ON MC100E416 Quint differential line receiver Datasheet

 SEMICONDUCTOR TECHNICAL DATA
The MC10E416/100E416 is a 5-bit differential line receiving device.
The 2.0GHz of bandwidth provided by the high frequency outputs makes
the device ideal for buffering of very high speed oscillators.
A VBB pin is available to AC couple an input signal to the device. More
information on AC coupling can be found in the design handbook section
of this data book.
The design incorporates two stages of gain, internal to the device,
making it an excellent choice for use in high bandwidth amplifier
applications.
The differential inputs have internal clamp structures which will force
the Q output of a gate in an open input condition to go to a LOW state.
Thus, inputs of unused gates can be left open and will not affect the
operation of the rest of the device. Note that the input clamp will take
affect only if both inputs fall 2.5V below VCC.
• Differential D and Q; VBB available
•
•
•
•
•
QUINT DIFFERENTIAL
LINE RECEIVER
600ps Max. Propagation Delay
High Frequency Outputs
FN SUFFIX
PLASTIC PACKAGE
CASE 776-02
2 Stages of Gain
Extended 100E VEE Range of – 4.2V to – 5.46V
Internal 75kΩ Input Pulldown Resistors
Pinout: 28-Lead PLCC (Top View)
D3
D4
D4
VCCO
Q4
Q4
VCCO
25
24
23
22
21
20
19
18
Q3
27
17
Q3
D2
28
16
VCC
D0
Q0
VEE
1
15
Q2
D0
Q0
VBB
2
14
Q2
D1
Q1
D0
3
13
VCCO
D1
Q1
D0
4
D2
Q2
D2
Q2
D3
Q3
D3
Q3
D4
Q4
D4
Q4
D3
26
D2
12
5
6
7
8
9
10
11
D1
D1
VCCO
Q0
Q0
VCCO
Q1
* All VCC and VCCO pins are tied together on the die.
PIN NAMES
Pin
Function
D[0:4], D[0:4]
Differential Data Inputs
Q[0:4], Q[0:4]
Differential Data Outputs
Q1
LOGIC DIAGRAM
VBB
12/93
 Motorola, Inc. 1996
2–1
REV 2
MC10E416 MC100E416
DC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
VBB
Characteristic
Output Reference Voltage
10E
100E
IIH
Input HIGH Current
IEE
Power Supply Current
10E
100E
VPP(DC)
Input Sensitivity
min
typ
25°C
max
min
–1.27
–1.26
–1.35
–1.38
typ
85°C
max
min
–1.25
–1.26
–1.31
–1.38
typ
max
Unit
Condition
V
–1.38
–1.38
150
–1.19
–1.26
150
150
µA
mA
135
135
162
162
135
135
50
162
162
50
135
155
162
186
50
mV
1
VCMR
Common Mode Range
–1.5
0
–1.5
0
–1.5
0
V
2
1. Differential input voltage required to obtain a full ECL swing on the outputs.
2. VCMR is referenced to the most positive side of the differential input signal. Normal operation is obtained when the input signal are within the
VCMR range and the input swing is greater than VPP MIN and < 1.0V
AC CHARACTERISTICS (VEE = VEE(min) to VEE(max); VCC = VCCO = GND)
0°C
Symbol
Characteristic
25°C
85°C
min
typ
max
min
typ
max
min
typ
max
250
200
350
350
500
550
250
200
350
350
500
550
250
200
350
350
500
550
Unit
Condition
tPLH
tPHL
Propagation Delay to Output
d(Diff)
D(SE)
ps
tSKEW
Within-Device Skew
50
50
50
ps
1
tSKEW
Duty Cycle Skew
tPLH-tPHL
±10
±10
±10
ps
2
mV
3
VPP(AC)
Minimum Input Swing
150
tr
tf
Rise/Fall Time
20 - 80%
100
150
200
350
100
150
200
350
100
200
350
ps
1. Within-device skew is defined as identical transitions on similar paths through a device.
2. Duty cycle skew defined only for differential operation when the delays are measured from the cross point of the inputs to the cross point of
the outputs.
3. Minimum input swing for which AC parameters are guaranteed.
MOTOROLA
2–2
ECLinPS and ECLinPS Lite
DL140 — Rev 4
MC10E416 MC100E416
OUTLINE DIMENSIONS
FN SUFFIX
PLASTIC PLCC PACKAGE
CASE 776–02
ISSUE D
0.007 (0.180)
B
Y BRK
-N-
T L –M
M
U
0.007 (0.180)
X
G1
M
S
N
T L –M
S
S
N
S
D
Z
-L-
-M-
D
W
28
V
1
C
A
0.007 (0.180)
M
R
0.007 (0.180)
M
T L –M
S
T L –M
S
N
S
N
S
H
S
N
S
0.007 (0.180)
M
T L –M
N
S
S
0.004 (0.100)
G
J
-T-
K
SEATING
PLANE
F
VIEW S
G1
T L –M
S
N
0.007 (0.180)
M
T L –M
S
N
S
VIEW S
S
NOTES:
1. DATUMS -L-, -M-, AND -N- DETERMINED
WHERE TOP OF LEAD SHOULDER EXITS
PLASTIC BODY AT MOLD PARTING LINE.
2. DIM G1, TRUE POSITION TO BE MEASURED
AT DATUM -T-, SEATING PLANE.
3. DIM R AND U DO NOT INCLUDE MOLD FLASH.
ALLOWABLE MOLD FLASH IS 0.010 (0.250)
PER SIDE.
4. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
5. CONTROLLING DIMENSION: INCH.
6. THE PACKAGE TOP MAY BE SMALLER THAN
THE PACKAGE BOTTOM BY UP TO 0.012
(0.300). DIMENSIONS R AND U ARE
DETERMINED AT THE OUTERMOST
EXTREMES OF THE PLASTIC BODY
EXCLUSIVE OF MOLD FLASH, TIE BAR
BURRS, GATE BURRS AND INTERLEAD
FLASH, BUT INCLUDING ANY MISMATCH
BETWEEN THE TOP AND BOTTOM OF THE
PLASTIC BODY.
7. DIMENSION H DOES NOT INCLUDE DAMBAR
PROTRUSION OR INTRUSION. THE DAMBAR
PROTRUSION(S) SHALL NOT CAUSE THE H
DIMENSION TO BE GREATER THAN 0.037
(0.940). THE DAMBAR INTRUSION(S) SHALL
NOT CAUSE THE H DIMENSION TO BE
SMALLER THAN 0.025 (0.635).
ECLinPS and ECLinPS Lite
DL140 — Rev 4
T L –M
K1
E
S
S
VIEW D-D
Z
0.010 (0.250)
0.010 (0.250)
2–3
DIM
A
B
C
E
F
G
H
J
K
R
U
V
W
X
Y
Z
G1
K1
INCHES
MIN
MAX
0.485 0.495
0.485 0.495
0.165 0.180
0.090 0.110
0.013 0.019
0.050 BSC
0.026 0.032
0.020
—
0.025
—
0.450 0.456
0.450 0.456
0.042 0.048
0.042 0.048
0.042 0.056
—
0.020
2°
10°
0.410 0.430
0.040
—
MILLIMETERS
MIN
MAX
12.32 12.57
12.32 12.57
4.20
4.57
2.29
2.79
0.33
0.48
1.27 BSC
0.66
0.81
0.51
—
0.64
—
11.43
11.58
11.43
11.58
1.07
1.21
1.07
1.21
1.07
1.42
—
0.50
2°
10°
10.42 10.92
1.02
—
MOTOROLA
MC10E416 MC100E416
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the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
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2–4
*MC10E416/D*
MC10E416/D
ECLinPS and ECLinPS Lite
DL140 — Rev 4
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