Micrel MIC4420BM 6a-peak low-side mosfet driver Datasheet

MIC4420/4429
Micrel, Inc.
MIC4420/4429
6A-Peak Low-Side MOSFET Driver
Bipolar/CMOS/DMOS Process
General Description
Features
MIC4420, MIC4429 and MIC429 MOSFET drivers are
tough, efficient, and easy to use. The MIC4429 and MIC429
are inverting drivers, while the MIC4420 is a non-inverting
driver.
• CMOS Construction
• Latch-Up Protected: Will Withstand >500mA
Reverse Output Current
• Logic Input Withstands Negative Swing of Up to 5V
• Matched Rise and Fall Times ................................ 25ns
• High Peak Output Current ............................... 6A Peak
• Wide Operating Range ............................... 4.5V to 18V
• High Capacitive Load Drive ............................10,000pF
• Low Delay Time .............................................. 55ns Typ
• Logic High Input for Any Voltage From 2.4V to VS
• Low Equivalent Input Capacitance (typ) ..................6pF
• Low Supply Current ...............450µA With Logic 1 Input
• Low Output Impedance ......................................... 2.5Ω
• Output Voltage Swing Within 25mV of Ground or VS
They are capable of 6A (peak) output and can drive the largest MOSFETs with an improved safe operating margin. The
MIC4420/4429/429 accepts any logic input from 2.4V to VS
without external speed-up capacitors or resistor networks.
Proprietary circuits allow the input to swing negative by as
much as 5V without damaging the part. Additional circuits
protect against damage from electrostatic discharge.
MIC4420/4429/429 drivers can replace three or more
discrete components, reducing PCB area requirements,
simplifying product design, and reducing assembly cost.
Modern BiCMOS/DMOS construction guarantees freedom
from latch-up. The rail-to-rail swing capability insures adequate gate voltage to the MOSFET during power up/down
sequencing.
Applications
•
•
•
•
Switch Mode Power Supplies
Motor Controls
Pulse Transformer Driver
Class-D Switching Amplifiers
Note: See MIC4120/4129 for high power and narrow
pulse applications.
Functional Diagram
VS
0.1mA
MIC4429
IN V E R T I N G
0.4mA
OUT
IN
2kΩ
MIC4420
NONINVERTING
GND
Micrel, Inc. • 2180 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 474-1000 • http://www.micrel.com
July 2005
1
M9999-072205
MIC4420/4429
Micrel, Inc.
Ordering Information
Part No.
Standard
Pb-Free
MIC4420CN
MIC4420ZN
MIC4420BN
MIC4420YN
MIC4420CM
MIC4420ZM
MIC4420BM
MIC4420YM
MIC4420BMM
MIC4420YMM
MIC4420CT
MIC4420ZT
MIC4429CN
MIC4429ZN
MIC4429BN
MIC4429YN
MIC4429CM
MIC4429ZM
MIC4429BM
MIC4429YM
MIC4429BMM
MIC4429YMM
MIC4429CT
MIC4429ZT
Temperature
Range
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
0°C to +70°C
–40°C to +85°C
0°C to +70°C
–40°C to +85°C
–40°C to +85°C
0°C to +70°C
Package
8-Pin PDIP
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
8-Pin MSOP
5-Pin TO-220
8-Pin PDIP
8-Pin PDIP
8-Pin SOIC
8-Pin SOIC
8-Pin MSOP
5-Pin TO-220
Configuration
Non-Inverting
Non-Inverting
Non-Inverting
Non-Inverting
Non-Inverting
Non-Inverting
Inverting
Inverting
Inverting
Inverting
Inverting
Inverting
Pin Configurations
8 VS
VS 1
IN 2
7 OUT
NC 3
6 OUT
GND 4
5 GND
Plastic DIP (N)
SOIC (M)
MSOP (MM)
5
4
3
2
1
OUT
GND
VS
GND
IN
TO-220-5 (T)
Pin Description
Pin Number
TO-220-5
Pin Number
DIP, SOIC, MSOP
Pin Name
Pin Function
1
2
IN
2, 4
4, 5
GND
3, TAB
1, 8
6, 7
VS
Supply Input: Duplicate pins must be externally connected together.
5
OUT
3
NC
Not connected.
M9999-072205
Control Input
Ground: Duplicate pins must be externally connected together.
Output: Duplicate pins must be externally connected together.
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July 2005
MIC4420/4429
Micrel, Inc.
Absolute Maximum Ratings (Notes 1, 2 and 3)
Operating Ratings
Supply Voltage ...........................................................20V
Input Voltage ............................... VS + 0.3V to GND – 5V
Input Current (VIN > VS) .......................................... 50mA
Power Dissipation, TA ≤ 25°C
PDIP ....................................................................960W
SOIC ...............................................................1040mW
5-Pin TO-220 ...........................................................2W
Power Dissipation, TC ≤ 25°C
5-Pin TO-220 ......................................................12.5W
Derating Factors (to Ambient)
PDIP .............................................................7.7mW/°C
SOIC .............................................................8.3mW/°C
5-Pin TO-220 .................................................17mW/°C
Storage Temperature............................. –65°C to +150°C
Lead Temperature (10 sec.) ................................... 300°C
Supply Voltage .............................................. 4.5V to 18V
Junction Temperature ............................................. 150°C
Ambient Temperature
C Version ................................................. 0°C to +70°C
B Version ............................................. –40°C to +85°C
Package Thermal Resistance
5-pin TO-220 (θJC) ............................................10°C/W
8-pin MSOP (θJA) ...........................................250°C/W
Electrical Characteristics:
Symbol
(TA = 25°C with 4.5V ≤ VS ≤ 18V unless otherwise specified. Note 4.)
Parameter
Conditions
Min
Typ
2.4
1.4
Max
Units
INPUT
VIH
Logic 1 Input Voltage
VIL
Logic 0 Input Voltage
IIN
Input Current
0 V ≤ VIN ≤ VS
VOH
High Output Voltage
See Figure 1
VIN
Input Voltage Range
OUTPUT
VOL
1.1
–5
V
0.8
VS + 0.3
–10
10
VS–0.025
V
V
µA
V
Low Output Voltage
See Figure 1
0.025
V
RO
Output Resistance,
Output Low
IOUT = 10 mA, VS = 18 V
1.7
2.8
Ω
RO
Output Resistance,
Output High
IOUT = 10 mA, VS = 18 V
1.5
2.5
Ω
IPK
Peak Output Current
VS = 18 V (See Figure 6)
IR
Latch-Up Protection
Withstand Reverse Current
6
A
>500
mA
SWITCHING TIME (Note 3)
tR
tF
tD1
Rise Time
Fall Time
Delay Time
tD2
Delay Time
IS
Power Supply Current
VS
Operating Input Voltage
Test Figure 1, CL = 2500 pF
12
35
ns
13
35
ns
Test Figure 1
18
75
ns
Test Figure 1
48
75
ns
0.45
90
1.5
150
mA
µA
18
V
Test Figure 1, CL = 2500 pF
POWER SUPPLY
July 2005
VIN = 3 V
VIN = 0 V
4.5
3
M9999-072205
MIC4420/4429
Micrel, Inc.
Electrical Characteristics: (TA = –55°C to +125°C with 4.5V ≤ VS ≤ 18V unless otherwise specified.)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
INPUT
VIH
Logic 1 Input Voltage
2.4
VIL
Logic 0 Input Voltage
IIN
Input Current
0V ≤ VIN ≤ VS
VOH
High Output Voltage
Figure 1
VIN
Input Voltage Range
–5
OUTPUT
VOL
V
0.8
V
VS + 0.3
–10
10
VS–0.025
V
µA
V
Low Output Voltage
Figure 1
0.025
V
RO
Output Resistance,
Output Low
IOUT = 10mA, VS = 18V
3
5
Ω
RO
Output Resistance,
Output High
IOUT = 10mA, VS = 18V
2.3
5
Ω
Figure 1, CL = 2500pF
32
60
ns
34
60
ns
Figure 1
50
100
ns
Figure 1
65
100
ns
VIN = 3V
VIN = 0V
0.45
0.06
3.0
0.4
mA
mA
18
V
SWITCHING TIME (Note 3)
tR
Rise Time
tF
Fall Time
tD1
Figure 1, CL = 2500pF
Delay Time
tD2
Delay Time
IS
Power Supply Current
POWER SUPPLY
VS
Operating Input Voltage
Note 1:
Note 2:
4.5
Functional operation above the absolute maximum stress ratings is not implied.
Static-sensitive device. Store only in conductive containers. Handling personnel and equipment should be grounded to
prevent damage from static discharge.
Switching times guaranteed by design.
Specification for packaged product only.
Note 3:
Note 4:
Test Circuits
VS = 18V
VS = 18V
0.1µF
0.1µF
IN
OUT
2500pF
MIC4429
INPUT
5V
90%
tD1
tP W
tF
tD2
0.1µF
0.1µF
IN
OUT
2500pF
MIC4420
2.5V
tP W ≥ 0.5µs
10%
0V
VS
90%
1.0µF
INPUT
tR
5V
90%
2.5V
tP W ≥ 0.5µs
10%
0V
VS
90%
1.0µF
tD1
tP W
tR
tD2
tF
O U TPU T
O U TPU T
10%
0V
10%
0V
Figure 1. Inverting Driver Switching Time
M9999-072205
Figure 2. Noninverting Driver Switching Time
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July 2005
MIC4420/4429
Micrel, Inc.
Typical Characteristic Curves
Rise Time vs. Supply Voltage
50
5
7
9
11
VS (V)
13
0
15
50
50
40
40
30
30
VS = 12V
10
TIME (ns)
VS = 5V
20
C L = 4700 pF
20
10
Rise Time vs. Capacitive Load
TIME (ns)
30
15
t FALL
t RISE
10
C L = 2200 pF
C L = 2200 pF
10
0
C L = 2200 pF
VS = 18V
20
TIME (ns)
C L = 4700 pF
20
25
C L = 10,000 pF
TIME (ns)
TIME (ns)
30
Rise and Fall Times vs. Temperature
40
C L = 10,000 pF
40
Fall Time vs. Supply Voltage
50
VS = 18V
5
5
7
9
11
VS (V)
13
0
–60
15
Fall Time vs. Capacitive Load
60
–20
20
60
100
TEMPERATURE (°C)
20
VS = 5V
VS = 12V
VS = 18V
10
140
Delay Time vs. Supply Voltage
50
DELAY TIME (ns)
60
tD2
40
30
20
tD1
10
Propagation Delay Time
vs. Temperature
TIME (ns)
84
40
30
20
10
–60
t D1
C L = 2200 pF
V S = 18V
July 2005
–20
20
60
100
TEMPERATURE (°C)
0
10,000
3000
CAPACITIVE LOAD (pF)
VS = 15V
56
42
500 kHz
200 kHz
14
20 kHz
140
0
0
6
1000
70
28
4
100
1000
CAPACITIVE LOAD (pF)
5
8
10
12
14
16
SUPPLY VOLTAGE (V)
18
Supply Current vs. Frequency
Supply Current vs. Capacitive Load
t D2
50
5
1000
10,000
IS – SUPPLY CURRENT (mA)
60
3000
CAPACITIVE LOAD (pF)
SUPPLY CURRENT (mA)
5
1000
10,000
CL = 2200 pF
18V
10V
100
5V
10
0
0
100
1000
FREQUENCY (kHz)
10,000
M9999-072205
MIC4420/4429
Micrel, Inc.
Typical Characteristic Curves (Cont.)
Quiescent Power Supply
Voltage vs. Supply Current
900
800
600
SUPPLY CURRENT (A)
SUPPLY CURRENT (A)
1000
Quiescent Power Supply
Current vs. Temperature
LOGIC “1” INPUT
400
200
0
LOGIC “0” INPUT
0
4
8
12
16
SUPPLY VOLTAGE (V)
800
700
600
500
400
–60
20
ROUT (W)
2
ROUT (W)
50 mA
7
5
9
11
VS (V)
13
50 mA
1
15
Effect of Input Amplitude
on Propagation Delay
200
10 mA
7
5
0
INPUT 3.0V
INPUT 5.0V
M9999-072205
INPUT 8V AND 10V
5
6
7
8
13
15
PER TRANSITION
-8
CROSSOVER AREA (A•s) x 10
DELAY (ns)
INPUT 2.4V
40
11
VS (V)
Crossover Area vs. Supply Voltage
160
80
9
2.0
LOAD = 2200 pF
120
140
100 mA
1.5
3
2
20
60
100
TEMPERATURE (°C)
2.5
100 mA
10 mA
–20
Low-State Output Resistance
High-State Output Resistance
5
4
LOGIC “1” INPUT
VS = 18V
1.5
1.0
0.5
0
9 10 11 12 13 14 15
VS (V)
5
6
7 8 9 10 11 12 13 14 15
SUPPLY VOLTAGE V (V)
S
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July 2005
MIC4420/4429
Micrel, Inc.
Applications Information
Grounding
Supply Bypassing
The high current capability of the MIC4420/4429 demands
careful PC board layout for best performance Since the
MIC4429 is an inverting driver, any ground lead impedance
will appear as negative feedback which can degrade switching speed. Feedback is especially noticeable with slow-rise
time inputs. The MIC4429 input structure includes 300mV
of hysteresis to ensure clean transitions and freedom from
oscillation, but attention to layout is still recommended.
Charging and discharging large capacitive loads quickly
requires large currents. For example, charging a 2500pF
load to 18V in 25ns requires a 1.8 A current from the device
power supply.
The MIC4420/4429 has double bonding on the supply pins,
the ground pins and output pins This reduces parasitic lead
inductance. Low inductance enables large currents to be
switched rapidly. It also reduces internal ringing that can
cause voltage breakdown when the driver is operated at
or near the maximum rated voltage.
Internal ringing can also cause output oscillation due to
feedback. This feedback is added to the input signal since
it is referenced to the same ground.
To guarantee low supply impedance over a wide frequency
range, a parallel capacitor combination is recommended for
supply bypassing. Low inductance ceramic disk capacitors
with short lead lengths (< 0.5 inch) should be used. A 1µF
low ESR film capacitor in parallel with two 0.1 µF low ESR
ceramic capacitors, (such as AVX RAM GUARD®), provides
adequate bypassing. Connect one ceramic capacitor directly between pins 1 and 4. Connect the second ceramic
capacitor directly between pins 8 and 5.
+15
Figure 3 shows the feedback effect in detail. As the MIC4429
input begins to go positive, the output goes negative and
several amperes of current flow in the ground lead. As little
as 0.05Ω of PC trace resistance can produce hundreds of
millivolts at the MIC4429 ground pins. If the driving logic is
referenced to power ground, the effective logic input level
is reduced and oscillation may result.
To insure optimum performance, separate ground traces
should be provided for the logic and power connections.
Connecting the logic ground directly to the MIC4429 GND
pins will ensure full logic drive to the input and ensure fast
output switching. Both of the MIC4429 GND pins should,
however, still be connected to power ground.
(x2) 1N4448
5.6 kΩ
560 Ω
0.1µF
50V
+
1
2
0.1µF
WIMA
MKS2
8
MIC4429
4
5
1µF
50V
MKS2
6, 7
BYV 10 (x 2)
+
220 µF 50V
+
35 µF 50V
UNIT E D CHE MCON S X E
Figure 3. Self-Contained Voltage Doubler
July 2005
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M9999-072205
MIC4420/4429
Micrel, Inc.
Input Stage
The input voltage level of the 4429 changes the quiescent
supply current. The N channel MOSFET input stage transistor drives a 450µA current source load. With a logic “1”
input, the maximum quiescent supply current is 450µA.
Logic “0” input level signals reduce quiescent current to
55µA maximum.
The MIC4420/4429 input is designed to provide 300mV of
hysteresis. This provides clean transitions, reduces noise
sensitivity, and minimizes output stage current spiking when
changing states. Input voltage threshold level is approximately 1.5V, making the device TTL compatible over the
4 .5V to 18V operating supply voltage range. Input current
is less than 10µA over this range.
The MIC4429 can be directly driven by the TL494,
SG1526/1527, SG1524, TSC170, MIC38HC42 and similar
switch mode power supply integrated circuits. By offloading
the power-driving duties to the MIC4420/4429, the power
supply controller can operate at lower dissipation. This can
improve performance and reliability.
The input can be greater than the +VS supply, however,
current will flow into the input lead. The propagation delay
for TD2 will increase to as much as 400ns at room temperature. The input currents can be as high as 30mA p-p
(6.4mARMS) with the input, 6 V greater than the supply
voltage. No damage will occur to MIC4420/4429 however,
and it will not latch.
The input appears as a 7pF capacitance, and does not
change even if the input is driven from an AC source. Care
should be taken so that the input does not go more than 5
volts below the negative rail.
Power Dissipation
CMOS circuits usually permit the user to ignore power dissipation. Logic families such as 4000 and 74C have outputs
which can only supply a few milliamperes of current, and
even shorting outputs to ground will not force enough current to destroy the device. The MIC4420/4429 on the other
hand, can source or sink several amperes and drive large
capacitive loads at high frequency. The package power
dissipation limit can easily be exceeded. Therefore, some
1
8
MIC4429
0.1µF
LOGIC
GROUND
4
Given the power dissipation in the device, and the thermal
resistance of the package, junction operating temperature
for any ambient is easy to calculate. For example, the
thermal resistance of the 8-pin MSOP package, from the
data sheet, is 250°C/W. In a 25°C ambient, then, using a
maximum junction temperature of 150°C, this package will
dissipate 500mW.
Accurate power dissipation numbers can be obtained by
summing the three sources of power dissipation in the
device:
• Load Power Dissipation (PL)
• Quiescent power dissipation (PQ)
• Transition power dissipation (PT)
Calculation of load power dissipation differs depending on
whether the load is capacitive, resistive or inductive.
Resistive Load Power Dissipation
Dissipation caused by a resistive load can be calculated
as:
PL = I2 RO D
where:
I = the current drawn by the load
RO = the output resistance of the driver when the output
is high, at the power supply voltage used. (See data
sheet)
D = fraction of time the load is conducting (duty cycle)
Operating Frequency
WIMA
MKS-2
1 µF
0V
The supply current vs frequency and supply current vs
capacitive load characteristic curves aid in determining
power dissipation calculations. Table 1 lists the maximum
safe operating frequency for several power supply voltages when driving a 2500pF load. More accurate power
dissipation figures can be obtained by summing the three
dissipation sources.
Table 1: MIC4429 Maximum
+18 V
5.0V
attention should be given to power dissipation when driving
low impedance loads and/or operating at high frequency.
6, 7
5
TE K C U R R E N T
P ROB E 6 3 0 2
0.1µF
VS
18V
15V
10V
18 V
0V
2,500 pF
POLYCARBONATE
Conditions:
6 AMPS
300 mV
Max Frequency
500kHz
700kHz
1.6MHz
1. DIP Package (θJA = 130°C/W)
2. TA = 25°C
3. CL = 2500pF
PC TRACE RESISTANCE = 0.05Ω
POWER
GROUND
Figure 4. Switching Time Degradation Due to
Negative Feedback
M9999-072205
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MIC4420/4429
Capacitive Load Power Dissipation
Micrel, Inc.
where:
IH =
IL =
D=
VS =
Dissipation caused by a capacitive load is simply the energy placed in, or removed from, the load capacitance by
the driver. The energy stored in a capacitor is described
by the equation:
E = 1/2 C V2
As this energy is lost in the driver each time the load is
charged or discharged, for power dissipation calculations
the 1/2 is removed. This equation also shows that it is
good practice not to place more voltage on the capacitor
than is necessary, as dissipation increases as the square
of the voltage applied to the capacitor. For a driver with a
capacitive load:
PL = f C (VS)2
where:
f = Operating Frequency
C = Load Capacitance
VS =Driver Supply Voltage
Inductive Load Power Dissipation
quiescent current with input high
quiescent current with input low
fraction of time input is high (duty cycle)
power supply voltage
Transition Power Dissipation
Transition power is dissipated in the driver each time its
output changes state, because during the transition, for a
very brief interval, both the N- and P-channel MOSFETs in
the output totem-pole are ON simultaneously, and a current is conducted through them from V+S to ground. The
transition power dissipation is approximately:
PT = 2 f VS (A•s)
where (A•s) is a time-current factor derived from the typical
characteristic curves.
Total power (PD) then, as previously described is:
PD = PL + PQ +PT
Definitions
CL = Load Capacitance in Farads.
For inductive loads the situation is more complicated. For
the part of the cycle in which the driver is actively forcing
current into the inductor, the situation is the same as it is
in the resistive case:
D = Duty Cycle expressed as the fraction of time the
input to the driver is high.
f = Operating Frequency of the driver in Hertz
PL1 = I2 RO D
IH = Power supply current drawn by a driver when both
inputs are high and neither output is loaded.
However, in this instance the RO required may be either
the on resistance of the driver when its output is in the high
state, or its on resistance when the driver is in the low state,
depending on how the inductor is connected, and this is
still only half the story. For the part of the cycle when the
inductor is forcing current through the driver, dissipation is
best described as
IL = Power supply current drawn by a driver when both
inputs are low and neither output is loaded.
ID = Output current from a driver in Amps.
PD = Total power dissipated in a driver in Watts.
PL2 = I VD (1-D)
PL = Power dissipated in the driver due to the driver’s
load in Watts.
where VD is the forward drop of the clamp diode in the
driver (generally around 0.7V). The two parts of the load
dissipation must be summed in to produce PL
PQ = Power dissipated in a quiescent driver in
Watts.
PL = PL1 + PL2
PT = Power dissipated in a driver when the output
changes states (“shoot-through current”) in Watts.
NOTE: The “shoot-through” current from a dual
transition (once up, once down) for both drivers
is shown by the "Typical Characteristic Curve :
Crossover Area vs. Supply Voltage and is in ampere-seconds. This figure must be multiplied by
the number of repetitions per second (frequency)
to find Watts.
Quiescent Power Dissipation
Quiescent power dissipation (PQ, as described in the input
section) depends on whether the input is high or low. A low
input will result in a maximum current drain (per driver) of
≤0.2mA; a logic high will result in a current drain of ≤2.0mA.
Quiescent power can therefore be found from:
PQ = VS [D IH + (1-D) IL]
RO = Output resistance of a driver in Ohms.
VS = Power supply voltage to the IC in Volts.
July 2005
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M9999-072205
MIC4420/4429
Micrel, Inc.
+18 V
WIMA
MK22
1 µF
5.0V
1
2
0V
0.1µF
8
MIC4429
4
TE K C U R R E N T
PROBE 6302
6, 7
5
0.1µF
18 V
0V
10,000 pF
PO L YC AR BO N AT E
Figure 5. Peak Output Current Test Circuit
M9999-072205
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July 2005
MIC4420/4429
Micrel, Inc.
Package Information
PIN 1
DIMENSIONS:
INCH (MM)
0.380 (9.65)
0.370 (9.40)
0.255 (6.48)
0.245 (6.22)
0.135 (3.43)
0.125 (3.18)
0.300 (7.62)
0.013 (0.330)
0.010 (0.254)
0.018 (0.57)
0.100 (2.54)
0.130 (3.30)
0.0375 (0.952)
0.380 (9.65)
0.320 (8.13)
8-Pin Plastic DIP (N)
8-Pin SOIC (M)
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M9999-072205
MIC4420/4429
Micrel, Inc.
0.112 (2.84)
0.187 (4.74)
INCH (MM)
0.116 (2.95)
0.038 (0.97)
0.032 (0.81)
0.007 (0.18)
0.005 (0.13)
0.012 (0.30) R
0.012 (0.03)
0.0256 (0.65) TYP
5°
0° MIN
0.004 (0.10)
0.012 (0.03) R
0.035 (0.89)
0.021 (0.53)
8-Pin MSOP (MM)
0.150 D ±0.005
(3.81 D ±0.13)
0.177 ±0.008
(4.50 ±0.20)
0.400 ±0.015
(10.16 ±0.38)
0.108 ±0.005
(2.74 ±0.13)
0.050 ±0.005
(1.27 ±0.13)
0.241 ±0.017
(6.12 ±0.43)
0.578 ±0.018
(14.68 ±0.46)
SEATING
PLANE
7°
Typ.
0.550 ±0.010
(13.97 ±0.25)
0.067 ±0.005
(1.70 ±0.127)
0.032 ±0.005
(0.81 ±0.13)
0.268 REF
(6.81 REF)
0.018 ±0.008
(0.46 ±0.20)
Dimensions:
0.103 ±0.013
(2.62 ±0.33)
inch
(mm)
5-Lead TO-220 (T)
MICREL INC.
2180 FORTUNE DRIVE
SAN JOSE, CA 95131
USA
TEL + 1 (408) 944-0800 FAX + 1 (408) 474-1000 WEB http://www.micrel.com
This information furnished by Micrel in this data sheet is believed to be accurate and reliable. However no responsibility is assumed by Micrel for its
use. Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.
Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product
can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical
implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the
user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is a Purchaser’s own risk and Purchaser
agrees to fully indemnify Micrel for any damages resulting from such use or sale.
© 2001 Micrel, Inc.
M9999-072205
12
July 2005