± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 D ESD Protection for RS-232 I/O Pins D D D D D D DB OR DW PACKAGE (TOP VIEW) − ±15 kV − Human-Body Model Meets or Exceeds the Requirements of TIA/EIA-232-F and ITU v.28 Standards Operates at 5-V VCC Supply Operates Up To 120 kbit/s External Capacitors . . . 4 × 0.1 µF Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II Applications − Battery-Powered Systems, PDAs, Notebooks, Laptops, Palmtop PCs, and Hand-Held Equipment DOUT3 DOUT1 DOUT2 RIN1 ROUT1 DIN2 DIN1 GND VCC C1+ V+ C1− 1 24 2 23 3 22 4 21 5 20 6 19 7 18 8 17 9 16 10 15 11 14 12 13 DOUT4 RIN2 ROUT2 DIN5 DOUT5 DIN4 DIN3 ROUT3 RIN3 V− C2− C2+ description/ordering information The MAX207 consists of five line drivers, three line receivers, and a dual charge-pump circuit with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/µs driver output slew rate. ORDERING INFORMATION PACKAGE† TA 0°C 0 C to 70 70°C C SOIC (DW) SSOP (DB) −40°C −40 C to 85 85°C C SOIC (DW) ORDERABLE PART NUMBER Tube of 25 MAX207CDW Reel of 2000 MAX207CDWR Reel of 2000 MAX207CDBR Tube of 25 MAX207IDW Reel of 2000 MAX207IDWR TOP-SIDE MARKING MAX207C MA207C MAX207I SSOP (DB) Reel of 2000 MAX207IDBR MB207I † Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 2004, Texas Instruments Incorporated !"#$ % &'!!($ #% )'*+&#$ ,#$(!,'&$% &!" $ %)(&&#$% )(! $.( $(!"% (/#% %$!'"($% %$#,#!, 0#!!#$1- !,'&$ )!&(%%2 ,(% $ (&(%%#!+1 &+',( $(%$2 #++ )#!#"($(!%- POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 1 ± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 Function Tables EACH DRIVER INPUT DIN OUTPUT DOUT L H H L H = high level, L = low level EACH RECEIVER INPUT RIN OUTPUT ROUT L H H L Open H H = high level, L = low level, Open = input disconnected or connected driver off logic diagram (positive logic) 7 2 DIN1 DOUT1 6 3 DIN2 TTL/CMOS Inputs DOUT2 18 1 DIN3 DOUT3 19 24 DIN4 DOUT4 21 20 DIN5 DOUT5 5 4 ROUT1 TTL/CMOS Outputs RIN1 22 23 ROUT2 RIN2 17 ROUT3 2 RS-232 Outputs POST OFFICE BOX 655303 16 RIN3 • DALLAS, TEXAS 75265 RS-232 Inputs ± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 absolute maximum ratings over operating free-air temperature range (unless otherwise noted)† Supply voltage range, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V Positive charge pump voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . VCC − 0.3 V to 14 V Negative charge pump voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −14 V to 0.3 V Input voltage range, VI: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V+ + 0.3 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±30 V Output voltage range, VO: Drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V− − 0.3 V to V+ + 0.3 V Receivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to VCC + 0.3 V Short-circuit duration: DOUT . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Continuous Package thermal impedance, θJA (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W Operating virtual junction temperature, TJ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C † Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. All voltages are with respect to network GND. 2. Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient temperature is PD = (TJ(max) − TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability. 3. The package thermal impedance is calculated in accordance with JESD 51-7. recommended operating conditions (see Note 4 and Figure 4) Supply voltage VIH VIL Driver high-level input voltage DIN Driver low-level input voltage DIN Driver input voltage DIN VI Receiver input voltage TA Operating free-air temperature MAX207C MAX207I MIN NOM MAX 4.5 5 5.5 2 UNIT V V 0.8 0 5.5 −30 30 0 70 −40 85 V V °C NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. electrical characteristics over recommended ranges of supply voltage (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER ICC Supply current TEST CONDITIONS No load, VCC = 5 V, TA = 25°C MIN TYP MAX 11 20 UNIT mA NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 3 ± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 DRIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER TEST CONDITIONS MIN TYP† VOH VOL High-level output voltage DOUT at RL = 3 kΩ to GND, DIN = GND 5 9 Low-level output voltage DOUT at RL = 3 kΩ to GND, DIN = VCC −5 −9 IIH IIL High-level input current Low-level input current VI = VCC VI at 0 V IOS‡ Short-circuit output current VCC = 5.5 V, VO = 0 V MAX UNIT V V µA 15 200 −15 −200 µA ±10 ±60 mA ro Output resistance VCC, V+, and V− = 0 V, VO = ±2 V 300 W † All typical values are at VCC = 5 V, and TA = 25°C. ‡ Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output should be shorted at a time. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER TEST CONDITIONS MIN TYP† MAX UNIT Maximum data rate CL = 50 to 1000 pF, One DOUT switching, RL = 3 kΩ to 7 kΩ, See Figure 1 tPLH (D) Propagation delay time, low- to high-level output CL = 2500 pF, all drivers loaded, RL = 3 kΩ, See Figure 1 2 µs tPHL (D) Propagation delay time, high- to low-level output CL = 2500 pF, all drivers loaded, RL = 3 kΩ, See Figure 1 2 µs tsk(p) Pulse skew§ CL = 150 pF to 2500 pF, RL = 3 kΩ to 7 kΩ, See Figure 2 300 ns SR(tr) Slew rate, transition region (see Figure 1) CL = 50 pF to 1000 pF VCC = 5 V RL = 3 kΩ to 7 kΩ, 120 3 kbit/s 6 30 V/µs TYP UNIT ±15 kV † All typical values are at VCC = 5 V, and TA = 25°C. § Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. ESD protection PIN DOUT, RIN 4 TEST CONDITIONS Human-Body Model POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 RECEIVER SECTION electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 4) PARAMETER TEST CONDITIONS VOH VOL High-level output voltage VIT+ VIT− Positive-going input threshold voltage Vhys ri Input hysteresis (VIT+ − VIT−) MIN TYP† 3.5 VCC−0.4 V IOH = −1 mA IOL = 1.6 mA Low-level output voltage VCC = 5 V, VCC = 5 V, Negative-going input threshold voltage TA = 25°C TA = 25°C VI = ±3 V to ±25 V Input resistance MAX UNIT V 1.7 0.4 V 2.4 V 0.8 1.2 0.2 0.5 1 V V 3 5 7 kW † All typical values are at VCC = 5 V, and TA = 25°C. NOTE 4: Test conditions are C1−C4 = 0.1 µF at VCC = 5 V ± 0.5 V. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Note 4 and Figure 3) PARAMETER TEST CONDITIONS tPLH tPHL Propagation delay time, low- to high-level output tsk(p) Pulse skew‡ CL= 150 pF Propagation delay time, high- to low-level output MIN TYP† MAX 0.5 10 µs 0.5 10 µs 300 UNIT ns † All typical values are at VCC = 5 V, and TA = 25°C. ‡ Pulse skew is defined as |tPLH − tPHL| of each channel of the same device. NOTE 4: Test conditions are C1−C4 = 0.1 µF, at VCC = 5 V ± 0.5 V. PARAMETER MEASUREMENT INFORMATION 3V Input Generator (see Note B) 1.5 V RS-232 Output 50 Ω RL 1.5 V 0V tPHL (D) CL (see Note A) Output tPLH (D) 3V −3 V TEST CIRCUIT SR(tr) + t PHL (D) 6V or t 3V −3 V VOH VOL VOLTAGE WAVEFORMS PLH (D) NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 1. Driver Slew Rate POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 5 ± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 PARAMETER MEASUREMENT INFORMATION 3V Generator (see Note B) RS-232 Output 50 Ω RL 1.5 V Input 1.5 V 0V CL (see Note A) tPHL (D) tPLH (D) VOH 50% 50% Output VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 2. Driver Pulse Skew Input 3V 1.5 V 1.5 V −3 V Output Generator (see Note B) 50 Ω CL (see Note A) tPHL (R) tPLH (R) VOH 50% Output 50% VOL TEST CIRCUIT VOLTAGE WAVEFORMS NOTES: A. CL includes probe and jig capacitance. B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns. Figure 3. Receiver Propagation Delay Times 6 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 APPLICATION INFORMATION DOUT3 DOUT1 1 24 2 23 DOUT4 RIN2 5 kΩ 22 3 DOUT2 4 RIN1 ROUT2 5V 5 kΩ 400 kΩ 21 5 ROUT1 20 5V 400 kΩ 400 kΩ 19 5V GND 400 kΩ 7 18 8 17 + CBYPASS − = 0.1µF DIN4 5V 400 kΩ DIN1 DOUT5 5V 6 DIN2 DIN5 16 DIN3 ROUT3 RIN3 C4 = 0.1 µF 16 V 5 kΩ 9 C3 † = 0.1 µF 6.3 V VCC V− − + 10 11 C1 = 0.1 µF 6.3 V C1+ C2− 15 − 14 V+ − + + − 12 C2+ C1− + 13 C2 = 0.1 µF 16 V † C3 can be connected to VCC or GND. NOTES: A. Resistor values shown are nominal. B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should be connected as shown. Figure 4. Typical Operating Circuit and Capacitor Values POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 7 ± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 APPLICATION INFORMATION capacitor selection The capacitor type used for C1−C4 is not critical for proper operation. The MAX207 requires 0.1-µF capacitors, although capacitors up to 10 µF can be used without harm. Ceramic dielectrics are suggested for the 0.1-µF capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×) nominal value. The capacitors’ effective series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+ and V−. Use larger capacitors (up to 10 µF) to reduce the output impedance at V+ and V−. Bypass VCC to ground with at least 0.1 µF. In applications sensitive to power-supply noise generated by the charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump capacitors (C1−C4). ESD protection TI MAX207 devices have standard ESD protection structures incorporated on the pins to protect against electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures were designed to successfully protect these bus pins against ESD discharge of ±15-kV when powered down. ESD test conditions ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a reliability report that documents test setup, methodology, and results. Human-Body Model The Human-Body Model (HBM) of ESD testing is shown in Figure 5, while Figure 6 shows the current waveform that is generated during a discharge into a low impedance. The model consists of a 100-pF capacitor, charged to the ESD voltage of concern, and subsequently discharged into the device under test (DUT) through a 1.5-kΩ resistor. RD 1.5 kΩ VHBM + − CS 100 pF DUT Figure 5. HBM ESD Test Circuit 8 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 ± SLLS592B − OCTOBER 2003 − REVISED JANUARY 2004 APPLICATION INFORMATION 1.5 VHBM = 2 kV DUT = 10-V, 1-Ω Zener Diode I DUT − A 1.0 0.5 0.0 0 50 100 150 200 Time − ns Figure 6. Typical HBM Current Waveform Machine Model The Machine Model (MM) ESD test applies to all pins using a 200-pF capacitor with no discharge resistance. The purpose of the MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC board assembly, the MM test no longer is as pertinent to the RS-232 pins. POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 9 PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) MAX207CDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MA207C MAX207CDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MA207C MAX207CDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX207C MAX207CDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 MAX207C MAX207IDB ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB207I MAX207IDBG4 ACTIVE SSOP DB 24 60 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB207I MAX207IDBR ACTIVE SSOP DB 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MB207I MAX207IDW ACTIVE SOIC DW 24 25 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX207I MAX207IDWR ACTIVE SOIC DW 24 2000 Green (RoHS & no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 85 MAX207I (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 10-Jun-2014 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device MAX207CDBR Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 MAX207CDWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 MAX207IDBR SSOP DB 24 2000 330.0 16.4 8.2 8.8 2.5 12.0 16.0 Q1 MAX207IDWR SOIC DW 24 2000 330.0 24.4 10.75 15.7 2.7 12.0 24.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Mar-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) MAX207CDBR SSOP DB 24 2000 367.0 367.0 38.0 MAX207CDWR SOIC DW 24 2000 367.0 367.0 45.0 MAX207IDBR SSOP DB 24 2000 367.0 367.0 38.0 MAX207IDWR SOIC DW 24 2000 367.0 367.0 45.0 Pack Materials-Page 2 MECHANICAL DATA MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001 DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE 28 PINS SHOWN 0,38 0,22 0,65 28 0,15 M 15 0,25 0,09 8,20 7,40 5,60 5,00 Gage Plane 1 14 0,25 A 0°–ā8° 0,95 0,55 Seating Plane 2,00 MAX 0,10 0,05 MIN PINS ** 14 16 20 24 28 30 38 A MAX 6,50 6,50 7,50 8,50 10,50 10,50 12,90 A MIN 5,90 5,90 6,90 7,90 9,90 9,90 12,30 DIM 4040065 /E 12/01 NOTES: A. B. C. D. All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion not to exceed 0,15. Falls within JEDEC MO-150 POST OFFICE BOX 655303 • DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment. 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