Datasheet Operational Amplifiers Input/Output Full Swing Low Input Offset Voltage Operational Amplifier BD5291xxx Key Specifications General Description Operating Supply Voltage (Single Supply): +1.7V to +5.5V 2.5V/µs(Typ.) Slew Rate: Operating Temperature Range: -40°C to +85°C VSS to VDD Input Voltage Range: Input Offset Voltage: ±2.5mV (Max) 70dB (Min) Common Mode Rejection Ratio: The BD5291xxx is ideally suited for sensor signal conditioning. This features input/output full-swing operation with a supply voltage as low as 1.7V. In addition, high common-mode rejection ratio, ultra low input bias current (1pA typical) and low input offset voltage increase the precision that can be achieved using these operational amplifiers. Package Features W(Typ) x D(Typ) x H(Max) 2.90mm x 2.80mm x 1.25mm 1.60mm x 1.60mm x 0.60mm SSOP5 VSOF5 Low Operating Supply Voltage Input Output Full Swing Low Input Offset Voltage High Common Mode Rejection Ratio High Slew Rate Applications Buffer Active Filter Sensor Amplifier Mobile Equipment Pin Configuration OUT 1 VSS 2 5 + +IN VDD - 3 4 -IN Pin No. Pin Name 1 OUT 2 VSS 3 +IN 4 -IN 5 VDD Pin No. Pin Name BD5291FVE : VSOF5 +IN 1 VSS 2 -IN 3 5 VDD + 1 +IN - 2 VSS 3 -IN 4 5 OUT 4 OUT Figure 1. Pin Configuration VDD Package SSOP5 VSOF5 BD5291G BD5291FVE ○Product structure：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･14･001 1/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Ordering Information B D 5 2 9 1 x x x Tx Packaging and forming specification TL: Embossed tape and reel (SSOP5) TR: Embossed tape and reel (VSOF5) Package G :SSOP5 FVE :VSOF5 Part Number BD5291G BD5291FVE - Line-up Topr Package Operable Part Number SSOP5 Reel of 3000 BD5291G-TL VSOF5 Reel of 3000 BD5291FVE-TR -40°C to +85°C Absolute Maximum Ratings(TA=25°C) Parameter Supply voltage Power dissipation Differential input voltage Input common-mode voltage range (Note 5) Input current Symbol Ratings Unit VDD-VSS +7 V PD (Note 4) SSOP5 0.67 (Note 1,3) VSOF5 0.25 (Note 2,3) W VID VDD - VSS V VICM (VSS – 0.3) to (VDD + 0.3 ) V II ±10 mA Operating supply voltage Vopr +1.7 to +5.5 V Operating temperature Topr - 40 to +85 °C Storage temperature Maximum junction temperature Tstg - 55 to +150 °C TJmax +150 °C (Note 1) To use at temperature above TA=25°C reduce 5.4mW/°C. (Note 2) To use at temperature above TA=25°C reduce 2.0mW/°C. (Note 3) Mounted on a FR4 glass epoxy PCB 70mm×70mm×1.6mm (Copper foil area less than 3%). (Note 4) The voltage difference between inverting input and non-inverting input is the differential input voltage. Then input pin voltage is set to more than VSS. (Note 5) An excessive input current will flow when input voltages of more than VDD+0.6V or less than VSS-0.6V are applied. The input current can be set to less than the rated current by adding a limiting resistor. Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 2/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Electrical Characteristics ○BD5291G (Unless otherwise specified VDD=+3.3V, VSS=0V, TA=25°C) Limits Temperature Parameter Symbol Range Min Typ Input offset voltage (Note 6,7) (Note 6,7) Input offset voltage drift Input offset current Input bias current VIO ΔVIO/ΔT (Note 6,7) IIO (Note 6,7) IB (Note 7) Supply current IDD Maximum output voltage(High) VOH (Note 7) Maximum output voltage(Low) VOL (Note 7) (Note 7) Large signal voltage gain AV Input common mode voltage VICM Common mode (Note 7) rejection ratio CMRR Power supply (Note 7) rejection ratio PSRR Output source current Output sink current (Note 8) (Note 8) Slew rate Gain bandwidth - 0.1 Full range - - 3.8 Full range - 0.8 - 25°C - 1 220 Full range - - 1700 25°C - 1 220 Full range - - 1700 25°C - 650 900 Full range - - 970 25°C VDD-0.1 - - Full range VDD-0.1 - - 25°C - - VSS+0.1 Full range - - VSS+0.1 25°C 80 105 - Full range 80 - - 25°C 80 110 - Full range 80 - - 0 - 1.8 0 - 3.3 25°C 25°C 70 90 - Full range 68 - - 25°C 70 90 - Full range 68 - - Isource 25°C Isink 25°C SR 25°C GBW Condition mV VDD=+1.8V ,+3.3V μV/°C - pA - pA - μA RL=∞, Av=0dB, +IN=VDD/2 V RL=10kΩ V RL=10kΩ VDD=+1.8V dB VDD=+3.3V V VDD=+1.8V, VSS to VDD VDD=+3.3V, VSS to VDD dB - dB - 6 - - 17 - 9 15 - - 35 - - 2.5 - V/μs CL=25pF - 3.0 - MHz VDD=+1.8V, f=100kHz, Open loop - 3.2 - MHz VDD=+3.3V, f=100kHz, Open loop deg Open loop mA mA OUT=VDD-0.4V output current OUT=VSS+0.4V output current 25°C 25°C - 40 - Vn 25°C - 18 - THD+N 25°C - 0.005 - Input referred noise voltage Unit 4 θ Phase margin Total harmonics distortion 25°C Max 2.5 nV/ Hz Av=40dB, f=1kHz % OUT=0.4VP-P, f=1kHz (Note 6) Absolute value (Note 7) Full range: TA=-40°C to +85°C (Note 8) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 3/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Electrical Characteristics - continued ○BD5291FVE (Unless otherwise specified VDD=+3.3V, VSS=0V, TA=25°C) Limits Temperature Parameter Symbol Range Min Typ Input offset voltage (Note 9,10) Input offset voltage drift Input offset current Input bias current (Note 9,10) VIO ΔVIO/ΔT (Note 9,10) IIO (Note 9,10) IB (Note 10) Supply current IDD Maximum output voltage(High) VOH (Note 10) Maximum output voltage(Low) VOL (Note 10) Large signal voltage gain AV (Note 10) Input common mode voltage VICM Common mode (Note 10) rejection ratio CMRR Power supply (Note 10) rejection ratio PSRR Output source current Output sink current (Note 11) (Note 11) Slew rate Gain bandwidth - 0.1 Full range - - 3.8 Full range - 0.8 - 25°C - 1 220 Full range - - 1700 25°C - 1 220 Full range - - 2800 25°C - 650 900 Full range - - 970 25°C VDD-0.1 - - Full range VDD-0.1 - - 25°C - - VSS+0.1 Full range - - VSS+0.1 25°C 80 105 - Full range 80 - - 25°C 80 110 - Full range 80 - - 0 - 1.8 0 - 3.3 25°C 25°C 70 90 - Full range 68 - - 25°C 70 90 - Full range 68 - - Isource 25°C Isink 25°C SR 25°C GBW Condition mV VDD=+1.8V ,+3.3V μV/°C - pA - pA - μA RL=∞, Av=0dB, +IN=VDD/2 V RL=10kΩ V RL=10kΩ VDD=+1.8V dB VDD=+3.3V V VDD=+1.8V, VSS to VDD VDD=+3.3V, VSS to VDD dB - dB - 6 - - 17 - 9 15 - - 35 - - 2.5 - V/μs CL=25pF - 3.0 - MHz VDD=+1.8V, f=100kHz, Open loop - 3.2 - MHz VDD=+3.3V, f=100kHz, Open loop deg Open loop mA mA OUT=VDD-0.4V output current OUT=VSS+0.4V output current 25°C 25°C - 40 - Vn 25°C - 18 - THD+N 25°C - 0.005 - Input referred noise voltage Unit 4 θ Phase margin Total harmonics distortion 25°C Max 2.5 nV/ Hz Av=40dB, f=1kHz % OUT=0.4VP-P, f=1kHz (Note 9) Absolute value (Note 10) Full range: TA=-40°C to +85°C (Note 11) Under the high temperature environment, consider the power dissipation of IC when selecting the output current. When the terminal short circuits are continuously output, the output current is reduced to climb to the temperature inside IC. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 4/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Description of electrical characteristics Described here are the terms of electric characteristics used in this datasheet. Items and symbols used are also shown. Note that item name and symbol and their meaning may differ from those on another manufacture’s document or general document. 1. Absolute maximum ratings Absolute maximum rating item indicates the condition which must not be exceeded. Application of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. (1) Power supply voltage (VDD/VSS) Indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruction of characteristics of internal circuit. (2) Differential input voltage (VID) Indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and destruction of characteristics of IC. (3) Input common-mode voltage range (VICM) Indicates the maximum voltage that can be applied to non-inverting terminal and inverting terminal without deterioration or destruction of characteristics. Input common-mode voltage range of the maximum ratings not assures normal operation of IC. When normal Operation of IC is desired, the input common-mode voltage of characteristics item must be followed. (4) Power dissipation (PD) Indicates the power that can be consumed by specified mounted board at the ambient temperature 25°C(normal temperature). As for package product, Pd is determined by the temperature that can be permitted by IC chip in the package (maximum junction temperature) and thermal resistance of the package. 2.Electrical characteristics item (1) Input offset voltage (VIO) Indicates the voltage difference between non-inverting terminal and inverting terminal. It can be translated into the input voltage difference required for setting the output voltage at 0 V. (2) Input offset voltage drift (△VIO/△T) Denotes the ratio of the input offset voltage fluctuation to the ambient temperature fluctuation. (3) Input offset current (IIO) Indicates the difference of input bias current between non-inverting terminal and inverting terminal. (4) Input bias current (IB) Indicates the current that flows into or out of the input terminal. It is defined by the average of input bias current at non-inverting terminal and input bias current at inverting terminal. (5) Supply current (IDD) Indicates the IC current that flows under specified conditions and no-load steady status. (6) Maximum Output Voltage(High) / Maximum Output Voltage(Low) (VOH/VOL) Indicates the voltage range that can be output by the IC under specified load condition. It is typically divided into maximum output voltage High and low. Maximum output voltage high indicates the upper limit of output voltage. Maximum output voltage low indicates the lower limit. (7) Large signal voltage gain (Av) Indicates the amplifying rate (gain) of output voltage against the voltage difference between non-inverting terminal and inverting terminal. It is normally the amplifying rate (gain) with reference to DC voltage. Av = (Output voltage) / (Differential Input voltage) (8) Input common-mode voltage range (VICM) Indicates the input voltage range where IC operates normally. (9) Common-mode rejection ratio (CMRR) Indicates the ratio of fluctuation of input offset voltage when in-phase input voltage is changed. It is normally the fluctuation of DC. CMRR = (Change of Input common-mode voltage)/(Input offset voltage fluctuation) (10) Power supply rejection ratio (PSRR) Indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. It is normally the fluctuation of DC. PSRR= (Change of power supply voltage)/(Input offset voltage fluctuation) (11) Output source current/ output sink current (Isource / Isink) The maximum current that can be output under specific output conditions, it is divided into output source current and output sink current. The output source current indicates the current flowing out of the IC, and the output sink current the current flowing into the IC. (12) Slew Rate (SR) SR is a parameter that shows movement speed of operational amplifier. It indicates rate of variable output voltage as unit time. (13) Gain Bandwidth (GBW) Indicates to multiply by the frequency and the gain where the voltage gain decreases 6dB/octave. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 5/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Description of electrical characteristics – continued (14) Phase Margin (θ) Indicates the margin of phase from 180 degree phase lag at unity gain frequency. (15) Input referred noise voltage (Vn) Indicates a noise voltage generated inside the operational amplifier equivalent by ideal voltage source connected in series with input terminal. (16) Total harmonic distortion + Noise (THD+N) Indicates the fluctuation of input offset voltage or that of output voltage with reference to the change of output voltage of driven channel. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 6/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Typical Performance Curves ○BD5291xxx 800 0.8 SUPPLY CURRENT [µA] . POWER DISSIPATION [W] . 750 0.6 BD5291G 0.4 BD5291FVE 0.2 85℃ 700 650 25℃ 600 -40℃ 550 500 450 400 0.0 0 25 85 50 75 100 125 AMBIENT TEMPERATURE [°C] 1 150 Figure 2. Derating curve 2 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 3. Supply Current – Supply Voltage 800 6 OUTPUT VOLTAGE HIGH [V] . 750 SUPPLY CURRENT [µA] 5.5V 700 650 3.3V 1.8V 600 550 500 450 400 5 85℃ 4 25℃ 3 -40℃ 2 1 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 1 Figure 4. Supply Current – Ambient Temperature 2 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 5. Maximum Output Voltage (High) – Supply Voltage (RL=10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 7/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Typical Performance Curves - continued ○BD5291xxx 10 5 OUTPUT VOLTAGE LOW [mV] OUTPUT VOLTAGE HIGH [V] 6 5.5V 4 3.3V 3 1.8V 2 1 0 8 85℃ 6 4 -40℃ 2 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 1 2 3 4 5 SUPPLY VOLTAGE [V] 6 Figure 7. Maximum Output Voltage (Low) – Supply Voltage (RL=10kΩ) Figure 6. Maximum Output Voltage (High) – Ambient Temperature (RL=10kΩ) 10 40 OUTPUT SOURCE CURRENT [mA] OUTPUT VOLTAGE LOW [mV] 25℃ 8 1.8V 6 5.5V 4 3.3V 2 0 35 30 25 25℃ -40℃ 20 15 85℃ 10 5 0 -50 -25 0 25 50 75 100 0 1 2 3 OUTPUT VOLTAGE [V] AMBIENT TEMPERATURE [°C] 4 Figure 9. Output Source Current – Output Voltage (VDD=3.3V) Figure 8. Maximum Output Voltage (Low) – Ambient Temperature (RL=10kΩ) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 8/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Typical Performance Curves - continued ○BD5291xxx 20 OUTPUT SOURCE CURRENT [mA] OUTPUT SOURCE CURRENT [mA] 80 70 60 25℃ 50 -40℃ 40 30 85℃ 20 10 0 0 1 2 3 4 OUTPUT VOLTAGE [V] 5 18 16 14 12 10 3.3V 8 6 1.8V 4 2 0 -50 6 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 Figure 11. Output Source Current –Ambient Temperature (OUT=VDD-0.4V) Figure 10. Output Source Current – Output Voltage (VDD=5.5V) 70 140 60 OUTPUT SINK CURRENT [mA] OUTPUT SINK CURRENT [mA] 5.5V -40℃ 50 40 30 85℃ 25℃ 20 10 0 120 -40℃ 100 80 25℃ 60 85℃ 40 20 0 0 1 2 3 4 0 1 OUTPUT VOLTAGE [V] 2 3 4 5 6 OUTPUT VOLTAGE [V] Figure 13. Output Sink Current – Output Voltage (VDD=5.5V) Figure 12. Output Sink Current – Output Voltage (VDD=3.3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 9/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Typical Performance Curves - continued ○BD5291xxx 40 4 INPUT OFFSET VOLTAGE [mV] OUTPUT SINK CURRENT [mA] 3 30 5.5V 20 3.3V 10 2 85℃ 25℃ 1 0 -40℃ -1 -2 -3 1.8V 0 -4 -25 0 25 50 75 100 1 2 3 4 5 6 AMBIENT TEMPERATURE[°C] SUPPLY VOLTAGE[V] Figure 14. Output Sink Current – Ambient Temperature (OUT=VSS+0.4V) Figure 15. Input Offset Voltage – Supply Voltage 4 4 3 3 INPUT OFFSET VOLTAGE [mV] INPUT OFFSET VOLTAGE [mV] -50 2 3.3V 5.5V 1 0 1.8V -1 -2 2 85℃ 1 25℃ 0 -40℃ -1 -2 -3 -3 -4 -4 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] -1 100 Figure 16. Input Offset Voltage – Ambient Temperature 0 1 2 3 INPUT VOLTAGE [V] 4 5 Figure 17. Input Offset Voltage – Input Voltage (VDD=3.3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 10/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Typical Performance Curves - continued ○BD5291xxx 160 LARGE [dB] LARGE SIGNAL SIGNAL VOLTAGE VOLTAGE GAIN GAIN[dB] LARGE LARGESIGNAL SIGNAL VOLTAGE VOLTAGEGAIN[dB] GAIN [dB] 160 140 85℃ 120 100 -40℃ 25℃ 80 60 40 20 0 5.5V 3.3V 120 100 1.8V 80 60 40 20 0 1 2 3 4 5 SUPPLY VOLTAGE [V] 6 -50 50 75 0 25 -25 AMBIENT TEMPERATURE [°C] 100 Figure 19. Large Signal Voltage Gain – Ambient Temperature Figure 18. Large Signal Voltage Gain – Supply Voltage 160 160 COMMONMODE MODEREJECTION REJECTIONRATIO RATIO[dB] COMMON [dB] COMMON MODE REJECTION RATIO[dB] COMMON MODE REJECTION RATIO [dB] 140 140 120 -40℃ 25℃ 100 80 85℃ 60 40 20 0 1 2 3 4 5 SUPPLY VOLTAGE [V] 6 140 120 3.3V 5.5V 100 80 1.8V 60 40 20 0 -50 -25 0 25 50 75 AMBIENT TEMPERATURE [°C] 100 Figure 21. Common Mode Rejection Ratio – Ambient Temperature Figure 20. Common Mode Rejection Ratio – Supply Voltage (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 11/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Typical Performance Curves - continued 120 200 POWER SUPPLY REJECTION RATIO [dB] . COMMON MODE REJECTION RATIO [dB] .. ○BD5291xxx 180 5.5V 100 80 160 140 3.3V 1.8V 120 100 60 40 20 0 2 3 4 5 80 60 40 20 0 -50 6 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 10 10 10 10 10 10 -25 25 50 75 100 AMBIENT TEMPERATURE[℃] FREQUENCY [Hz] Figure 22. Common Mode Rejection Ratio – Frequency Figure 23. Power Supply Rejection Ratio – Ambient Temperature (VDD=1.7V to 5.5V) 500 120 INPUT BIAS CURRENT [pA] POWER SUPPLY REJECTION RATIO [dB] ….. 0 ….. 100 5.5V 80 3.3V 1.8V 60 40 450 400 350 300 250 200 150 100 20 50 0 0 2 3 4 5 6 -50 1.E+01 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 10 10 10 10 10 10 FREQUENCY [Hz] -25 0 25 50 75 100 125 AMBIENT TEMPERATURE [°C] Figure 24. Power Supply Rejection Ratio – Frequency Figure 25. Input Bias Current – Ambient Temperature (VDD=3.3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 12/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Typical Performance Curves – continued 120 120 100 100 80 60 80 90 60 45 0 Gain 20 -45 0 -90 -20 0 -135 -40 11 2 10 10 3 10 100 -180 2 3 4 5 6 7 10 10 10 10 10 10 1.E+02 1.E+03 1.E+04 1.E+05 1.E+06 1.E+07 4 10 1000 10 10000 FREQUENCY [Hz] FREQUENCY [Hz] Figure 26. Input Referred Noise Voltage－Frequency (VDD=3.3V) Figure 27. Voltage Gain, Phase – Frequency (VDD=3.3V , Open loop) 4.5 5 4 GAIN BANDWIDTH [MHz] ….. UNITY GAIN FREQUENCY [MHz] ….. 135 Phase 40 40 20 180 PHASE [deg] 140 GAIN [dB] INPUT REFERRED NOISE VOLTAGE [nV/√ Hz]….. ○BD5291xxx 3.5 3 5.5V 2.5 2 3.3V 1.8V 1.5 4.5 5.5V 4 1.8V 3.3V 3.5 3 2.5 1 0.5 2 -50 -25 0 25 50 75 100 -50 -25 0 25 50 75 AMBIENT TEMPERATURE TEMPERATURE [℃] [°C] AMBIENT TEMPERATURE TEMPERATURE [℃][°C] Figure 28. Unity Gain Frequency – Ambient Temperature Figure 29. Gain Bandwidth – Ambient Temperature 100 (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 13/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Typical Performance Curves – continued ○BD5291xxx 4 60 rise 50 SLEW RATE [V/μs] ….. PHASE MARGIN [deg] …. 70 3.3V 40 5.5V 30 1.8V 20 3 2 fall 1 10 0 0 10 100 1000 1.5 2 LOAD CAPACITANCE [pF] OUTPUT VOLTAGE[V] INPUT VOLTAGE [V] [V] INPUT VOLTAGE OUT VOLTAGE [V] SLEW RATE [V/μs] ….. rise fall 1 0 -50 -25 0 25 50 75 100 3.5 4 4.5 5 5.5 6 Figure 31. Slew Rate－Supply Voltage 4 2 3 SUPPLY VOLTEGE [V] Figure 30. Phase Margin－Load Capacitance 3 2.5 44 9 33 8 22 7 11 6 00 5 -1 4 -2 3 3 -3 2 2 -4 1 1 0 -5 0 -6 -1 6 125 8 10 12 14 16 18 20 22 24 26 28 TIME [μs] TIME [μs] AMBIENT TEMPERATURE TEMPERATURE [℃] [°C] Figure 33. Input and Output Wave Form (VDD=5V, AV=1, RL=2kΩ, CL=10pF IN=3VP-P, TA=25℃) Figure 32. Slew Rate – Ambient Temperature (VDD=3.3V) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 14/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Typical Performance Curves - continued 0.55 0.20 0.20 0.50 0.15 0.15 0.45 0.10 0.10 0.40 0.05 0.05 0.35 0.00 0.30 -0.05 0.25 0.25 -0.10 0.20 0.20 -0.15 0.15 0.15 0.10 -0.20 0.10 0.05 -0.25 0.05 6 8 INPUT [V][V] INPUTVOLTAGE VOLTAGE 0.25 0.25 OUTPUT VOLTAGE[V] OUT VOLTAGE [V] OUTPUT VOLTAGE[V] OUT VOLTAGE [V] INPUT VOLTAGE INPUT VOLTAGE[V] [V] ○BD5291xxx TIME[μs] [μs] TIME INPUT VOLTAGE [V] [V] INPUT VOLTAGE 33 8 22 7 11 6 00 5 -1 4 -2 3 3 2 -3 2 1 -4 1 0 -5 0 -6 -1 8 10 12 14 16 18 20 22 24 26 28 TIME [μs] TIME [μs] Figure 35. Input and Output Wave Form (VDD=5V, AV=-1, RL=2kΩ, CL=10pF IN=3VP-P, TA=25°C) Figure 34. Input and Output Wave Form (VDD=5V, AV=1, RL=2kΩ, CL=10pF IN=100mVP-P, TA=25°C) OUTPUT VOLTAGE[V] OUT VOLTAGE [V] 9 6 10 12 14 16 18 20 22 24 26 28 0.25 0.25 0.45 0.20 0.20 0.4 0.15 0.15 0.35 0.10 0.10 0.3 0.05 0.05 0.25 0.00 0.2 -0.05 0.25 0.15 -0.10 0.20 0.1 0.15 -0.15 0.05 0.10 -0.20 0 0.05 -0.25 44 -0.05 6 8 10 12 14 16 18 20 22 24 26 28 TIME[μs] [μs] TIME Figure 36. Input and Output Wave Form (VDD=5V, AV=-1, RL=2kΩ, CL=10pF IN=100mVP-P, TA=25°C) (*)The above characteristics are measurements of typical sample, they are not guaranteed. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 15/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Application Information NULL method condition for Test Circuit 1 VDD, VSS, EK, VICM Unit:V Parameter Input Offset Voltage VF SW1 SW2 SW3 VDD VSS EK VICM VRL Calculation VF1 ON ON OFF 3.3 0 -1.65 1.65 - 1 ON ON ON 3.3 0 -0.5 VF2 Large Signal Voltage Gain VF3 1.65 0.9 -2.5 VF4 Common-mode Rejection Ratio (Input Common-mode Voltage Range) ON ON OFF 3.3 0 VF6 ON ON OFF VF7 1.7 0 0 - 3.3 - -1.5 3 VF5 Power Supply Rejection Ratio 2 1.65 -0.9 0 5.5 - 4 - － Calculation－ |VF1| 1. Input Offset Voltage (VIO) VIO = [V] 2. Large Signal Voltage Gain (Av) Av = 20Log ΔVEK × (1+RF/RS) [dB] |VF2-VF3| 1+RF/RS 3. Common-mode Rejection Ratio (CMRR) ΔVICM × (1+RF/RS) CMRR=20Log [dB] |VF4 - VF5| 4. Power Supply Rejection Ratio (PSRR) ΔVDD × (1+ RF/RS) PSRR = 20Log [dB] |VF6 - VF7| 0.1µF RF=50kΩ 0.01µF 500kΩ SW1 VDD EK RS=50Ω 15V Vo Ri=1MΩ 500kΩ 0.015µF 0.015µF DUT NULL SW3 RS=50Ω 1000pF Ri=1MΩ RL Vicm SW2 50kΩ VSS VF VRL -15V Figure 37. Test circuit 1 www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 16/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Application Information - continued Switch Condition for Test Circuit 2 SW1 SW2 SW3 SW4 SW5 SW6 SW7 SW8 SW9 SW10 SW11 SW12 Parameter Supply Current OFF OFF ON OFF ON OFF OFF OFF OFF OFF OFF OFF Maximum Output Voltage RL=10kΩ OFF ON OFF OFF ON OFF OFF Output Current OFF ON OFF OFF ON OFF OFF OFF OFF Slew Rate OFF OFF Unit gain frequency ON ON OFF OFF OFF OFF OFF ON ON ON ON OFF OFF ON ON OFF OFF OFF OFF ON OFF OFF ON OFF OFF OFF ON OFF OFF ON SW３ SW4 R2 100kΩ ● ● VDD － SW1 SW2 ＋ SW5 SW6 SW7 SW8 SW9 RL CL SW10 SW11 SW12 R1 1kΩ VSS VIN- VIN+ Vo Figure 38. Test circuit 2 Input voltage VH VL t Input wave Output voltage 90% SR=ΔV/Δt VH ΔV 10% VL Δt Output wave t Figure 39. Slew rate input output wave www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 17/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Application example ○Voltage follower VDD Voltage gain is 0dB. Using this circuit, the output voltage (OUT) is configured to be equal to the input voltage (IN). This circuit also stabilizes the output voltage (OUT) due to high input impedance and low output impedance. Expression for output voltage (OUT) is shown below. OUT=IN OUT IN VSS Figure 40. Voltage follower ○Inverting amplifier R2 For inverting amplifier, input voltage (IN) is amplified by a voltage gain and depends on the ratio of R1 and R2. The out-of-phase output voltage is shown in the next expression OUT=-(R2/R1)・IN This circuit has input impedance equal to R1. VDD R1 IN OUT R1//R2 VSS Figure 41. Inverting amplifier circuit ○Non-inverting amplifier R1 R2 VDD OUT R1//R2 For non-inverting amplifier, input voltage (IN) is amplified by a voltage gain, which depends on the ratio of R1 and R2. The output voltage (OUT) is in-phase with the input voltage (IN) and is shown in the next expression. OUT=(1 + R2/R1)・IN Effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. IN VSS Figure 42. Non-inverting amplifier circuit www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 18/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Power Dissipation Power dissipation (total loss) indicates the power that can be consumed by IC at TA=25°C(normal temperature).IC is heated when it consumed power, and the temperature of IC ship becomes higher than ambient temperature. The temperature that can be accepted by IC chip depends on circuit configuration, manufacturing process, and consumable power is limited. Power dissipation is determined by the temperature allowed in IC chip (maximum junction temperature) and thermal resistance of package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage package (heat dissipation capability). The maximum junction temperature is typically equal to the maximum value in the storage temperature range. Heat generated by consumed power of IC radiates from the mold resin or lead frame of the package. The parameter which indicates this heat dissipation capability (hardness of heat release) is called thermal resistance, represented by the symbol θJA°C/W. The temperature of IC inside the package can be estimated by this thermal resistance. Figure 43.(a) shows the model of thermal resistance of the package. Thermal resistance θJA, ambient temperature TA, maximum junction temperature Tjmax, and power dissipation Pd can be calculated by the equation below: θJA = (TJmax－TA) / PD °C/W Derating curve in Figure 43.(b) indicates power that can be consumed by IC with reference to ambient temperature. Power that can be consumed by IC begins to attenuate at certain ambient temperature. This gradient is determined by thermal resistance θJA. Thermal resistance θJA depends on chip size, power consumption, package, ambient temperature, package condition, wind velocity, etc even when the same of package is used. Thermal reduction curve indicates a reference value measured at a specified condition. Figure 43.(c),(d) show a derating curve for an example of BD5291xxx. LSI の消費電力 [W] PDmax θJA=(TJmax-TA)/PD P2 許容損失 PD ℃/W Ambient temperature TA[ ℃ ] Package face temperature θJA2 < θJA1 θJA2 P1 Tjmax θJA1 0 Chip surface temperature Tj[ ℃ ] 50 100 75 125 150 周囲温度 TA [ °C ] (b) Derating curve (a) Thermal resistance 0.8 . . 0.8 BD5291G(Note 12) POWER DISSIPATION [W] POWER DISSIPATION [W] 25 0.6 0.4 0.2 0.6 0.4 BD5291FVE(Note 13) 0.2 0.0 0.0 0 25 50 75 85 100 125 0 150 AMBIENT TEMPERATURE [℃] 85 25 50 75 100 125 150 AMBIENT TEMPERATURE [℃] (c) BD5291G (d) BD5291FVE Note 12 Note 13 Unit 5.4 2.0 mW/℃ When using the unit above TA=25°C, subtract the value above per °C. Permissible dissipation is the value when FR4 glass epoxy board 70mm×70mm×1.6mm (copper foil area below 3%) is mounted Figure 43. Derating Curve www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 19/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Operational Notes 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC’s power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. However, pins that drive inductive loads (e.g. motor driver outputs, DC-DC converter outputs) may inevitably go below ground due to back EMF or electromotive force. In such cases, the user should make sure that such voltages going below ground will not cause the IC and the system to malfunction by examining carefully all relevant factors and conditions such as motor characteristics, supply voltage, operating frequency and PCB wiring to name a few. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the power dissipation rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. The absolute maximum rating of the Pd stated in this specification is when the IC is mounted on a 70mm x 70mm x 1.6mm glass epoxy board. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the Pd rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC’s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 20/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Operational Notes – continued 12. Regarding the Input Pin of the IC This monolithic IC contains P+ isolation and P substrate layers between adjacent elements in order to keep them isolated. P-N junctions are formed at the intersection of the P layers with the N layers of other elements, creating a parasitic diode or transistor. For example (refer to figure below): When GND > Pin A and GND > Pin B, the P-N junction operates as a parasitic diode. When GND > Pin B, the P-N junction operates as a parasitic transistor. Parasitic diodes inevitably occur in the structure of the IC. The operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions that cause these diodes to operate, such as applying a voltage lower than the GND voltage to an input pin (and thus to the P substrate) should be avoided. Figure 44. Example of monolithic IC structure 13. Oscillation for feed back circuit Be careful when using the IC in feed back circuit. Phase margin of this IC is 40°.Oscillation is caused by large size capacitive load connecting to output terminal. If the circuits has large size capacitor that is connected to output terminal. Please insert of isolation resistor between output terminal and capacitive load. 14. Input Voltage Applying VDD+0.3V to the input terminal is possible without causing deterioration of the electrical characteristics or destruction, regardless of the supply voltage. However, this does not ensure normal circuit operation. Please note that the circuit operates normally only when the input voltage is within the common mode input voltage range of the electric characteristics. 15. Power supply(single/dual) The operational amplifiers operate when the voltage supplied is between VDD and VSS. Therefore, the single supply operational amplifiers can be used as dual supply operational amplifiers as well. 16. Output capacitor Discharge of the external output capacitor to VDD is possible via internal parasitic elements when VDD is shorted to VSS, causing damage to the internal circuitry due to thermal stress. Therefore, when using this IC in circuits where oscillation due to output capacitive load does not occur, such as in voltage comparators, use an output capacitor with a capacitance less than 0.1µF. Designed negative feedback circuit using this IC, verify output oscillation caused by capacitive load. 17. Latch up Be careful of input voltage that exceed the VDD and VSS. When CMOS device have sometimes occur latch up operation. And protect the IC from abnormaly noise. 18. Decupling Capacitor Insert the decupling capacitance between VDD and VSS, for stable operation of operational amplifier. www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 21/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Marking Diagram VSOF5(TOP VIEW) SSOP5(TOP VIEW) Part Number Marking LOT Number LOT Number Part Number Marking Product Name Package Type Marking G SSOP5 L7 FVE VSOF5 N6 BD5291 Land Pattern data SSOP5 e ℓ2 MIE e b2 Unit：mm Land Width b2 PKG Land Pitch e Land Space MIE Land Length ≧ℓ 2 SSOP5 0.95 2.4 1.0 0.6 VSOF5 0.5 1.35 0.35 0.25 www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 22/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Physical Dimensions Tape and Reel Information Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 SSOP5 23/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Physical Dimensions Tape and Reel Information – continued Package Name www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 VSOF5 24/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Datasheet BD5291xxx Revision History Date Revision Changes 10.JUN.2013 001 New Release 26.NOV.2013 002 Add BD5291FVE, Delete Simplified Schematic 13.FEB.2014 003 General Description is modified 22.APR.2014 004 Delete BD5291FVE 06.Jun.2016 005 Added BD5291FVE www.rohm.com ©2013 ROHM Co., Ltd. All rights reserved. TSZ22111･15･001 25/25 TSZ02201-0RAR0G200660-1-2 06.Jun.2016 Rev.005 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASSⅢ CLASSⅡb CLASSⅢ CLASSⅢ CLASSⅣ CLASSⅢ 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E © 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM’s Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice – WE © 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet BD5291G - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS BD5291G SSOP5 3000 3000 Taping inquiry Yes