CHM1290 20-30GHz SUB-HARMONICALLY PUMPED MIXER GaAs Monolithic Microwave IC Description The CHM1290 is a MFC which integrates a self biased LO buffer amplifier and a subharmonically diodes mixer for 2LO suppression It is usable both for up-conversion and downconversion. It is designed for a wide range of applications, typically commercial communication systems for broadband local access (LMDS). The backside of the chip is both RF and DC grounds. This helps simplify the assembly process. The circuit is manufactured with a PM-HEMT process, 0.25µm gate length, capacities over via holes, via holes through the substrate, air bridges and electron beam gate lithography. It is available in chip form. Main Features • • • • • • • Broadband performance : 20-30GHz 10dB conversion Loss 29dB 2LO to RF isolation -4dBm LO input power -3dBm input power 1 dB compression Low DC power consumption, [email protected] Chip size : 0.86 X 1.28 X 0.10 mm Main Characteristics Tamb. = 25°C Parameter Min Typ Max Unit FRF RF frequency range 20 30 GHz FLO LO frequency range 10 15 GHz FIF IF frequency range DC 6 GHz Lc Conversion Loss 12 dB 10 ESD Protection : Electrostatic discharge sensitive device. Observe handling precautions ! Ref. : DSCHM12902045 - 14-Feb.-02 1/6 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 20-30GHz SHP Mixer CHM1290 Electrical Characteristics for Broadband Operation Tamb = +25°C, Vd = 4.0V Id=33mA Symbol Parameter Min Typ Max Unit FRF RF frequency range 20 30 GHz FLO LO frequency range 10 15 GHz FIF IF frequency range DC 6 GHz Lc Conversion Loss 10 12 dB LO Input power -4 8 dBm PLO 2xLO Leak 2xLO Leakage (for PLO=-4dBm) IP1dB 30 Input power at 1dB gain compression -3 0 LO Match LO Matching 2.0:1 RF Match RF Matching 2.0:1 IF Match IF Matching 2.0:1 dBm 3 dBm Sz Chip size 1.1 mm² Id Bias current 33 mA Values Unit Absolute Maximum Ratings Tamb. = 25°C (1) Symbol Parameter Vd Drain bias voltage 5.0 V Id Drain bias current 50 mA TBD dBm Pin Maximum peak input power overdrive (2) Ta Operating temperature range -40 to +85 °C Storage temperature range -55 to +155 °C Tstg (1) Operation of this device above anyone of these parameters may cause permanent damage. (2) Duration < 1s. Ref. : DSCHM12902045 - 14-Feb.-02 2/6 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 20-30GHz SHP Mixer CHM1290 CHM1290 : Conversion Loss & Leakages Vds = 4.0V, Ids = 33mA ; LO Power = -4dBm / IF Frequency = 1.0GHz 0.0 5 Conversion Loss ( dB ) Lc (2xLO-IF) P LO @ RF P 2*LO @ RF 0 -5.0 -5 -7.5 -10 -10.0 -15 -12.5 -20 -15.0 -25 -17.5 -30 -20.0 -35 -22.5 -40 -25.0 -45 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 LO Frequency ( GHz ) CHM2190 : Conversion LOSS Vds = 4.0V, Ids = 33mA LO Power = -4dBm / IF Frequency = 2.0GHz -5 -6 -7 Conversion Gain ( dB ) -8 RF Freq. = 30GHz RF Freq. = 22GHz -9 -10 -11 -12 -13 -14 -15 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 LO Frequency ( GHz ) Ref. : DSCHM12902045 - 14-Feb.-02 3/6 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice Leakage @ LO & 2xLO ( dBm ) Lc (2xLO+IF) -2.5 20-30GHz SHP Mixer CHM1290 CHM1290 : Conversion Loss & Leakages Vds = 4.0V, Ids = 33mA ; LO Power = 0dBm / IF Frequency = 1.0GHz 5 0.0 Conversion Loss ( dB ) Lc (2xLO-IF) P LO @ RF P 2*LO @ RF 0 -5.0 -5 -7.5 -10 -10.0 -15 -12.5 -20 -15.0 -25 -17.5 -30 -20.0 -35 -22.5 -40 -45 -25.0 9.0 9.5 10.0 10.5 11.0 11.5 12.0 12.5 13.0 13.5 14.0 14.5 15.0 15.5 16.0 LO Frequency ( GHz ) Ref. : DSCHM12902045 - 14-Feb.-02 4/6 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice Leakage @ LO & 2xLO ( dBm ) Lc (2xLO+IF) -2.5 20-30GHz SHP Mixer CHM1290 Chip Assembly and Mechanical Data RF Input/Output bonding wires as short as possible Vd Voltage 10nF 120pF IF Input/Output DC coupled to diodes LO Input/Output bonding wires as short as possible Note : Supply feed should be capacitively bypassed. 25µm diameter gold wire is recommended Bonding pad positions 810 +/- 35 35 1280 +/- 35 860 760 260 140 35 ( Chip thickness : 100µm. All dimensions are in micrometers ) Ref. : DSCHM12902045 - 14-Feb.-02 5/6 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice 20-30GHz SHP Mixer CHM1290 Ordering Information Chip form : CHM1290-99F/00 Information furnished is believed to be accurate and reliable. However United Monolithic Semiconductors S.A.S. assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of United Monolithic Semiconductors S.A.S.. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. United Monolithic Semiconductors S.A.S. products are not authorised for use as critical components in life support devices or systems without express written approval from United Monolithic Semiconductors S.A.S. Ref. : DSCHM12902045 - 14-Feb.-02 6/6 Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE Tel.: +33 (0)1 69 33 03 08 - Fax : +33 (0)1 69 33 03 09 Specifications subject to change without notice