16 M EDO DRAM (1-Mword × 16-bit) 4 k Refresh/1 k Refresh LP EO Description HM51W16165 Series HM51W18165 Series E0153H10 (Ver. 1.0) (Previous ADE-203-650D (Z)) Jul. 6, 2001 (K) The HM51W16165 Series, HM51W18165 Series are CMOS dynamic RAMs organized as 1,048,576-word × 16-bit. They employ the most advanced CMOS technology for high performance and low power. HM51W16165 Series, HM51W18165 Series offer Extended Data Out (EDO) Page Mode as a high speed access mode. They have package variations of standard 400-mil 42-pin plastic SOJ and 400-mil 50-pin plastic TSOP. ro Features ct du • Single 3.3 V (±0.3 V) • Access time: 50 ns/60 ns/70 ns (max) • Power dissipation Active mode : 396 mW/360mW/324 mW (max) (HM51W16165 Series) : 684 mW /612 mW /540 mW (max) (HM51W18165 Series) Standby mode : 7.2 mW (max) : 0.54 mW (max) (L-version) • EDO page mode capability • Refresh cycles 4096 refresh cycles : 64 ms (HM51W16165 Series) : 128 ms (L-version) 1024 refresh cycles : 16 ms (HM51W18165 Series) : 128 ms (L-version) • 4 variations of refresh RAS-only refresh CAS-before-RAS refresh Hidden refresh Self refresh (L-version) • 2CAS-byte control Elpida Memory, Inc. is a joint venture DRAM company of NEC Corporation and Hitachi, Ltd. EO HM51W16165 Series, HM51W18165 Series • Battery backup operation (L-version) Ordering Information Access time Package HM51W16165J-5 HM51W16165J-6 HM51W16165J-7 50 ns 60 ns 70 ns 400-mil 42-pin plastic SOJ (CP-42D) HM51W16165LJ-5 HM51W16165LJ-6 HM51W16165LJ-7 50 ns 60 ns 70 ns HM51W18165J-5 HM51W18165J-6 HM51W18165J-7 HM51W18165LJ-5 HM51W18165LJ-6 HM51W18165LJ-7 HM51W16165TT-5 HM51W16165TT-6 HM51W16165TT-7 LP Type No. 50 ns 60 ns 70 ns 50 ns 60 ns 70 ns 50 ns 60 ns 70 ns 50 ns 60 ns 70 ns HM51W18165TT-5 HM51W18165TT-6 HM51W18165TT-7 50 ns 60 ns 70 ns HM51W18165LTT-5 HM51W18165LTT-6 HM51W18165LTT-7 50 ns 60 ns 70 ns ct du ro HM51W16165LTT-5 HM51W16165LTT-6 HM51W16165LTT-7 400-mil 50-pin plastic TSOP II (TTP-50/44DC) Data Sheet E0153H10 2 EO HM51W16165 Series, HM51W18165 Series Pin Arrangement HM51W16165TT/LTT Series HM51W16165J/LJ Series 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 VSS I/O15 I/O14 I/O13 I/O12 VSS I/O11 I/O10 I/O9 I/O8 NC LCAS UCAS OE A9 A8 A7 A6 A5 A4 VSS (Top view) Pin Description Function A0 to A11 Address input — Row/Refresh address A0 to A11 — Column address A0 to A7 I/O0 to I/O15 Data input/Data output RAS Row address strobe UCAS, LCAS Column address strobe WE Read/Write enable OE Output enable VCC Power supply VSS Ground NC No connection 1 2 3 4 5 6 7 8 9 10 11 50 49 48 47 46 45 44 43 42 41 40 VSS I/O15 I/O14 I/O13 I/O12 VSS I/O11 I/O10 I/O9 I/O8 NC NC NC WE RAS A11 A10 A0 A1 A2 A3 VCC 15 16 17 18 19 20 21 22 23 24 25 36 35 34 33 32 31 30 29 28 27 26 NC LCAS UCAS OE A9 A8 A7 A6 A5 A4 VSS (Top view) ct Pin name VCC I/O0 I/O1 I/O2 I/O3 VCC I/O4 I/O5 I/O6 I/O7 NC du ro 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 LP VCC I/O0 I/O1 I/O2 I/O3 VCC I/O4 I/O5 I/O6 I/O7 NC NC WE RAS A11 A10 A0 A1 A2 A3 VCC Data Sheet E0153H10 3 EO HM51W16165 Series, HM51W18165 Series Pin Arrangement HM51W18165TT/LTT Series HM51W18165J/LJ Series 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 42 41 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 VSS I/O15 I/O14 I/O13 I/O12 VSS I/O11 I/O10 I/O9 I/O8 NC LCAS UCAS OE A9 A8 A7 A6 A5 A4 V (Top view) SS 1 2 3 4 5 6 7 8 9 10 11 50 49 48 47 46 45 44 43 42 41 40 VSS I/O15 I/O14 I/O13 I/O12 VSS I/O11 I/O10 I/O9 I/O8 NC NC NC WE RAS NC NC A0 A1 A2 A3 VCC 15 16 17 18 19 20 21 22 23 24 25 36 35 34 33 32 31 30 29 28 27 26 NC LCAS UCAS OE A9 A8 A7 A6 A5 A4 VSS Function A0 to A9 Address input — Row/Refresh address A0 to A9 — Column address A0 to A9 I/O0 to I/O15 Data input/Data output RAS Row address strobe UCAS, LCAS Column address strobe WE Read/Write enable OE Output enable VCC Power supply VSS Ground NC No connection Data Sheet E0153H10 ct Pin name (Top view) du Pin Description 4 VCC I/O0 I/O1 I/O2 I/O3 VCC I/O4 I/O5 I/O6 I/O7 NC ro LP VCC I/O0 I/O1 I/O2 I/O3 VCC I/O4 I/O5 I/O6 I/O7 NC NC WE RAS NC NC A0 A1 A2 A3 VCC EO HM51W16165 Series, HM51W18165 Series Block Diagram (HM51W16165 Series) to A7 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array address buffers Row address buffers ro A10 A11 OE Column decoder Column • • • • • • A8 A9 WE Timing and control Row decoder A1 UCAS LCAS LP A0 RAS I/O buffers I/O0 to I/O15 Block Diagram(HM51W18165 Series) RAS UCAS LCAS WE OE du Timing and control A0 Column decoder A1 to Column • • • address buffers Row address buffers Row decoder • • • ct A9 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array 1M array I/O buffers I/O0 to I/O15 Data Sheet E0153H10 5 EO HM51W16165 Series, HM51W18165 Series Truth Table RAS LCAS UCAS WE OE Output Operation H D D D D Open Standby L L H H L Valid Lower byte Read cycle L H L H L Valid Upper byte L L L H L H Valid Word L* D Open Lower byte Early write cycle L* 2 D Open Upper byte L* 2 D Open Word L* 2 H Undefined Lower byte Delayed write cycle L* 2 H Undefined Upper byte L L* 2 H Undefined Word H H to L L to H Valid Lower byte Read-modify-write cycle L H to L L to H Valid Upper byte L H to L L to H Valid Word H D D Open Word RAS-only refresh cycle Open Word CAS-before-RAS refresh cycle or Open Word Self refresh cycle (L-version) Open Word H L L L L L H L L L H H to L H L D D H to L L H D D H to L L L D D L L L H H L L L L L H L H L ro L LP L L L 2 Open Read cycle (Output disabled) ct du Notes: 1. H: High (inactive) L: Low (active) D: H or L 2. t WCS ≥ 0 ns Early write cycle t WCS < 0 ns Delayed write cycle 3. Mode is determined by the OR function of the UCAS and LCAS. (Mode is set by the earliest of UCAS and LCAS active edge and reset by the latest of UCAS and LCAS inactive edge.) However write OPERATION and output HIZ control are done independently by each UCAS, LCAS. ex. if RAS = H to L, UCAS = H, LCAS = L, then CAS-before-RAS refresh cycle is selected. Data Sheet E0153H10 6 EO HM51W16165 Series, HM51W18165 Series Absolute Maximum Ratings Symbol Value Unit Voltage on any pin relative to V SS VT –0.5 to VCC + 0.5 (≤ +4.6 V (max)) V Supply voltage relative to VSS VCC –0.5 to +4.6 V Short circuit output current Iout 50 mA Power dissipation PT 1.0 W Operating temperature Topr 0 to +70 °C –55 to +125 °C LP Parameter Storage temperature Tstg Recommended DC Operating Conditions (Ta = 0 to +70°C) Parameter Supply voltage Input high voltage Input low voltage Symbol Min Typ Max Unit Notes VCC 3.0 3.3 3.6 V 1, 2 VIH 2.0 — VCC + 0.3 V 1 VIL –0.3 — 0.8 V 1 ct du ro Notes: 1. All voltage referred to VSS . 2. The supply voltage with all VCC pins must be on the same level. The supply voltage with all VSS pins must be on the same level. Data Sheet E0153H10 7 EO HM51W16165 Series, HM51W18165 Series DC Characteristics (Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (HM51W16165 Series) HM51W16165 -5 Parameter -6 -7 Symbol Min Max Min Max Min Max Unit Test conditions I CC1 — 110 — 100 — 90 mA t RC = min I CC2 — 2 — 2 — 2 mA TTL interface RAS, UCAS, LCAS = VIH Dout = High-Z — 1 — 1 — 1 mA CMOS interface RAS, UCAS, LCAS ≥ VCC – 0.2 V Dout = High-Z I CC2 — 150 — 150 — 150 µA CMOS interface RAS, UCAS, LCAS ≥ VCC – 0.2 V Dout = High-Z I CC3 — 110 — 100 — 90 mA t RC = min I CC5 — 5 5 5 mA RAS = VIH UCAS, LCAS = VIL Dout = enable I CC6 — EDO page mode current*1, * 3 I CC7 — 1, Operating current* * 2 Standby current RAS-only refresh current*2 1 Standby current* CAS-before-RAS refresh current 4 — ro LP Standby current (L-version) — 110 — 100 — 90 mA t RC = min 105 — 95 85 mA t HPC = min 400 — 400 — 250 — 250 — — I CC10 — Self refresh mode current (L-version) I CC11 — Input leakage current I LI –10 10 –10 10 –10 10 µA 0 V ≤ Vin ≤ 4.6 V Output leakage current I LO –10 10 –10 10 –10 10 µA 0 V ≤ Vout ≤ 4.6 V Dout = disable Output high voltage VOH 2.4 VCC 2.4 VCC 2.4 VCC V Output low voltage VOL 0 0.4 0.4 0.4 V 0 250 µA CMOS interface Dout = High-Z CBR refresh: tRC = 31.3 µs t RAS ≤ 0.3 µs CMOS interface RAS, UCAS, LCAS ≤ 0.2 V Dout = High-Z ct 0 400 µA du Battery backup current* (Standby with CBR refresh) (L-version) High Iout = –2 mA Low Iout = 2 mA Notes: 1. I CC depends on output load condition when the device is selected. ICC max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Address can be changed once or less while UCAS and LCAS = VIH. 4. VIH ≥ VCC – 0.2 V, 0 V ≤ VIL ≤ 0.2 V. Data Sheet E0153H10 8 EO HM51W16165 Series, HM51W18165 Series DC Characteristics (Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V) (HM51W18165 Series) HM51W18165 -5 -7 Symbol Min Max Min Max Min Max Unit Test conditions I CC1 — 190 — 170 — 150 mA t RC = min Standby current I CC2 — 2 — 2 — 2 mA TTL interface RAS, UCAS, LCAS = VIH Dout = High-Z — 1 — 1 — 1 mA CMOS interface RAS, UCAS, LCAS ≥ VCC – 0.2 V Dout = High-Z Standby current (L-version) LP Parameter -6 I CC2 — 150 — 150 — 150 µA CMOS interface RAS, UCAS, LCAS ≥ VCC – 0.2 V Dout = High-Z I CC3 — 190 — 170 — 150 mA t RC = min I CC5 — 5 5 5 RAS = VIH UCAS, LCAS = VIL Dout = enable I CC6 — EDO page mode current*1, * 3 I CC7 — 1, Operating current* * 2 RAS-only refresh current*2 1 Standby current* 4 — ro CAS-before-RAS refresh current — mA 190 — 170 — 150 mA t RC = min 185 — 165 — 145 mA t HPC = min 400 — 400 — 400 µA CMOS interface Dout = High-Z CBR refresh: tRC = 125 µs t RAS ≤ 0.3 µs 250 — 250 — I CC10 — Self refresh mode current (L-version) I CC11 — Input leakage current I LI –10 10 –10 10 –10 10 µA 0 V ≤ Vin ≤ 4.6 V Output leakage current I LO –10 10 –10 10 –10 10 µA 0 V ≤ Vout ≤ 4.6 V Dout = disable Output high voltage VOH 2.4 VCC 2.4 VCC 2.4 VCC V High Iout = –2 mA Output low voltage VOL 0 0.4 0.4 0.4 V 0 250 µA CMOS interface RAS, UCAS, LCAS ≤ 0.2 V Dout = High-Z ct 0 du Battery backup current* (Standby with CBR refresh) (L-version) Low Iout = 2 mA Notes: 1. I CC depends on output load condition when the device is selected. ICC max is specified at the output open condition. 2. Address can be changed once or less while RAS = VIL. 3. Address can be changed once or less while UCAS and LCAS = VIH. 4. VIH ≥ VCC – 0.2 V, 0 V ≤ VIL ≤ 0.2 V. Data Sheet E0153H10 9 EO HM51W16165 Series, HM51W18165 Series Capacitance (Ta = 25°C, VCC = 3.3 V ± 0.3 V) Parameter Symbol Typ Max Unit Notes Input capacitance (Address) CI1 — 5 pF 1 Input capacitance (Clocks) CI2 — 7 pF 1 Output capacitance (Data-in, Data-out) CI/O — 7 pF 1, 2 Notes : 1. Capacitance measured with Boonton Meter or effective capacitance measuring method. 2. RAS, UCAS and LCAS = VIH to disable Dout. ct du ro LP Data Sheet E0153H10 10 EO HM51W16165 Series, HM51W18165 Series AC Characteristics (Ta = 0 to +70°C, VCC = 3.3 V ± 0.3 V, VSS = 0 V)*1, *2, *18, *19, *20 Test Conditions Input rise and fall time: 2 ns Input levels: 0 V, 3.0 V Input timing reference levels: 0.8 V, 2.0 V Output timing reference levels: 0.8 V, 2.0 V Output load: 1 TTL gate + C L (100 pF) (Including scope and jig) LP • • • • • Read, Write, Read-Modify-Write and Refresh Cycles (Common parameters) Parameter HM51W16165/HM51W18165 -5 -6 -7 Min Max Min Max Min Max Unit Random read or write cycle time t RC 84 — 104 — 124 — ns RAS precharge time t RP 30 — 40 — 50 — ns CAS precharge time t CP 8 — 10 — 13 — ns RAS pulse width t RAS 50 10000 60 10000 70 10000 ns 8 10000 10 10000 13 10000 ns 0 — 0 — 0 — ns 8 — 10 — 10 — ns 0 — 0 — 0 — ns 21 8 — 10 — 13 — ns 21 12 37 14 45 14 52 ns 3 12 30 12 35 ns 4 13 — 13 — ns 40 — 45 — ns 23 5 — 5 — ns 22 15 — 18 — ns 5 0 — 0 — ns 6 0 — 0 — ns 6 2 50 2 t CAS Row address setup time t ASR Row address hold time t RAH Column address setup time t ASC Column address hold time t CAH RAS to CAS delay time t RCD RAS to column address delay time t RAD 10 25 RAS hold time t RSH 10 — CAS hold time t CSH 35 — CAS to RAS precharge time t CRP 5 — OE to Din delay time t OED 13 — OE delay time from Din t DZO 0 — CAS delay time from Din t DZC 0 — Transition time (rise and fall) tT 2 50 ct CAS pulse width du ro Symbol 50 ns Notes 7 Data Sheet E0153H10 11 EO HM51W16165 Series, HM51W18165 Series Read Cycle HM51W16165/HM51W18165 -5 -6 -7 Symbol Min Max Min Max Min Max Unit Notes Access time from RAS t RAC — 50 — 60 — 70 ns 8, 9 Access time from CAS t CAC — 13 — 15 — 18 ns 9, 10, 17 Access time from address t AA — 25 — 30 — 35 ns 9, 11, 17 Access time from OE t OEA — 13 — 15 — 18 ns 9 Read command setup time t RCS 0 — 0 — 0 — ns 21 Read command hold time to CAS t RCH 0 — 0 — 0 — ns 12, 22 Read command hold time from RAS t RCHR 50 — 60 — 70 — ns Read command hold time to RAS t RRH 0 — 0 — 0 — ns Column address to RAS lead time t RAL 25 — 30 — 35 — ns Column address to CAS lead time t CAL 15 — 18 — 23 — ns CAS to output in low-Z t CLZ 0 — 0 — 0 — ns Output data hold time t OH 3 — 3 — 3 — ns Output data hold time from OE t OHO Output buffer turn-off time t OFF Output buffer turn-off to OE t OEZ CAS to Din delay time t CDD Output data hold time from RAS t OHR Output buffer turn-off to RAS t OFR Output buffer turn-off to WE ro LP Parameter 12 27 — 3 — 3 — ns — 13 — 15 — 15 ns 13, 27 — 13 — 15 — 15 ns 13 13 — 15 — 18 — ns 5 3 — 3 — 3 — ns 27 — 13 — 15 — 15 ns 27 t WEZ — 13 WE to Din delay time t WED 13 — RAS to Din delay time t RDD 13 — RAS next CAS delay time t RNCD 50 — du 3 — 15 — 15 ns 15 — 18 — ns 15 — 18 — ns 60 — 70 — ns ct Data Sheet E0153H10 12 EO HM51W16165 Series, HM51W18165 Series Write Cycle HM51W16165/HM51W18165 -5 -6 -7 Parameter Symbol Min Max Min Max Min Max Unit Notes Write command setup time t WCS 0 — 0 — 0 — ns 14, 21 Write command hold time t WCH 8 — 10 — 13 — ns 21 Write command pulse width t WP 8 — 10 — 10 — ns LP Write command to RAS lead time t RWL 8 — 10 — 13 — ns Write command to CAS lead time t CWL 8 — 10 — 13 — ns 23 Data-in setup time t DS 0 — 0 — 0 — ns 15, 23 t DH 8 — 10 — 13 — ns 15, 23 Notes Data-in hold time Read-Modify-Write Cycle HM51W16165/HM51W18165 -5 -6 -7 ro Parameter Symbol Min Max Min Max Min Max Unit Read-modify-write cycle time t RWC 111 — 135 — 161 — ns RAS to WE delay time t RWD 67 — 79 — 92 — ns 14 CAS to WE delay time t CWD 30 — 34 — 40 — ns 14 Column address to WE delay time t AWD 42 — 49 — 57 — ns 14 OE hold time from WE t OEH 13 — 15 — 18 — ns du Refresh Cycle HM51W16165/HM51W18165 -5 Parameter Symbol -6 -7 Max Min Max Min Max Unit Notes CAS setup time (CBR refresh cycle) t CSR 5 — 5 — 5 — ns 21 CAS hold time (CBR refresh cycle) t CHR 8 — 10 — 10 — ns 22 RAS precharge to CAS hold time 5 — 5 — 5 — ns 21 t RPC ct Min Data Sheet E0153H10 13 EO HM51W16165 Series, HM51W18165 Series EDO Page Mode Cycle HM51W16165/HM51W18165 -5 -6 -7 Symbol Min Max Min Max Min Max Unit Notes EDO page mode cycle time t HPC 20 — 25 30 ns 25 EDO page mode RAS pulse width t RASP — 100000 — 100000 — 100000 ns 16 Access time from CAS precharge t CPA — 30 — 35 — 40 ns 9, 17, 22 RAS hold time from CAS precharge t CPRH 30 — 35 — 40 — ns Output data hold time from CAS low t DOH 3 — 3 — 3 — ns CAS hold time referred OE t COL 8 — 10 — 13 — ns CAS to OE setup time t COP 5 — 5 — 5 — ns Read command hold time from CAS precharge t RCHC 30 — 35 — 40 — ns LP Parameter — — 9 EDO Page Mode Read-Modify-Write Cycle ro HM51W16165/HM51W18165 -5 Parameter Symbol EDO page mode read-modify-write t HPRWC cycle time WE delay time from CAS precharge t CPW -6 Min Max Min Max Min Max Unit 57 — 68 — 79 — ns 45 — 54 — 62 — ns Parameter Symbol Refresh period t REF Refresh period (L-version) t REF 14, 22 Unit Note 64 ms 4096 cycles 128 ms 4096 cycles Parameter Symbol Max Refresh period t REF 16 Refresh period (L-version) t REF 128 Data Sheet E0153H10 Notes Max ct Refresh (HM51W18165 Series) du Refresh (HM51W16165 Series) 14 -7 Unit Note ms 1024 cycles ms 1024 cycles EO HM51W16165 Series, HM51W18165 Series Self Refresh Mode (L-version) HM51W16165L/HM51W18165L -5 -6 -7 Symbol Min Max Min Max Min Max Unit Notes RAS pulse width (self refresh) t RASS 100 — 100 — 100 — µs 28, 29, 30, 31 RAS precharge time (self refresh) t RPS 90 — 110 — 130 — ns CAS hold time (self refresh) t CHS –50 — –50 — –50 — ns LP Parameter ct du ro Notes: 1. AC measurements assume t T = 2 ns. 2. An initial pause of 200 µs is required after power up followed by a minimum of eight initialization cycles (any combination of cycles containing RAS-only refresh or CAS-before-RAS refresh). 3. Operation with the tRCD (max) limit insures that tRAC (max) can be met, tRCD (max) is specified as a reference point only; if t RCD ≥ tRAD (max) + tAA (max) – tCAC (max), then access time is controlled exclusively by t CAC . 4. Operation with the tRAD (max) limit insures that tRAC (max) can be met, tRAD (max) is specified as a reference point only; if t RAD is greater than the specified tRAD (max) limit, then access time is controlled exclusively by tAA . 5. Either t OED or tCDD must be satisfied. 6. Either t DZO or tDZC must be satisfied. 7. VIH (min) and VIL (max) are reference levels for measuring timing of input signals. Also, transition times are measured between V IH (min) and VIL (max). 8. Assumes that t RCD ≤ tRCD (max) and tRAD ≤ tRAD (max). If tRCD or tRAD is greater than the maximum recommended value shown in this table, t RAC exceeds the value shown. 9. Measured with a load circuit equivalent to 1 TTL loads and 100 pF. 10. Assumes that t RCD ≥ tRCD (max) and tRCD + tCAC (max) ≥ tRAD + tAA (max). 11. Assumes that t RAD ≥ tRAD (max) and tRCD + tCAC (max) ≤ tRAD + tAA (max). 12. Either t RCH or tRRH must be satisfied for a read cycles. 13. t OFF (max) and tOEZ (max) define the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels. 14. t WCS , t RWD, t CWD, t AWD and t CPW are not restrictive operating parameters. They are included in the data sheet as electrical characteristics only; if t WCS ≥ tWCS (min), the cycle is an early write cycle and the data out pin will remain open circuit (high impedance) throughout the entire cycle; if tRWD ≥ tRWD (min), tCWD ≥ tCWD (min), and tAWD ≥ tAWD (min), or tCWD ≥ tCWD (min), tAWD ≥ tAWD (min) and tCPW ≥ t CPW (min), the cycle is a read-modify-write and the data output will contain data read from the selected cell; if neither of the above sets of conditions is satisfied, the condition of the data out (at access time) is indeterminate. 15. These parameters are referred to UCAS and LCAS leading edge in early write cycles and to WE leading edge in delayed write or read-modify-write cycles. 16. t RASP defines RAS pulse width in EDO page mode cycles. 17. Access time is determined by the longest among t AA , t CAC and t CPA. 18. In delayed write or read-modify-write cycles, OE must disable output buffer prior to applying data to the device 19. When both UCAS and LCAS go low at the same time, all 16-bit data are written into the device. UCAS and LCAS cannot be staggered within the same write/read cycles. 20 All the V CC and VSS pins shall be supplied with the same voltages. Data Sheet E0153H10 15 EO HM51W16165 Series, HM51W18165 Series ct du ro LP 21. t ASC, tCAH , t RCS , t WCS , t WCH, t CSR and t RPC are determined by the earlier falling edge of UCAS or LCAS. 22. t CRP , t CHR, t RCH, t CPA and tCPW are determined by the later rising edge of UCAS or LCAS. 23. t CWL, t DH, t DS and t CHS should be satisfied by both UCAS and LCAS. 24. t CP is determined by the time that both UCAS and LCAS are high. 25. t HPC (min) can be achieved during a series of EDO page mode write cycles or EDO page mode read cycles. If both write and read operation are mixed in a EDO page mode RAS cycle (EDO page mode mix cycle (1), (2)), minimum value of CAS cycle (tCAS + tCP + 2 tT) becomes greater than the specified t HPC (min) value.The value of CAS cycle time of mixed EDO page mode is shown in EDO page mode mix cycle (1) and (2). 26. When output buffers are enabled once, sustain the low impedance state until valid data is obtained. When output buffer is turned on and off within a very short time, generally it causes large V CC/V SS line noise, which causes to degrade V IH min/VIL max level. 27. Data output turns off and becomes high impedance from later rising edge of RAS and CAS. Hold time and turn off time are specified by the timing specifications of later rising edge of RAS and CAS between t OHR and t OH , and between t OFR and t OFF. 28. Please do not use tRASS timing, 10 µs ≤ tRASS ≤ 100 µs. During this period, the device is in transition state from normal operation mode to self refresh mode. If t RASS ≥ 100 µs, then RAS precharge time should use tRPS instead of tRP. 29. If you use distributed CBR refresh mode with 15.6 µs interval in normal read/write cycle, CBR refresh should be executed within 15.6 µs immediately after exiting from and before entering into self refresh mode. 30. If you use RAS only refresh or CBR burst refresh mode in normal read/write cycle, 4096 or 1024 cycles (4096 cycles: HM51W16165 Series, 1024 cycles: HM51W18165 Series) of distributed CBR refresh with 15.6 µs interval should be executed within 64 or 16 ms (64 ms: HM51W16165, 16 ms: HM51W18165) immediately after exiting from and before entering into the self refresh mode. 31. Repetitive self refresh mode without refreshing all memory is not allowed. Once you exit from self fresh mode, all memory cells need to be refreshed before re-entering the self refresh mode again. 32. XXX: H or L (H: VIH (min) ≤ VIN ≤ VIH (max), L: VIL (min) ≤ VIN ≤ VIL (max)) ///////: Invalid Dout When the address, clock and input pins are not described on timing waveforms, their pins must be applied VIH or VIL. Data Sheet E0153H10 16 EO HM51W16165 Series, HM51W18165 Series Notes concerning 2CAS control Please do not separate the UCAS/LCAS operation timing intentionally. However skew between UCAS/LCAS are allowed under the following conditions. 1. Each of the UCAS/LCAS should satisfy the timing specifications individually. 2. Different operation mode for upper/lower byte is not allowed; such as following. UCAS LCAS WE LP RAS Delayed write Early write RAS UCAS du LCAS ro 3. Closely separated upper/lower byte control is not allowed. However when the condition (tCP ≤ tUL) is satisfied, EDO page mode can be performed. t UL 4. Byte control operation by remaining UCAS or LCAS high is guaranteed. ct Data Sheet E0153H10 17 EO HM51W16165 Series, HM51W18165 Series Timing Waveforms*32 Read Cycle t RC t RAS t RP RAS LP t CSH t CRP t RCD t RSH t CAS tT UCAS LCAS t RAD t ASR Address t RAH t ASC t RAL t CAL t CAH Column Row ro t RRH t RCHR t RCS WE t DZC t DZO t OEA OE t WED t CDD t RDD du High-Z Din t RCH t OED t AA ct t OEZ t OHO t OFF t CAC t OH t OFR t OHR t RAC t CLZ t WEZ Dout Dout Data Sheet E0153H10 18 EO HM51W16165 Series, HM51W18165 Series Early Write Cycle tRC tRAS tRP RAS tCSH tCRP LP tRCD tRSH tCAS tT UCAS LCAS tASR Address tRAH Row tASC tCAH Column ro tWCS WE tWCH Din Din High-Z* ct Dout tDH du tDS * t WCS t WCS (min) Data Sheet E0153H10 19 EO HM51W16165 Series, HM51W18165 Series Delayed Write Cycle*18 t RC t RAS t RP RAS t CSH t CRP LP t RCD t RSH t CAS tT UCAS LCAS t ASR Address t RAH t ASC Row t CAH Column t CWL ro t RCS WE t DZC t DH du Din t DS t RWL t WP High-Z Din t OEH t OED OE t OEZ t CLZ High-Z Dout Invalid Dout Data Sheet E0153H10 20 ct # t DZO EO HM51W16165 Series, HM51W18165 Series Read-Modify-Write Cycle*18 t RWC t RAS t RP RAS LCAS t RCD LP UCAS tT t CAS t CRP t RAD t ASR Address t RAH t ASC Row WE Column t CWD ro t RCS t CAH tCWL t AWD t RWL t RWD t WP t DZC t DS du High-Z Din t DH Din t OED t DZO t OEH t OEA OE t OEZ t AA t RAC t OHO Dout Dout t CLZ ct t CAC High-Z Data Sheet E0153H10 21 EO HM51W16165 Series, HM51W18165 Series RAS-Only Refresh Cycle t RC t RAS t RP RAS LCAS t CRP LP UCAS tT t ASR Address t RPC t CRP t RAH Row t OFR t OFF Data Sheet E0153H10 22 ct du ! High-Z ro Dout EO HM51W16165 Series, HM51W18165 Series CAS-Before-RAS Refresh Cycle t RC t RP t RAS t RC t RP t RAS t RP RAS tT LP t RPC t CP t CHR t CRP t CSR t CHR ")# UCAS t CSR t RPC t CP LCAS Address t OFR Dout ro t OFF High-Z ct du Data Sheet E0153H10 23 EO HM51W16165 Series, HM51W18165 Series Hidden Refresh Cycle t RC t RAS t RC t RAS t RP t RC t RP t RAS t RP RAS tT t CHR LP t RSH t CRP t RCD UCAS LCAS t RAD t ASR t RAH Address t RAL t ASC Row t CAH Column t RRH t RCH ro t RCS WE t DZC t WED t CDD t RDD t DZO t OEA OE t CAC t AA t CLZ Dout Dout t OED t OFF t OH t OFR t OHR Data Sheet E0153H10 24 t OEZ t WEZ t OHO ct t RAC du High-Z Din EO HM51W16165 Series, HM51W18165 Series EDO Page Mode Read Cycle t RP t RNCD RAS tT t CSH Row t HPC t CPRH t CP t tCAH Column 1 tCAS tCAS t RCHC t ASC t CAH t ASC t CAH Column 2 Column 3 t CAL t CRP RSH t RCH t RCS LP Address tRAH tASC t CP t CAS t RCHR t RCS tASR t HPC t CP t CAS UCAS LCAS WE t HPC t RASP t CAL t RRH t RCH t RAL t CAH tASC t WED Column 4 t CAL t CAL tRDD tCDD tDZC Din High-Z tCOL tCOP tOED ro tDZO OE tCPA tOEA tAA tCAC tCAC tAA tWEZ Dout Dout 1 tAA tOEZ tOEA Dout 2 tDOH du tRAC tOEZ tOHO tOFR tOHR tOEZ tCPA tCPA tAA tCAC Dout 2 tOHO Dout 3 tCAC tOHO tOFF tOH tOEA Dout 4 ct Data Sheet E0153H10 25 EO HM51W16165 Series, HM51W18165 Series EDO Page Mode Read Cycle (2CAS control) t RP t RNCD t RASP RAS tT t CSH t CAS LCAS tHPC t CP t HPC t CP t CRP tRSH t CAS LP UCAS t HPC t CP tCAS t CAS t RCHC t RRH t RCH t RCS WE tASR Address tRAH tASC Row tCAH Column 1 t ASC t CAH t ASC t CAH Column 2 Column 3 t CAL tASC High-Z Column 4 tRDD t CAL tCDD tCOL tCOP tOED OE tOEA tCPA tAA tCAC tCAC tAA tDOH tRAC L Dout tOEZ tOHO du tDZO t WED t CAL ro tDZC Din t CAL t RAL t CAH tOEZ tOEA Dout 1 Dout 2 tCAC Dout 4 Dout 2 tOEA ct Dout 1 Data Sheet E0153H10 26 tAA tOHO tCPA tAA tCAC U Dout tCPA Dout 3 Dout 4 tOFR tOHR tOEZ tOHO tOFF tOH EO HM51W16165 Series, HM51W18165 Series EDO Page Mode Early Write Cycle tRP tRASP RAS tT tCSH LP UCAS LCAS tASR Address tHPC tCAS tRCD Row tRAH tASC tCAH Column 1 tWCH WE Din Dout tDH Din 1 tASC tCAH Column 2 tWCH tWCS tDS tDH tCP tCAS tASC tCRP tCAH Column N tWCS tDS tWCH tDH du tDS tRSH tCAS ro tWCS tCP Din 2 Din N High-Z* ct * t WCS t WCS (min) Data Sheet E0153H10 27 EO HM51W16165 Series, HM51W18165 Series EDO Page Mode Delayed Write Cycle*18 t RASP t RP RAS tT t CP LP t CSH t RCD UCAS LCAS t CRP t CP t HPC t CAS t CAS t RSH t CAS t RAD t ASR t ASC t RAH Address t ASC t CAH Row t ASC t CAH Column 1 t CAH Column 2 t CWL WE t WP t DZC t DS t CWL t RCS t WP t WP t DZC t DS t DZC t DS t DH t DZO t DH Din 2 Din N t DZO # t DZO t DH du Din 1 Din t CWL t RWL t RCS ro t RCS Column N t OED t OEH t OEH OE t CLZ t CLZ t OEZ t OEH t CLZ t OEZ t OEZ ct High-Z Dout Invalid Dout Invalid Dout Data Sheet E0153H10 28 t OED t OED Invalid Dout EO HM51W16165 Series, HM51W18165 Series EDO Page Mode Read-Modify-Write Cycle*18 t RASP t RP RAS tT t HPRWC t RCD UCAS LCAS t RSH t CP LP t CP t CAS t CAS t CRP t CAS t RAD t ASR Address t ASC t RAH Row t ASC t CAH t CAH Column 1 t RWD Column 2 t CWL t WP t CWD t RCS t DZC t DS t DH t OED t DH Din 2 t OED t DZO Din N t OED t DZO t OEH t OEH *# t OEH t DH du t DZO t RWL t WP t DZC t DS Din 1 t CWL t CWD t WP t DZC t DS Din t CPW t AWD ro t RCS t CWL t AWD t RCS WE Column N t CPW t AWD t CWD t ASC t CAH OE t OHO t OEA t CAC t OHO t OEA t CAC t AA t AA t CPA t RAC t AA t CPA t OEZ t CLZ t CLZ ct t OEZ t CLZ t OHO t OEA t CAC t OEZ High-Z Dout Dout 1 Dout 2 Dout N Data Sheet E0153H10 29 EO HM51W16165 Series, HM51W18165 Series EDO Page Mode Mix Cycle (1) t RP t RASP RAS tT t CAS t CAS tCAS tCAS t CSH LP UCAS LCAS t CRP t CP t CP t CP tRSH t RCD t WCS WE t ASC tRAH tASR Address Row t DS Column 1 tCPW tAWD t ASC t CAH tASC t CAH Column 2 Column 3 tASC t RAL t CAH Column 4 t CAL tRDD tCDD t CAL t DH Din 1 tWP t DH t DS High-Z Din 3 tOED tWED OE tCAH t RRH t RCH t RCS t RCS ro Din t WCH tCPA tAA tOEA Dout tAA tAA t OEZ t DOH Dout 2 tCAC t OHO Dout 3 tOEZ tCAC du tCAC tOFR tWEZ tCPA tCPA tOHO tOEA tOFF tOH Dout 4 ct Data Sheet E0153H10 30 EO HM51W16165 Series, HM51W18165 Series EDO Page Mode Mix Cycle (2) t RP t RNCD t RASP RAS tT UCAS LCAS t CSH t CAS t CAS LP t RCD t ASC tRAH tASR Address Row tCAS t RCH tWCS t WCH tCAH Column 1 t ASC t CAH Column 2 Column 3 High-Z t CAH Column 4 t CAL t CAL t DS t DH tRDD tCDD t DH ro Din 3 tOED tCOP tWED tCOL OE tAA tOEA tCAC tOEZ t OHO Dout 1 t OEA tOFR tWEZ tCPA tCPA tAA tCAC tOEZ du tRAC Dout t RAL tASC Din 2 tOED t RRH t RCH tWP tCPW t ASC t CAH t DS tRSH t RCS t RCS t CAL Din tCAS t RCHR t RCS WE t CRP t CP t CP t CP t OHO Dout 3 tAA tCAC tOEZ tOEA tOFF tOH tOHO Dout 4 ct Data Sheet E0153H10 31 EO HM51W16165 Series, HM51W18165 Series Self Refresh Cycle (L-version)* 28, * 29, * 30, * 31 t RASS t RP t RPS RAS tT t CRP t CSR t CHS #$%*+ UCAS LP , t RPC t CP LCAS t OFR t OFF Dout High-Z ct du ro Data Sheet E0153H10 32 EO HM51W16165 Series, HM51W18165 Series Package Dimensions HM51W16165J/LJ Series HM51W18165J/LJ Series (CP-42D) Unit: mm 1.30 Max 0.43 ± 0.10 0.41 ± 0.08 1.27 0.10 Dimension including the plating thickness Base material dimension 11.18 ± 0.13 10.16 ± 0.13 21 2.50 ± 0.12 0.74 0.80 +0.25 –0.17 1 22 3.50 ± 0.26 42 9.40 ± 0.25 Hitachi Code JEDEC EIAJ Weight (reference value) CP-42D Conforms — 1.75 g ct du ro LP 27.06 27.43 Max Data Sheet E0153H10 33 EO HM51W16165 Series, HM51W18165 Series HM51W16165TT/LTT Series HM51W18165TT/LTT Series (TTP-50/44DC) 20.95 21.35 Max 40 36 26 LP 10.16 50 Unit: mm 11 15 25 0.10 Dimension including the plating thickness Base material dimension 0.145 ± 0.05 0.125 ± 0.04 3.20 11.76 ± 0.20 0° – 5° 0.50 ± 0.10 Hitachi Code JEDEC EIAJ Weight (reference value) TTP-50/44DC Conforms — 0.50 g ct du ro 1.20 Max 0.27 ± 0.07 0.13 M 0.25 ± 0.05 1.15 Max 0.80 0.68 0.80 0.13 ± 0.05 1 Data Sheet E0153H10 34 EO HM51W16165 Series, HM51W18165 Series Cautions ct du ro LP 1. Elpida Memory, Inc. neither warrants nor grants licenses of any rights of Elpida Memory, Inc.’s or any third party’s patent, copyright, trademark, or other intellectual property rights for information contained in this document. Elpida Memory, Inc. bears no responsibility for problems that may arise with third party’s rights, including intellectual property rights, in connection with use of the information contained in this document. 2. Products and product specifications may be subject to change without notice. Confirm that you have received the latest product standards or specifications before final design, purchase or use. 3. Elpida Memory, Inc. makes every attempt to ensure that its products are of high quality and reliability. However, contact Elpida Memory, Inc. before using the product in an application that demands especially high quality and reliability or where its failure or malfunction may directly threaten human life or cause risk of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation, traffic, safety equipment or medical equipment for life support. 4. Design your application so that the product is used within the ranges guaranteed by Elpida Memory, Inc. particularly for maximum rating, operating supply voltage range, heat radiation characteristics, installation conditions and other characteristics. Elpida Memory, Inc. bears no responsibility for failure or damage when used beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-safes, so that the equipment incorporating Elpida Memory, Inc. product does not cause bodily injury, fire or other consequential damage due to operation of the Elpida Memory, Inc. product. 5. This product is not designed to be radiation resistant. 6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without written approval from Elpida Memory, Inc.. 7. Contact Elpida Memory, Inc. for any questions regarding this document or Elpida Memory, Inc. semiconductor products. Data Sheet E0153H10 35