ON MBRB3030CTT4 Switchmode power rectifier Datasheet

MBRB3030CT
Preferred Device
SWITCHMODE
Power Rectifier
These state−of−the−art devices use the Schottky Barrier principle
with a proprietary barrier metal.
Features
•
•
•
•
•
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Guardring for Stress Protection
Maximum Die Size
175°C Operating Junction Temperature
Short Heat Sink Tab Manufactured − Not Sheared
Pb−Free Packages are Available
SCHOTTKY BARRIER
RECTIFIER
30 AMPERES, 30 VOLTS
Mechanical Characteristics:
• Case: Epoxy, Molded, Epoxy Meets UL 94 V−0
• Weight: 1.7 Grams (Approximately)
• Finish: All External Surfaces Corrosion Resistant and Terminal
1
4
3
Leads are Readily Solderable
• Lead and Mounting Surface Temperature for Soldering Purposes:
•
•
260°C Max. for 10 Seconds
Device Meets MSL1 Requirements
ESD Ratings: Machine Model, C (>400 V)
Human Body Model, 3B (>8000 V)
4
1
3
MAXIMUM RATINGS
Symbol
Value
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
30
V
D2PAK
CASE 418B
STYLE 3
Average Rectified Forward Current
(At Rated VR, TC = 134°C)
Per Device
Per Leg
IF(AV)
A
MARKING DIAGRAM
Peak Repetitive Forward Current
(At Rated VR, Square Wave,
20 kHz, TC = +137°C) Per Leg
IFRM
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions,
Halfwave, Single Phase, 60 Hz)
IFSM
200
A
Peak Repetitive Reverse Surge Current
(2.0 s, 1.0 kHz)
IRRM
2.0
A
Storage Temperature Range
Tstg
−55 to +175
°C
Operating Junction Temperature (Note 1)
TJ
−55 to +175
°C
dv/dt
10,000
V/s
W
100
mJ
Rating
Voltage Rate of Change (Rated VR)
Reverse Energy
(Unclamped Inductive Surge)
(Inductance = 3 mH, TC = 25°C)
30
15
30
A
AY WW
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. The heat generated must be less than the thermal conductivity from
Junction−to−Ambient: dPD/dTJ < 1/RJA.
 Semiconductor Components Industries, LLC, 2006
February, 2006 − Rev. 6
1
B3030CTG
AKA
A
Y
WW
B3030CT
G
AKA
= Assembly Location
= Year
= Work Week
= Device Code
= Pb−Free Package
= Diode Polarity
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 2 of this data sheet.
Preferred devices are recommended choices for future use
and best overall value.
Publication Order Number:
MBRB3030CT/D
MBRB3030CT
THERMAL CHARACTERISTICS (Per Leg)
Characteristic
Thermal Resistance, − Junction−to−Case
− Junction−to−Ambient (Note 2)
Symbol
Value
Unit
RJC
RJA
1.0
50
°C/W
Symbol
Value
Unit
2. When mounted using minimum recommended pad size on FR−4 board.
ELECTRICAL CHARACTERISTICS (Per Leg)
Characteristic
Maximum Instantaneous Forward Voltage (Note 3), Per Leg
(IF = 15 Amps, TC = +25°C)
(IF = 15 Amps, TC = +150°C)
(IF = 30 Amps, TC = +25°C)
(IF = 30 Amps, TC = +150°C)
VF
Maximum Instantaneous Reverse Current (Note 3), Per Leg
(Rated dc Voltage, TC = +25°C)
(Reverse Voltage = 10 V, TC = +150°C)
(Rated dc Voltage, TC = +150°C)
IR
V
0.54
0.47
0.67
0.66
mA
0.6
46
145
3. Pulse Test: Pulse Width = 300 s, Duty Cycle ≤ 2.0%.
ORDERING INFORMATION
Package
Shipping†
D2PAK
50 Units / Rail
MBRB3030CTG
D2PAK
(Pb−Free)
50 Units / Rail
MBRB3030CTT4
D2PAK
800 Units / Tape & Reel
D2PAK
(Pb−Free)
800 Units / Tape & Reel
Device
MBRB3030CT
MBRB3030CTT4G
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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2
MBRB3030CT
100
ÎÎÎÎ
10
TJ = 150°C
ÎÎ
25°C
1
ÎÎÎ
ÎÎÎ
100°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
ÎÎ
25°C
1
ÎÎ
ÎÎ
100°C
0.1
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
VF, INSTANTANEOUS VOLTAGE (V)
Figure 2. Typical Forward Voltage, Per Leg
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
ÎÎÎ
1.0
TJ = 150°C
0.01
100°C
0.001
10−4
10−5
5
10
15
20
25
TJ = 150°C
0.01
100°C
10−4
25°C
10−5
30
10−6
0
5
10
15
20
25
VR, REVERSE VOLTAGE (V)
VR, REVERSE VOLTAGE (V)
Figure 3. Maximum Reverse Current, Per Leg
Figure 4. Typical Reverse Current, Per Leg
TJ = 25°C
C, CAPACITANCE (pF)
5000
3000
MAXIMUM
TYPICAL
1000
800
600
1
10
VR, REVERSE VOLTAGE (V)
Figure 5. Capacitance
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3
0.8
ÎÎÎÎ
ÎÎÎÎ
ÎÎ
ÎÎÎ
ÎÎÎ
0.1
0.001
25°C
0
TJ = 150°C
VF, INSTANTANEOUS VOLTAGE (VOLTS)
0.1
10−6
ÎÎÎ
10
Figure 1. Maximum Forward Voltage, Per Leg
1.0
I R , REVERSE CURRENT (A)
I F, INSTANTANEOUS FORWARD CURRENT (A)
100
I R , REVERSE CURRENT (A)
I F, INSTANTANEOUS FORWARD CURRENT (A)
ELECTRICAL CHARACTERISTICS
30
MBRB3030CT
30
I F(AV), AVERAGE FORWARD CURRENT (A)
I F(AV), AVERAGE FORWARD CURRENT (A)
TYPICAL CHARACTERISTICS
RJC = 1°C/W
DC
20
SQUARE WAVE
IPK
= 5.0 (CAPACITIVE
IAV
LOAD)
π (RESISTIVE LOAD)
10
10
20
0
120
125
130
140
135
145
TC, CASE TEMPERATURE (°C)
150
RJA = 25°C/W
15
DC
20
0
155
PF(AV), AVERAGE FORWARD POWER DISSIPATION (W)
π (RESISTIVE LOAD)
SQUARE WAVE
6
IPK = 5.0 (CAPACITIVE
IAV
LOAD)
4
10
2
20
0
0
50
100
TA, AMBIENT TEMPERATURE (°C)
150
π (RESISTIVE LOAD)
15
TJ = 150°C
IPK = 5.0 (CAPACITIVE
IAV
LOAD)
DC
10
10
20
SQUARE WAVE
5
0
15
5
10
20
IF(AV), AVERAGE FORWARD CURRENT (A)
0
Figure 8. Current Derating, Free Air
25
Figure 9. Forward Power Dissipation
1.0
R(t), EFFECTIVE TRANSIENT THERMAL
RESISTANCE (NORMALIZED)
I F(AV), AVERAGE FORWARD CURRENT (A)
DC
150
50
100
TA, AMBIENT TEMPERATURE (°C)
0
Figure 7. Current Derating
RJA = 50°C/W
8
IPK = 5.0 (CAPACITIVE
IAV
LOAD)
10
5
Figure 6. Current Derating, Infinite Heatsink
10
SQUARE WAVE
10 π (RESISTIVE LOAD)
SINGLE PULSE
0.1
0.01
Ppk
tp
Ppk
TIME
DUTY CYCLE, D = tp/t1
PEAK POWER, Ppk, is peak of an
equivalent square power pulse.
t1
TJL = Ppk • RJL [D + (1 − D) • r(t1 + tp) + r(tp) − r(t1)]
where
TJL = the increase in junction temperature above the lead temperature
r(t) = normalized value of transient thermal resistance at time, t, for example,
r(t) = r(t1 + tp) = normalized value of transient thermal resistance at time, t1 + tp.
0.1
1.0
10
t, TIME (ms)
Figure 10. Thermal Response
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4
100
1000
MBRB3030CT
PACKAGE DIMENSIONS
D2PAK 3
CASE 418B−04
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING
PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 418B−01 THRU 418B−03 OBSOLETE,
NEW STANDARD 418B−04.
C
E
V
W
−B−
4
DIM
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
S
V
A
1
2
S
3
−T−
SEATING
PLANE
K
W
J
G
D
H
3 PL
0.13 (0.005)
VARIABLE
CONFIGURATION
ZONE
M
T B
M
N
R
M
STYLE 3:
PIN 1. ANODE
2. CATHODE
3. ANODE
4. CATHODE
P
U
L
L
L
M
M
F
F
F
VIEW W−W
1
VIEW W−W
2
VIEW W−W
3
SOLDERING FOOTPRINT*
8.38
0.33
1.016
0.04
10.66
0.42
5.08
0.20
3.05
0.12
17.02
0.67
SCALE 3:1
mm inches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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5
INCHES
MIN
MAX
0.340 0.380
0.380 0.405
0.160 0.190
0.020 0.035
0.045 0.055
0.310 0.350
0.100 BSC
0.080
0.110
0.018 0.025
0.090
0.110
0.052 0.072
0.280 0.320
0.197 REF
0.079 REF
0.039 REF
0.575 0.625
0.045 0.055
MILLIMETERS
MIN
MAX
8.64
9.65
9.65 10.29
4.06
4.83
0.51
0.89
1.14
1.40
7.87
8.89
2.54 BSC
2.03
2.79
0.46
0.64
2.29
2.79
1.32
1.83
7.11
8.13
5.00 REF
2.00 REF
0.99 REF
14.60 15.88
1.14
1.40
MBRB3030CT
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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For additional information, please contact your
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MBRB3030CT/D
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