LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
D
D
D
D
D
D
D
D
− Max Rating . . . 2 V to 36 V
− Tested to 30 V . . . Non-V Devices
− Tested to 32 V . . . V-Suffix Devices
Low Supply-Current Drain Independent of
Supply Voltage . . . 0.4 mA Typ Per
Comparator
Low Input Bias Current . . . 25 nA Typ
Low Input Offset Current . . . 3 nA Typ
(LM193)
Low Input Offset Voltage . . . 2 mV Typ
Common-Mode Input Voltage Range
Includes Ground
Differential Input Voltage Range Equal to
Maximum-Rated Supply Voltage . . . ±36 V
Low Output Saturation Voltage
Output Compatible With TTL, MOS, and
CMOS
LM193 . . . D OR JG PACKAGE
LM293 . . . D, DGK, OR P PACKAGE
LM293A . . . D OR DGK PACKAGE
LM393, LM393A . . . D, DGK, P, PS, OR PW PACKAGE
LM2903 . . . D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
1OUT
1IN−
1IN+
GND
1
8
2
7
3
6
4
5
VCC
2OUT
2IN−
2IN+
LM193 . . . FK PACKAGE
(TOP VIEW)
NC
1OUT
NC
VCC
NC
D Single Supply or Dual Supplies
D Wide Range of Supply Voltage
NC
1IN−
NC
1IN+
NC
3 2
1 20 19
18
5
17
6
16
7
15
8
14
9 10 11 12 13
NC
2OUT
NC
2IN−
NC
NC
GND
NC
2IN+
NC
description/ordering information
4
These devices consist of two independent voltage
comparators that are designed to operate from a
NC − No internal connection
single power supply over a wide range of voltages.
Operation from dual supplies also is possible as
long as the difference between the two supplies is
2 V to 36 V, and VCC is at least 1.5 V more positive than the input common-mode voltage. Current drain is
independent of the supply voltage. The outputs can be connected to other open-collector outputs to achieve
wired-AND relationships.
The LM193 is characterized for operation from −55°C to 125°C. The LM293 and LM293A are characterized for
operation from −25°C to 85°C. The LM393 and LM393A are characterized for operation from 0°C to 70°C. The
LM2903 is characterized for operation from −40°C to 125°C.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2010, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
1
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
ORDERING INFORMATION{
TA
VIOmax
AT 25°C
MAX VCC
PDIP (P)
30 V
LM393P
Tube of 75
LM393D
Reel of 2500
LM393DR
Reel of 2500
LM393DRG3
Reel of 2000
LM393PSR
Tube of 150
LM393PW
Reel of 2000
LM393PWR
Reel of 2000
LM393PWRG3
MSOP/VSSOP (DGK)
Reel of 2500
LM393DGKR
M9_§
PDIP (P)
Tube of 50
LM393AP
LM393AP
Tube of 75
LM393AD
Reel of 2500
LM393ADR
SOP (PS)
Reel of 2000
LM393APSR
L393A
TSSOP (PW)
Reel of 2000
LM393APWR
L393A
MSOP/VSSOP (DGK)
Reel of 2500
LM393ADGKR
M8_§
PDIP (P)
Tube of 50
LM293P
LM293P
Tube of 75
LM293D
Reel of 2500
LM293DR
Reel of 2500
LM293DRG3
Reel of 2500
LM293DGKR
Tube of 75
LM293AD
Reel of 2500
LM293ADR
MSOP/VSSOP (DGK)
Reel of 2500
LM293ADGKR
MD_§
PDIP (P)
Tube of 50
LM2903P
LM2903P
Tube of 75
LM2903D
Reel of 2500
LM2903DR
Reel of 2500
LM2903DRG3
Reel of 2000
LM2903PSR
Reel of 2000
LM2903PWR
Reel of 2000
LM2903PWRG3
MSOP/VSSOP (DGK)
Reel of 2500
LM2903DGKR
MA_§
SOIC (D)
Reel of 2500
LM2903VQDR
L2903V
TSSOP (PW)
Reel of 2000
LM2903VQPWR
L2903V
SOIC (D)
Reel of 2500
LM2903AVQDR
L2903AV
TSSOP (PW)
Reel of 2000
LM2903AVQPWR
L2903AV
CDIP (JG)
Tube of 50
LM193JG
LM193JG
LCCC (FK)
Tube of 55
LM193FK
LM193FK
SOIC (D)
Reel of 2500
LM193DR
LM193
SOP (PS)
TSSOP (PW)
0°C
70°C
0
C to 70
C
SOIC (D)
2 mV
5 mV
30 V
30 V
−25°C
25°C to 85°C
SOIC (D)
MSOP/VSSOP (DGK)
2 mV
30 V
SOIC (D)
SOIC (D)
7 mV
V
30 V
−55°C to 125°C
SOP (PS)
TSSOP (PW)
−40°C
40°C to 125°C
7 mV
32 V
2 mV
32 V
5 mV
30 V
TOP-SIDE
MARKING
Tube of 50
SOIC (D)
5 mV
ORDERABLE
PART NUMBER
PACKAGE}
†
LM393P
LM393
L393
L393
LM393A
LM293
MC_§
LM293A
LM2903
L2903
L2903
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web
site at www.ti.com.
‡ Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
§ The actual top-side marking has one additional character that designates the wafer fab/assembly site.
2
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
symbol (each comparator)
IN+
OUT
IN−
schematic (each comparator)
VCC
80-µA
Current Regulator
10 µA
60 µA
10 µA
IN+
80 µA
COMPONENT COUNT
OUT
Epi-FET
Diodes
Resistors
Transistors
1
2
2
30
IN−
GND
Current values shown are nominal.
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)†
Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Differential input voltage, VID (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±36 V
Input voltage range, VI (either input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 36 V
Output voltage, VO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 V
Output current, IO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
Duration of output short-circuit to ground (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Unlimited
Package thermal impedance, θJA (see Notes 4 and 5): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
DGK package . . . . . . . . . . . . . . . . . . . . . . . . 172°C/W
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 95°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Package thermal impedance, θJC (see Notes 6 and 7): FK package . . . . . . . . . . . . . . . . . . . . . . . . . 5.61°C/W
JG package . . . . . . . . . . . . . . . . . . . . . . . . . 14.5°C/W
Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
Case temperature for 60 seconds: FK package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds: JG package . . . . . . . . . . . . . . . . . . . . 300°C
Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to GND.
2. Differential voltages are at IN+, with respect to IN−.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) − TC)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
7. The package thermal impedance is calculated in accordance with MIL-STD-883.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
3
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
MIN
VCC = 5 V to 30 V,
VO = 1.4
1 4 V,
V
VIC = VIC(min)
VIO
Input offset voltage
IIO
Input offset current
VO = 1.4
14V
IIB
Input bias current
14V
VO = 1.4
VICR
Common
mode
Common-mode
input voltage range‡
LM293
LM393
LM193
TA†
TEST CONDITIONS
25°C
TYP
MAX
2
5
MIN
UNIT
TYP
MAX
2
5
mV
Full range
9
25°C
3
Full range
25°C
Full range
AVD
Large-signal
differential-voltage
amplification
VCC = 15 V,
VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
High level
High-level
output current
VOH = 5 V,
VID = 1 V
25°C
IOH
VOH = 30 V,
VID = 1 V
Full range
VOL
Low level
Low-level
output voltage
IOL = 4 mA,
mA
VID = −1
1V
IOL
Low-level
output current
VOL = 1.5 V,
VID = −1 V
25°C
ICC
Supply current
RL = ∞
VCC = 5 V
25°C
VCC = 30 V
Full range
25°C
25
5
100
−25
Full range
25°C
9
−100
−25
−300
0 to
VCC − 1.5
0 to
VCC − 2
0 to
VCC − 2
200
50
0.1
25°C
150
200
0.1
400
150
700
6
†
V/mV
50
nA
1
µA
400
700
6
0.8
1
2.5
nA
V
1
Full range
nA
−250
−400
0 to
VCC − 1.5
50
50
250
mV
mA
0.8
1
2.5
mA
Full range (MIN or MAX) for LM193 is −55°C to 125°C, for LM293 is 25°C to 85°C, and for LM393 is 0°C to 70°C. All characteristics are measured
with zero common-mode input voltage, unless otherwise specified.
‡ The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is VCC+ − 1.5 V for the inverting input (−), and the non-inverting input (+) can exceed the VCC level; the comparator provides a proper output
state. Either or both inputs can go to 30 V without damage.
4
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
LM293A
LM393A
TA†
MIN
VIO
Input offset voltage
VCC = 5 V to 30 V, VO = 1.4 V,
VIC = VIC(min)
IIO
Input offset current
VO = 1.4
14V
IIB
Input bias current
VO = 1.4
14V
VICR
Common mode input voltage
Common-mode
range§
25°C
IOH
High level output current
High-level
VOL
IOL
Full range
−25
Full range
Full range
VCC = 15 V, VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
25°C
VOH = 5 V,
VID = 1 V
25°C
VOH = 30 V,
VID = 1 V
Full range
Low level output voltage
Low-level
IOL = 4 mA,
mA
1V
VID = −1
Low-level output current
VOL = 1.5 V,
VID = −1 V
25°C
VCC = 5 V
25°C
VCC = 30 V
Full range
Supply current
RL = ∞
nA
−250
−400
0 to
VCC − 1.5
nA
V
0 to
VCC − 2
50
mV
50
150
200
0.1
25°C
ICC
2
5
25°C
Large-signal differential-voltage
amplification
1
4
25°C
AVD
MAX
Full range
25°C
UNIT
TYP
150
V/mV
50
nA
1
µA
400
700
Full range
6
mV
mA
0.8
1
2.5
mA
†
Full range (MIN or MAX) for LM293A is 25°C to 85°C, and for LM393A is 0°C to 70°C. All characteristics are measured with zero common-mode
input voltage, unless otherwise specified.
§ The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is VCC+ − 1.5 V, but either or both inputs can go to 30 V without damage.
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
5
LM193, LM293, LM293A
LM393, LM393A, LM2903, LM2903V
DUAL DIFFERENTIAL COMPARATORS
SLCS005W − JUNE 1976 − REVISED JULY 2010
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TA†
TEST CONDITIONS
VCC = 5 V to MAX‡,
VO = 1.4
1 4 V,
V
VIC = VIC(min)
VIO
Input offset voltage
IIO
Input offset current
VO = 1.4
14V
IIB
Input bias current
VO = 1.4
14V
VICR
Common mode
Common-mode
input voltage range§
LM2903
MIN
25°C
LM2903A
TYP
MAX
2
7
MIN
TYP
MAX
1
2
UNIT
mV
Full range
15
25°C
5
Full range
25°C
5
−25
−250
−25
−500
0 to
VCC − 1.5
Full range
0 to
VCC − 2
0 to
VCC − 2
VCC = 15 V,
VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
25°C
High-level
High
level
output current
VOH = 5 V,
25°C
IOH
VOL
Low level
Low-level
output voltage
IOL = 4 mA,
mA
VID = −1
1V
IOL
Low-level
output current
VOL = 1.5 V,
VID = −1 V
ICC
Supply current
RL = ∞
VID = 1 V
25
100
0.1
50
150
400
Full range
VCC = 5 V
100
V/mV
0.1
50
nA
1
µA
150
400
700
Full range
6
25°C
Full range
700
6
0.8
1
nA
V
1
25°C
25°C
25
nA
−250
−500
0 to
VCC − 1.5
Large-signal
differential-voltage
amplification
50
200
25°C
AVD
VCC = MAX
50
200
Full range
VOH = VCC MAX, VID = 1 V
4
mV
mA
0.8
2.5
1
2.5
mA
†
Full range (MIN or MAX) for LM2903 is −40°C to 125°C. All characteristics are measured with zero common-mode input voltage, unless otherwise
specified.
‡V
CC MAX = 30 V for non-V devices and 32 V for V-suffix devices.
§ The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-mode voltage
range is VCC+ − 1.5 V, but either or both inputs can go to 30 V (32 V for V-suffix devices) without damage.
switching characteristics, VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
LM193
LM293, LM293A
LM393, LM393A
LM2903
UNIT
TYP
Response time
RL connected to 5 V through 5.1 kΩ,
CL = 15 pF¶, See Note 8
100-mV input step with 5-mV overdrive
1.3
TTL-level input step
0.3
¶ C includes probe and jig capacitance.
L
NOTE 8: The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
6
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
µs
PACKAGE OPTION ADDENDUM
11-Apr-2013
www.ti.com
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
5962-9452601Q2A
ACTIVE
LCCC
FK
20
1
TBD
Call TI
Call TI
-55 to 125
59629452601Q2A
LM193FKB
5962-9452601QPA
ACTIVE
CDIP
JG
8
1
TBD
Call TI
Call TI
-55 to 125
9452601QPA
LM193
JM38510/11202BPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/11202BPA
LM193DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
LM193
LM193DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
LM193
LM193FKB
ACTIVE
LCCC
FK
20
1
TBD
POST-PLATE
N / A for Pkg Type
-55 to 125
59629452601Q2A
LM193FKB
LM193JG
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
LM193JG
LM193JGB
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
9452601QPA
LM193
LM2903AVQDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903AV
LM2903AVQDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903AV
LM2903AVQPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903AV
LM2903AVQPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903AV
LM2903D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2903
LM2903DE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2903
LM2903DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2903
LM2903DGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(MAP ~ MAS ~ MAU)
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
11-Apr-2013
www.ti.com
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM2903DGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
(MAP ~ MAS ~ MAU)
LM2903DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU SN
Level-1-260C-UNLIM
-40 to 125
LM2903
LM2903DRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2903
LM2903DRG3
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
LM2903
LM2903DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
LM2903
LM2903P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
LM2903P
LM2903PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-40 to 125
LM2903P
LM2903PSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903
LM2903PSRG4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903
LM2903PWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
-40 to 125
LM2903PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903
LM2903PWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903
LM2903PWRG3
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-40 to 125
L2903
LM2903PWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903
LM2903QD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
2903Q
LM2903QDG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
2903Q
LM2903QDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
2903Q
LM2903QDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
2903Q
LM2903QP
OBSOLETE
PDIP
P
8
TBD
Call TI
Call TI
-40 to 125
Addendum-Page 2
Samples
PACKAGE OPTION ADDENDUM
11-Apr-2013
www.ti.com
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM2903VQDR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903V
LM2903VQDRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903V
LM2903VQPWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903V
LM2903VQPWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-40 to 125
L2903V
LM293AD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293A
LM293ADE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293A
LM293ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293A
LM293ADGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
(MDP ~ MDS ~ MDU)
LM293ADGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
(MDP ~ MDS ~ MDU)
LM293ADR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293A
LM293ADRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293A
LM293ADRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293A
LM293D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293
LM293DE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293
LM293DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293
LM293DGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
(MCP ~ MCS ~ MCU)
LM293DGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
(MCP ~ MCS ~ MCU)
LM293DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293
Addendum-Page 3
Samples
PACKAGE OPTION ADDENDUM
11-Apr-2013
www.ti.com
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM293DRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293
LM293DRG3
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
-25 to 85
LM293
LM293DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-25 to 85
LM293
LM293P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-25 to 85
LM293P
LM293PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-25 to 85
LM293P
LM393AD
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393A
LM393ADE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393A
LM393ADG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393A
LM393ADGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
(M8P ~ M8S ~ M8U)
LM393ADGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
(M8P ~ M8S ~ M8U)
LM393ADR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393A
LM393ADRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393A
LM393ADRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393A
LM393AP
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM393AP
LM393APE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM393AP
LM393APSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393A
LM393APSRE4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393A
LM393APSRG4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393A
Addendum-Page 4
Samples
PACKAGE OPTION ADDENDUM
11-Apr-2013
www.ti.com
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM393APWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
0 to 70
LM393APWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393A
LM393APWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393A
LM393APWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393A
LM393D
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393
LM393DE4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393
LM393DG4
ACTIVE
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393
LM393DGKR
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
(M9P ~ M9S ~ M9U)
LM393DGKRG4
ACTIVE
VSSOP
DGK
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
(M9P ~ M9S ~ M9U)
LM393DR
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393
LM393DRE4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393
LM393DRG3
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
LM393
LM393DRG4
ACTIVE
SOIC
D
8
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
LM393
LM393P
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM393P
LM393PE3
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU SN
N / A for Pkg Type
0 to 70
LM393P
LM393PE4
ACTIVE
PDIP
P
8
50
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
0 to 70
LM393P
LM393PSLE
OBSOLETE
SO
PS
8
TBD
Call TI
Call TI
0 to 70
LM393PSR
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393
LM393PSRG4
ACTIVE
SO
PS
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393
Addendum-Page 5
Samples
PACKAGE OPTION ADDENDUM
11-Apr-2013
www.ti.com
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
(2)
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
(3)
(4)
LM393PW
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393
LM393PWE4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393
LM393PWG4
ACTIVE
TSSOP
PW
8
150
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393
LM393PWLE
OBSOLETE
TSSOP
PW
8
TBD
Call TI
Call TI
0 to 70
LM393PWR
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393
LM393PWRE4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393
LM393PWRG3
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU SN
Level-1-260C-UNLIM
0 to 70
L393
LM393PWRG4
ACTIVE
TSSOP
PW
8
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
0 to 70
L393
M38510/11202BPA
ACTIVE
CDIP
JG
8
1
TBD
A42
N / A for Pkg Type
-55 to 125
JM38510
/11202BPA
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 6
Samples
PACKAGE OPTION ADDENDUM
11-Apr-2013
www.ti.com
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM2903, LM293 :
• Automotive: LM2903-Q1
• Enhanced Product: LM293-EP
NOTE: Qualified Version Definitions:
• Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
• Enhanced Product - Supports Defense, Aerospace and Medical Applications
Addendum-Page 7
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM193DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2903DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
LM2903PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM2903PWRG3
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM2903QDR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903QDRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903VQPWRG4
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM293ADGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM293ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM293DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393ADGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM393ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393APSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
LM393APWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM393DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM393DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
LM393PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM393PWRG3
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Mar-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM193DR
SOIC
D
8
2500
367.0
367.0
35.0
LM2903DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM2903DR
SOIC
D
8
2500
367.0
367.0
35.0
LM2903DR
SOIC
D
8
2500
340.5
338.1
20.6
LM2903DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM2903DRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM2903PSR
SO
PS
8
2000
367.0
367.0
38.0
LM2903PWR
TSSOP
PW
8
2000
364.0
364.0
27.0
LM2903PWRG3
TSSOP
PW
8
2000
364.0
364.0
27.0
LM2903QDR
SOIC
D
8
2500
367.0
367.0
35.0
LM2903QDRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM2903VQPWRG4
TSSOP
PW
8
2000
367.0
367.0
35.0
LM293ADGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM293ADR
SOIC
D
8
2500
340.5
338.1
20.6
LM293ADR
SOIC
D
8
2500
367.0
367.0
35.0
LM293ADRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM293ADRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM293DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM293DR
SOIC
D
8
2500
340.5
338.1
20.6
LM293DR
SOIC
D
8
2500
367.0
367.0
35.0
LM293DRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM293DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM393ADGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM393ADR
SOIC
D
8
2500
340.5
338.1
20.6
LM393ADR
SOIC
D
8
2500
367.0
367.0
35.0
LM393ADRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM393ADRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM393APSR
SO
PS
8
2000
367.0
367.0
38.0
LM393APWR
TSSOP
PW
8
2000
364.0
364.0
27.0
LM393DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM393DR
SOIC
D
8
2500
340.5
338.1
20.6
LM393DR
SOIC
D
8
2500
367.0
367.0
35.0
LM393DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM393DRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM393PSR
SO
PS
8
2000
367.0
367.0
38.0
LM393PWR
TSSOP
PW
8
2000
364.0
364.0
27.0
LM393PWRG3
TSSOP
PW
8
2000
364.0
364.0
27.0
Pack Materials-Page 3
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8)
CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8
5
0.280 (7,11)
0.245 (6,22)
1
0.063 (1,60)
0.015 (0,38)
4
0.065 (1,65)
0.045 (1,14)
0.310 (7,87)
0.290 (7,37)
0.020 (0,51) MIN
0.200 (5,08) MAX
Seating Plane
0.130 (3,30) MIN
0.023 (0,58)
0.015 (0,38)
0°–15°
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
4040107/C 08/96
NOTES: A.
B.
C.
D.
E.
All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303
• DALLAS, TEXAS 75265
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Oct-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM193DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM2903DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903DRG3
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LM2903DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
LM2903PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM2903PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM2903PWRG3
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM2903QDRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM2903VQPWRG4
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM293ADGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM293ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Oct-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
B0
(mm)
K0
(mm)
P1
(mm)
W
Pin1
(mm) Quadrant
LM293DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM293DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293DR
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LM293DRG3
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LM293DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM293DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393ADGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM393ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393ADR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393ADRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393APSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
LM393APWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM393DGKR
VSSOP
DGK
8
2500
330.0
12.4
5.3
3.4
1.4
8.0
12.0
Q1
LM393DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393DR
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393DRG3
SOIC
D
8
2500
330.0
12.8
6.4
5.2
2.1
8.0
12.0
Q1
LM393DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393DRG4
SOIC
D
8
2500
330.0
12.4
6.4
5.2
2.1
8.0
12.0
Q1
LM393PSR
SO
PS
8
2000
330.0
16.4
8.2
6.6
2.5
12.0
16.0
Q1
LM393PWR
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
LM393PWRG3
TSSOP
PW
8
2000
330.0
12.4
7.0
3.6
1.6
8.0
12.0
Q1
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Oct-2013
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM193DR
SOIC
D
8
2500
367.0
367.0
35.0
LM2903DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM2903DR
SOIC
D
8
2500
340.5
338.1
20.6
LM2903DR
SOIC
D
8
2500
367.0
367.0
35.0
LM2903DRG3
SOIC
D
8
2500
364.0
364.0
27.0
LM2903DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM2903DRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM2903PSR
SO
PS
8
2000
367.0
367.0
38.0
LM2903PWR
TSSOP
PW
8
2000
364.0
364.0
27.0
LM2903PWR
TSSOP
PW
8
2000
367.0
367.0
35.0
LM2903PWRG3
TSSOP
PW
8
2000
364.0
364.0
27.0
LM2903QDRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM2903VQPWRG4
TSSOP
PW
8
2000
367.0
367.0
35.0
LM293ADGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM293ADR
SOIC
D
8
2500
367.0
367.0
35.0
LM293ADR
SOIC
D
8
2500
340.5
338.1
20.6
LM293ADRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM293ADRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM293DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM293DR
SOIC
D
8
2500
340.5
338.1
20.6
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
23-Oct-2013
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
LM293DR
SOIC
D
8
2500
367.0
367.0
35.0
LM293DR
SOIC
D
8
2500
364.0
364.0
27.0
LM293DRG3
SOIC
D
8
2500
364.0
364.0
27.0
LM293DRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM293DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM393ADGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM393ADR
SOIC
D
8
2500
367.0
367.0
35.0
LM393ADR
SOIC
D
8
2500
340.5
338.1
20.6
LM393ADRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM393ADRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM393APSR
SO
PS
8
2000
367.0
367.0
38.0
LM393APWR
TSSOP
PW
8
2000
364.0
364.0
27.0
LM393DGKR
VSSOP
DGK
8
2500
364.0
364.0
27.0
LM393DR
SOIC
D
8
2500
340.5
338.1
20.6
LM393DR
SOIC
D
8
2500
367.0
367.0
35.0
LM393DRG3
SOIC
D
8
2500
364.0
364.0
27.0
LM393DRG4
SOIC
D
8
2500
340.5
338.1
20.6
LM393DRG4
SOIC
D
8
2500
367.0
367.0
35.0
LM393PSR
SO
PS
8
2000
367.0
367.0
38.0
LM393PWR
TSSOP
PW
8
2000
364.0
364.0
27.0
LM393PWRG3
TSSOP
PW
8
2000
364.0
364.0
27.0
Pack Materials-Page 4
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