AD AD9649 14-bit, 20/40/65/80 msps, 1.8 v analog-to-digital converter Datasheet

14-Bit, 20/40/65/80 MSPS,
1.8 V Analog-to-Digital Converter
AD9649
FEATURES
FUNCTIONAL BLOCK DIAGRAM
1.8 V analog supply operation
1.8 V to 3.3 V output supply
SNR
74.3 dBFS at 9.7 MHz input
71.5 dBFS at 200 MHz input
SFDR
93 dBc at 9.7 MHz input
80 dBc at 200 MHz input
Low power
45 mW at 20 MSPS
87 mW at 80 MSPS
Differential input with 700 MHz bandwidth
On-chip voltage reference and sample-and-hold circuit
2 V p-p differential analog input
DNL = ±0.35 LSB
Serial port control options
Offset binary, gray code, or twos complement data format
Integer 1, 2, or 4 input clock divider
Built-in selectable digital test pattern generation
Energy-saving power-down modes
Data clock out (DCO) with programmable clock and data
alignment
AVDD
APPLICATIONS
Communications
Diversity radio systems
Multimode digital receivers
GSM, EDGE, W-CDMA, LTE, CDMA2000, WiMAX, TD-SCDMA
Smart antenna systems
Battery-powered instruments
Handheld scope meters
Portable medical imaging
Ultrasound
Radar/LIDAR
GND
SDIO SCLK CSB
RBIAS
DRVDD
VCM
PROGRAMMING DATA
VIN+
ADC
CORE
VIN–
CMOS
OUTPUT BUFFER
SPI
VREF
OR
D13 (MSB)
D0 (LSB)
DCO
SENSE
AD9649
DIVIDE BY
1, 2, 4
MODE
CONTROLS
PDWN
CLK+ CLK–
DFS
MODE
08539-001
REF
SELECT
Figure 1.
PRODUCT HIGHLIGHTS
1.
2.
3.
4.
The AD9649 operates from a single 1.8 V analog power
supply and features a separate digital output driver supply
to accommodate 1.8 V to 3.3 V logic families.
The patented sample-and-hold circuit maintains excellent
performance for input frequencies up to 200 MHz and is
designed for low cost, low power, and ease of use.
A standard serial port interface (SPI) supports various
product features and functions, such as data output formatting, internal clock divider, power-down, DCO, data output
(D13 to D0) timing and offset adjustments, and voltage
reference modes.
The AD9649 is packaged in a 32-lead RoHS-compliant LFCSP
that is pin compatible with the AD9629 12-bit ADC and
the AD9609 10-bit ADC, enabling a simple migration path
between 10-bit and 14-bit converters sampling from 20 MSPS
to 80 MSPS.
Rev. 0
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other
rights of third parties that may result from its use. Specifications subject to change without notice. No
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Trademarks and registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700
www.analog.com
Fax: 781.461.3113
©2009 Analog Devices, Inc. All rights reserved.
AD9649
TABLE OF CONTENTS
Features .............................................................................................. 1
Voltage Reference ....................................................................... 19
Applications ....................................................................................... 1
Clock Input Considerations ...................................................... 20
Functional Block Diagram .............................................................. 1
Power Dissipation and Standby Mode .................................... 21
Product Highlights ........................................................................... 1
Digital Outputs ........................................................................... 22
Revision History ............................................................................... 2
Timing ......................................................................................... 22
General Description ......................................................................... 3
Built-In Self-Test (BIST) and Output Test .................................. 23
Specifications..................................................................................... 4
Built-In Self-Test (BIST) ............................................................ 23
DC Specifications ......................................................................... 4
Output Test Modes ..................................................................... 23
AC Specifications.......................................................................... 5
Serial Port Interface (SPI) .............................................................. 24
Digital Specifications ................................................................... 6
Configuration Using the SPI ..................................................... 24
Switching Specifications .............................................................. 7
Hardware Interface..................................................................... 25
Timing Specifications .................................................................. 8
Configuration Without the SPI ................................................ 25
Absolute Maximum Ratings............................................................ 9
SPI Accessible Features .............................................................. 25
Thermal Characteristics .............................................................. 9
Memory Map .................................................................................. 26
ESD Caution .................................................................................. 9
Reading the Memory Map Register Table............................... 26
Pin Configuration and Function Descriptions ........................... 10
Open Locations .......................................................................... 26
Typical Performance Characteristics ........................................... 11
Default Values ............................................................................. 26
AD9649-80 .................................................................................. 11
Memory Map Register Table ..................................................... 27
AD9649-65 .................................................................................. 13
Memory Map Register Descriptions ........................................ 29
AD9649-40 .................................................................................. 14
Applications Information .............................................................. 30
AD9649-20 .................................................................................. 15
Design Guidelines ...................................................................... 30
Equivalent Circuits ......................................................................... 16
Outline Dimensions ....................................................................... 31
Theory of Operation ...................................................................... 17
Ordering Guide .......................................................................... 31
Analog Input Considerations.................................................... 17
REVISION HISTORY
10/09—Revision 0: Initial Version
Rev. 0 | Page 2 of 32
AD9649
GENERAL DESCRIPTION
The AD9649 is a monolithic, single channel 1.8 V supply, 14-bit,
20/40/65/80 MSPS analog-to-digital converter (ADC). It features
a high performance sample-and-hold circuit and an on-chip voltage reference.
deterministic and pseudorandom patterns, along with custom
user-defined test patterns entered via the serial port interface (SPI).
The product uses multistage differential pipeline architecture
with output error correction logic to provide 14-bit accuracy at
80 MSPS data rates and to guarantee no missing codes over the
full operating temperature range.
The digital output data is presented in offset binary, gray code, or
twos complement format. A data output clock (DCO) is provided
to ensure proper latch timing with receiving logic. Both 1.8 V and
3.3 V CMOS levels are supported.
The ADC contains several features designed to maximize
flexibility and minimize system cost, such as programmable
clock and data alignment and programmable digital test pattern
generation. The available digital test patterns include built-in
The AD9649 is available in a 32-lead RoHS-compliant LFCSP and
is specified over the industrial temperature range (−40°C to
+85°C).
A differential clock input with optional 1, 2, or 4 divide ratios
controls all internal conversion cycles.
Rev. 0 | Page 3 of 32
AD9649
SPECIFICATIONS
DC SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
Table 1.
Parameter
RESOLUTION
ACCURACY
No Missing Codes
Offset Error
Gain Error 1
Differential Nonlinearity (DNL) 2
Integral Nonlinearity (INL)2
TEMPERATURE DRIFT
Offset Error
INTERNAL VOLTAGE REFERENCE
Output Voltage (1 V Mode)
Load Regulation Error at 1.0 mA
INPUT-REFERRED NOISE
VREF = 1.0 V
ANALOG INPUT
Input Span, VREF = 1.0 V
Input Capacitance 3
Input Common-Mode Voltage
Input Common-Mode Range
REFERENCE INPUT RESISTANCE
POWER SUPPLIES
Supply Voltage
AVDD
DRVDD
Supply Current
IAVDD2
IDRVDD2 (1.8 V)
IDRVDD2 (3.3 V)
POWER CONSUMPTION
DC Input
2
Sine Wave Input (DRVDD = 1.8 V)
Sine Wave Input2 (DRVDD = 3.3 V)
Standby Power 4
Power-Down Power
Temp
Full
Full
Full
Full
Full
25°C
Full
25°C
AD9649-20/AD9649-40
Min
Typ
Max
14
−0.40
Full
Full
Full
Guaranteed
+0.05
+0.50
−1.5
±0.50
±0.25
±1.30
±0.50
Min
14
AD9649-65
Typ
Max
Guaranteed
−0.40 +0.05 +0.50
−1.5
+0.55
±0.3
±1.30
±0.50
±2
0.984
Min
14
AD9649-80
Typ
Max
Guaranteed
−0.40 +0.05 +0.50
−1.5
±0.65
±0.35
±1.75
±0.60
±2
0.996
2
1.008
0.984
0.996
2
±2
1.008
0.984
0.996
2
Unit
Bits
% FSR
% FSR
LSB
LSB
LSB
LSB
ppm/°C
1.008
V
mV
25°C
0.98
0.98
0.98
LSB rms
Full
Full
Full
Full
Full
2
6
0.9
2
6
0.9
2
6
0.9
V p-p
pF
V
V
kΩ
Full
Full
0.5
1.3
0.5
7.5
1.7
1.7
1.3
0.5
7.5
1.8
1.9
3.6
Full
Full
Full
25.0/31.3
1.6/2.9
3.0/5.3
27.3/33.7
Full
Full
Full
Full
Full
45.2/57.2
47.9/61.6
54.9/73.8
34/34
0.5
51.8/65.8
1
1.7
1.7
1.8
1.9
3.6
41.0
4.7
8.4
44.0
75.2
82.3
101.5
34
0.5
1.7
1.7
87.5
Measured with 1.0 V external reference.
Measured with a 10 MHz input frequency at rated sample rate, full-scale sine wave, with approximately 5 pF loading on each output bit.
3
Input capacitance refers to the effective capacitance between one differential input pin and ground.
4
Standby power is measured with a dc input and the CLK+, CLK− active.
2
Rev. 0 | Page 4 of 32
1.3
7.5
1.8
1.9
3.6
V
V
47.0
5.6
10.2
50.0
mA
mA
mA
86.8
94.7
118.3
34
0.5
100
mW
mW
mW
mW
mW
AD9649
AC SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
Table 2.
Parameter 1
SIGNAL-TO-NOISE RATIO (SNR)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 200 MHz
SIGNAL-TO-NOISE-AND-DISTORTION (SINAD)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 200 MHz
EFFECTIVE NUMBER OF BITS (ENOB)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 200 MHz
WORST SECOND OR THIRD HARMONIC
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 200 MHz
SPURIOUS-FREE DYNAMIC RANGE (SFDR)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 200 MHz
WORST OTHER (HARMONIC OR SPUR)
fIN = 9.7 MHz
fIN = 30.5 MHz
fIN = 70 MHz
fIN = 200 MHz
TWO-TONE SFDR
fIN = 30.5 MHz (−7 dBFS), 32.5 MHz (−7 dBFS)
ANALOG INPUT BANDWIDTH
1
Temp
25°C
25°C
Full
25°C
Full
25°C
25°C
25°C
Full
25°C
Full
25°C
AD9649-20/AD9649-40
Min
Typ
Max
Min
74.7
74.4
AD9649-65
Typ
Max
Min
74.5
74.3
73.1
AD9649-80
Typ
Max
74.3
74.1
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
73.6
73.7
73.7
73.6
72.7
71.5
71.5
71.5
74.6
74.3
74.4
74.2
74.1
74.0
Unit
70.0
70.0
70.0
dBFS
dBFS
dBFS
dBFS
dBFS
dBFS
25°C
25°C
25°C
25°C
12.0
12.0
11.9
11.3
12.0
12.0
11.9
11.3
12.0
12.0
11.9
11.3
Bits
Bits
Bits
Bits
25°C
25°C
Full
25°C
Full
25°C
−95
−95
−95
−95
−93
−93
dBc
dBc
dBc
dBc
dBc
dBc
25°C
25°C
Full
25°C
Full
25°C
73.0
73.5
73.6
73.6
73.5
72.6
−82
−83
−94
−94
−92
−80
−80
−80
95
94
95
94
93
93
−82
82
dBc
dBc
dBc
dBc
dBc
dBc
83
93
93
92
82
80
80
80
25°C
25°C
Full
25°C
Full
25°C
−100
−100
−100
−100
−100
−100
25°C
25°C
−100
−100
−100
−95
−95
−95
dBc
dBc
dBc
dBc
dBc
dBc
90
700
90
700
90
700
dBc
MHz
−90
−90
−90
See the AN-835 Application Note, Understanding High Speed ADC Testing and Evaluation, for a complete set of definitions.
Rev. 0 | Page 5 of 32
AD9649
DIGITAL SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
Table 3.
Parameter
DIFFERENTIAL CLOCK INPUTS (CLK+, CLK−)
Logic Compliance
Internal Common-Mode Bias
Differential Input Voltage
Input Voltage Range
High Level Input Current
Low Level Input Current
Input Resistance
Input Capacitance
LOGIC INPUTS (SCLK/DFS, MODE, SDIO/PDWN)1
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Input Capacitance
LOGIC INPUTS (CSB)2
High Level Input Voltage
Low Level Input Voltage
High Level Input Current
Low Level Input Current
Input Resistance
Input Capacitance
DIGITAL OUTPUTS
DRVDD = 3.3 V
High Level Output Voltage (IOH)
IOH = 50 μA
IOH = 0.5 mA
Low Level Output Voltage (IOL)
IOL = 1.6 mA
IOL = 50 μA
DRVDD = 1.8 V
High Level Output Voltage (IOH)
IOH = 50 μA
IOH = 0.5 mA
Low Level Output Voltage (IOL)
IOL = 1.6 mA
IOL = 50 μA
1
2
Temp
Full
Full
Full
Full
Full
Full
Full
AD9649-20/AD9649-40/AD9649-65/AD9649-80
Min
Typ
Max
CMOS/LVDS/LVPECL
0.9
0.2
GND − 0.3
−10
−10
8
Full
Full
Full
Full
Full
Full
1.2
0
−50
−10
Full
Full
Full
Full
Full
Full
1.2
0
−10
40
Full
Full
3.29
3.25
V
V
μA
μA
kΩ
pF
DRVDD + 0.3
0.8
+10
135
V
V
μA
μA
kΩ
pF
26
2
V
V
0.2
0.05
1.79
1.75
Full
Full
Internal 30 kΩ pull-down.
Internal 30 kΩ pull-up.
Rev. 0 | Page 6 of 32
V
V p-p
V
μA
μA
kΩ
pF
DRVDD + 0.3
0.8
−75
+10
30
2
Full
Full
Full
Full
10
4
3.6
AVDD + 0.2
+10
+10
12
Unit
V
V
V
V
0.2
0.05
V
V
AD9649
SWITCHING SPECIFICATIONS
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty
cycle clock, unless otherwise noted.
Table 4.
Parameter
CLOCK INPUT PARAMETERS
Input Clock Rate
Conversion Rate 1
CLK Period, Divide-by-1 Mode (tCLK)
CLK Pulse Width High (tCH)
Aperture Delay (tA)
Aperture Uncertainty (Jitter, tJ)
DATA OUTPUT PARAMETERS
Data Propagation Delay (tPD)
DCO Propagation Delay (tDCO)
DCO to Data Skew (tSKEW)
Pipeline Delay (Latency)
Wake-Up Time 2
Standby
OUT-OF-RANGE RECOVERY TIME
2
Full
Full
Full
AD9649-20/AD9649-40
Min
Typ
Max
80/160
20/40
Min
AD9649-65
Typ
Max
AD9649-80
Typ
Max
Full
Full
25.0/12.5
1.0
0.1
7.69
1.0
0.1
6.25
1.0
0.1
Full
Full
Full
Full
Full
Full
Full
3
3
0.1
8
350
600/400
2
3
3
0.1
8
350
300
2
3
3
0.1
8
350
260
2
ns
ns
ns
Cycles
μs
ns
Cycles
50/25
3
15.38
320
80
Unit
MHz
MSPS
ns
ns
ns
ps rms
3
260
65
Min
3
12.5
Conversion rate is the clock rate after the CLK divider.
Wake-up time is dependent on the value of the decoupling capacitors.
N–1
N+4
tA
N+5
N
N+3
VIN
N+1
tCH
N+2
tCLK
CLK+
CLK–
tDCO
DCO
tSKEW
DATA
N–8
N–7
N–6
tPD
Figure 2. CMOS Output Data Timing
Rev. 0 | Page 7 of 32
N–5
N–4
08539-002
1
Temp
AD9649
TIMING SPECIFICATIONS
Table 5.
Parameter
SPI TIMING REQUIREMENTS
tDS
tDH
tCLK
tS
tH
tHIGH
tLOW
tEN_SDIO
tDIS_SDIO
Conditions
Min
Setup time between the data and the rising edge of SCLK
Hold time between the data and the rising edge of SCLK
Period of the SCLK
Setup time between CSB and SCLK
Hold time between CSB and SCLK
SCLK pulse width high
SCLK pulse width low
Time required for the SDIO pin to switch from an input to an
output relative to the SCLK falling edge
Time required for the SDIO pin to switch from an output to an
input relative to the SCLK rising edge
2
2
40
2
2
10
10
10
ns
ns
ns
ns
ns
ns
ns
ns
10
ns
Rev. 0 | Page 8 of 32
Typ
Max
Unit
AD9649
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 6.
Parameter
AVDD to AGND1
DRVDD to AGND1
VIN+, VIN− to AGND1
CLK+, CLK− to AGND1
VREF to AGND1
SENSE to AGND1
VCM to AGND1
RBIAS to AGND1
CSB to AGND1
SCLK/DFS to AGND1
SDIO/PDWN to AGND1
MODE/OR to AGND1
D0 through D13 to AGND1
DCO to AGND1
Operating Temperature Range (Ambient)
Maximum Junction Temperature Under Bias
Storage Temperature Range (Ambient)
1
Rating
−0.3 V to +2.0 V
−0.3 V to +3.9 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to AVDD + 0.2 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to DRVDD + 0.3 V
−40°C to +85°C
150°C
−65°C to +150°C
AGND refers to the analog ground of the customer’s PCB.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
The exposed paddle is the only ground connection for the chip
and must be soldered to the analog ground plane of the user’s
PCB. Soldering the exposed paddle to the user’s board also
increases the reliability of the solder joints and maximizes the
thermal capability of the package.
Table 7. Thermal Resistance
Package
Type
32-Lead LFCSP
5 mm × 5 mm
Airflow
Velocity
(m/sec)
0
1.0
2.5
θJA1, 2
37.1
32.4
29.1
θJC1, 3
3.1
θJB1, 4
20.7
ΨJT1,2
0.3
0.5
0.8
Unit
°C/W
°C/W
°C/W
1
Per JEDEC 51-7, plus JEDEC 51-5 2S2P test board.
Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (moving air).
Per MIL-Std 883, Method 1012.1.
4
Per JEDEC JESD51-8 (still air).
2
3
Typical θJA is specified for a 4-layer PCB with a solid ground
plane. As shown in Table 7, airflow improves heat dissipation,
which reduces θJA. In addition, metal in direct contact with the
package leads from metal traces, through holes, ground, and
power planes, reduces the θJA.
ESD CAUTION
Rev. 0 | Page 9 of 32
AD9649
32
31
30
29
28
27
26
25
AVDD
VIN+
VIN–
AVDD
RBIAS
VCM
SENSE
VREF
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
PIN 1
INDICATOR
AD9649
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
AVDD
MODE/OR
DCO
D13 (MSB)
D12
D11
D10
D9
D2
D3
D4
D5
DRVDD
D6
D7
D8
08539-003
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
CLK+
CLK–
AVDD
CSB
SCLK/DFS
SDIO/PDWN
D0 (LSB)
D1
NOTES
1. THE EXPOSED PADDLE MUST BE SOLDERED TO THE ANALOG GROUND
PLANE OF THE PCB TO ENSURE PROPER FUNCTIONALITY AND MAXIMIZE
THE HEAT DISSIPATION, NOISE, AND MECHANICAL STRENGTH BENEFITS.
Figure 3. Pin Configuration
Table 8. Pin Function Descriptions
Pin No.
0 (EP)
Mnemonic
GND
1, 2
3, 24, 29, 32
4
5
CLK+, CLK−
AVDD
CSB
SCLK/DFS
6
SDIO/PDWN
7 to 12, 14 to 21
13
22
23
D0 (LSB) to
D13 (MSB)
DRVDD
DCO
MODE/OR
25
26
27
28
30, 31
VREF
SENSE
VCM
RBIAS
VIN−, VIN+
Description
Exposed Paddle. The exposed paddle is the only ground connection. It must be soldered to the analog
ground of the customer’s PCB to ensure proper functionality and maximize the heat dissipation, noise,
and mechanical strength benefits.
Differential Encode Clock for PECL, LVDS, or 1.8 V CMOS Inputs.
1.8 V Supply Pin for the ADC CORE Domain.
SPI Chip Select. Active low enable, 30 kΩ internal pull-up.
SPI Clock Input in SPI Mode (SCLK). 30 kΩ internal pull-down.
Data Format Select in Non-SPI Mode (DFS). Static control of data output format. 30 kΩ internal pull-down.
DFS high = twos complement output; DFS low = offset binary output.
SPI Data Input/Output (SDIO). Bidirectional SPI data I/O with 30 kΩ internal pull-down.
Non-SPI Mode Power-Down (PDWN). Static control of chip power-down with 30 kΩ internal pull-down.
See Table 14 for details.
ADC Digital Outputs.
1.8 V to 3.3 V Supply Pin for Output Driver Domain.
Data Clock Digital Output.
Chip Mode Select Input in SPI Mode (MODE).
Out-of-Range Digital Output in SPI Mode or in Non-SPI Mode (OR).
Default = out-of-range (OR) digital output (SPI Register 0x2A, Bit 0 = 1).
Option = chip mode select input (SPI Register 0x2A, Bit 0 = 0).
Chip power-down (SPI Register 0x08, Bits[7:5] = 100).
Chip stand-by (SPI Register 0x08, Bits[7:5] = 101).
Normal operation, output disabled (SPI Register 0x08, Bits[7:5] = 110).
Normal operation, output enabled (SPI Register 0x08, Bits[7:5] = 111).
In non-SPI mode, the pin operates only as an out-of-range (OR) digital output.
1.0 V Voltage Reference Input/Output. See Table 10.
Reference Mode Selection. See Table 10.
Analog Output Voltage at Mid AVDD Supply. Sets common mode of the analog inputs.
Set Analog Current Bias. Connect to 10 kΩ (1% tolerance) resistor to ground.
ADC Analog Inputs.
Rev. 0 | Page 10 of 32
AD9649
TYPICAL PERFORMANCE CHARACTERISTICS
AD9649-80
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty cycle
clock, unless otherwise noted.
0
0
80MSPS
9.7MHz @ –1dBFS
SNR = 73.4dB (74.4dBFS)
SFDR = 94.4dBc
–15
–15
–30
AMPLITUDE (dBFS)
–45
–60
–75
–90
3
2
–105
5
6
4
–60
–75
–90
3
2
5
–105
–120
6
4
8
12
16
20
24
28
FREQUENCY (MHz)
32
08539-033
–120
4
36
4
8
12
16
20
24
28
FREQUENCY (MHz)
32
36
Figure 4. AD9649-80 Single-Tone FFT with fIN = 9.7 MHz
Figure 7. AD9649-80 Single-Tone FFT with fIN = 30.5 MHz
0
0
80MSPS
70.3MHz @ –1dBFS
SNR = 72.1dB (73.1dBFS)
SFDR = 93.5dBc
–15
–15
–30
80MSPS
200MHz @ –1dBFS
SNR = 70.5dB (71.5dBFS)
SFDR = 80.2dBc
–30
AMPLITUDE (dBFS)
AMPLITUDE (dBFS)
–45
08539-034
AMPLITUDE (dBFS)
–30
80MSPS
30.5MHz @ –1dBFS
SNR = 73.2dB (74.2dBFS)
SFDR = 93.6dBc
–45
–60
–75
–90
2
–60
–75
2
3
–90
3
6
–105
–45
4
5
–105
4 6
5
–120
12
16
20
24
28
FREQUENCY (MHz)
32
36
–120
4
8
12
32
36
Figure 5. AD9649-80 Single-Tone FFT with fIN = 70.3 MHz
Figure 8. AD9649-80 Single-Tone FFT with fIN = 200 MHz
0
0
–15
80MSPS
30.5MHz @ –7dBFS
32.5MHz @ –7dBFS
SFDR = 89.5dBc (96.5dBFS)
–20
SFDR/IMD3 (dBc/dBFS)
–30
AMPLITUDE (dBFS)
16
20
24
28
FREQUENCY (MHz)
–45
–60
–75
–90
2F1 + F2
2F2 + F1
F1 + F2
F2 – F1
08539-036
8
08539-062
4
SFDR (dBc)
–40
IMD3 (dBc)
–60
–80
SFDR (dBFS)
2F1 – F2
2F2 – F1
–100
–105
IMD3 (dBFS)
8
12
16
20
24
28
FREQUENCY (MHz)
32
36
08539-200
4
–120
–90
Figure 6. AD9649-80 Two-Tone FFT with fIN1 = 30.5 MHz and fIN2 = 32.5 MHz
–78
–66
–54
–42
–30
INPUT AMPLITUDE (dBFS)
–18
–6
08539-054
–120
Figure 9. AD9649-80 Two-Tone SFDR/IMD3 vs. Input Amplitude (AIN)
with fIN1 = 30.5 MHz and fIN2 = 32.5 MHz
Rev. 0 | Page 11 of 32
AD9649
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty cycle
clock, unless otherwise noted.
120
100
SFDR (dBc)
90
SFDRFS
100
70
SNR (dBFS)
SNR/SFDR (dBFS)
SNR/SFDR (dBFS/dBc)
80
60
50
40
80
SNRFS
60
SFDR
40
30
SNR
20
20
0
50
100
150
INPUT FREQUENCY (MHz)
200
0
–90
08539-057
0
–80
–60
–40
INPUT AMPLITUDE (dBFS)
–20
0
08539-061
10
Figure 13. AD9649-80 SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
Figure 10. AD9649-80 SNR/SFDR vs. Input Frequency (AIN)
with 2 V p-p Full Scale
450,000
120
400,000
SFDR (dBc)
100
SNR (dBFS)
80
NUMBER OF HITS
SNR/SFDR (dBFS/dBc)
350,000
60
40
300,000
250,000
200,000
150,000
100,000
20
20
30
40
50
60
SAMPLE RATE (MSPS)
70
80
0
08539-055
0
10
N–4 N–3 N–2
N–1
N
N+1 N+2 N+3 N+4
OUTPUT CODE
08539-048
50,000
Figure 14. AD9649-80 Grounded Input Histogram
Figure 11. AD9649-80 SNR/SFDR vs. Sample Rate with AIN = 9.7 MHz
2.0
0.5
0.4
1.5
0.3
1.0
INL ERROR (LSB)
0.1
0
–0.1
–0.2
0.5
0
–0.5
–1.0
–0.3
–0.4
–0.5
0
2048
4096
–2.0
0
6144
8192 10,240 12,288 14,336 16,384
OUTPUT CODE
Figure 12. AD9649-80 DNL Error with fIN = 9.7 MHz
2048
4096
6144
8192 10,240 12,288 14,336 16,384
OUTPUT CODE
Figure 15. AD9649-80 INL with fIN = 9.7 MHz
Rev. 0 | Page 12 of 32
08539-037
–1.5
08539-038
DNL ERROR (LSB)
0.2
AD9649
AD9649-65
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty cycle
clock, unless otherwise noted.
0
120
65MSPS
9.7MHz @ –1dBFS
SNR = 73.5dB (74.5dBFS)
SFDR = 97.7dBc
–15
SFDRFS
100
SNR/SFDR (dBFS)
AMPLITUDE (dBFS)
–30
–45
–60
–75
80
SNRFS
60
SFDR
40
–90
SNR
5
6
–105
2
4
3
20
6
9
12
15
18
21
FREQUENCY (MHz)
24
27
0
–90
08539-030
3
30
Figure 16. AD9649-65 Single-Tone FFT with fIN = 9.7 MHz
90
SNR/SFDR (dBFS/dBc)
–45
–60
–75
–90
2
3
–105
4
5
SFDR (dBc)
70
SNR (dBFS)
60
50
40
30
20
6
10
–120
6
9
12
15
18
21
FREQUENCY (MHz)
24
27
30
0
08539-032
3
0
65MSPS
30.5MHz @ –1dBFS
SNR = 73.3dB (74.3dBFS)
SFDR = 99.3dBc
–30
–45
–60
–75
–90
3
5
2
6
4
6
9
12
15
18
21
FREQUENCY (MHz)
24
27
30
08539-031
–120
3
100
150
INPUT FREQUENCY (MHz)
200
Figure 20. AD9649-65 SNR/SFDR vs. Input Frequency (AIN)
with 2 V p-p Full Scale
Figure 17. AD9649-65 Single-Tone FFT with fIN = 70.3 MHz
–105
50
Figure 18. AD9649-65 Single-Tone FFT with fIN = 30.5 MHz
Rev. 0 | Page 13 of 32
08539-056
AMPLITUDE (dBFS)
0
80
–30
AMPLITUDE (dBFS)
–20
100
65MSPS
70.3MHz @ –1dBFS
SNR = 72.6dB (73.6dBFS)
SFDR = 94.1dBc
–15
–15
–60
–40
INPUT AMPLITUDE (dBFS)
Figure 19.AD9649-65 SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
0
0
–80
08539-060
–120
AD9649
AD9649-40
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty cycle
clock, unless otherwise noted.
0
–15
120
40MSPS
9.7MHz @ –1dBFS
SNR = 73.5dB (74.5dBFS)
SFDR = 95.4dBc
SFDRFS
100
SNR/SFDR (dBFS)
AMPLITUDE (dB)
–30
–45
–60
–75
–90
–105
80
SNRFS
60
SFDR
40
SNR
4
5
3
2
6
20
4
6
8
10
12
14
FREQUENCY (MHz)
16
18
Figure 21. AD9649-40 Single-Tone FFT with fIN = 9.7 MHz
0
–15
0
–90
08539-028
2
40MSPS
30.5MHz @ –1dBFS
SNR = 73.2dB (74.2dBFS)
SFDR = 95.7dBc
–60
–75
–90
5
3
2
6
–120
2
4
6
8
10
12
14
FREQUENCY (MHz)
16
18
08539-029
AMPLITUDE (dBFS)
–45
4
–60
–40
INPUT AMPLITUDE (dBFS)
–20
0
Figure 23. AD9649-40 SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
–30
–105
–80
08539-059
–120
Figure 22. AD9649-40 Single-Tone FFT with fIN = 30.5 MHz
Rev. 0 | Page 14 of 32
AD9649
AD9649-20
AVDD = 1.8 V; DRVDD = 1.8 V, maximum sample rate, 2 V p-p differential input, 1.0 V internal reference; AIN = −1.0 dBFS, 50% duty cycle
clock, unless otherwise noted.
0
–15
120
20MSPS
9.7MHz @ –1dBFS
SNR = 73.5dBFS (74.5dBFS)
SFDR = 97.2dBc
SFDR (dBFS)
100
SNR/SFDR (dBc/dBFS)
AMPLITUDE (dBFS)
–30
–45
–60
–75
–90
–105
2
4
5 3
6
SNR (dBFS)
80
60
SFDR (dBc)
40
SNR (dBc)
20
0
–100
08539-024
950k 1.90 2.85 3.80 4.75 5.70 6.65 7.60 8.55 9.50
FREQUENCY (MHz)
Figure 24. AD9649-20 Single-Tone FFT with fIN = 9.7 MHz
20MSPS
30.5MHz @ –1dBFS
SNR = 73.2dB (74.2dBFS)
SFDR = 98.1dBc
–45
–60
–75
–90
2
4
6
5
3
–120
950k 1.90 2.85 3.80 4.75 5.70 6.65 7.60 8.55 9.50
FREQUENCY (MHz)
08539-026
AMPLITUDE (dBFS)
–30
–105
–80
–70 –60 –50 –40 –30
INPUT AMPLITUDE (dBFS)
–20
–10
0
Figure 26. AD9649-20 SNR/SFDR vs. Input Amplitude (AIN) with fIN = 9.7 MHz
0
–15
–90
08539-058
–120
Figure 25. AD9649-20 Single-Tone FFT with fIN = 30.5 MHz
Rev. 0 | Page 15 of 32
AD9649
EQUIVALENT CIRCUITS
DRVDD
AVDD
08539-039
08539-042
VIN±
Figure 31. Equivalent D0 to D13 and OR Digital Output Circuit
Figure 27. Equivalent Analog Input Circuit
DRVDD
AVDD
SCLK/DFS,
MODE,
SDIO/PDWN
VREF
30kΩ
08539-047
7.5kΩ
350Ω
08539-043
375Ω
Figure 32. Equivalent SCLK/DFS, MODE and SDIO/PDWN Input Circuit
Figure 28. Equivalent VREF Circuit
AVDD
DRVDD
AVDD
375Ω
SENSE
30kΩ
350Ω
08539-045
08539-046
CSB
Figure 29. Equivalent SENSE Circuit
CLK+
Figure 33. Equivalent CSB Input Circuit
5Ω
15kΩ
0.9V
AVDD
15kΩ
CLK–
5Ω
375Ω
08539-044
08539-040
RBIAS
AND VCM
Figure 34. Equivalent RBIAS, VCM Circuit
Figure 30. Equivalent Clock Input Circuit
Rev. 0 | Page 16 of 32
AD9649
THEORY OF OPERATION
Each stage of the pipeline, excluding the last, consists of a low
resolution flash ADC connected to a switched-capacitor DAC
and an interstage residue amplifier (for example, a multiplying
digital-to-analog converter (MDAC)). The residue amplifier
magnifies the difference between the reconstructed DAC output
and the flash input for the next stage in the pipeline. One bit of
redundancy is used in each stage to facilitate digital correction
of flash errors. The last stage consists of a flash ADC.
high IF frequencies. Either a shunt capacitor or two single-ended
capacitors can be placed on the inputs to provide a matching passive network. This ultimately creates a low-pass filter at the input
to limit unwanted broadband noise. See the AN-742 Application
Note, the AN-827 Application Note, and the Analog Dialogue
article, “Transformer-Coupled Front-End for Wideband A/D
Converters” (Volume 39, April 2005) for more information. In
general, the precise values depend on the application.
Input Common Mode
The analog inputs of the AD9649 are not internally dc-biased.
Therefore, in ac-coupled applications, the user must provide an
external dc bias. Setting the device so that VCM = AVDD/2
is recommended for optimum performance, but the device can
function over a wider range with reasonable performance, as
shown in Figure 36 and Figure 37.
100
The output staging block aligns the data, corrects errors, and
passes the data to the CMOS output buffers. The output buffers
are powered from a separate (DRVDD) supply, allowing adjustment of the output voltage swing. During power-down, the output
buffers go into a high impedance state.
SFDR (dBc)
SNR/SFDR (dBFS/dBc)
90
ANALOG INPUT CONSIDERATIONS
The analog input to the AD9649 is a differential switchedcapacitor circuit designed for processing differential input
signals. This circuit can support a wide common-mode range
while maintaining excellent performance. By using an input
common-mode voltage of midsupply, users can minimize
signal-dependent errors and achieve optimum performance.
80
SNR (dBFS)
70
60
50
0.5
0.6
0.7
0.8
0.9
1.0
1.1
INPUT COMMON-MODE VOLTAGE (V)
1.2
1.3
08539-049
The AD9649 architecture consists of a multistage, pipelined ADC.
Each stage provides sufficient overlap to correct for flash errors in
the preceding stage. The quantized outputs from each stage are
combined into a final 14-bit result in the digital correction logic.
The pipelined architecture permits the first stage to operate with
a new input sample, whereas the remaining stages operate with preceding samples. Sampling occurs on the rising edge of the clock.
Figure 36. SNR/SFDR vs. Input Common-Mode Voltage,
fIN = 32.1 MHz, fS = 80 MSPS
H
CPAR
100
H
VIN+
CSAMPLE
S
S
S
SFDR (dBc)
90
SNR/SFDR (dBFS/dBc)
CSAMPLE
VIN–
H
08539-006
H
CPAR
Figure 35. Switched-Capacitor Input Circuit
The clock signal alternately switches the input circuit between
sample mode and hold mode (see Figure 35). When the input
circuit is switched to sample mode, the signal source must be
capable of charging the sample capacitors and settling within onehalf of a clock cycle. A small resistor in series with each input
can help reduce the peak transient current injected from the output
stage of the driving source. In addition, low Q inductors or ferrite
beads can be placed on each leg of the input to reduce high differential capacitance at the analog inputs and, therefore, achieve the
maximum bandwidth of the ADC. Such use of low Q inductors or
ferrite beads is required when driving the converter front end at
80
SNR (dBFS)
70
60
50
0.5
0.6
0.7
0.8
0.9
1.0
1.1
INPUT COMMON-MODE VOLTAGE (V)
1.2
1.3
08539-050
S
Figure 37. SNR/SFDR vs. Input Common-Mode Voltage,
fIN = 10.3 MHz, fS = 20 MSPS
An on-board, common-mode voltage reference is included in
the design and is available from the VCM pin. The VCM pin
must be decoupled to ground by a 0.1 μF capacitor, as described
in the Applications Information section.
Rev. 0 | Page 17 of 32
AD9649
Differential Input Configurations
the true SNR performance of the AD9649. For applications above
~10 MHz where SNR is a key parameter, differential double balun
coupling is the recommended input configuration (see Figure 41).
Optimum performance is achieved while driving the AD9649
in a differential input configuration. For baseband applications,
the AD8138, ADA4937-2, and ADA4938-2 differential drivers
provide excellent performance and a flexible interface to the ADC.
An alternative to using a transformer-coupled input at frequencies
in the second Nyquist zone is to use the AD8352 differential driver.
An example is shown in Figure 42. See the AD8352 data sheet
for more information.
The output common-mode voltage of the ADA4938-2 is easily
set with the VCM pin of the AD9649 (see Figure 38), and the
driver can be configured in a Sallen-Key filter topology to
provide band limiting of the input signal.
33Ω
VIN–
76.8Ω
AVDD
90Ω
10pF
120Ω
ADC
33Ω
VCM
VIN+
Table 9. Example RC Network
08539-007
ADA4938-2
200Ω
For baseband applications below ~10 MHz where SNR is a key
parameter, differential transformer coupling is the recommended
input configuration. An example is shown in Figure 39. To bias
the analog input, the VCM voltage can be connected to the
center tap of the secondary winding of the transformer.
A single-ended input can provide adequate performance in costsensitive applications. In this configuration, SFDR and distortion
performance degrade due to the large input common-mode swing.
If the source impedances on each input are matched, there should
be little effect on SNR performance. Figure 40 shows a typical
single-ended input configuration.
VIN+
49.9Ω
ADC
C
R
VCM
08539-008
VIN–
0.1µF
10µF
AVDD
1kΩ
Figure 39. Differential Transformer-Coupled Configuration
1V p-p
The signal characteristics must be considered when selecting
a transformer. Most RF transformers saturate at frequencies
below a few megahertz (MHz). Excessive signal power can also
cause core saturation, which leads to distortion.
49.9Ω
0.1µF
R
VIN+
1kΩ
AVDD
ADC
C
1kΩ
R
VIN–
10µF
At input frequencies in the second Nyquist zone and above, the
noise performance of most amplifiers is not adequate to achieve
0.1µF
1kΩ
Figure 40. Single-Ended Input Configuration
0.1µF
0.1µF
C Differential (pF)
22
Open
Single-Ended Input Configuration
R
R
VIN+
2V p-p
25Ω
PA
S
S
P
ADC
C
0.1µF
25Ω
0.1µF
R
VCM
VIN–
Figure 41. Differential Double Balun Input Configuration
VCC
0.1µF
0Ω
ANALOG INPUT
16
1
8, 13
11
2
CD
RD
RG
3
5
0.1µF
0Ω
R
VIN+
200Ω
10
ADC
C
AD8352
4
ANALOG INPUT
0.1µF
0.1µF
0.1µF
200Ω
R
VIN–
14
0.1µF
0.1µF
Figure 42. Differential Input Configuration Using the AD8352
Rev. 0 | Page 18 of 32
VCM
08539-011
2V p-p
R Series
(Ω Each)
33
125
Frequency Range (MHz)
0 to 70
70 to 200
Figure 38. Differential Input Configuration Using the ADA4938-2
08539-010
0.1µF
08539-009
200Ω
VIN
In any configuration, the value of Shunt Capacitor C is dependent
on the input frequency and source impedance and may need to
be reduced or removed. Table 9 displays the suggested values to set
the RC network. However, these values are dependent on the
input signal and should be used only as a starting guide.
AD9649
0
Internal Reference Connection
A comparator within the AD9649 detects the potential at the
SENSE pin and configures the reference into two possible modes,
which are summarized in Table 10. If SENSE is grounded, the
reference amplifier switch is connected to the internal resistor
divider (see Figure 43), setting VREF to 1.0 V.
–0.5
–1.0
INTERNAL VREF = 0.996V
–1.5
–2.0
–2.5
–3.0
0
0.2
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
LOAD CURRENT (mA)
08539-014
A stable and accurate 1.0 V voltage reference is built into the
AD9649. The VREF can be configured using either the internal
1.0 V reference or an externally applied 1.0 V reference voltage.
The various reference modes are summarized in the sections
that follow. The Reference Decoupling section describes the
best practices PCB layout of the reference.
REFERENCE VOLTAGE ERROR (%)
VOLTAGE REFERENCE
Figure 44. VREF Accuracy vs. Load Current
VIN+
4
VIN–
3
2
ADC
CORE
VREF ERROR (mV)
VREF ERROR (mV)
1
VREF
1.0µF
0.1µF
SELECT
LOGIC
SENSE
0
–1
–2
–3
–4
0.5V
–6
–40
Figure 43. Internal Reference Configuration
If the internal reference of the AD9649 is used to drive multiple
converters to improve gain matching, the loading of the reference
by the other converters must be considered. Figure 44 shows
how the internal reference voltage is affected by loading.
External Reference Operation
The use of an external reference may be necessary to enhance
the gain accuracy of the ADC or improve thermal drift characteristics. Figure 45 shows the typical drift characteristics of the
internal reference in 1.0 V mode.
–20
0
20
40
TEMPERATURE (°C)
60
80
Figure 45. Typical VREF Drift
When the SENSE pin is tied to AVDD, the internal reference is
disabled, allowing the use of an external reference. An internal
reference buffer loads the external reference with an equivalent
7.5 kΩ load (see Figure 28). The internal buffer generates the
positive and negative full-scale references for the ADC core.
Therefore, the external reference must be limited to a maximum
of 1.0 V.
Table 10. Reference Configuration Summary
Selected Mode
Fixed Internal Reference
Fixed External Reference
SENSE Voltage (V)
AGND to 0.2
AVDD
08539-052
ADC
08539-012
–5
Resulting VREF (V)
1.0 internal
1.0 applied to external VREF pin
Rev. 0 | Page 19 of 32
Resulting Differential Span (V p-p)
2.0
2.0
AD9649
CLOCK INPUT CONSIDERATIONS
For optimum performance, clock the AD9649 sample clock inputs,
CLK+ and CLK−, with a differential signal. The signal is typically ac-coupled into the CLK+ and CLK− pins via a transformer
or capacitors. These pins are biased internally (see Figure 46) and
require no external bias.
AVDD
0.9V
If a low jitter clock source is not available, another option is to
ac couple a differential PECL signal to the sample clock input
pins, as shown in Figure 49. The AD9510/AD9511/AD9512/
AD9513/AD9514/AD9515/AD9516/AD9517 clock drivers offer
excellent jitter performance.
CLK–
0.1µF
0.1µF
CLOCK
INPUT
2pF
08539-016
2pF
CLK+
0.1µF
AD951x
PECL DRIVER
CLOCK
INPUT
Clock Input Options
240Ω
50kΩ
Figure 47 and Figure 48 show two preferred methods for clocking the AD9649. The CLK inputs support up to 4× the rated sample
rate when using the internal clock divider feature. A low jitter clock
source is converted from a single-ended signal to a differential
signal using either an RF transformer or an RF balun.
A third option is to ac couple a differential LVDS signal to the
sample clock input pins as shown in Figure 50. The AD9510/
AD9511/AD9512/AD9513/AD9514/AD9515/AD9516/AD9517
clock drivers offer excellent jitter performance.
0.1µF
0.1µF
CLOCK
INPUT
CLK+
0.1µF
AD951x
LVDS DRIVER
CLOCK
INPUT
XFMR
0.1µF
ADC
0.1µF
CLK–
08539-017
SCHOTTKY
DIODES:
HSMS2822
0.1µF
ADC
0.1µF
08539-020
50kΩ
Figure 50. Differential LVDS Sample Clock (Up to 4× Rated Sample Rate)
CLK+
100Ω
50Ω
100Ω
CLK–
50kΩ
Mini-Circuits®
ADT1-1WT, 1:1 Z
0.1µF
240Ω
Figure 49. Differential PECL Sample Clock (Up to 4× Rated Sample Rate)
The AD9649 has a very flexible clock input structure. The clock
input can be a CMOS, LVDS, LVPECL, or sine wave signal.
Regardless of the type of signal being used, clock source jitter is
of great concern, as described in the Jitter Considerations section.
CLOCK
INPUT
ADC
0.1µF
CLK–
50kΩ
Figure 46. Equivalent Clock Input Circuit
100Ω
08539-019
CLK+
This limit helps prevent the large voltage swings of the clock
from feeding through to other portions of the AD9649 while
preserving the fast rise and fall times of the signal that are critical
to a low jitter performance.
Figure 47. Transformer-Coupled Differential Clock (3 MHz to 200 MHz)
In some applications, it may be acceptable to drive the sample
clock inputs with a single-ended 1.8 V CMOS signal. In such
applications, drive the CLK+ pin directly from a CMOS gate, and
bypass the CLK− pin to ground with a 0.1 μF capacitor (see
Figure 51).
VCC
0.1µF
CLOCK
INPUT
CLK+
50Ω
50Ω 1
ADC
0.1µF
1nF
1kΩ
AD951x
CMOS DRIVER
OPTIONAL
0.1µF
100Ω
1kΩ
ADC
CLK–
CLK–
08539-018
SCHOTTKY
DIODES:
HSMS2822
CLK+
0.1µF
150Ω
Figure 48. Balun-Coupled Differential Clock (Up to 4× Rated Sample Rate)
RESISTOR IS OPTIONAL.
Figure 51. Single-Ended 1.8 V CMOS Input Clock (Up to 200 MHz)
The RF balun configuration is recommended for clock frequencies between 80 MHz and 320 MHz, and the RF transformer is
recommended for clock frequencies from 3 MHz to 200 MHz.
The back-to-back Schottky diodes across the transformer/balun
secondary limit clock excursions into the AD9649 to ~0.8 V p-p
differential.
Input Clock Divider
The AD9649 contains an input clock divider with the ability
to divide the input clock by integer values of 1, 2, or 4.
Rev. 0 | Page 20 of 32
08539-021
1nF
CLOCK
INPUT
0.1µF
AD9649
Clock Duty Cycle
Typical high speed ADCs use both clock edges to generate a
variety of internal timing signals and, as a result, may be sensitive
to clock duty cycle. Commonly, a 50% duty cycle clock with ±5%
tolerance is required to maintain optimum dynamic performance,
as shown in Figure 52.
Jitter on the rising edge of the clock input can also impact dynamic
performance and should be minimized, as discussed in the Jitter
Considerations section of this datasheet.
80
75
70
supplies for clock drivers separate from the ADC output driver
supplies. Low jitter, crystal-controlled oscillators make the best
clock sources. If the clock is generated from another type of source
(by gating, dividing, or another method), it should be retimed by
the original clock at the last step.
For more information, see the AN-501 Application Note and the
AN-756 Application Note, which are available on www.analog.com.
POWER DISSIPATION AND STANDBY MODE
As shown in Figure 54, the analog core power dissipated by the
AD9649 is proportional to its sample rate. The digital power dissipation of the CMOS outputs are determined primarily by the
strength of the digital drivers and the load on each output bit.
IDRVDD = VDRVDD × CLOAD × fCLK × N
60
where N is the number of output bits (15, in the case of the
AD9649).
55
This maximum current occurs when every output bit switches
on every clock cycle, that is, a full-scale square wave at the Nyquist
frequency of fCLK/2. In practice, the DRVDD current is established by the average number of output bits that are switching,
which is determined by the sample rate and the characteristics
of the analog input signal.
50
40
10
20
30
40
50
60
POSITIVE DUTY CYCLE (%)
70
80
08539-053
45
Figure 52. SNR vs. Clock Duty Cycle
Jitter Considerations
High speed, high resolution ADCs are sensitive to the quality
of the clock input. The degradation in SNR from the low frequency SNR (SNRLF) at a given input frequency (fINPUT) due to
jitter (tJRMS) can be calculated by
Reducing the capacitive load presented to the output drivers can
minimize digital power consumption. The data in Figure 54 was
taken using the same operating conditions as those used for the
Typical Performance Characteristics, with a 5 pF load on each
output driver.
85
SNRHF = −10 log[(2π × fINPUT × tJRMS)2 + 10 ( − SNRLF /10) ]
80
ANALOG CORE POWER (mW)
In the previous equation, the rms aperture jitter represents the
clock input jitter specification. IF undersampling applications
are particularly sensitive to jitter, as illustrated in Figure 53.
80
75
0.05ps
70
65
55
50
60
1.5ps
3.0ps
45
1
10
2.0ps
2.5ps
100
FREQUENCY (MHz)
AD9649-20
20
30
40
50
60
CLOCK RATE (MSPS)
70
80
Figure 54. Analog Core Power vs. Clock Rate
1.0ps
50
AD9649-40
45
35
10
55
AD9649-65
60
40
0.5ps
AD9649-80
70
65
1k
08539-022
SNR (dBFS)
0.2ps
75
08539-051
SNR (dBFS)
The maximum DRVDD current (IDRVDD) can be calculated as
65
Figure 53. SNR vs. Input Frequency and Jitter
The clock input should be treated as an analog signal in cases in
which aperture jitter may affect the dynamic range of the AD9649.
To avoid modulating the clock signal with digital noise, keep power
In SPI mode, the AD9649 can be placed in power-down mode
directly via the SPI port or by using the programmable external
MODE pin. In non-SPI mode, power-down is achieved by asserting the PDWN pin high. In this state, the ADC typically dissipates
500 μW. During power-down, the output drivers are placed in a
high impedance state. Asserting the PDWN pin (or the MODE pin
in SPI mode) low returns the AD9649 to normal operating mode.
Note that PDWN is referenced to the digital output driver supply
(DRVDD) and should not exceed that supply voltage.
Rev. 0 | Page 21 of 32
AD9649
Low power dissipation in power-down mode is achieved by shutting down the reference, reference buffer, biasing networks, and
clock. Internal capacitors are discharged when entering powerdown mode and then must be recharged when returning to normal
operation. As a result, wake-up time is related to the time spent
in power-down mode, and shorter power-down cycles result in
proportionally shorter wake-up times.
Digital Output Enable Function (OEB)
When using the SPI interface, the data outputs and DCO can be
independently three-stated by using the programmable external
MODE pin. The OEB function of the MODE pin is enabled via
Bits[6:5] of Register 0x08.
When using the SPI port interface, the user can place the ADC
in power-down mode or standby mode. Standby mode allows
the user to keep the internal reference circuitry powered when
faster wake-up times are required. See the Memory Map section for
more details.
If the MODE pin is configured to operate in traditional OEB mode
and the MODE pin is low, the output data drivers and DCOs are
enabled. If the MODE pin is high, the output data drivers and
DCOs are placed in a high impedance state. This OEB function
is not intended for rapid access to the data bus. Note that the
MODE pin is referenced to the digital output driver supply
(DRVDD) and should not exceed that supply voltage.
DIGITAL OUTPUTS
TIMING
The AD9649 output drivers can be configured to interface with
1.8 V to 3.3 V CMOS logic families. Output data can also be multiplexed onto a single output bus to reduce the total number of traces
required.
The AD9649 provides latched data with a pipeline delay of eight
clock cycles. Data outputs are available one propagation delay (tPD)
after the rising edge of the clock signal.
The CMOS output drivers are sized to provide sufficient output
current to drive a wide variety of logic families. However, large
drive currents tend to cause current glitches on the supplies and
may affect converter performance.
Applications requiring the ADC to drive large capacitive loads
or large fanouts may require external buffers or latches.
The output data format can be selected to be either offset binary
or twos complement by setting the SCLK/DFS pin when operating
in the external pin mode (see Table 11).
As detailed in the AN-877 Application Note, Interfacing to High
Speed ADCs via SPI, the data format can be selected for offset
binary, twos complement, or gray code when using the SPI control.
Minimize the length of the output data lines and loads placed on
them to reduce transients within the AD9649. These transients may
degrade converter dynamic performance.
The lowest typical conversion rate of the AD9649 is 3 MSPS.
At clock rates below 3 MSPS, dynamic performance may degrade.
Data Clock Output (DCO)
The AD9649 provides a data clock output (DCO) signal that is
intended for capturing the data in an external register. The CMOS
data outputs are valid on the rising edge of DCO, unless the DCO
clock polarity has been changed via the SPI. See Figure 2 for a
graphical timing description.
Table 11. SCLK/DFS and SDIO/PDWN Mode Selection
(External Pin Mode)
Voltage at Pin
GND
SCLK/DFS
Offset binary (default)
DRVDD
Twos complement
SDIO/PDWN
Normal operation
(default)
Outputs disabled
Table 12. Output Data Format
Input (V)
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
VIN+ − VIN−
Condition (V)
< −VREF − 0.5 LSB
= −VREF
=0
= +VREF − 1.0 LSB
> +VREF − 0.5 LSB
Offset Binary Output Mode
00 0000 0000 0000
00 0000 0000 0000
10 0000 0000 0000
11 1111 1111 1111
11 1111 1111 1111
Rev. 0 | Page 22 of 32
Twos Complement Mode
10 0000 0000 0000
10 0000 0000 0000
00 0000 0000 0000
01 1111 1111 1111
01 1111 1111 1111
OR
1
0
0
0
1
AD9649
BUILT-IN SELF-TEST (BIST) AND OUTPUT TEST
The AD9649 includes a built-in test feature designed to enable
verification of the integrity of each channel, as well as facilitate
board-level debugging. Also included is a built-in self-test (BIST)
feature that verifies the integrity of the digital datapath of the
AD9649. Various output test options are also provided to place
predictable values on the outputs of the AD9649.
BUILT-IN SELF-TEST (BIST)
The BIST is a thorough test of the digital portion of the selected
AD9649 signal path. Perform the BIST test after a reset to ensure
that the part is in a known state. During the BIST test, data from
an internal pseudorandom noise (PN) source is driven through
the digital datapath of both channels, starting at the ADC block
output. At the datapath output, CRC logic calculates a signature
from the data. The BIST sequence runs for 512 cycles and then
stops. When the BIST sequence is complete, the BIST compares
the signature results with a predetermined value. If the signatures
match, the BIST sets Bit 0 of Register 0x24, signifying that the
test passed. If the BIST test failed, Bit 0 of Register 0x24 is cleared.
The outputs are connected during this test so that the PN sequence
can be observed as it runs. Writing the value 0x05 to Register 0x0E
runs the BIST, enabling Bit 0 (BIST enable) of Register 0x0E
and resetting the PN sequence generator, Bit 2 (BIST init) of
Register 0x0E. Upon completion of the BIST, Bit 0 of Register 0x24
is automatically cleared. The PN sequence can be continued from
its last value by writing a 0 in Bit 2 of Register 0x0E. However, if the
PN sequence is not reset, the signature calculation does not equal
the predetermined value at the end of the test. The user must
then rely on verifying the output data.
OUTPUT TEST MODES
The output test options are described in Table 16 at Address 0x0D.
When an output test mode is enabled, the analog section of the
ADC is disconnected from the digital back end blocks and the
test pattern is run through the output formatting block. Some of
the test patterns are subject to output formatting, and some are
not. The PN generators from the PN sequence tests can be reset
by setting Bit 4 or Bit 5 of Register 0x0D. These tests can be performed with or without an analog signal (if present, the analog
signal is ignored), but they do require an encode clock. For more
information, see the AN-877 Application Note, Interfacing to
High Speed ADCs via SPI.
Rev. 0 | Page 23 of 32
AD9649
SERIAL PORT INTERFACE (SPI)
The falling edge of CSB, in conjunction with the rising edge of
SCLK, determines the start of the framing. An example of the
serial timing and its definitions can be found in Figure 55 and
Table 5.
The AD9649 SPI allows the user to configure the converter for
specific functions or operations through a structured register space
provided inside the ADC. The SPI gives the user added flexibility
and customization, depending on the application. Addresses are
accessed via the serial port and can be written to or read from via
the port. Memory is organized into bytes that can be further
divided into fields, which are documented in the Memory Map
section. For detailed operational information, see the AN-877
Application Note, Interfacing to High Speed ADCs via SPI.
Other modes involving the CSB are available. The CSB can be
held low indefinitely, which permanently enables the device;
this is called streaming. The CSB can stall high between bytes to
allow for additional external timing. When CSB is tied high, SPI
functions are placed in high impedance mode. This mode turns
on any SPI pin secondary functions.
CONFIGURATION USING THE SPI
During an instruction phase, a 16-bit instruction is transmitted.
Data follows the instruction phase, and its length is determined
by the W0 and W1 bits, as shown in Figure 55.
Three pins define the SPI of this ADC: the SCLK (SCLK/DFS,
the SDIO (SDIO/PDWN), and the CSB (see Table 13). The SCLK
(a serial clock) is used to synchronize the read and write data
presented from and to the ADC. The SDIO (serial data input/
output) is a dual-purpose pin that allows data to be sent and
read from the internal ADC memory map registers. The CSB
(chip select bar) is an active-low control that enables or disables
the read and write cycles.
All data is composed of 8-bit words. The first bit of the first byte in
a multibyte serial data transfer frame indicates whether a read command or a write command is issued. This allows the serial data
input/output (SDIO) pin to change direction from an input to
an output at the appropriate point in the serial frame.
In addition to word length, the instruction phase determines
whether the serial frame is a read or write operation, allowing
the serial port to be used both to program the chip and to read
the contents of the on-chip memory. If the instruction is a readback
operation, performing a readback causes the serial data input/
output (SDIO) pin to change direction from an input to an output
at the appropriate point in the serial frame.
Table 13. Serial Port Interface Pins
Pin
SCLK
SDIO
CSB
Function
Serial clock. The serial shift clock input, which is used to
synchronize serial interface reads and writes.
Serial data input/output. A dual-purpose pin that
typically serves as an input or an output, depending on
the instruction being sent and the relative position in the
timing frame.
Chip select bar. An active-low control that gates the read
and write cycles.
tHIGH
tDS
tS
tDH
Data can be sent in MSB-first mode or in LSB-first mode. MSB
first is the default on power-up and can be changed via the SPI
port configuration register. For more information about this
and other features, see the AN-877 Application Note, Interfacing
to High Speed ADCs via SPI.
tCLK
tH
tLOW
CSB
SDIO DON’T CARE
DON’T CARE
R/W
W1
W0
A12
A11
A10
A9
A8
A7
D5
Figure 55. Serial Port Interface Timing Diagram
Rev. 0 | Page 24 of 32
D4
D3
D2
D1
D0
DON’T CARE
08539-023
SCLK DON’T CARE
AD9649
HARDWARE INTERFACE
The pins described in Table 13 constitute the physical interface
between the programming device of the user and the serial port
of the AD9649. The SCLK pin and the CSB pin function as inputs
when using the SPI interface. The SDIO pin is bidirectional,
functioning as an input during write phases and as an output
during readback.
The SPI interface is flexible enough to be controlled by either
FPGAs or microcontrollers. For detailed information about one
method for SPI configuration, refer to the AN-812 Application
Note, Microcontroller-Based Serial Port Interface (SPI) Boot Circuit.
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK signal, the CSB signal, and the SDIO signal are typically
asynchronous to the ADC clock, noise from these signals can
degrade converter performance. If the on-board SPI bus is used for
other devices, it may be necessary to provide buffers between this
bus and the AD9649 to prevent these signals from transitioning
at the converter inputs during critical sampling periods.
The SDIO/PDWN and SCLK/DFS pins serve a dual function when
the SPI interface is not being used. When the pins are strapped
to DRVDD or ground during device power-on, they are associated
with a specific function. The Digital Outputs section describes
the strappable functions supported on the AD9649.
CONFIGURATION WITHOUT THE SPI
In applications that do not interface to the SPI control registers,
the SDIO/PDWN pin and the SCLK/DFS pin serve as standalone
CMOS-compatible control pins. When the device is powered up, it
is assumed that the user intends to use the pins as static control
lines for the power-down and output data format feature control.
In this mode, connect the CSB chip select to DRVDD, which
disables the serial port interface.
Table 14. Mode Selection
Pin
SDIO/PDWN
SCLK/DFS
External
Voltage
DRVDD
AGND (default)
DRVDD
AGND (default)
Configuration
Chip power-down mode
Normal operation (default)
Twos complement enabled
Offset binary enabled
SPI ACCESSIBLE FEATURES
Table 15 provides a brief description of the general features that
are accessible via the SPI. These features are described in detail
in the AN-877 Application Note, Interfacing to High Speed ADCs
via SPI. The AD9649 part-specific features are described in detail
in Table 16.
Table 15. Features Accessible Using the SPI
Feature
Modes
Offset Adjust
Test Mode
Output Mode
Output Phase
Output Delay
Rev. 0 | Page 25 of 32
Description
Allows the user to set either power-down mode or
standby mode
Allows the user to digitally adjust the converter
offset
Allows the user to set test modes to have known
data on output bits
Allows the user to set up outputs
Allows the user to set the output clock polarity
Allows the user to vary the DCO delay
AD9649
MEMORY MAP
READING THE MEMORY MAP REGISTER TABLE
DEFAULT VALUES
Each row in the memory map register table (see Table 16) contains
eight bit locations. The memory map is roughly divided into four
sections: the chip configuration registers (Address 0x00 to
Address 0x02); the device transfer registers (Address 0xFF); the
program registers, including setup, control, and test (Address 0x08
to Address 0x2A); and the digital feature control registers
(Address 0x101).
After the AD9649 is reset, critical registers are loaded with default
values. The default values for the registers are given in the memory
map register table (see Table 16).
Table 16 documents the default hexadecimal value for each
hexadecimal address shown. The column with the heading Bit 7
(MSB) is the start of the default hexadecimal value given. For
example, Address 0x2A, the OR/MODE select register, has a hexadecimal default value of 0x01. This means that in Address 0x2A,
Bits[7:1] = 0, and Bit 0 = 1. This setting is the default OR/MODE
setting. The default value results in the programmable external
MODE/OR pin (Pin 23) functioning as an out-of-range digital
output. For more information on this function and others, see the
AN-877 Application Note, Interfacing to High Speed ADCs via SPI.
This document details the functions controlled by Register 0x00
to Register 0xFF. The remaining register, Register 0x101, is documented in the Memory Map Register Descriptions section that
follows Table 16.
Logic Levels
An explanation of logic level terminology follows:
•
•
“Bit is set” is synonymous with “bit is set to Logic 1” or
“writing Logic 1 for the bit.”
“Clear a bit” is synonymous with “bit is set to Logic 0” or
“writing Logic 0 for the bit.”
Transfer Register Map
Address 0x08 to Address 0x18 are shadowed. Writes to these
addresses do not affect part operation until a transfer command
is issued by writing 0x01 to Address 0xFF, setting the transfer bit.
This allows these registers to be updated internally and simultaneously when the transfer bit is set. The internal update takes
place when the transfer bit is set, and then the bit autoclears.
OPEN LOCATIONS
All address and bit locations that are not included in the SPI map
are not currently supported for this device. Unused bits of a valid
address location should be written with 0s. Writing to these locations is required only when part of an address location is open
(for example, Address 0x2A). If the entire address location is
open, it is omitted from the SPI map (for example, Address 0x13)
and should not be written.
Rev. 0 | Page 26 of 32
AD9649
MEMORY MAP REGISTER TABLE
All address and bit locations that are not included in Table 16 are not currently supported for this device.
Table 16.
Addr.
(Hex)
Register Name
Chip configuration registers
0x00
SPI port
configuration
0x01
Chip ID
0x02
Chip grade
Device transfer registers
0xFF
Transfer
Program registers
0x08
Modes
(MSB)
Bit 7
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
0
LSB first
Soft
reset
1
1
Soft
reset
Bit 1
(LSB)
Bit 0
Def.
Value
(Hex)
Default
Notes/
Comments
LSB first
0
0x18
The nibbles are
mirrored so that
LSB or MSB first
mode registers
correctly, regardless of shift
mode.
Unique chip ID
used to differentiate devices;
read only.
Unique speed
grade ID used to
differentiate
devices; read
only.
8-bit chip ID, Bits[7:0]
AD9649 = 0x6F
Open
Speed grade ID, Bits[6:4]
(identify device variants of chip ID)
20 MSPS = 000
40 MSPS = 001
65 MSPS = 010
80 MSPS = 011
Open
Open
External
Pin 23
MODE
input
enable
External Pin 23
function when high
00 = full power-down
01 = standby
10 = normal mode,
output disabled
11 = normal mode,
output enabled
Open
Open
Open
Read
only
Open
Open
Open
Open
Transfer
0x00
Synchronously
transfers data
from the master
shift register to
the slave.
Open
Open
Open
00 = chip run
01 = full power-down
10 = standby
11 = chip wide
digital reset
0x00
Determines
various generic
modes of chip
operation.
0x00
The divide ratio
is the value + 1.
0x00
When set, the
test data is
placed on the
output pins in
place of normal
data.
0x00
When Bit 0 is set,
the built-in selftest function is
initiated.
Device offset
trim.
0x0B
Clock divide
0x0D
Test mode
User test mode
00 = single
01 = alternate
10 = single once
11 = alternate once
Reset PN
long gen
Reset PN
short
gen
0x0E
BIST enable
Open
Open
Open
0x10
Offset adjust
Open
Read
only
Clock divider, Bits[2:0]
Clock divide ratio
000 = divide-by-1
001 = divide-by-2
011 = divide-by-4
Output test mode, Bits[3:0] (local)
0000 = off (default)
0001 = midscale short
0010 = positive FS
0011 = negative FS
0100 = alternating checkerboard
0101 = PN 23 sequence
0110 = PN 9 sequence
0111 = 1/0 word toggle
1000 = user input
1001 = 1/0 bit toggle
1010 = 1× sync
1011 = one bit high
1100 = mixed bit frequency
Open
BIST init
Open
BIST
enable
8-bit device offset adjustment, Bits[7:0] (local)
Offset adjust in LSBs from +127 to −128 (twos complement format)
Rev. 0 | Page 27 of 32
0x00
AD9649
Def.
Value
(Hex)
Default
Notes/
Comments
0x00
Configures the
outputs and the
format of the
data.
0x22
Determines
CMOS output
drive strength
properties.
0x00
On devices that
use global clock
divide, determines which
phase of the
divider output is
used to supply
the output clock;
internal latching
is unaffected.
0x00
Sets the fine
output delay of
the output clock
but does not
change internal
timing.
B6
00 = offset binary
01 = twos
complement
10 = gray code
11 = offset binary
1.8 V data
3.3 V data
1.8 V DCO
drive strength
drive strength
drive strength
00 = 1 stripe
00 = 1 stripe
00 = 1 stripe
01 = 2 stripes
(default)
01 = 2 stripes
10 = 3 stripes
01 = 2 stripes
10 = 3 stripes
(default)
10 = 3 stripes
(default)
11 = 4 stripes
11 = 4 stripes
11 = 4 stripes
Open
Open
Open
Input clock phase adjust,
Bits[2:0]
(Value is number of input clock
cycles of phase delay)
000 = no delay
001 = 1 input clock cycle
010 = 2 input clock cycles
011 = 3 input clock cycles
100 = 4 input clock cycles
101 = 5 input clock cycles
110 = 6 input clock cycles
111 = 7 input clock cycles
Enable
Open
DCO/data delay, Bits[2:0]
data
000 = 0.56 ns
delay
001 = 1.12 ns
010 = 1.68 ns
011 = 2.24 ns
100 = 2.80 ns
101 = 3.36 ns
110 = 3.92 ns
111 = 4.48 ns
B5
B4
B3
B2
B1
B0
0x00
B15
B14
B13
B12
B11
B10
B9
B8
0x00
USER_PATT2_LSB
B7
B6
B5
B4
B3
B2
B1
B0
0x00
0x1C
USER_PATT2_MSB
B15
B14
B13
B12
B11
B10
B9
B8
0x00
0x24
BIST signature LSB
0x2A
OR/MODE select
User-defined
Pattern 1 LSB.
User-defined
Pattern 1 MSB.
User-defined
Pattern 2 LSB.
User-defined
Pattern 2 MSB.
Least significant
byte of BIST signature, read only.
Selects I/O
functionality in
conjunction with
Address 0x08 for
MODE (input) or
OR (output) on
External Pin 23.
Addr.
(Hex)
(MSB)
Bit 7
Register Name
Bit 6
Bit 5
Bit 4
Bit 3
Bit 2
0x14
Output mode
00 = 3.3 V CMOS
10 = 1.8 V CMOS
Open
Output
disable
Open
Output
invert
0x15
Output adjust
0x16
Output phase
3.3 V DCO
drive strength
00 = 1 stripe
(default)
01 = 2 stripes
10 = 3 stripes
11 = 4 stripes
Open
DCO
output
polarity
0=
normal
1 = inv
0x17
Output delay
Enable
DCO
delay
Open
0x19
USER_PATT1_LSB
B7
0x1A
USER_PATT1_MSB
0x1B
Bit 1
(LSB)
Bit 0
BIST signature, Bits[7:0]
Open
Digital feature control register
0x101
USR2
1
0x00
Open
Open
Open
Open
Open
Open
0=
MODE
1 = OR
(default)
0x01
Open
Open
Open
Enable
GCLK
detect
Run
GCLK
Open
Disable
SDIO
pulldown
0x88
Rev. 0 | Page 28 of 32
Enables internal
oscillator for
clock rates of
<5 MHz.
AD9649
MEMORY MAP REGISTER DESCRIPTIONS
Bit 2—Run GCLK
For additional information about functions controlled in
Register 0x00 to Register 0xFF, see the AN-877 Application
Note, Interfacing to High Speed ADCs via SPI.
Bit 2 enables the GCLK oscillator. For some applications with
encode rates below 10 MSPS, it may be preferable to set this bit
high to supersede the GCLK detector.
USR2 (Register 0x101)
Bit 0—Disable SDIO Pull-Down
Bit 3—Enable GCLK Detect
Bit 0 can be set high to disable the internal 30 kΩ pull-down on
the SDIO pin, which can be used to limit the loading when many
devices are connected to the SPI bus.
Normally set high, Bit 3 enables a circuit that detects encode
rates below ~5 MSPS. When a low encode rate is detected, an
internal oscillator, GCLK, is enabled, ensuring the proper operation of several circuits. If set low, the detector is disabled.
Rev. 0 | Page 29 of 32
AD9649
APPLICATIONS INFORMATION
DESIGN GUIDELINES
Before starting the design and layout of the AD9649 as a system,
it is recommended that the designer become familiar with these
guidelines, which discuss the special circuit connections and
layout requirements needed for certain pins.
Power and Ground Recommendations
When connecting power to the AD9649, it is strongly recommended that two separate supplies be used. Use one 1.8 V supply
for analog (AVDD); use a separate 1.8 V to 3.3 V supply for the
digital output supply (DRVDD). If a common 1.8 V AVDD and
DRVDD supply must be used, the AVDD and DRVDD domains
must be isolated with a ferrite bead or filter choke and separate
decoupling capacitors. Several different decoupling capacitors can
be used to cover both high and low frequencies. Locate these
capacitors close to the point of entry at the PCB level and close
to the pins of the part, with minimal trace length.
To maximize the coverage and adhesion between the ADC and
the PCB, a silkscreen should be overlaid to partition the continuous
plane on the PCB into several uniform sections. This provides
several tie points between the ADC and the PCB during the reflow
process. Using one continuous plane with no partitions guarantees
only one tie point between the ADC and the PCB. For detailed
information about packaging and PCB layout of chip scale
packages, see the AN-772 Application Note, A Design and
Manufacturing Guide for the Lead Frame Chip Scale Package
(LFCSP), at www.analog.com.
Encode Clock
For optimum dynamic performance, use a low jitter encode
clock source with a 50% duty cycle (±5%) to clock the AD9649.
VCM
The VCM pin should be decoupled to ground with a 0.1 μF
capacitor, as shown in Figure 39.
A single PCB ground plane should be sufficient when using the
AD9649. With proper decoupling and smart partitioning of the
PCB analog, digital, and clock sections, optimum performance
is easily achieved.
RBIAS
Exposed Paddle Thermal Heat Sink Recommendations
Reference Decoupling
The exposed paddle (Pin 0) is the only ground connection for
the AD9649; therefore, it must be connected to analog ground
(AGND) on the customer’s PCB. To achieve the best electrical
and thermal performance, mate an exposed (no solder mask)
continuous copper plane on the PCB to the AD9649 exposed
paddle, Pin 0.
Externally decouple the VREF pin to ground with a low ESR,
1.0 μF capacitor in parallel with a low ESR, 0.1 μF ceramic
capacitor.
The copper plane should have several vias to achieve the lowest
possible resistive thermal path for heat dissipation to flow through
the bottom of the PCB. Fill or plug these vias with nonconductive epoxy.
The AD9649 requires that a 10 kΩ resistor be placed between
the RBIAS pin and ground. This resistor sets the master current
reference of the ADC core and should have at least a 1% tolerance.
SPI Port
The SPI port should not be active during periods when the full
dynamic performance of the converter is required. Because the
SCLK, CSB, and SDIO signals are typically asynchronous to the
ADC clock, noise from these signals can degrade converter
performance. If the on-board SPI bus is used for other devices,
it may be necessary to provide buffers between this bus and the
AD9649 to keep these signals from transitioning at the converter
inputs during critical sampling periods.
Rev. 0 | Page 30 of 32
AD9649
OUTLINE DIMENSIONS
0.60 MAX
5.00
BSC SQ
0.60 MAX
PIN 1
INDICATOR
0.50
BSC
4.75
BSC SQ
0.50
0.40
0.30
12° MAX
17
16
0.80 MAX
0.65 TYP
0.30
0.23
0.18
1
EXPOSED
PAD
(BOTTOM VIEW)
3.65
3.50 SQ
3.35
9
8
0.25 MIN
3.50 REF
0.05 MAX
0.02 NOM
SEATING
PLANE
32
0.20 REF
COPLANARITY
0.08
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-VHHD-2
100608-A
TOP
VIEW
1.00
0.85
0.80
PIN 1
INDICATOR
25
24
Figure 56. 32-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
5 mm × 5 mm Body, Very Thin Quad
(CP-32-4)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD9649BCPZ-80 1, 2
AD9649BCPZRL7-801, 2
AD9649BCPZ-651, 2
AD9649BCPZRL7-651, 2
AD9649BCPZ-401, 2
AD9649BCPZRL7-401, 2
AD9649BCPZ-201, 2
AD9649BCPZRL7-201, 2
AD9649-80EBZ1
AD9649-65EBZ1
AD9649-40EBZ1
AD9649-20EBZ1
1
2
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
Package Description
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
32-Lead Lead Frame Chip Scale Package (LFCSP_VQ)
Evaluation Board
Evaluation Board
Evaluation Board
Evaluation Board
Z = RoHS Compliant Part.
The exposed paddle (Pin 0) is the only GND connection on the chip and must be connected to the PCB AGND.
Rev. 0 | Page 31 of 32
Package Option
CP-32-4
CP-32-4
CP-32-4
CP-32-4
CP-32-4
CP-32-4
CP-32-4
CP-32-4
AD9649
NOTES
©2009 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D08539-0-10/09(0)
Rev. 0 | Page 32 of 32