and minimum input voltage are critical. Low dropout voltage Load regulation: 0.05% typical On-chip thermal limiting SO-8 and 5-lead SPAK and TO-252 DPAK packages Fixed 3.3V, and adjustable or 2.5V or 1.8V fixed Stable with low ESR output capacitors Current limit features protect the outputs against short circuit currents. On-chip thermal limiting provides protection against any combination of overload and ambient temperature that would create excessive junction temperatures. Applications • • • • • • Hard Disk Drives, CD-ROMs, DVDs High efficiency linear regulators Post regulators for switching supplies ADSL and Cable Modems 5V to 3.3V and 2.5V linear regulators Motherboard with multiple supplies The FAN1537 series regulators are available in SO-8 and 5-lead SPAK and TO-252 DPAK power packages. Typical Applications FAN1537A V1 VIN = 5V + 3.3V at 1.0A VIN 22µF NC GND 2.5V at 1.0A V2 + + 22µF 22µF FAN1537B V1 VIN = 5V + VIN 3.3V at 1.0A 1.8V at 1.0A V2 + 22µF GND FB R1 54.9Ω 22µF + 22µF R2 124Ω V2 = VREF (1 + R1/R2) REV. 1.1.1 3/20/02 FAN1537 PRODUCT SPECIFICATION Pin Assignments 1 2 3 8-Lead Plastic SO-8 ΘJC=25°C/W 4 5 5-Lead SPAK ΘJC=2°C/W 1 2 3 4 5 1 2 3 4 5 V2 1 2 3 V1 GND GND 5 FB 4 VIN V2 V2 GND V1 6 NC 3 FAN1537DB FRONT VIEW GND V1 FAN1537DA FAN1537DC FRONT VIEW VIN GND 4 5 V1 7 V2 2 FB GND NC VIN GND V1 8 V2 1 VIN VIN FAN1537PB FRONT VIEW NC GND TOP VIEW FAN1537PA FAN1537PC FRONT VIEW 5-Lead SPAK ΘJC=2°C/W 5-Lead Plastic TO-252 DPAK ΘJC=3°C/W Tab is GND Pin Descriptions Pin Name SO-8 SPAK DPAK VIN 1 1 Pin Function Input supply voltage NC/FB 2 2 V1 3 4/5 Output #1 For V2 fixed, no connect. For V2 adjustable, feedback voltage. V2 4 5/4 Output #2 GND 5, 6, 7, 8 3 Ground Absolute Maximum Ratings Parameter Min. Max. 10 V 0 150 °C -65 150 °C 300 °C VIN Operating Junction Temperature Range Storage Temperature Range Lead Temperature (Soldering, 10 sec.) 2 Unit REV. 1.1.1 3/20/02 PRODUCT SPECIFICATION FAN1537 Electrical Characteristics (Operating Conditions: VIN ≤ 7V, TJ=25°C unless otherwise specified.) The • denotes specifications which apply over the specified operating temperature range of 0°C to 125°C junction temperature. Parameter Conditions Output Voltages 10mA ≤ IOUT ≤ 1A 4.75V ≤ VIN ≤ 7V Min. Typ. Max. • 1.764 1.742 2.450 2.420 3.234 3.200 1.8 1.8 2.500 2.500 3.300 3.300 1.836 1.858 2.550 2.580 3.366 3.400 • 3.2 1.225 1.210 V • • Output Voltage 3.3V Output, VIN = 4.5V, IOUT = 1A Units Time to Output Voltages Valid From VIN ≥ 4.75V Reference Voltage, VREF 10mA ≤ IOUT ≤ 1A 4.75V ≤ VIN ≤ 7V • Line Regulation1,2 (both outputs) 4.75V ≤ VIN ≤ 7V, IOUT = 10mA Load Regulation1,2 (both outputs) V 5 msec 1.250 1.250 1.275 1.290 V • 0.005 0.5 % VIN = 4.75V, 10mA ≤ IOUT ≤ 1A • 0.05 0.5 % Dropout Voltage (3.3V output) ∆VOUT = 1%, IOUT = 1A • 1.100 1.300 V Current Limit (both outputs) VIN = 5V • Minimum Load Current (both outputs) 4.75V ≤ VIN ≤ 7V • Quiescent Current VIN = 7V • Rejection3 Ripple (both outputs) f = 120Hz, COUT = 22µF Tantalum, VIN = 5V, IOUT = 1A Long-Term Stability TA = 125°C, 1000 hrs. RMS Output Noise (% of VOUT) TA = 25°C, 10Hz ≤ f ≤ 10kHz Thermal Resistance, Junction to SO-8 Case TO-252 DPAK SPAK Thermal Shutdown Thermal Shutdown Hysteresis Junction Temperature 1.3 1.5 A 10 mA 6 15 60 mA dB 0.03 1.0 % 0.003 % 50 °C/W 3 °C/W 2 °C/W 155 °C 10 °C Notes: 1. See thermal regulation specifications for changes in output voltage due to heating effects. Load and line regulation are measured at a constant junction temperature by low duty cycle pulse testing. 2. Power dissipation is determined by input/output differential and the output current. Guaranteed maximum output power will not be available over the full input/output voltage range. 3. ESR = 0.2Ω. 4. For adjust only, VOUT = VREF (1 + R1/R2) REV. 1.1.1 3/20/02 3 FAN1537 PRODUCT SPECIFICATION Application Hints External Capacitors Like any low-dropout regulator, the FAN1537 requires external capacitors for stability. Input Capacitor A Tantalum input capacitor of 22µF is recommended. This capacitor must be located at a distance of no more than 0.5" from the input pin of the device and returned to a clean analog ground. Output Capacitor The FAN1537 is designed to work with Ceramic or Tantalum load capacitors. A value of 22µF is recommended on each output, but the value can be reduced to 10µF to save space. Additional capacitance can be added without limit for better performance, e.g. improved transient response and lower noise. When a Ceramic multilayer capacitor is used, the X7R dielectric is recommended which holds the capacitance within ±15%. The output capacitor should be located not more than 0.5" from the output pins of the device and returned to a clean analog ground. 4 REV. 1.1.1 3/20/02 PRODUCT SPECIFICATION FAN1537 Mechanical Dimensions 8-Lead SOIC Package Inches Symbol Millimeters Min. Max. Min. Max. A A1 B C D .053 .004 .013 .0075 .189 .069 .010 1.35 0.10 0.33 0.20 4.80 1.75 0.25 E e H h L N α ccc .150 .158 .050 BSC 3.81 4.01 1.27 BSC .228 .010 .016 5.79 0.25 0.40 .020 .010 .197 .244 .020 .050 8 0.51 0.25 5.00 6.20 0.50 1.27 8 0° 8° 0° 8° — .004 — 0.10 8 Notes: Notes 1. Dimensioning and tolerancing per ANSI Y14.5M-1982. 2. "D" and "E" do not include mold flash. Mold flash or protrusions shall not exceed .010 inch (0.25mm). 3. "L" is the length of terminal for soldering to a substrate. 4. Terminal numbers are shown for reference only. 5 2 2 5. "C" dimension does not include solder finish thickness. 6. Symbol "N" is the maximum number of terminals. 3 6 5 E 1 H 4 h x 45° D C A1 A SEATING PLANE e B REV. 1.1.1 3/20/02 –C– LEAD COPLANARITY α L ccc C 5 FAN1537 PRODUCT SPECIFICATION Mechanical Dimensions 5-Lead SPAK Inches Symbol Min. Millimeters Max. Min. Max. A B b1 b2 0.350 0.360 0.220 NOM 0.268 0.025 0.031 8.89 9.14 5.59 NOM 6.81 0.63 0.79 C c1 c2 D E e L L1 L2 L3 R α 0.080 0.070 0.040 0.050 0.010 NOM 0.295 NOM 0.365 0.375 0.067 2.03 1.78 1.02 1.27 0.25 NOM 7.49 NOM 9.27 9.52 1.72 0.410 0.031 0.350 10.41 0.79 8.89 0.420 0.041 0.360 0.310 0.320 0.010 NOM 0° 8° Notes: 1. All linear dimensions are in inches (millimeters). 2. This drawing is subject to change without notice. 3. The center lead is in electrical contact with the thermal tab. 4. Dimensions do not include mold protrusions, not to exceed 0.006 (0,15). Notes 10.67 1.04 9.14 7.87 8.13 0.25 NOM 0° 8° E C A c1 B c2 D L3 L 1 L2 Thermal Ta b (See Note 3) 5 Seating Plane b2 e b1 0.004 (0,10) 0.010 (0,25) M 0.005 (0.13) 0.001 (0.03) R L1 Gage Plane 3°–6° 6 REV. 1.1.1 3/20/02 FAN1537 PRODUCT SPECIFICATION Mechanical Dimensions 5-Lead TO-252 Package 6.00 MIN A 6.80 6.35 5.64 5.04 1.27 0.50 6.56 MIN 6.30 5.90 6.25 1.02 0.60 3.00 MIN C 1 3 2 1 5 4 1.27 (0.44) 0.57±0.07 1.27 1.00 3.81 0.69±0.15 1.27 0.25 M A M C LAND PATTERN RECOMMENDATION 5.08 B 2.40 2.18 0.60 0.40 (5.09) (4.05) 10.42 9.20 SEE DETAIL A 3 5 4 2 1 0.10 B GAGE PLANE 0.60 0.40 0.51 (1.54) NOTES: UNLESS OTHERWISE SPECIFIED 10° 0° 1.78 1.40 A) ALL DIMENSIONS ARE IN MILLIMETERS. B) THIS PACKAGE CONFORMS TO JEDEC, TO-252, ISSUE C, VARIATION AA, DATED NOV. 1999. 0.13 MAX (2.90) SEATING PLANE DETAIL A (ROTATED 90°) SCALE: 2X 7 REV. 1.1.1 3/20/02 FAN1537 PRODUCT SPECIFICATION Ordering Information Example: FAN1537PA FAN1537 P M = SO-8 P = SPAK D = TO-252 DPAK A Table 1 Table 1. Suffix V1 V2 A 3.3V 2.5V B 3.3V ADJ C 3.3V 1.8V DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. www.fairchildsemi.com 3/20/02 0.0m 004 Stock#DS30001537 2001 Fairchild Semiconductor Corporation