Material Content Data Sheet Sales Product Name TLE82453-3SA MA# MA001270292 Package PG-DSO-36-54 Issued 18. May 2015 Weight* 2100.65 mg Construction Element Material Group Substances CAS# if applicable Weight [mg] Average Mass [%] chip leadframe inorganic material inorganic material non noble metal non noble metal non noble metal non noble metal organic material plastics inorganic material non noble metal noble metal noble metal non noble metal non noble metal < 10% silicon phosphorus zinc iron copper copper carbon black epoxy resin silicondioxide tin silver silver tin lead 7440-21-3 7723-14-0 7440-66-6 7439-89-6 7440-50-8 7440-50-8 1333-86-4 60676-86-0 7440-31-5 7440-22-4 7440-22-4 7440-31-5 7439-92-1 21.749 1.04 0.387 0.02 wire encapsulation leadfinish plating solder *deviation Sum [%] Average Mass [ppm] Sum [ppm] 1.04 10354 10354 184 1.547 0.07 737 30.947 1.47 14732 1256.594 59.82 61.38 598194 613847 2.672 0.13 0.13 1272 1272 1.521 0.07 724 69.947 3.33 688.822 32.79 36.19 327910 33298 361932 15.232 0.73 0.73 7251 7251 0.683 0.03 0.03 325 325 0.158 0.01 0.105 0.00 10.281 0.49 75 50 0.50 Sum in total: 100.00 Important Remarks: 1. 2. 3. Infineon Technologies AG provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. Infineon Technologies AG and Infineon Technologies AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. All statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. This product is in compliance with EU Directive 2011/65/EU (RoHS) and does not use any exemption. Company Infineon Technologies AG Address 81726 München Internet www.infineon.com 4894 5019 1000000