ADDtek AMC1112SK 1a low dropout positive regulator Datasheet

AMC1112
1A LOW DROPOUT
POSITIVE REGULATOR
www.addmtek.com
DESCRIPTION
FEATURES
The AMC1112 of positive fixed regulators is
designed to provide 1A for applications requiring high
efficiency. All internal circuitry is designed to operated
down to 800mV input to output differential and the
dropout voltage is fully specified as a function of load
current.
The AMC1112 offers current limiting and thermal
protection. The on chip trimming adjusts the reference
voltage accuracy to 1%.
„
Output current of 1A typical
„
Three-terminal fixed 1.2V outputs
„
Low dropout of typical 800mV
„
Thermal protection built in
„
Typical 0.015% line regulation
„
Typical 0.01% load regulation
„
Fast transient response
„
Available in SOT-223 and TO-252 packages
„
Pin assignment identical to earlier FAN1112.
APPLICATIONS
PACKAGE PIN OUT
„
2.85V Model for SCSI-2 Active Termination
„
Battery Charger
3. VIN
„
High Efficiency Linear Regulators
2. VOUT
„
Battery Powered Instrumentation
1. GND
„
Post Regulator for Switching DC/DC Converter
3-Pin Plastic SOT-223
Surface Mount
(Top View)
3. VIN
2. VOUT
1. GND
3-Pin Plastic TO-252
Surface Mount
(Top View)
ORDER INFORMATION
TA (OC)
0 to 70
Note:
SOT223
3-pin
AMC1112SK (SnPb)
AMC1112KF (Lead Free)
TO-252
3-pin
AMC1112SJ (SnPb)
AMC1112SJF (Lead Free)
SK
1.All surface-mount packages are available in Tape & Reel.
2.The letter “F” is marked for Lead Free process.
Copyright © 2007 ADDtek Corp
SJ
Append the letter “T” to part number (i.e. AMC1112SJT).
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AMC1112
ABSOLUTE MAXIMUM RATINGS
(Note 1)
13V
0 OC to 150 OC
-65 OC to 150 OC
260 OC
Input Voltage
Operating Junction Temperature Range, TJ
Storage Temperature Range
Lead Temperature (soldiering, 10 seconds)
Note 1:
Exceeding these ratings could cause damage to the device.
negative out of the specified terminal.
All voltages are with respect to Ground. Currents are positive into,
POWER DISSIPATION TABLE
Package
θJA
(OC /W )
Derating factor ( mW/ OC)
TA≥ 25 OC
TA≤ 25 OC
Power rating(mW)
TA=70 OC
Power rating(mW)
TA= 85 OC
Power rating (mW)
SK
136
7.35
919
588
478
SKF
SJ
SJF
136
80
80
7.35
12.5
12.5
919
1562
1562
588
1000
1000
478
812
812
Note :
1.
θJA: Thermal Resistance-Junction to Ambient, DF : Derating factor, Po: Power consumption.
Junction Temperature Calculation: TJ = TA + (PD × θJA), Po = DF × (TJ- TA)
The θJA numbers are guidelines for the thermal performance of the device/PC-board system.
All of the above assume no ambient airflow.
2.
θJT: Thermal Resistance-Junction to Tab, TC: case(Tab) temperature, TJ = TC + (PD × θJT)
For SK package, θJT = 15.0 OC /W.
For SJ package, θJT = 7.0 OC /W.
BLOCK DIAGRAM
VIN
VOUT
For 1.2V
Output
GND
Copyright © 2007 ADDtek Corp
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AMC1112
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Parameter
Symbol
Min.
Typ.
Max.
Input Voltage
VIN
2.4
12
Load Current (with adequate heatsinking)
IO
10
Input Capacitor (VIN to GND)
1.0
Output Capacitor with ESR of 10Ω max., (VOUT to GND)
4.7
Junction temperature
TJ
Units
V
mA
µF
µF
O
125
C
ELECTRICAL CHARACTERISTICS
Unless otherwise specified, VIN = VOUT +2V, IO =10mA, and TJ = 25 OC.
Parameter
Output
Voltage
AMC1112
Symbol
Vout
AMC1112
Line
Regulation AMC1112
∆VOI
AMC1112
Load
Regulation AMC1112
∆VOL
Dropout Voltage
∆V
Minimum Load Current
(Note 1)
Quiescent
Current
AMC1112
Current Limit
Adjust Pin Current
IO = 10mA, VIN – VOUT = 2V
10mA ≤ IO ≤ 1A, VOUT +1.5V ≤ VIN ≤ 12V
IO = 10mA, VOUT +1.5V ≤ VIN ≤ 12V
IO = 10mA,
VOUT +1.5V ≤ VIN ≤ 12V
AMC1112
Min
Typ
1.18
1.20
1.17
1.20
0.04
Units
V
%
6.0
mV
10mA ≤ IO ≤ 1A, VIN – VOUT = 3V
0.10
0.40
%
10mA ≤ IO ≤ 1A, VIN = VOUT +1.5V
1.0
10.0
mV
IO = 10mA
IO = 500mA
IO = 1A
0.8
0.8
1.0
1.15
1.20
120
V
IQ
VIN ≤ 12V
ICL
VIN – VOUT = 3V
IO = 10mA, VIN – VOUT = 2V
10
mA
6
1
O
TA = 25 C, 30 ms pulse
RR
Max
1.26
1.27
0.20
1.0
3.0V ≤ Vin ≤ 12V
Thermal Regulation (Note 2)
Ripple rejection (Note 2)
Test Conditions
fO = 120HZ, 1V RMS, I O = 400mA,
VIN – VOUT = 3V
60
10
mA
1.2
50
120
A
µA
0.01
0.1
%/W
75
dB
Note 1:
For the adjustable device, the minimum load current is the minimum current required to maintain regulation. Normally the current in
the resistor divider used to set the output voltage is selected to meet the minimum load current requirement.
Note 2:
These parameters, although guaranteed, are not tested in production.
Copyright © 2007 ADDtek Corp
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AMC1112
CHARACTERIZATION CURVES
Unless otherwise specified, VIN= VOUT+2V,CIN=1µF,COUT=4.7µF,TA=25 OC
Load Regulation
Output Voltage (%)
102.0%
101.5%
101.0%
100.5%
100.0%
99.5%
99.0%
98.5%
98.0%
10
200
400
600
800
1000
Current (mA)
Quiescent Current vs.
Temperature
2
Quiescent Current (mA)
Output Voltage Change (%)
Temperature Stability
1.5
1
0.5
0
-0.5
-1
-1.5
-2
-40 -20
0
20 40
8
6
4
2
0
-40 -20
60 80 100 120
0
20 40
60 80 100 120
O
TA ( C)
TA (OC)
Copyright © 2007 ADDtek Corp
10
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AMC1112
APPLICATION INFORMATION
VIN
R
Ω
* 120
C1
10µF
Note:
VOUT
AMC1112
C2
22µF
1. *120Ω for warrant work on 10mA.
2. R doesn’t need to use if load more than 120Ω.
Fixed Voltage Regulator
Copyright © 2007 ADDtek Corp
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AMC1112
Application Note:
Maximum Power Calculation:
TJ(MAX) – TA(MAX)
θJA
TJ(OC): Maximum recommended junction temperature
TA(OC): Ambient temperature of the application
θJA(OC/W): Junction-to-junction temperature thermal resistance of the package, and other heat dissipating
materials.
The maximum power dissipation of a single-output regulator :
PD(MAX) = [(VIN(MAX) - VOUT(NOM))] × IOUT(NOM) + VIN(MAX) × IQ
PD(MAX)=
Where: VOUT(NOM) = the nominal output voltage
IOUT(NOM) = the nominal output current, and
IQ = the quiescent current the regulator consumes at IOUT(MAX)
VIN(MAX) = the maximum input voltage
Then θJA = (150 OC – TA)/ PD
Thermal consideration:
When power consumption is over about 404 mW ( for SOT-223 package, 687mW for TO-252 package, at TA=70 OC),
additional heat sink is required to control the junction temperature below 125 OC.
The junction temperature is: TJ = P D ( θJT + θCS + θSA ) + TA
P D :Dissipated power.
θJT :Thermal resistance from the junction to the mounting tab of the package.
θCS :Thermal resistance through the interface between the IC and the surface on which it is mounted. (typically,
θCS < 1.0°C/W)
θSA : Thermal resistance from the mounting surface to ambient (thermal resistance of the heat sink).
If PC Board copper is going to be used as a heat sink, below table can be used to determine the appropriate size of
copper foil required. For multi-layered PCB, these layers can also be used as a heat sink. They can be connected with
several through hole vias.
59
PCB θSA (OC /W )
2
PCB heat sink size (mm ) 500
45
1000
38
1500
33
2000
27
3000
24
4000
21
5000
Recommended figure of PCB area used as a heat sink.
through hole vias
(Top View)
Copyright © 2007 ADDtek Corp
(Bottom View)
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AMC1112
PACKAGE
3-Pin Surface Mount SOT-223 ( SK )
D
MILLIMETERS
A
c
MIN
TYP
MAX
A
1.50
1.65
1.80
A1
0.02
0.05
0.08
B1
H
E
K
L
e
B
0.60
0.70
0.80
B1
2.90
-
3.15
c
0.28
0.30
0.32
D
6.30
6.50
6.70
E
3.30
3.50
3.70
A1
e
2.3 BSC
e1
4.6 BSC
e1
B
H
6.70
7.00
7.30
L
0.91
1.00
1.10
K
1.50
1.75
2.00
α
0°
5°
10°
β
3°
3-Pin Surface Mount TO-252 (SJ)
INCHES
MIN
A
E
b2
A
A1
c1
L2
TYP
MILLIMETERS
MAX
MIN
TYP
MAX
0.086
-
0.094
2.18
-
2.39
A1 0.040
-
0.050
1.02
-
1.27
0.024
-
-
0.61
-
b
-
SEATING PLAN
b2 0.205
D
b
L
c
e1
Copyright © 2007 ADDtek Corp
0.215
5.21
-
5.46
-
0.023
0.46
-
0.58
c1 0.018
-
0.023
0.46
-
0.58
D 0.210
-
0.220
5.33
-
5.59
E
-
0.265
6.35
-
6.73
H
L1
e
-
0.018
c
7
0.250
e
0.090 BSC
e1
0.180 BSC
2.29 BSC
4.58 BSC
H 0.370
-
0.410
9.40
-
10.41
L
0.020
-
-
0.51
-
-
L1 0.025
-
0.040
0.64
-
1.02
L2 0.060
-
0.080
1.52
-
2.03
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AMC1112
IMPORTANT NOTICE
ADDtek reserves the right to make changes to its products or to discontinue any integrated circuit product or service
without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing
orders, that the information being relied on is current.
A few applications using integrated circuit products may involve potential risks of death, personal injury, or severe
property or environmental damage. ADDtek integrated circuit products are not designed, intended, authorized, or
warranted to be suitable for use in life-support applications, devices or systems or other critical applications. Use of
ADDtek products in such applications is understood to be fully at the risk of the customer. In order to minimize risks
associated with the customer’s applications, the customer should provide adequate design and operating safeguards.
ADDtek assumes to no liability to customer product design or application support. ADDtek warrants the performance of
its products to the specifications applicable at the time of sale.
ADDtek Corp.
9F, No. 20, Sec. 3, Bade Rd., Taipei, Taiwan, 105
TEL: 2-25700299
FAX: 2-25700196
Copyright © 2007 ADDtek Corp
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