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Agilent HFBR/HFCT-5208M 1 x 9
Fiber Optic Transceivers for 622 Mb/s
ATM/SONET/SDH Applications
Data Sheet
Description
General
The HFBR-5208M (multimode
transceiver) and HFCT-5208M
(single-mode transceiver) from
Agilent allow the system designer
to implement a range of solutions
for ATM/SONET STS-12/SDH
STM-4 applications.
The overall Agilent transceiver
consists of three sections: the
transmitter and receiver optical
subassemblies, an electrical
subassembly and the mezzanine
package housing which
incorporates a duplex SC
connector receptacle.
Transmitter Section
The transmitter section of the
HFBR-5208M consists of a 1300 nm
LED in an optical subassembly
(OSA) which mates to the multimode fiber cable. The HFCT-5208M
incorporates a 1300 nm Fabry
Perot (FP) laser in the optical
subassembly. In addition, this
package has been designed to be
compliant with IEC 825 eye-safety
requirements under any single
fault condition. The OSA’s are
driven by a custom, silicon bipolar
IC which converts differential
PECL logic signals (ECL
referenced to a +5 V supply) into
an analog LED/laser drive current.
Applications
HFBR-5208M:
• General purpose low-cost MMF
links at 155 to 650 Mb/s
• ATM 622 Mb/s MMF links from
switch-to-switch or switch-toserver in the end-user premise
• Private MMF interconnections at
622 Mb/s SONET STS-12/SDH
STM-4 rate
HFCT-5208M:
• ATM 622 Mb/s SMF links from
switch-to-switch or switch-toserver in the end-user premise
• Private SMF interconnections at
622 Mb/s SONET STS-12/SDH
STM-4 rate
622 Mb/s Product Family
HFCT-5218M:
• 1300 nm laser-based transceiver
in 1 x 9 package for links of 40 km
with single-mode fiber cables
Features
• Performance
HFBR-5208M:
Links of 500 m with 62.5/125 µm
multimode fiber (MMF) from
155-622 Mb/s
HFCT-5208M:
Links of 15 km with 9/125 µm
single-mode fiber (SMF)
• Compliant with ATM forum
622.08 Mb/s physical layer
specification (AF-PHY-0046.000)
• Compliant with ANSI broadband
ISDN - physical layer
specification T1.646-1995 and
T1.646a-1997
• HFBR-5208M is compliant with
ANSI network to customer
installation interfaces synchronous optical NETwork
(SONET) physical media
dependent specification:
multimode fiber T1.416.01-1998
• HFCT-5208M is compliant to the
intermediate SONET OC12/SDH
STM(S4.1) specifications
• Industry-standard multi-sourced
1 x 9 mezzanine package style
• Single +5 V power supply
operation and PECL logic
interfaces
• Wave solder and aqueous wash
process compatible
• Unconditionally eye safe laser IEC
825/CDRH Class 1 compliant
Receiver Section
The receiver contains an InGaAs
PIN photodiode mounted together
with a custom, silicon bipolar
transimpedance preamplifier IC in
an OSA. This OSA is mated to a
custom, silicon bipolar circuit
providing post amplification and
quantization and optical signal
detection.
The custom, silicon bipolar circuit
includes a Signal Detect circuit
which provides a PECL logic high
state output upon detection of a
usable input optical signal level.
This single-ended PECL output is
designed to drive a standard PECL
input through normal 50 W PECL
load.
Applications Information
Typical BER Performance of
HFBR-5208M Receiver versus Input
Optical Power Level
The HFBR/HFCT-5208M
transceiver can be operated at
Bit-Error-Ratio conditions other
than the required BER = 1 x 10-10
of the 622 MBd ATM Forum
622.08 Mb/s Physical Layer
Standard and the ANSI T1.646a.
The typical trade-off of BER
versus Relative Input Optical
Power is shown in Figure 1. The
Relative Input Optical Power in
dB is referenced to the Input
Optical Power parameter value in
the Receiver Optical
Characteristics table. For better
BER condition than 1 x 10-10,
more input signal is needed (+dB).
For example, to operate the
10-2
BIT ERROR RATIO
10-3
10-4
10-5
10-6
10-7
10-8
10-9
10-10
10-11
10-12
10-13
10-14
10-15
LINEAR EXTRAPOLATION OF
10-4 THROUGH 10 -7 DATA
ACTUAL DATA
-5 -4 -3 -2 -1
0
1
Figure 1. Relative Input Optical Power dBm Average.
2
2
3
HFBR-5208M at a BER of 1 x 10-12,
the receiver will require an input
signal approximately 0.6 dB higher
than the -26 dBm level required for
1 x 10-10 operation, i.e. -25.4 dBm.
An informative graph of a typical,
short fiber transceiver link performance can be seen in Figure 2.
This figure is useful for designing
short reach links with time-based
jitter requirements. This figure
indicates Relative Input Optical
Power versus Sampling Time
Position within the receiver
output data eye-opening. The
given curves are at a constant biterror-ratio (BER) of 10-10 for four
different signaling rates, 155 MBd,
311 MBd, 622 MBd and 650 MBd.
These curves, called “tub”
diagrams for their shape, show
the amount of data eye-opening
time-width for various receiver
input optical power levels. A
wider data eye-opening provides
more time for the clock recovery
circuit to operate within without
creating errors. The deeper the
tub is indicates less input optical
power is needed to operate the
receiver at the same BER
condition. Generally, the wider
and deeper the tub is the better.
The Relative Input Optical Power
amount (dB) is referenced to the
absolute level (dBm avg.) given
in the Receiver Optical
Characteristics table. The 0 ns
sampling time position for this
Figure 2 refers to the center of the
Baud interval for the particular
signaling rate. The Baud interval is
the reciprocal of the signaling rate
in MBd. For example, at 622 MBd
the Baud interval is 1.61 ns, at
155 MBd the Baud interval is
6.45 ns. Test conditions for this
tub diagram are listed in Figure 2.
The HFBR/HFCT-5208M receiver
input optical power requirements
vary slightly over the signaling
rate range of 20 MBd to 700 MBd
for a constant bit-error-ratio
(BER) of 10-10 condition. Figure 3
illustrates the typical receiver
relative input optical power varies
by <0.7 dB over this full range.
This small sensitivity variation
allows the optical budget to
remain nearly constant for designs
that make use of the broad
signaling rate range of the
HFBR/HFCT-5208M. The curve
has been normalized to the input
optical power level (dBm avg.) of
the receiver for 622 MBd at center
of the Baud interval with a BER of
10-10. The data patterns that can
be used at these signaling rates
should be, on average, balanced
duty factor of 50%. Momentary
excursions of less or more data
duty factor than 50% can occur,
but the overall data pattern must
remain balanced. Unbalanced data
duty factor will cause excessive
pulse-width distortion, or worse,
bit errors. The test conditions are
listed in Figure 3.
Recommended Circuit Schematic
When designing the HFBR/HFCT5208M circuit interface, there are
a few fundamental guidelines to
follow. For example, in the
Recommended Circuit Schematic,
Figure 4, the differential data
lines should be treated as 50 ohm
Microstrip or stripline
transmission lines. This will help
to minimize the parasitic
inductance and capacitance
effects. Proper termination of the
differential data signal will
prevent reflections and ringing
which would compromise the
signal fidelity and generate
unwanted electrical noise. Locate
termination at the received signal
end of the transmission line. The
length of these lines should be
kept short and of equal length to
prevent pulse-width distortion
from occurring. For the high-speed
signal lines, differential signals
should be used, not single-ended
signals. These differential signals
need to be loaded symmetrically
to prevent unbalanced currents
from flowing which will cause
distortion in the signal.
Equivalent Average Optical Input Power in dBm for extrapolated BER =le -10
3
155.52 MBd
311.04 MBd
622.08 MBd
650.00 MBd
2.5
2
1.5
1
0.5
0
-0.5
-1
-3.5
-2.5
-1.5
-0.5
0.5
1.5
2.5
3.5
Clock to Data Offset Delay in nsec (0 = Data Eye Center)
Figure 2. HFBR-5208M Relative Input Optical Power as a function of sampling time position. Normalized to center of Baud interval at 622 MBd.
Test Conditions +25°C, 5.25 V, PRBS 2 23-1, optical t r/t f = 0.9 ns with 3 m of 62.5 µm MMF.
Relative Sensitivity in dB for extrapolated BER = le -10
2.5
HFBR-5208M
2
HFCT-5208M
1.5
1
0.5
0
-0.5
-1
-1.5
20
105
190
275
360
445
530
Module Data Stream Serial Data Rate in MBd
Figure 3. Relative Input Optical Power as a function of data rate normalized to center of Baud interval at 622 MBd.
Test Conditions +25°C, 5.25 V, PRBS 2 23-1, optical tr/t f = 0.9 ns with 3 m of MMF or SMF.
3
615
700
Maintain a solid, low inductance
ground plane for returning signal
currents to the power supply.
Multilayer plane printed circuit
board is best for distribution of
VCC, returning ground currents,
forming transmission lines and
shielding. Also, it is important to
suppress noise from influencing
the fiber-optic transceiver performance, especially the receiver
circuit. Proper power supply
filtering of VCC for this transceiver
is accomplished by using the
recommended separate filter
circuits shown in Figure 4. These
filter circuits suppress VCC noise
of 100 mV peak-to-peak or less
over a broad frequency range.
This prevents receiver sensitivity
degradation . It is recommended
that surface-mount components
be used. Use tantalum capacitors
for the 10 µF capacitors and
monolithic, ceramic bypass
capacitors for the 0.1 µF
capacitors. Also, it is
recommended that a surfacemount coil inductor of 1 µH be
used. Ferrite beads can be used to
replace the coil inductors
when using quieter VCC supplies,
but a coil inductor is recommended over a ferrite bead to
provide low-frequency noise
filtering as well. Coils with a low,
series dc resistance (<0.7 ohms)
and high, self-resonating
frequency are recommended. All
power supply components need to
be placed physically next to the
VCC pins of the receiver and
transmitter. Use a good, uniform
ground plane with a minimum
number of holes to provide a lowinductance ground current return
path for the signal and power
supply currents.
Although the front mounting posts
make contact with the metallized
housing, these posts should not be
relied upon to provide adequate
electrical connection to the plated
housing. It is recommended to
4
MOUNTING POST
MOUNTING POST
NO INTERNAL CONNECTION
NO INTERNAL CONNECTION
HFBR/HFCT-5208M
TOP VIEW
Rx
VEER
1
RD
2
RD
3
Rx
VCCR
5
SD
4
Tx
VCCT
6
C1
TD
7
Tx
VEET
9
TD
8
C2
VCC
TERMINATION
AT PHY
DEVICE
INPUTS
C7
VCC
R5
R2
L2
R8
RD
SD
VCC
R4
C5
TERMINATION
AT TRANSCEIVER
INPUTS
R10
RD
R3
R1
C3
C4
VCC FILTER
AT V CC PINS
TRANSCEIVER
R9
R7
C6
R6
L1
TD
TD
NOTES:
THE SPLIT-LOAD TERMINATIONS FOR PECL SIGNALS NEED TO BE LOCATED AT THE INPUT
OF DEVICES RECEIVING THOSE PECL SIGNALS. RECOMMEND MULTI-LAYER PRINTED
CIRCUIT BOARD WITH 50 OHM MICROSTRIP OR STRIPLINE SIGNAL PATHS BE USED.
R1 = R4 = R6 = R8 = R10 = 130 OHMS.
R2 = R3 = R5 = R7 = R9 = 82 OHMS.
C1 = C2 = C3 = C5 = C6 = 0.1 µF.
C4 = C7 = 10 µF.
L1 = L2 = 1 µH COIL OR FERRITE INDUCTOR (see text comments).
Figure 4. Recommended Circuit Schematic for dc Coupling (at +5 V) between Optical
Transceiver and Physical Layer IC
either connect these front posts to
chassis ground or allow them to
remain unconnected. These front
posts should not be connected to
signal ground.
Figure 5 shows the recommended
board layout pattern.
In addition to these recommendations, Agilent’s Application
Engineering staff is available for
consulting on best layout practices
with various vendors’ serializer/
deserializer, clock recovery/
generation integrated circuits.
Reference Design
Agilent has developed a reference
design for multimode and singlemode OC-12 ATM-SONET/SDH
applications shown in Figure 6.
This reference design uses a
Vitesse Semiconductor Inc.’s
VSC8117 clock recovery/clock
generation/serializer/deserializer
integrated circuit and a PMCSierra Inc. PM5355 framer IC.
Application Note 1178 documents
the design, layout, testing and
performance of this reference
design. Gerber files, schematic
and application note are available
from the Agilent Fiber-Optics
Components’ web site at the URL
of http://www.semiconductor.
agilent.com.
Operation in -5.2 V Designs
For applications that require
-5.2 V dc power supply level for
true ECL logic circuits, the
HFBR/HFCT-5208M transceiver
can be operated with a VCC = 0 V
dc and a VEE = -5.2 V dc. This
transceiver is not specified with
an operating, negative power
supply voltage. The potential
compromises that can occur with
use of -5.2 V dc power are that the
absolute voltage states for VOH
and VOL will be changed slightly
due to the 0.2 V difference in
supply levels. Also, noise
immunity may be compromised
for the HFBR/HFCT-5208M transceiver because the ground plane is
now the VCC supply point. The
suggested power supply filter
circuit shown in the Recommended
Circuit Schematic figure should be
located in the VEE paths at the
transceiver supply pins. Direct
coupling of the differential data
signal can be done between the
HFBR-5208M transceiver and the
standard ECL circuits. For
guaranteed -5.2 V dc operation,
contact your local Agilent
Component Field Sales Engineer
for assistance.
5
2 x Ø 1.9 ± 0.1
(0.075 ± 0.004)
20.32
(0.800)
9 x Ø 0.8 ± 0.1
(0.032 ± 0.004)
20.32
(0.800)
2.54
(0.100)
TOP VIEW
DIMENSIONS ARE IN MILLIMETERS (INCHES)
Figure 5. Recommended Board Layout Pattern
Figure 6. 622.08 Mb/s OC-12 ATM-SONET/SDH Reference Design Board
Electromagnetic Interference (EMI)
One of a circuit board designer’s
foremost concerns is the control
of electromagnetic emissions
from electronic equipment.
Success in controlling generated
Electromagnetic Interference
(EMI) enables the designer to pass
a governmental agency’s EMI
regulatory standard; and more
importantly, it reduces the
possibility of interference to
neighboring equipment. There are
three options available for the
HFBR/HFCT-5208M with regard to
EMI shielding for providing the
designer with a means to achieve
good EMI performance. The EMI
performance of an enclosure
using these transceivers is
dependent on the chassis design.
Agilent encourages using standard
RF suppression practices and
avoiding poorly EMI-sealed
enclosures. In addition, Agilent
advises that for the best EMI
performance, the metalized case
must be connected to chassis
ground using one of the shield
options.
An un-shielded option, shown in
Figure 7 is available for the
HFBR/HFCT-5208M fiber optic
transceiver. This unit is intended
for applications where EMI is
either not an issue for the
designer, or the unit resides in a
highly-shielded enclosure.
The first shielded option, option
EM, is for applications where the
position of the transceiver module
will extend outside the equipment
enclosure. The metallized plastic
package and integral external
metal shield of the transceiver
helps locally to terminate EM
fields to the chassis to prevent
their emissions outside the
enclosure. This metal shield
contacts the panel or enclosure on
the inside of the aperture on all
but the bottom side of the shield
and provides a good RF
connection to the panel. This
option can accommodate various
panel or enclosure thicknesses,
i.e. 1.02 mm (.04 in) min to 2.54 mm
(0.1 in) max. The reference plane
for this panel thickness variation is
from the front surface of the panel
or enclosure. The recommended
length for protruding the
HFBR/HFCT-5208EM transceiver
beyond the front surface of the
panel or enclosure is 6.35 mm
Agilent XXXX-XXXX
ZZZZZ LASER PROD
N.B. For shielded
module the label
is mounted on
the end as
shown.
TX
39.6
MAX.
(1.56)
12.7
(0.50)
(
KEY:
YYWW = DATE CODE
XXXX-XXXX = HFBR-5208M or HFCT-5208M
ZZZZ = 1300 nm
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4 MAX.
(1.00)
+0.1
0.25 -0.05
+0.004
0.010 -0.002
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
SLOT DEPTH
12.7
(0.50)
SLOT WIDTH
2.5
(0.10)
2.0 ± 0.1
(0.079 ± 0.004)
)
9.8
MAX.
(0.386)
0.51
(0.020)
3.3 ± 0.38
(0.130 ± 0.015)
+0.25
0.46 -0.05
9X Ø
+0.010
0.018 -0.002
(
23.8
(0.937)
20.32
(0.800)
2X Ø
20.32
(0.800)
)
20.32
(0.800)
14.5
(0.57)
Masked insulator material (no metalization)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X ±0.05 mm
Figure 7. Package Outline Drawing for HFBR/HFCT-5208M
6
+0.25
1.27 -0.05
2X Ø
+0.010
0.050 -0.002
(
8X 2.54
(0.100)
1.3
(0.051)
15.8 ± 0.15
(0.622 ± 0.006)
)
(0.25 in) . With this option, there
is flexibility of positioning the
module to fit the specific need of
the enclosure design. (See Figure 8
for the mechanical drawing
dimensions of this shield.)
The second shielded option,
option FM, is for applications that
are designed to have a flush
mounting of the module with
respect to the front of the panel or
enclosure. The flush-mount design
accommodates a large variety of
panel thickness, i.e. 1.02 mm
(.04 in) min to 2.54 mm (0.1 in)
max. Note the reference plane for
the flush-mount design is the
interior side of the panel or
enclosure. The recommended
distance from the centerline of the
transceiver front solder posts to
the inside wall of the panel is
13.82 mm (0.544 in) . This option
contacts the inside panel or
enclosure wall on all four sides of
this metal shield. (See Figure 10
for the mechanical drawing
dimensions of this shield.)
Both shielded design options
connect only to the equipment
chassis and not to the signal or
logic ground of the circuit board
within the equipment closure. The
front panel aperture dimensions
are recommended in Figures 9
and 11. When layout of the printed
circuit board is done to
incorporate these metal-shielded
transceivers, keep the area on the
printed circuit board directly
under the external metal shield
free of any components and
circuit board traces. For
additional EMI performance
advantage, use duplex SC fiberoptic connectors that have low
metal content inside the
connector. This lowers the ability
of the metal fiber-optic
connectors to couple EMI out
through the aperture of the panel
or enclosure.
7
Recommended Solder and Wash
Process
The HFBR/HFCT-5208M is
compatible with industry-standard
wave or hand solder processes.
HFBR-5000 Process Plug
The HFBR/HFCT-5208M
transceiver is supplied with a
process plug, the HFBR-5000, for
protection of the optical ports
with the Duplex SC connector
receptacle. This process plug
prevents contamination during
wave solder and aqueous rinse as
well as during handling, shipping
or storage. It is made of hightemperature, molded, sealing
material that will withstand
+85°C and a rinse pressure of
110 lb/in2.
Recommended Solder Fluxes and
Cleaning/Degreasing Chemicals
Solder fluxes used with the
HFBR/HFCT-5208M fiber-optic
transceiver should be watersoluble, organic solder fluxes.
Some recommended solder fluxes
are Lonco 3355-11 from London
Chemical West, Inc. of Burbank,
CA, and 100 Flux from Alphametals of Jersey City, NJ or
equivalent fluxes from other
companies.
Recommended cleaning and
degreasing chemicals for the
HFBR/HFCT-5208M are alcohols
(methyl, isopropyl, isobutyl),
aliphatics (hexane, heptane) and
other chemicals, such as soap
solution or naphtha. Do not use
partially halogenated
hydrocarbons for cleaning/
degreasing. Examples of
chemicals to avoid are 1,1.1
trichloroethane, ketones (such as
MEK), acetone, chloroform, ethyl
acetate, methylene dichloride,
phenol, methylene chloride or
N methylpyrolldone.
Regulatory Compliance
These transceiver products are
intended to enable commercial
system designers to develop
equipment that complies with the
various regulations governing
certification of Information
Technology Equipment. See the
Regulatory Compliance Table
for details. Additional information
is available from your Agilent
sales representative.
Electrostatic Discharge (ESD)
There are two design cases in
which immunity to ESD damage is
important.
The first case is during handling of
the transceiver prior to mounting it
on the circuit board. It is important
to use normal ESD handling
precautions for ESD sensitive
devices. These precautions
include using grounded wrist
straps, work benches, and floor
mats in ESD controlled areas, etc.
The second case to consider is
static discharges to the exterior of
the equipment chassis containing
the transceiver parts. To the
extent that the duplex SC
connector receptacle is exposed
to the outside of the equipment
chassis, it may be subject to
whatever ESD system level test
criteria that the equipment is
intended to meet.
Electromagnetic Interference (EMI)
Most equipment designs utilizing
these high-speed transceivers
from Agilent will be required to
meet the requirements of FCC in
the United States, CENELEC
EN55022 (CISPR 22) in Europe
and VCCI in Japan.
The HFBR/HFCT-5208M EMI has
been characterized with a chassis
enclosure to demonstrate the
robustness of the parts.
Performance of a system
containing these transceivers will
vary depending on the individual
chassis design.
Immunity
Equipment utilizing these
HFBR/HFCT-5208M transceivers
will be subject to radio-frequency
electromagnetic fields in some
environments. These transceivers,
with their integral shields, have
been characterized without the
benefit of a normal equipment
chassis enclosure and the results
are reported below. Performance
of a system containing these
transceivers within a welldesigned chassis is expected to be
better than the results of these
tests without a chassis enclosure.
Eye Safety
The HFCT-5208M transceiver is
classified as AEL Class I (U.S. 21
CFR(J) and AEL Class 1 per
EN 60825-1 (+A11). It is eye safe
when used within the data sheet
limits per CDRH. It is also eye
safe under normal operating
conditions and under all
reasonably foreseeable single
fault conditions per EN60825-1.
Agilent has tested the transceiver
design for compliance with the
requirements listed below under
normal operating conditions and
under single fault conditions
where applicable. TUV Rheinland
has granted certification to this
transceiver for laser eye safety and
use in EN 60950 and EN 60825-2
applications.
Regulatory Compliance - Targeted Specifications
Feature
Electrostatic Discharge
(ESD)
Immunity
Test Method
MIL-STD-883C
Method 3015.4
Machine Model
JEDEC
JESD22-A115-A
RAD
IEC-61000-4-2
FCC Class B
CENELEC EN55022
Class B (CISPR 22B)
VCCI Class 2
Variation of IEC 801-3
Eye Safety
IEC 825/CDRH Class 1
Electromagnetic
Interference (EMI)
Performance
Min 2000 V
Min 100 V
Products of this design typically withstand 25 kV without
damage.
Margins are dependant on customer board and chassis design.
It is recommended that the flush mount shield design
(HFBR/HFCT-5208FM) be used for best EMI margin against
FCC Class B.
Typically show no measurable effect from a 10 V/m field swept
from 26 to 1000 MHz applied to the transceiver when mounted to
a circuit card without a chassis enclosure.
CDRH Accession Numbers:
HFCT-5208xx
9521220 - 22
TUV Bauart License:
Þ
HFCT-5208xx Þ 933/510906/01
The HFBR-5208M LED and the HFCT-5208M Laser transmitters are classified as IEC 825-1 Accessible Emission Limit
(AEL) Class 1. AEL Class 1 LED/Laser devices are considered eye safe.
8
1 = VEER
N/C
2 = RD
3 = RD
4 = SD
5 = VCCR
TOP VIEW
6 = VCCT
N/C = NO INTERNAL CONNECTION
(MOUNTING POSTS) - CONNECT
TO CHASSIS GROUND OR LEAVE
FLOATING, DO NOT CONNECT TO
SIGNAL GROUND.
7 = TD
8 = TD
N/C
9 = VEET
Table 1. Pinout Table
Pin
Symbol
Functional Description
Mounting Studs
The mounting studs are provided for transceiver mechanical attachment to the circuit boards,
they are embedded in the metalized plastic housing and are not connected to the transceiver
internal circuit. They should be soldered into plated-through holes on the printed circuit board
and not connected to signal ground.
1
VEER
Receiver Signal Ground
Directly connect this pin to receiver signal ground plane. Receiver VEER and transmitter VEET
can connect to a common circuit board ground plane.
2
RD+
Receiver Data Out
Terminate this high-speed, differential, PECL output with standard PECL techniques at the
follow-on device input pin.
3
RD-
Receiver Data Out Bar
Terminate this high-speed, differential, PECL output with standard PECL techniques at the
follow-on device input pin.
4
SD
Signal Detect
Normal input optical signal levels to the receiver result in a logic "1" output (VOH).
Low input optical signal levels to the receiver result in a fault condition indication shown by a
logic "0" output (VOL).
If Signal Detect output is not used, leave it open-circuited.
This Signal Detect output can be used to drive a PECL input on an upstream circuit, such as,
Signal Detect input or Loss of Signal-bar.
5
VCCR
Receiver Power Supply
Provide +5 V dc via the recommended receiver VCCR power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCR pin.
6
VCCT
Transmitter Power Supply
Provide +5 V dc via the recommended transmitter VCCT power supply filter circuit.
Locate the power supply filter circuit as close as possible to the VCCT pin.
7
TD-
Transmitter Data In Bar
Terminate this high-speed, differential, Transmitter Data input with standard PECL techniques
at the transmitter input pin.
8
TD+
Transmitter Data In
Terminate this high-speed, differential, Transmitter Data input with standard PECL techniques
at the transmitter input pin.
9
VEET
Transmitter Signal Ground
Directly connect this pin to the transmitter signal ground plane. Transmitter VEET and receiver
VEER can connect to a common circuit board ground plane.
9
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause catastrophic damage to the device. Limits apply to each
parameter in isolation, all other parameters having values within the recommended operating conditions. It should not be
assumed that limiting values of more than one parameter can be applied to the product at the same time. Exposure to the absolute
maximum ratings for extended periods can adversely affect device reliability.
Parameter
Storage Temperature
Lead Soldering Temperature - HFBR-5208M
Lead Soldering Temperature - HFCT-5208M
Lead Soldering Time
Supply Voltage
Data Input Voltage
Transmitter Differential Input Voltage
Symbol
TS
TSOLD
TSOLD
tSOLD
VCC
VI
VD
Minimum
-40
Output Current
Relative Humidity
ID
RH
0
Symbol
TA
Minimum
0
Typical
-0.5
-0.5
Maximum
+85
+260
+260
10
6.0
VCC
1.6
Unit
°C
°C
°C
sec.
V
V
V
Notes
50
95
mA
%
Maximum
+70
Unit
°C
Notes
2
2
1
Recommended Operating Conditions
Parameter
Ambient Operating Temperature
HFBR-5208xM, HFCT-5208xM
Ambient Operating Temperature
HFBR-5208AxM , HFCT-5208AxM
Supply Voltage
Power Supply Rejection
Transmitter Data Input Voltage - Low
Transmitter Data Input Voltage - High
Transmitter Differential Input Voltage
Typical
TA
-40
+85
°C
VCC
PSR
VIL-VCC
VIH-VCC
VD
4.75
5.25
V
mV p-p 3
V
4
V
4
V
Data Output Load
Signal Detect Output Load
RDL
RSDL
100
-1.810
-1.165
0.3
-1.475
-0.880
1.6
50
50
W
W
5
5
Notes:
1. This is the maximum voltage that can be applied across the Differential Transmitter Data Inputs without damaging the ESD protection circuit.
2. 2 ms-1 air flow required (for HFCT -5208xxM only).
3. Tested with a 100 mV p-p sinusoidal signal in the frequency range from 500 Hz to 1 MHz imposed on the VCC supply with the recommended
power supply filter in place, see Figure 4. Typically less than a 0.5 dB change in sensitivity is experienced.
4. Compatible with 10K, 10KH and 100K ECL and PECL output signals.
5. The outputs are terminated to VCC - 2 V.
10
HFBR-5208M Family, 1300 nm LED
Transmitter Electrical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V)
(TA = -40°C to +85°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
Parameter
Supply Current
Power Dissipation
Data Input Current - Low
Data Input Current -High
Symbol
ICCT
PDIST
IIL
IIH
Minimum
Typical
155
0.75
Maximum
200
1.05
Notes
1
350
Unit
mA
W
µA
µA
Typical
112
0.37
-1.82
-0.94
0.3
0.3
-1.82
-0.94
35
Maximum
177
0.77
-1.620
-0.740
0.51
0.51
-1.620
-0.740
100
Unit
mA
W
V
V
ns
ns
V
V
µs
Notes
2
3
3
4
4
3
3
5
60
350
µs
6
-350
Receiver Electrical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V)
(TA = -40°C to +85°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
Parameter
Supply Current
Power Dissipation
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Reaction Time
(Off to On)
Signal Detect Deassert Reaction Time
(On to Off)
Symbol
ICCR
PDISR
VOL - VCC
VOH - VCC
tR
tF
VOL - VCC
VOH - VCC
tSDA
tSDD
Minimum
-1.950
-1.045
0.2
0.2
-1.950
-1.045
Notes:
1. The ICC value is held nearly constant to minimize unwanted electrical noise from being generated and conducted or emitted to
neighboring circuitry.
2. Power dissipation value is the power dissipated in the receiver itself. It is calculated as the sum of the products of V CC and ICC minus the sum
of the products of the output voltages and load currents.
3. These outputs are compatible with 10K, 10KH and 100K ECL and PECL inputs.
4. These are 20% - 80% values.
5. The Signal Detect output will change from logic “VOL” to “VOH” within 100 µs of a step transition in input optical power from no light to -26 dBm.
6. The Signal Detect output will change from logic “VOH” to “VOL” within 350 µs of a step transition in input optical power from -26 dBm to no light.
11
HFBR-5208M Family, 1300 nm LED
Transmitter Optical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V)
(TA = -40°C to +85°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
Parameter
Output Optical Power
62.5/125 µm. NA = 0.275 fiber
Output Optical Power
50/125 µm. NA = 0.20 fiber
Output Optical Power at Logic "0" State
Optical Extinction Ratio
Center Wavelength
Spectral Width - FWHM
Optical Rise Time
Optical Fall Time
Overshoot
Systematic Jitter Contributed by the Transmitter
Random Jitter Contributed by the Transmitter
Symbol
PO (BOL)
PO (EOL)
PO (BOL)
PO (EOL)
PO ("0")
ER
lc
s
tR
tF
SJ
RJ
Minimum
-19.5
-20
10
1270
Typical Maximum
-17
-14
-14
-21.5
-14
-22
-14
-60
46
1330
1380
136
200
0.7
1.25
0.9
1.25
0
25
0.04
0.23
0.0
0.10
Unit
Notes
dBm avg.
dBm avg. 7
dBm avg.
dB
nm
nm
8
ns
9
ns
9
%
ns p-p
ns p-p
Notes:
7. The Output Optical Power is measured with the following conditions:
• 1 meter of fiber with cladding modes removed.
• The input electrical signal is a 12.5 MHz square wave.
• The Beginning of Life (BOL) to End of Life (EOL) degradation is less than 0.5 dB.
8. The relationship between FWHM and RMS values for spectral width can be derived from the assumption of a Gaussian-shaped spectrum
which results in RMS = FWHM/2.35.
9. These are 10-90% values.
12
HFBR-5208M Family, 1300 nm LED
Receiver Optical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V)
(TA = -40°C to +85°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
Parameter
Minimum Input Optical Power at window edge
Symbol
PIN MIN (W)
Minimum Input Optical Power at eye center
PIN MIN (C)
Input Optical Power Maximum
Input Operating Wavelength
Systematic Jitter Contributed by the Receiver
Random Jitter Contributed by the Receiver
Signal Detect - Asserted
Signal Detect - Deasserted
Signal Detect - Hysteresis
PIN MAX
Minimum
Typical Maximum
-29.0
-26
-30.5
l
-14
1270
-11
SJ
RJ
PA
PD
PA - PD
0.1
0.25
PD +1.0 dB -30.5
-45
-33.7
1.0
3.2
1380
0.30
0.48
-28
5
Unit
Notes
dBm avg. 10
Fig 2
dBm avg. 10
Fig 2,3
dBm avg. 10
nm
ns p-p
ns p-p
dBm avg.
dBm avg.
dB
Notes:
10. This specification is intended to indicate the performance of the receiver section of the transceiver when the input power ranges from the
minimum level (with a window time-width) to the maximum level. Over this range the receiver is guaranteed to provide output data with a
Bit Error Ratio (BER) better than or equal to 1 x 10-10
• At the Beginning of Life (BOL)
• Over the specified operating temperature and voltage ranges
• Input is at 622.08 Mbd, 223 -1 PRBS data pattern with 72 “1”s and 72 “0”s inserted per the CCITT (now ITU-T) recommendation G.958
Appendix 1.
• Receiver worst-case output data eye-opening (window time-width) is measured by applying worst-case input systematic (SJ) and random
jitter (RJ). The worst-case maximum input SJ = 0.5 ns peak-to-peak and the RJ = 0.15 ns peak-to-peak per ANSI T1.646a standard. Since
the input (transmitter) random jitter contribution is very small and difficult to produce exactly, only the maximum systematic jitter is
produced and used for testing the receiver. The corresponding receiver test window time-width must meet the requirement of 0.31 ns or
larger. This worst-case test window time-width results from the following jitter equation:
Minimum Test Window Time-Width = Baud Interval - Tx SJ max. - Rx SJ max. - Rx RJ max.
Respectively, Minimum Test Window Time-Width = 1.608 ns - 0.50 ns - 0.30 ns - 0.48 ns = 0.328 ns.
This is a test method that is within practical test error of the worst-case 0.31 ns limit.
• Input optical rise and fall times (10% - 90%) are 0.7 ns and 0.9 ns respectively.
• Transmitter operating with a 622.08 MBd, 311.04 MHz square wave input signal to simulate any cross talk present between the transmitter
and receiver sections of the transceiver.
13
HFCT-5208M Family, 1300 nm FP Laser
Transmitter Electrical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V)
(TA = -40°C to +85°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
Parameter
Supply Current
Power Dissipation
Data Input Current - Low
Data Input Current -High
Symbol
ICCT
PDIST
IIL
IIH
Minimum
Typical Maximum
47
140
0.235
0.75
Unit
mA
W
µA
µA
Notes
1
Typical Maximum
130
150
0.65
0.787
-1.620
-0.740
0.5
0.5
-1.620
-0.740
25
100
Unit
mA
W
V
V
ns
ns
V
V
µs
Notes
1, 2
80
µs
6
-350
350
Receiver Electrical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V)
(TA = -40°C to +85°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
Parameter
Supply Current
Power Dissipation
Data Output Voltage - Low
Data Output Voltage - High
Data Output Rise Time
Data Output Fall Time
Signal Detect Output Voltage - Low
Signal Detect Output Voltage - High
Signal Detect Assert Reaction Time
(Off to On)
Signal Detect Deassert Reaction Time
(On to Off)
Symbol
ICCR
PDISR
VOL - VCC
VOH - VCC
tR
tF
VOL - VCC
VOH - VCC
tSDA
tSDD
Minimum
-1.950
-1.045
-1.950
-1.045
100
3
3
4
4
3
3
5
Notes:
1. The power supply current varies with temperature. Maximum current is specified at VCC = Maximum @ maximum temperature
(not including termination currents) and end of life.
2. The current excludes the output load current.
3. These outputs are compatible with 10K, 10KH and 100K ECL and PECL inputs.
4. These are 20% - 80% values.
5. The Signal Detect output will change from logic “VOL” to “VOH” within 100 µs of a step transition in input optical power from no light to -28 dBm.
6. The Signal Detect output will change from logic “VOH ” to “VOL” within 100 µs of a step transition in input optical power from -28 dBM to no light.
14
HFCT-5208M Family, 1300 nm FP Laser
Transmitter Optical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V)
(TA = -40°C to +85°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
Parameter
Output Optical Power
Optical Extinction Ratio
Center Wavelength
Spectral Width - (RMS)
Output Optical Eye Opening
Symbol
PO
ER
lc
Minimum
-15
8.2
1274
Typical Maximum Unit
Notes
-11
-8
dBm avg. 7
13.8
dB
1313
1356
nm
1.1
2.5
nm
s
Compliant with Bellcore TR-NWT-000253 and ITU-T
recommendation G.957.
Receiver Optical Characteristics
(TA = 0°C to +70°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V)
(TA = -40°C to +85°C, VCC = 4.75 to 5.25 V. Typical @+25°C, 5 V for A specification part)
Parameter
Minimum Input Optical Power
Maximum Input Optical Power
Signal Detect - Asserted
Signal Detect - Hysteresis
Symbol
PIN MIN
PIN MAX
PA
PA - PD
Minimum
-7
-42
0.5
Typical Maximum
-32
-28
-39
1.2
-31
4.0
Unit
dBm
dBm
dBm
dB
Notes
8
8
9,10
Notes:
7. The output power is coupled into a 1 m single-mode fiber. Minimum output optical level is at end of life.
8. Minimum sensitivity and saturation levels for 223-1 PRBS with 72 ones and 72 zeros inserted. (ITU-T recommendation G.958).
Sensitivity is measured for a BER of 10-10 at center of Baud interval with the transmitter powered up to test for crosstalk between the
transmitter and receiver sections of the transceiver.
9. The Bit Error Rate (BER) measurements are not performed but a high to low transition in SD typically occurs at a receiver BER of 10-6 or
worse.
10. For HFCT-5208Axx (extended temperature) Signal Detect - Hysteresis: 0.3 dB minimum.
15
Agilent
TX
KEY:
YYWW = DATE CODE
FOR MULTIMODE MODULES:
XXXX-XXXX = HFBR-5208EM
ZZZZ = 1300 nm
FOR SINGLEMODE MODULES:
XXXX-XXXX = HFCT-5208EM
ZZZZ = 1300 nm
XXXX-XXXX
ZZZZZ LASER PROD
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
29.6
(1.16) UNCOMPRESSED
39.6
MAX.
(1.56)
12.7
(0.50)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4 MAX.
(1.00)
18.1
(0.711)
20.5
(0.805)
(
+0.1
0.25 -0.05
+0.004
0.010 -0.002
4.7
(0.185)
2.0 ± 0.1
SLOT WIDTH (0.079 ± 0.004)
3.3
(0.13)
10.2
MAX.
(0.40)
)
12.7
(0.50)
2.09 UNCOMPRESSED
(0.08)
9.8 MAX.
(0.386)
3.3 ± 0.38
(0.130 ± 0.015)
+0.25
0.46 -0.05
9X Ø
+0.010
0.018 -0.002
(
23.8
(0.937)
20.32
(0.800)
2X Ø
20.32
(0.800)
15.8 ± 0.15
(0.622 ± 0.006)
+0.25
1.27 -0.05
2X Ø
+0.010
0.050 -0.002
)
(
8X 2.54
(0.100)
1.3
(0.051)
20.32
(0.800)
14.5
(0.57)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X
±0.05 mm
Figure 8. Package Outline for HFBR/HFCT-5208EM
16
1.3
(0.05)
5.9
(0.23)
13.6
(0.54)
Masked insulator material (no metalization)
)
0.8
2X (0.032)
0.8
2X (0.032)
+0.5
-0.25
+0.02
0.43
-0.01
10.9
)
9.4
(0.37)
PCB BOTTOM VIEW
6.35
(0.25)
MODULE
PROTRUSION
3.5
(0.14)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X ±0.05 mm
Figure 9. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-5208EM
17
27.4 ± 0.50
(1.08 ± 0.02)
)
Agilent XXXX-XXXX
ZZZZZ LASER PROD
TX
21CFR(J) CLASS 1
COUNTRY OF ORIGIN YYWW
RX
KEY:
YYWW = DATE CODE
FOR MULTIMODE MODULES:
XXXX-XXXX = HFBR-5208FM
ZZZZ = 1300 nm
FOR SINGLEMODE MODULES:
XXXX-XXXX = HFCT-5208FM
ZZZZ = 1300 nm
39.6
MAX.
(1.56)
1.01
(0.04)
(
4.7
(0.185)
AREA
RESERVED
FOR
PROCESS
PLUG
25.4 MAX.
(1.00)
+0.1
0.25 -0.05
+0.004
0.010 -0.002
12.7
(0.50)
25.8
MAX.
(1.02)
)
10.2
MAX.
(0.40)
2.2
SLOT DEPTH
(0.09)
3.3 ± 0.38
(0.130 ± 0.015)
22.0
(0.87)
+0.25
0.46 -0.05
9X Ø
+0.010
0.018 -0.002
23.8
(0.937)
20.32
(0.800)
2X Ø
20.32
(0.800)
15.8 ± 0.15
(0.622 ± 0.006)
+0.25
1.27 -0.05
2X Ø
+0.010
0.050 -0.002
)
(
AREA
RESERVED
FOR
PROCESS
PLUG
8X 2.54
(0.100)
1.3
(0.051)
Figure 10. Package Outline for HFBR/HFCT-5208FM
20.32
(0.800)
14.5
(0.57)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X ±0.05 mm
18
SLOT WIDTH 2.0 ± 0.1
(0.079 ± 0.004)
14.4
(0.57)
9.8 MAX.
(0.386)
(
12.7
(0.50)
29.7
(1.17)
Masked insulator material (no metalization)
)
1.98
(0.078)
DIMENSION SHOWN FOR MOUNTING MODULE
FLUSH TO PANEL. THICKER PANEL WILL
RECESS MODULE. THINNER PANEL WILL
PROTRUDE MODULE.
1.27 SEPTUM
(0.05)
30.2
(1.19)
0.36
(0.014)
10.82
(0.426)
13.82
(0.544)
BOTTOM SIDE OF PCB
1.82
(0.072)
12.0
(0.47)
DIMENSIONS ARE IN MILLIMETERS (INCHES).
TOLERANCES: X.XX ±0.025 mm
UNLESS OTHERWISE SPECIFIED.
X.X ±0.05 mm
Figure 11. Suggested Module Positioning and Panel Cut-out for HFBR/HFCT-5208FM
19
KEEP OUT ZONE
26.4
(1.04)
14.73
(0.58)
Ordering Information
1300 nm LED (temperature range 0°C to +70°C)
HFBR-5208M
No shield, metallized housing.
HFBR-5208EM
Extended/protruding shield, metallized housing.
HFBR-5208FM
Flush shield, metallized housing.
1300 nm LED (temperature range -40°C to +85°C)
HFBR-5208AM
No shield, metallized housing.
HFBR-5208AEM
Extended/protruding shield, metallized housing.
HFBR-5208AFM
Flush shield, metallized housing.
1300 nm FP Laser (temperature range 0°C to +70°C)
HFCT-5208M
No shield, metallized housing.
HFCT-5208EM
Extended/protruding shield, metallized housing.
HFCT-5208FM
Flush shield, metallized housing.
1300 nm FP Laser (temperature range -40°C to +85°C)
HFCT-5208AM
No shield, metallized housing.
HFCT-5208AEM
Extended/protruding shield, metallized housing.
HFCT-5208AFM
Flush shield, metallized housing.
Supporting Documentation
HFBR-5208M/HFCT-5208M
HFBR-5208xx/HFCT-5208xx (0°C to +70°C)
HFBR-5208Axx (-40°C to +85°C)
HFCT-5208Axx (-40°C to +85°C)
HFCT-5208M/HFCT-5218M
HFBR-5208M
HFBR-5208M/HFCT-5208M/HFCT-5218M
www.semiconductor.agilent.com
Data subject to change.
Copyright © 2001 Agilent Technologies, Inc.
Obsoletes: 5988-2479EN
May 9, 2001
5988-2916EN
Application Note
Characterization Report
Characterization Report
Characterization Report
Qualification Report
Qualification Report
Reference Design Application Note 1178