Product Folder Sample & Buy Support & Community Tools & Software Technical Documents bq25898C SLUSCJ7B – MARCH 2016 – REVISED APRIL 2016 bq25898C I2C Controlled Single Cell 3-A Charger for High Input Voltage in Compact DSBGA Package 1 Features 2 Applications • • • • 1 • • • • • • • • • • • Operation as Slave Charger to Provide Fast Charging in Dual Charger Operation Simple Configuration with Minimum BOM High Efficiency 3-A, 1.5-MHz Switch Mode Buck Charge – 92% Charge Efficiency at 3 A and 94% Charge Efficiency at 2 A Charge Current – Optimize for High Voltage Input (9 V / 12 V) – Low Power PFM mode for Light Load Operations Single Input to Support USB Input and Adjustable High Voltage Adapters – Support 3.9-V to 14-V Input Voltage Range – Input Current Limit (100 mA to 3.25 A with 50mA resolution) to Support USB2.0, USB3.0 standard and High Voltage Adapters – Wide Input Dynamic Power Management (DPM) Range Highest Battery Discharge Efficiency with 5-mΩ Default Charge Disabled Integrated ADC for System Monitor (Voltage, Charge Current) Flexible Autonomous and I2C Mode for Optimal System Performance Remote Battery Sensing High Integration includes all MOSFETs, Current Sensing and Loop Compensation High Accuracy – ±0.5% Charge Voltage Regulation – ±5% Charge Current Regulation – ±7.5% Input Current Regulation Safety – Thermal Regulation and Thermal Shutdown – Input UVLO/Overvoltage Protection – Battery OVP – Safety Timer Smart Phone Tablet PC Portable Internet Devices 3 Description The bq25898C is a highly-integrated switch-mode battery charge management and system power path management device for single cell Li-Ion and Lipolymer battery. The device supports high input voltage for charging. The low impedance power path optimizes switch-mode operation efficiency, reduces battery charging time and extends battery life during discharging phase. The I2C serial interface with charging and system settings makes the device a truly flexible solution. The bq25898C is available in a 2.8mm x 2.5mm 42-ball DSBGA package. Device Information(1) PART NUMBER bq25898C PACKAGE BODY SIZE (NOM) DSBGA (42) 2.80 mm x 2.50 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic INPUT 3.9V±14V USB SW VBUS BTST SYS ICHG I2C BUS BAT BATSEN bq25898C Host Host Control Copyright © 2016, Texas Instruments Incorporated 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. bq25898C SLUSCJ7B – MARCH 2016 – REVISED APRIL 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (Continued) ........................................ Device and Documentation Support.................... 1 1 1 2 3 4 6.1 Device Support ........................................................ 4 6.2 6.3 6.4 6.5 7 Community Resources.............................................. Trademarks ............................................................... Electrostatic Discharge Caution ................................ Glossary .................................................................... 4 4 4 4 Mechanical, Packaging, and Orderable Information ............................................................. 4 7.1 Package Option Addendum ...................................... 5 4 Revision History Changes from Revision A (March 2016) to Revision B • 2 Page Updated product preview data sheet to production data ....................................................................................................... 1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq25898C bq25898C www.ti.com SLUSCJ7B – MARCH 2016 – REVISED APRIL 2016 5 Description (Continued) The bq25898C is a highly-integrated 3-A switch-mode battery charge management device for single cell Li-Ion and Li-polymer battery. As a tiny and cost-effective device, it can also be configured as slave charger to provide fast charging in dual charger applications. It features fast charging with high input voltage support for a wide range of smartphone, tablet and portable devices. Its low impedance power path optimizes switch-mode operation efficiency, reduces battery charging time and extends battery life during discharging phase. The solution is highly integrated with input reverseblocking FET (RBFET,Q1), high-side switching FET (HSFET, Q2), low-side switching FET (LSFET, Q3), and integrated charge current sensing. It also integrates the bootstrap diode for the high-side gate drive and battery monitor for simplified system design. The I2C serial interface with charging and system settings makes the device a truly flexible solution. The device supports a wide range of input sources, including standard USB host port, USB charging port, and USB compliant adjustable high voltage adapter. To set the default input current limit, the device takes the result from detection circuit in the system, such as USB PHY device. The device is compliant with USB 2.0 and USB 3.0 power spec with input current and voltage regulation. The default charge current is set to 0 mA (charge disabled). Once charge is enabled, the device may initiate and complete a charging cycle with software control. The charger provides various safety features for battery charging and system operations, charging safety timer and overvoltage/overcurrent protections. The thermal regulation reduces charge current when the junction temperature exceeds 120°C (programmable). The STAT output reports the charging status and any fault conditions. The PG output indicates if a good power source is present. The INT immediately notifies host when fault occurs. The device is available in a 2.80 mm x 2.50 mm 42-ball DSBGA package. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq25898C 3 bq25898C SLUSCJ7B – MARCH 2016 – REVISED APRIL 2016 www.ti.com 6 Device and Documentation Support 6.1 Device Support 6.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 6.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 6.3 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 6.4 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 6.5 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 7 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 4 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq25898C bq25898C www.ti.com SLUSCJ7B – MARCH 2016 – REVISED APRIL 2016 7.1 Package Option Addendum 7.1.1 Packaging Information Orderable Device (1) (2) (3) (4) (5) Status (1) Package Type Package Drawing Pins Package Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3) Op Temp (°C) BQ25898CYFFR ACTIVE DSBGA YFF 42 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 BQ25898CYFFT ACTIVE DSBGA YFF 42 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 Device Marking (4) (5) BQ25898C The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PRE_PROD Unannounced device, not in production, not available for mass market, nor on the web, samples not available. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. space Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) space MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. space There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device space Multiple Device markings will be inside parentheses. Only on Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer: The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq25898C 5 bq25898C SLUSCJ7B – MARCH 2016 – REVISED APRIL 2016 www.ti.com 7.1.2 Tape and Reel Information REEL DIMENSIONS TAPE DIMENSIONS K0 P1 B0 W Reel Diameter Cavity A0 B0 K0 W P1 A0 Dimension designed to accommodate the component width Dimension designed to accommodate the component length Dimension designed to accommodate the component thickness Overall width of the carrier tape Pitch between successive cavity centers Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE Sprocket Holes Q1 Q2 Q1 Q2 Q3 Q4 Q3 Q4 User Direction of Feed Pocket Quadrants 6 Device Package Type Package Drawing Pins SPQ Reel Diameter (mm) Reel Width W1 (mm) A0 (mm) B0 (mm) K0 (mm) P1 (mm) W (mm) Pin1 Quadrant BQ25898CYFFR DSBGA YFF 42 3000 180 8.4 2.66 2.95 0.81 4.0 8.0 Q1 BQ25898CYFFT DSBGA YFF 42 250 180 8.4 2.66 2.95 0.81 4.0 8.0 Q1 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq25898C bq25898C www.ti.com SLUSCJ7B – MARCH 2016 – REVISED APRIL 2016 TAPE AND REEL BOX DIMENSIONS Width (mm) W L H Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ25898CYFFR DSBGA YFF 42 3000 182 182 20 BQ25898CYFFT DSBGA YFF 42 250 182 182 20 Submit Documentation Feedback Copyright © 2016, Texas Instruments Incorporated Product Folder Links: bq25898C 7 PACKAGE OUTLINE YFF0042 DSBGA - 0.625 mm max height SCALE 4.500 DIE SIZE BALL GRID ARRAY B E A BUMP A1 CORNER D D: Max = 2.79mm, Min = 2.85mm E: Max = 2.50mm, Min = 2.56mm C 0.625 MAX SEATING PLANE BALL TYP 0.30 0.12 0.05 C 2 TYP SYMM G F E 2.4 TYP SYMM D C 42X B 0.4 TYP A 1 2 3 4 5 0.3 0.2 0.015 C A B 6 0.4 TYP 4222067/A 05/2015 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. www.ti.com EXAMPLE BOARD LAYOUT YFF0042 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.4) TYP 42X ( 0.23) 2 1 (0.4) TYP 3 4 5 6 A B C SYMM D E F G SYMM LAND PATTERN EXAMPLE SCALE:25X ( 0.23) METAL 0.05 MAX 0.05 MIN ( 0.23) SOLDER MASK OPENING SOLDER MASK OPENING METAL UNDER SOLDER MASK NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4222067/A 05/2015 NOTES: (continued) 3. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). www.ti.com EXAMPLE STENCIL DESIGN YFF0042 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.4) TYP (R0.05) TYP 42X ( 0.25) 1 A (0.4) TYP METAL TYP 2 4 3 5 6 B C SYMM D E F G SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:30X 4222067/A 05/2015 NOTES: (continued) 4. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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