plerowTM ALN0450 Internally Matched LNA Module Features Description · S21 = 36.6 dB@400 MHz = 35.4 dB@500 MHz · NF of 0.65 dB over Frequency · Unconditionally Stable · Single 5V Supply · High OIP3@Low Current C o u pl er C o u pl er The plerowTM ALN-series is the compactly designed surface-mount module for the use of the LNA with or without the following gain blocks in the infrastructure equipment of the mobile wireless (CDMA, GSM, PCS, PHS, WCDMA, DMB, WLAN, WiBro, WiMAX), GPS, satellite communication terminals, CATV and so on. It has an exceptional performance of low noise figure, high gain, high OIP3, and low bias current. The stability factor is always kept more than unity over the application band in order to ensure its unconditionally stable implementation to the application system environment. The surface-mount module package including the completed matching circuit and other components necessary just in case allows very simple and convenient implementation onto the system board in mass production level. Specifications (in Production) Typ.@T = 25 C, Vs = 5 V, Freq. = 450 MHz, Zo.sys = 50 ohms Parameter Unit Frequency Range Min MHz 400 Gain dB 35 Gain Flatness dB Noise Figure Typ dBm S11/S22 36 37.5 0.6 0.8 0.65 0.70 dBm Website: www.asb.co.kr E-mail: [email protected] Tel: (82) 42-528-7223 Fax: (82) 42-528-7222 -18/-18 20 21 sec - Supply Current mA 170 Supply Voltage V 5 Impedance 50 Switching Time (3) More Information 38.5 dB Output P1dB Max 500 dB Output IP3 2-stage Single Type Specifications 190 Max. RF Input Power dBm C.W 23~25 (before fail) Package Type&Size mm Surface Mount Type, 13Wx13Lx3.8H Operating temperature is -40C to +85C. 1) OIP3 is measured with two tones at an output power of 5 dBm/tone separated by 1 MHz. 2) S11/S22 (max) is the worst value within the frequency band. 3) Switching time means the time that takes for output power to get stabilized to its final level after switching DC voltage from 0 V to VS. Outline Drawing (Unit: mm) plerow ALN0450 ASB Inc. (Top View) (Bottom View) Pin Number Function 3 RF In 8 RF Out 10 Vs Others Ground Note: 1. The number and size of ground via holes in a circuit board is critical for thermal RF grounding considerations. 2. We recommend that the ground via holes be placed on the bottom of all ground pins for better RF and thermal performance, as shown in the drawing at the left side. Solder Stencil Area (Side View) Ø 0.4 plated thru holes to ground plane (Recommended Footprint) 1/3 www.asb.co.kr March 2010 plerowTM ALN0450 Internally Matched LNA Module S-parameters Typical Performance (Measured) 400~500 MHz +5 V S-parameters & K Factor Noise Figure OIP3 2/3 P1dB www.asb.co.kr March 2010 plerowTM ALN0450 Internally Matched LNA Module Application Circuit VS + - Tantal or MLC (Multi Layer Ceramic) Capacitor C1 C2 ALN IN OUT 1) The tantal or MLC (Multi Layer Ceramic) capacitor is optional and for bypassing the AC noise introduced from the DC supply. The capacitance value may be determined by customer’s DC supply status. The capacitor should be placed as close as possible to Vs pin and be connected directly to the ground plane for the best electrical performance. 2) DC blocking capacitors are always necessarily placed at the input and output port for allowing only the RF signal to pass and blocking the DC component in the signal. The DC blocking capacitors are included inside the ALN module. Therefore, C1 & C2 capacitors may not be necessary, but can be added just in case that the customer wants. The value of C1 & C2 is determined by considering the application frequency. Recommended Soldering Reflow Process Evaluation Board Layout Vs 20~40 sec 260C Ramp-up (3˚C/sec) 200C Ramp-down (6C/sec) OUT IN 150C Size 25x25mm (for ALN Series – 13x13mm) 60~180 sec 3/3 www.asb.co.kr March 2010